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- research-articleJanuary 2022
A low-g omnidirectional MEMS inertial switch with load direction identification
AbstractIn order to solve the problem that the low-g omnidirectional MEMS inertial switches cannot recognize the load direction, a nickel omnidirectional MEMS inertial switch with identifiable load direction and uniform in-plane threshold ...
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Highlights- A low-g MEMS inertial switch with identifiable load direction was designed.
- The ...
- research-articleJuly 2021
Mm-level ultra-thick folded waveguide structures fabricated by UV-LIGA for W-band TWTs
AbstractWhile the precision CNC milling method is widely used to fabricate relatively large sized folded waveguides (FWGs), especially W-band FWGs, UV-LIGA is considered capable of fabricating small dimensional FWGs, such as those at 220 GHz ...
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- articleFebruary 2014
Effect of thermal treatment on the mechanical properties of Cu specimen fabricated using electrodeposition bath for through-silicon-via filling
The Cu specimens were fabricated by the UV-LIGA process using the electrodeposition bath for through-silicon-via (TSV) filling. Mechanical properties of the Cu specimens annealed at different temperatures were investigated by a uniaxial tensile test. ...
- ArticleJanuary 2013
Design and Simulation of Structurally Decoupled 4-DOF MEMS Vibratory Gyroscope
VLSID '13: Proceedings of the 2013 26th International Conference on VLSI Design and 2013 12th International Conference on Embedded SystemsPages 380–385https://doi.org/10.1109/VLSID.2013.218This paper presents design of a structurally decoupled 4-DOF MEMS vibratory gyroscope with increased robustness and gain. The proposed design utilizes dynamic amplification in 2-DOF drive mode oscillator and 2-DOF sense mode oscillator to achieve large ...
- articleAugust 2011
Cost efficient master fabrication process on copper substrates
Microelectronic Engineering (MCEE), Volume 88, Issue 8Pages 2322–2324https://doi.org/10.1016/j.mee.2011.02.023In this work a rapid and low cost process for master fabrication was carried out. Thick epoxy SU-8 photoresist was employed as sacrificial patternable layer for the definition of metal deposition area. An SU-8 photolithographic recipe was employed on ...
- articleJanuary 2007
Multi-layer microstructure fabrication by combining bulk silicon micromachining and UV-LIGA technology
Microelectronics Journal (MICROJ), Volume 38, Issue 1Pages 120–124https://doi.org/10.1016/j.mejo.2006.09.003A novel method for fabrication of multi-layer microstructures of microelectro-mechanical system (MEMS) devices is described. This technique, which combines bulk silicon micromachining technique and UV-LIGA technique can overcome some shape limitations ...
- articleMay 2004
Process research of high aspect ratio microstructure using SU-8 resist
Microsystem Technologies (MITE), Volume 10, Issue 4Pages 265–268SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to ...
- articleMay 2004
A novel device of passive and fixed alignment of optical fiber
Microsystem Technologies (MITE), Volume 10, Issue 4Pages 269–271In the microoptics field, precise alignment is very important to reduce the coupling losses in optical links. In this paper, a novel device of passive and fixed alignment of optical fiber is proposed. The rectangular V-groove formed by one sidewall of ...
