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High-speed interconnect modeling and high-accuracy simulation using SPICE and finite element methods

Authors:

Tai-Yu Chou,

Jay Cosentino,

Zoltan J. CendesAuthors Info & Claims

DAC '93: Proceedings of the 30th international Design Automation Conference

Pages 684 - 690

https://doi.org/10.1145/157485.165091

Published: 01 July 1993 Publication History

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Lawrence Yang (2006)System Design Methodology of UltraSPARC&#8482; -I32nd Design Automation Conference10.1109/DAC.1995.250034(7-12)Online publication date: Dec-2006
https://doi.org/10.1109/DAC.1995.250034
Chou TCendes Z(2006)Capacitance calculation of IC packages using the finite element method and planes of symmetryIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/43.31090413:9(1159-1166)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/43.310904
Hsu TChiang KYu-Po Wang (2002)RFICs packages electrical performance comparison of both ULTRA-CSP and Standard TSOP4th Electronics Packaging Technology Conference, 2002.10.1109/EPTC.2002.1185591(25-31)Online publication date: 2002
https://doi.org/10.1109/EPTC.2002.1185591
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High-speed interconnect modeling and high-accuracy simulation using SPICE and finite element methods

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Published In

DAC '93: Proceedings of the 30th international Design Automation Conference

July 1993

768 pages

ISBN:0897915771

DOI:10.1145/157485

Chairman:
Alfred E. Dunlop
AT&T Bell Labs., Murray Hill, NJ

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

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Published: 01 July 1993

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DAC93: The 30th ACM/IEEE Design Automation Conference

June 14 - 18, 1993

Texas, Dallas, USA

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Lawrence Yang (2006)System Design Methodology of UltraSPARC&#8482; -I32nd Design Automation Conference10.1109/DAC.1995.250034(7-12)Online publication date: Dec-2006
https://doi.org/10.1109/DAC.1995.250034
Chou TCendes Z(2006)Capacitance calculation of IC packages using the finite element method and planes of symmetryIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/43.31090413:9(1159-1166)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/43.310904
Hsu TChiang KYu-Po Wang (2002)RFICs packages electrical performance comparison of both ULTRA-CSP and Standard TSOP4th Electronics Packaging Technology Conference, 2002.10.1109/EPTC.2002.1185591(25-31)Online publication date: 2002
https://doi.org/10.1109/EPTC.2002.1185591
McFee SGiannacopoulos D(2000)The implications of adaptive finite element analysis on electromagnetic simulation for microelectronic system interconnections42nd Midwest Symposium on Circuits and Systems (Cat. No.99CH36356)10.1109/MWSCAS.1999.867272(325-332)Online publication date: 2000
https://doi.org/10.1109/MWSCAS.1999.867272
Horng TWu SShih C(1999)Electrical modeling of RFIC packages up to 12 GHz1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)10.1109/ECTC.1999.776284(867-872)Online publication date: 1999
https://doi.org/10.1109/ECTC.1999.776284
Beker BHirsch T(1997)Numerical and experimental modeling of high-speed cables and interconnects1997 Proceedings 47th Electronic Components and Technology Conference10.1109/ECTC.1997.606276(898-904)Online publication date: 1997
https://doi.org/10.1109/ECTC.1997.606276
Poddar RBrooke M(1996)Accurate, high speed modeling of integrated passive devices in multichip modulesElectrical Performance of Electronic Packaging10.1109/EPEP.1996.564825(184-186)Online publication date: 1996
https://doi.org/10.1109/EPEP.1996.564825
Yang LGao DMostoufi JJoshi RLoewenstein PPreas B(1995)System design methodology of ultraSPARC-IProceedings of the 32nd annual ACM/IEEE Design Automation Conference10.1145/217474.217481(7-12)Online publication date: 1-Jan-1995
https://dl.acm.org/doi/10.1145/217474.217481
Ouda MSebak A(1995)Efficient method for frequency dependent inductance and resistance calculationsIEEE WESCANEX 95. Communications, Power, and Computing. Conference Proceedings10.1109/WESCAN.1995.494076(473-477)Online publication date: 1995
https://doi.org/10.1109/WESCAN.1995.494076
Singh DRabaey JPedram MCatthoor FRajgopal SSehgal NMozdzen T(1995)Power conscious CAD tools and methodologies: a perspectiveProceedings of the IEEE10.1109/5.37196783:4(570-594)Online publication date: Apr-1995
https://doi.org/10.1109/5.371967
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A Numerical Study of FETI Algorithms for Mortar Finite Element Methods

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A Numerical Study of FETI Algorithms for Mortar Finite Element Methods

A Numerical Study of FETI Algorithms for Mortar Finite Element Methods

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