research-article

Predictability for timing and temperature in multiprocessor system-on-chip platforms

Authors:

Iuliana Bacivarov, and

Hoeseok YangAuthors Info & Claims

ACM Transactions on Embedded Computing Systems (TECS), Volume 12, Issue 1s

Article No.: 48, Pages 1 - 25

https://doi.org/10.1145/2435227.2435244

Published: 21 March 2013 Publication History

Abstract

High computational performance in multiprocessor system-on-chips (MPSoCs) is constrained by the ever-increasing power densities in integrated circuits, so that nowadays MPSoCs face various thermal issues. For instance, high chip temperatures may lead to long-term reliability concerns and short-term functional errors. Therefore, the new challenge in designing embedded real-time MPSoCs is to guarantee the final performance and correct function of the system, considering both functional and non-functional properties. One way to achieve this is by ruling out mapping alternatives that do not fulfill requirements on performance or peak temperature already in early design stages. In this article, we propose a thermal-aware optimization framework for mapping real-time applications onto MPSoC platforms. The performance and temperature of mapping candidates are evaluated by formal temporal and thermal analysis models. To this end, analysis models are automatically generated during design space exploration, based on the same specifications as used for software synthesis. The analysis models are automatically calibrated with performance data reflecting the execution of the system on the target platform. The data is automatically obtained prior to design space exploration based on a set of benchmark mappings. Case studies show that the performance and temperature requirements are often conflicting goals and optimizing them together leads to major benefits in terms of a guaranteed and predictable high performance.

References

[1]

Atienza, D. et al. 2007. HW-SW emulation framework for temperature-aware design in MPSoCs. ACM Trans. Des. Autom. Electron. Syst. 12, 3, 1--26.

Digital Library

[2]

Bacivarov, I., Haid, W., Huang, K., and Thiele, L. 2010. Methods and tools for mapping process networks onto multi-processor systems-on-chip. In Handbook of Signal Processing Systems, S. S. Bhattacharyya, E. F. Deprettere, R. Leupers, and J. Takala, Eds., Springer, New York, NY, 1007--1040.

[3]

Bartolini, A., Cacciari, M., Tilli, A., Benini, L., and Gries, M. 2010. A virtual platform environment for exploring power, thermal and reliability management control strategies in high-performance multicores. In Proceedings of the Great Lakes Symposium on VLSI (GLSVLSI). ACM, 311--316.

Digital Library

[4]

Benini, L., Bertozzi, D., Bogliolo, A., Menichelli, F., and Olivieri, M. 2005. MPARM: exploring the multi-processor SOC design space with SystemC. J. VLSI Signal Process 41, 2, 169--182.

Digital Library

[5]

Birkhoff, G. and Varga, R. S. 1958. Reactor criticality and nonnegative matrices. J. Soc. Ind. Appl. Math. 6, 4, 354--377.

[6]

Brooks, D. and Martonosi, M. 2001. Dynamic thermal management for high-performance microprocessors. In Proceedings of the International Symposium on High-Performance Computer Architecture (HPCA). IEEE, 171--182.

Digital Library

[7]

Chantem, T., Dick, R. P., and Hu, X. S. 2008. Temperature-aware scheduling and assignment for hard real-time applications on MPSoCs. In Proceedings of the Design, Automation and Test in Europe Conference (DATE). ACM/IEEE.

Digital Library

[8]

Coskun, A. K., Rosing, T. S., and Whisnant, K. 2007. Temperature aware task scheduling in MPSoCs. In Proceedings of the Design, Automation and Test in Europe Conference (DATE). ACM/IEEE.

Digital Library

[9]

Donald, J. and Martonosi, M. 2006. Techniques for multicore thermal management: classification and new exploration. In Proceedings of the International Symposium on Computer Architecture (ISCA). IEEE.

Digital Library

[10]

Friedland, B. 1986. Control Systems Design: An Introduction to State-Space Methods. McGraw-Hill, New York, NY.

Digital Library

[11]

Garcia del Valle, P. and Atienza, D. 2010. Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling. Microelectron. J. 41, 10, 1--9.

Digital Library

[12]

Gupta, R. et al. 1997. The Elmore Delay as a bound for RC trees with generalized input signals. IEEE Trans. Comput.-Aided Design Integr. Circuits Syst. 16, 95--104.

Digital Library

[13]

Hardavellas, N., Ferdman, M., Falsafi, B., and Ailamaki, A. 2011. Toward dark silicon in servers. IEEE Micro 31, 4, 6--15.

