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Analyzing static and dynamic write margin for nanometer SRAMs

Published: 11 August 2008 Publication History

Abstract

This paper analyzes write ability for SRAM cells in deeply scaled technologies, focusing on the relationship between static and dynamic write margin metrics. Reliability has become a major concern for SRAM designs in modern technologies. Both local mismatch and scaled VDD degrade read stability and write ability. Several static approaches, including traditional SNM, BL margin, and the N-curve method, can be used to measure static write margin. However, static approaches cannot indicate the impact of dynamic dependencies on cell stability. We propose to analyze dynamic write ability by considering the write operation as a noise event that we analyze using dynamic stability criteria. We also define dynamic write ability as the critical pulse width for a write. By using this dynamic criterion, we evaluate the existing static write margin metrics at normal and scaled supply voltages and assess their limitations. The dynamic write time metric can also be used to improve the accuracy of VCCmin estimation for active VDD scaling designs.

References

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A. Bhavnagarwala et al. Fluctuation limits & scaling opportunities for CMOS SRAM cells. IEDM, 659--662, 2005.
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K. Zhang et al. A 3-GHz 70-Mb SRAM in 65-nm CMOS technology with integrated column-based dynamic power supply. IEEE J. Solid-State Circuits, 41(1):146--151, 2006.
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K. Takeda et al. Redefinition of write-margin for next-generation SRAM and write-margin monitoring circuit. ISSCC, 2602--2603, 2006.
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C. Wann et al. SRAM cell design for stability methodology. IEEE VLSI-TSA, 21--22, Aug 2004.
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E. Grossar et al. Read stability and write-ability analysis of SRAM cells for nanometer technologies. IEEE J. Solid-State Circuits, 41(11):2577--2588, Nov 2006.
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N. Gierczynski et al. A new combined methodology for write-margin extraction of advanced SRAM. IEEE Int. Conf. on Microelectronic Test Structures, 97--100, 2007.
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M. Khellah et al. Effect of power supply noise on SRAM dynamic stability. Symp. VLSI Circuits, 76--77, 2007.
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S. Mukhopadhyay et al. Modeling of failure probability and statistical design of SRAM array for yield enhancement in nanoscaled CMOS. IEEE Tran. Comput. Aided Des. Integr. Circuits Syst., 24(12):1859--1880, Dec 2005.
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Cited By

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  • (2024)Addressing Power Efficiency and Stability in SRAM: A 4x4 Cell Array Design with Enhanced Power GatingInternational Journal of Innovative Science and Research Technology (IJISRT)10.38124/ijisrt/IJISRT24SEP1230(1578-1584)Online publication date: 1-Oct-2024
  • (2024)Low-Power 8T Memory Cell of Register File for 180 nm TechnologyRadioelectronics and Communications Systems10.3103/S073527272310005966:12(658-666)Online publication date: 2-Dec-2024
  • (2024)A New 8T SRAM Cell Design of Low-Power and High-Write-Speed2024 3rd International Symposium on Semiconductor and Electronic Technology (ISSET)10.1109/ISSET62871.2024.10779965(473-476)Online publication date: 23-Aug-2024
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  1. Analyzing static and dynamic write margin for nanometer SRAMs

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      cover image ACM Conferences
      ISLPED '08: Proceedings of the 2008 international symposium on Low Power Electronics & Design
      August 2008
      396 pages
      ISBN:9781605581095
      DOI:10.1145/1393921
      Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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      Publication History

      Published: 11 August 2008

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      Author Tags

      1. SRAM
      2. VCCmin
      3. dynamic noise margin
      4. reliability
      5. static noise margin
      6. variation
      7. write margin

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      View all
      • (2024)Addressing Power Efficiency and Stability in SRAM: A 4x4 Cell Array Design with Enhanced Power GatingInternational Journal of Innovative Science and Research Technology (IJISRT)10.38124/ijisrt/IJISRT24SEP1230(1578-1584)Online publication date: 1-Oct-2024
      • (2024)Low-Power 8T Memory Cell of Register File for 180 nm TechnologyRadioelectronics and Communications Systems10.3103/S073527272310005966:12(658-666)Online publication date: 2-Dec-2024
      • (2024)A New 8T SRAM Cell Design of Low-Power and High-Write-Speed2024 3rd International Symposium on Semiconductor and Electronic Technology (ISSET)10.1109/ISSET62871.2024.10779965(473-476)Online publication date: 23-Aug-2024
      • (2024)Evaluation of various phase-transition materials for steep switching super-low power application in the latest technology nodeResults in Physics10.1016/j.rinp.2024.10761960(107619)Online publication date: May-2024
      • (2024)Design of polarity hardening SRAM for mitigating single event multiple node upsetsMicroelectronics Journal10.1016/j.mejo.2024.106214149:COnline publication date: 1-Jul-2024
      • (2024)Circuit-level design of radiation tolerant memory cellAEU - International Journal of Electronics and Communications10.1016/j.aeue.2023.155103175(155103)Online publication date: Feb-2024
      • (2024)Extended Write Margin Methodology for SRAM Subarray in Resistance-Dominated Technology NodeCircuit-Technology Co-Optimization of SRAM Design in Advanced CMOS Nodes10.1007/978-3-031-76109-6_3(57-76)Online publication date: 21-Dec-2024
      • (2024)SRAM Operations and Simulation Methodologies at Bitcell, Subarray, and Macro LevelsCircuit-Technology Co-Optimization of SRAM Design in Advanced CMOS Nodes10.1007/978-3-031-76109-6_2(23-55)Online publication date: 23-Oct-2024
      • (2023)A Novel Low-Power and Soft Error Recovery 10T SRAM CellMicromachines10.3390/mi1404084514:4(845)Online publication date: 13-Apr-2023
      • (2023)Analytical Model of SRAM VMin to Predict Reliability and Process Impact2023 IEEE International Integrated Reliability Workshop (IIRW)10.1109/IIRW59383.2023.10477717(1-4)Online publication date: 8-Oct-2023
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