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- research-articleJanuary 2023
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation ConferencePages 7–12https://doi.org/10.1145/3566097.3567911This work develops an efficient chiplet placer with thermal consideration for 2.5D ICs. Combining the sequence-pair based tree, branch-and-bound method, and advanced placement/pruning techniques, the developed placer can find the solution fast with the ...
- research-articleJanuary 2023
Efficient Global Optimization for Large Scaled Ordered Escape Routing
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation ConferencePages 535–540https://doi.org/10.1145/3566097.3567901Ordered Escape Routing (OER) problem, which is an NP-hard problem, is critical in PCB design. Primary methods based on integer linear programming (ILP) or heuristic algorithms work well on small-scale PCBs with fewer pins. However, when dealing with ...
- research-articleJanuary 2023
MacroRank: Ranking Macro Placement Solutions Leveraging Translation Equivariancy
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation ConferencePages 258–263https://doi.org/10.1145/3566097.3567899Modern large-scale designs make extensive use of heterogeneous macros, which can significantly affect routability. Predicting the final routing quality in the early macro placement stage can filter out poor solutions and speed up design closure. By ...
- research-articleJanuary 2023
EDDY: A Multi-Core BDD Package with Dynamic Memory Management and Reduced Fragmentation
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation ConferencePages 423–428https://doi.org/10.1145/3566097.3567913In recent years, hardware systems have significantly grown in complexity. Due to the increasing complexity, there is a need to continuously improve the quality of the hardware design process. This leads designers to strive for more efficient data ...
- research-articleJanuary 2023
Accelerated Capacitance Simulation of 3-D Structures with Considerable Amounts of General Floating Metals
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation ConferencePages 346–351https://doi.org/10.1145/3566097.3567883Floating metals are special conductors introduced into conductor structures by design for manufacturing (DFM). They bring difficulty to accurate capacitance simulation. In this work, we aim to accelerate the floating random walk (FRW) based capacitance ...
- research-articleJanuary 2023
Fully Automated Machine Learning Model Development for Analog Placement Quality Prediction
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation ConferencePages 58–63https://doi.org/10.1145/3566097.3567881Analog integrated circuit (IC) placement is a heavily manual and time-consuming task that has a significant impact on chip quality. Several recent studies apply machine learning (ML) techniques to directly predict the impact of placement on circuit ...
- proceedingJanuary 2023
ASPDAC '23: Proceedings of the 28th Asia and South Pacific Design Automation Conference
ASP-DAC is a high-quality and premium conference on Electronic Design Automation (EDA) like other sister conferences such as Design Automation Conference (DAC), Design, Automation & Test in Europe (DATE), International Conference on Computer Aided Design ...