Digital Library

[14]

Henia, R., Hamann, A., Jersak, M., Racu, R., Richter, K., and Ernst, R. 2005. System level performance analysis - The SymTA/S approach. IEEE Proc. Comput. Digital Techniq. 152, 2, 148--166.

[15]

Huang, K., Haid, W., Bacivarov, I., Keller, M., and Thiele, L. 2012. Embedding formal performance analysis into the design cycle of MPSoCs for real-time streaming applications. ACM Trans. Embedd. Comput. Syst. 11, 1, 8:1--8:23.

Digital Library

[16]

Huang, W., Ghosh, S., Velusamy, S., Sankaranarayanan, K., Skadron, K., and Stan, M. 2006. HotSpot: A compact thermal modeling methodology for early-stage VLSI design. IEEE Trans. VLSI Syst. 14, 5, 501--513.

Digital Library

[17]

Kahle, J. A., Day, M. N., Hofstee, H. P., Johns, C. R., Maeurer, T. R., and Shippy, D. 2005. Introduction to the cell multiprocessor. IBM J. Res. Develop. 49, 4.5, 589--604.

Digital Library

[18]

Kangas, T., Kukkala, P., Orsila, H., Salminen, E., Hännikäinen, M., Hämäläinen, T. D., Riihimäki, J., and Kuusilinna, K. 2006. UML-based multiprocessor SoC design framework. ACM Trans. Embedd. Comput. Syst. 5, 281--320.

Digital Library

[19]

Kienhuis, B., Deprettere, E., Vissers, K., and van der Wolf, P. 1997. An approach for quantitative analysis of application-specific dataflow architectures. In Proceedings of the International Conference on Application-Specific Systems, Architectures and Processors (ASAP). IEEE, 338--349.

Digital Library

[20]

Krum, A. 2000. Thermal management. In The CRC Handbook of Thermal Engineering, F. Kreith, Ed., CRC Press, Boca Raton, FL, 1--92.

[21]

Kumar, A., Shang, L., Peh, L., and Jha, N. 2006. HybDTM: A coordinated hardware-software approach for dynamic thermal management. In Proceedings of the Design Automation Conference (DAC). ACM, San Francisco, 548--553.

Digital Library

[22]

Künzli, S., Hamann, A., Ernst, R., and Thiele, L. 2007. Combined approach to system level performance analysis of embedded systems. In Proceedings of the International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS). ACM.

Digital Library

[23]

Le Boudec, J.-Y. and Thiran, P. 2001. Network calculus: A theory of deterministic queuing systems for the internet. Lecture Notes In Computer Science, vol. 2050, Springer, Berlin.

Digital Library

[24]

Lee, E. and Messerschmitt, D. 1987. Synchronous data flow. Proc. IEEE 75, 9, 1235--1245.

[25]

Liu, Y. et al. 2007. Accurate temperature-dependent integrated circuit leakage power estimation is easy. In Proceedings of the Design, Automation and Test in Europe Conference (DATE). ACM/IEEE.

Digital Library

[26]

Loh, G. H. 2008. 3D-stacked memory architectures for multi-core processors. In Proceedings of the International Symposium on Computer Architecture (ISCA). IEEE, 453--464.

Digital Library

[27]

Maeda, H., Kodama, S., and Kajiya, F. 1977. Compartmental system analysis: Realization of a class of linear systems with physical constraints. IEEE Trans. Circuits Syst. 24, 1, 8--14.

[28]

Paolucci, P. S., Jerraya, A. A., Leupers, R., Thiele, L., and Vicini, P. 2006. SHAPES:: A tiled scalable software hardware architecture platform for embedded systems. In Proceedings of the International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS). ACM, 167--172.

Digital Library

[29]

Pimentel, A. 2008. The Artemis Workbench for system-level performance evaluation of embedded systems. Int. J. Embed. Syst. 3, 3, 181--196.

[30]

Rai, D., Yang, H., Bacivarov, I., Chen, J.-J., and Thiele, L. 2011. Worst-case temperature analysis for real-time systems. In Proceedings of the Design, Automation and Test in Europe Conference (DATE). ACM/IEEE.

[31]

Schor, L., Bacivarov, I., Yang, H., and Thiele, L. 2012. Worst-case temperature guarantees for real-time applications on multi-core systems. In Proceedings of the IEEE Real-Time and Embedded Technology and Applications Symposium (RTAS). IEEE.

Digital Library

[32]

Skadron, K., Stan, M. R., Sankaranarayanan, K., Huang, W., Velusamy, S., and Tarjan, D. 2004. Temperature-Aware Microarchitecture: Modeling and Implementation. ACM Trans. Architec. Code Optim. 1, 1, 94--125.

