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3D integrated circuits: designing in a new dimension

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Robert PattiAuthors Info & Claims

ICCAD '12: Proceedings of the International Conference on Computer-Aided Design

Page 274

https://doi.org/10.1145/2429384.2429439

Published: 05 November 2012 Publication History

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Abstract

Moore's law predicted the sustained scaling the semiconductor industry has enjoyed for decades, but in the coming decade the limits of physics will force the pace of geometric scaling to slow and perhaps all but stop. In the face of this issue, the electronics industry needs alternatives that can give end consumers the continual increase in function and reduction in cost that they have come to expect. 3D integrated circuits have emerged as the near term solution to mitigate the roll-off of geometric semiconductor scaling.

The power of 3D circuit integration comes from its ability to reduce wire length. The ramifications of this are more numerous and powerful than one might initially realize. The shortened wires improve speed and reduce power, but they also allow new combinations of technologies optimized for the performance of specific circuitry. 3D wiring changes alone might provide a 5--30% device improvement, but combining disparate circuit types and using 3D optimized architectures could enable 100--500% improvements.

This paper discusses the benefits of 3D and the methods of producing various types of 3D and examines various examples ranging from imagers to exascale computing memories. It also presents an overview of the new requirements that 3D EDA tools must address to effectively handle 3D integration and describes some of the tools that are already available.

Index Terms

3D integrated circuits: designing in a new dimension
1. Applied computing
  1. Arts and humanities
    1. Architecture (buildings)
      1. Computer-aided design
  2. Physical sciences and engineering
    1. Engineering
      1. Computer-aided design
2. Hardware

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ICCAD '12: Proceedings of the International Conference on Computer-Aided Design

November 2012

781 pages

ISBN:9781450315739

DOI:10.1145/2429384

General Chair:
Alan J. Hu
Univ. of British Columbia, Vancouver, BC, Canada

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 05 November 2012

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ICCAD '12

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SIGDA

ICCAD '12: The International Conference on Computer-Aided Design

November 5 - 8, 2012

California, San Jose

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Overall Acceptance Rate 457 of 1,762 submissions, 26%

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Power gating topologies in TSV based 3D integrated circuits

Advances in 3D integrated circuits

Integrated Circuits 3D Silicon Integration

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