Digital Library

[33]

Sridhar, M., Raj, A., Vincenzi, A., Ruggiero, M., Brunschwiler, T., and Atienza Alonso, D. 2010. 3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling. In Proceedings of the International Conference on Computer-Aided Design (ICCAD). ACM/IEEE, 463--470.

Digital Library

[34]

Thiele, L., Bacivarov, I., Haid, W., and Huang, K. 2007. Mapping applications to tiled multiprocessor embedded systems. In Proceedings of the International Conference on Application of Concurrency to System Design (ACSD). IEEE, 29--40.

Digital Library

[35]

Thiele, L., Chakraborty, S., and Naedele, M. 2000. Real-time calculus for scheduling hard real-time systems. In Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS) Vol. 4., IEEE, 101--104.

[36]

Thiele, L., Schor, L., Yang, H., and Bacivarov, I. 2011. Thermal-aware system analysis and software synthesis for embedded multi-processors. In Proceedings of the Design Automation Conference (DAC). ACM, 268--273.

Digital Library

[37]

Wandeler, E., Thiele, L., Verhoef, M., and Lieverse, P. 2006. System architecture evaluation using modular performance analysis: A case study. Int. Softw. Tools Technol. Transfer 8, 6, 649--667.

Digital Library

[38]

Watanabe, Y., Davis, J. D., and Wood, D. A. 2010. WiDGET: Wisconsin decoupled grid execution tiles. In Proceedings of the International Symposium on Computer Architecture (ISCA). ACM, 2--13.

Digital Library

[39]

Wilhelm, R. et al. 2008. The worst-case execution-time problem -- Overview of methods and survey of tools. ACM Trans. Embedd. Comput. Syst. 7, 1--53.

Digital Library

[40]

Wu, C.-W. and Chang, C.-T. 1993. FFT butterfly network design for easy testing. IEEE Trans. Circuits Syst. II: Analog Digital Signal Proces. 40, 2, 110--115.

[41]

Xie, Y. and Hung, W.-l. 2006. Temperature-aware task allocation and scheduling for embedded multiprocessor systems-on-chip (MPSoC) design. J. VLSI Signal Process. 45, 3, 177--189.

Digital Library

[42]

Yang, C.-Y., Chen, J.-J., Thiele, L., and Kuo, T.-W. 2010. Energy-efficient real-time task scheduling with temperature-dependent leakage. In Proceedings of the Design, Automation and Test in Europe Conference (DATE). ACM/IEEE, Dresden, Germany, 9--14.

Digital Library

[43]

Zhao, M., Childers, B. R., and Soffa, M. L. 2005. A model-based framework: An approach for profit-driven optimization. In Proceedings of the International Symposium on Code Generation and Optimization (CGO). ACM/IEEE, 317--327.

Digital Library

[44]

Zhu, C., Gu, Z., Shang, L., Dick, R., and Joseph, R. 2008. Three-dimensional chip-multiprocessor run-time thermal management. IEEE Trans. Comput.-Aided Design Integr. Circuits Syst. 27, 8, 1479--1492.

Digital Library

Cited By

Cheng LHuang KChen GBing ZKnoll A(2019)Adaptive Periodic Thermal Management for Pipelined Hard Real-Time SystemsIEEE Access10.1109/ACCESS.2019.29353397(114731-114746)Online publication date: 2019
https://doi.org/10.1109/ACCESS.2019.2935339
Cheng LHuang KChen GHu BKnoll AFanucci LTeich J(2016)Minimizing peak temperature for pipelined hard real-time systemsProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2972062(1090-1095)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2972062
Nouri ABozga MBensalem S(2016)Building Faithful Embedded Systems Models: Challenges and OpportunitiesModel-Implementation Fidelity in Cyber Physical System Design10.1007/978-3-319-47307-9_1(1-24)Online publication date: 10-Dec-2016
https://doi.org/10.1007/978-3-319-47307-9_1
Show More Cited By

Index Terms

Predictability for timing and temperature in multiprocessor system-on-chip platforms

Recommendations

Temperature-aware Real-Time Scheduling - Extended Abstract
QEST '11: Proceedings of the 2011 Eighth International Conference on Quantitative Evaluation of SysTems

Power density has been continuously increasing in modern processors, leading to high on-chip temperatures. A system could fail if the operating temperature exceeds a certain threshold, leading to low reliability and even chip burnout. Recently, many ...
Read More
A lightweight software-based runtime temperature monitoring model for multiprocessor embedded systems
SBCCI '16: Proceedings of the 29th Symposium on Integrated Circuits and Systems Design: Chip on the Mountains

High-thermal variation and temperature operation can have a noteworthy impact on system performance, power consumption and reliability, which is a major and increasingly critical design metric in emerging multiprocessor embedded systems. Existing ...
Read More
A Torus-Based Hierarchical Optical-Electronic Network-on-Chip for Multiprocessor System-on-Chip

Networks-on-chip (NoCs) are emerging as a key on-chip communication architecture for multiprocessor systems-on-chip (MPSoCs). Optical communication technologies are introduced to NoCs in order to empower ultra-high bandwidth with low power consumption. ...
Read More

Comments

Information & Contributors

Information

Published In

cover image ACM Transactions on Embedded Computing Systems

ACM Transactions on Embedded Computing Systems Volume 12, Issue 1s

Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems

March 2013

701 pages

ISSN:1539-9087

EISSN:1558-3465

DOI:10.1145/2435227

Issue’s Table of Contents

Copyright © 2013 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Publisher

Association for Computing Machinery

New York, NY, United States

Journal Family

ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 21 March 2013

Accepted: 01 June 2012

Revised: 01 March 2012

Received: 01 November 2011

Published in TECS Volume 12, Issue 1s

Permissions

Request permissions for this article.

Request Permissions

Check for updates

Author Tags

Qualifiers

Research-article
Research
Refereed

Funding Sources

Seventh Framework Programme

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

8
Total Citations
View Citations
267
Total Downloads

Downloads (Last 12 months)5
Downloads (Last 6 weeks)0

Other Metrics

View Author Metrics

Citations

Cited By

Cheng LHuang KChen GBing ZKnoll A(2019)Adaptive Periodic Thermal Management for Pipelined Hard Real-Time SystemsIEEE Access10.1109/ACCESS.2019.29353397(114731-114746)Online publication date: 2019
https://doi.org/10.1109/ACCESS.2019.2935339
Cheng LHuang KChen GHu BKnoll AFanucci LTeich J(2016)Minimizing peak temperature for pipelined hard real-time systemsProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2972062(1090-1095)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2972062
Nouri ABozga MBensalem S(2016)Building Faithful Embedded Systems Models: Challenges and OpportunitiesModel-Implementation Fidelity in Cyber Physical System Design10.1007/978-3-319-47307-9_1(1-24)Online publication date: 10-Dec-2016
https://doi.org/10.1007/978-3-319-47307-9_1
Castrillon JThiele LSchorr LSheng WJuurlink BAlvarez-Mesa MPohl AJessenberger RReyes VLeupers RNebel WAtienza D(2015)Multi/many-core programmingProceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition10.5555/2755753.2757208(1708-1717)Online publication date: 9-Mar-2015
https://dl.acm.org/doi/10.5555/2755753.2757208
Tilli ABartolini ACacciari MBenini L(2015)Guaranteed Computational Resprinting via Model-Predictive ControlACM Transactions on Embedded Computing Systems10.1145/272471514:3(1-26)Online publication date: 21-Apr-2015
https://dl.acm.org/doi/10.1145/2724715
Schor LBacivarov IMurillo LPaolucci PRousseau FAntably ABuecs RFournel NLeupers RRai DThiele LTosoratto LVicini PWeinstock J(2014)EURETILE Design FlowProceedings of the 2014 IEEE International Symposium on Parallel and Distributed Processing with Applications10.1109/ISPA.2014.32(182-189)Online publication date: 26-Aug-2014
https://dl.acm.org/doi/10.1109/ISPA.2014.32
Cox MSingh AKumar ACorporaal H(2013)Thermal-aware mapping of streaming applications on 3D Multi-Processor SystemsThe 11th IEEE Symposium on Embedded Systems for Real-time Multimedia10.1109/ESTIMedia.2013.6704498(11-20)Online publication date: Oct-2013
https://doi.org/10.1109/ESTIMedia.2013.6704498
Schor LBacivarov IYang HThiele L(2013)Efficient Worst-Case Temperature Evaluation for Thermal-Aware Assignment of Real-Time Applications on MPSoCsJournal of Electronic Testing: Theory and Applications10.1007/s10836-013-5397-529:4(521-535)Online publication date: 1-Aug-2013
https://dl.acm.org/doi/10.1007/s10836-013-5397-5

View Options

Get Access

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Full Access

Get this Article

View options

PDF

View or Download as a PDF file.

eReader

View online with eReader.

Media

Figures

Other

Tables

View Issue’s Table of Contents