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Dealing with inductance in high-speed chip design

Published: 01 June 1999 Publication History
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References

[1]
P. J. Restle, K. A. Jenkins, A. Deutsch and P. W. Cook, "Measurement and Modeling of On-Chip l'ranslnission-Line Effects in a 4~10 Ml-lz Microprocessor." IEEE .lou~71al ~?f Solid-State ('ireuits. Vol. 33 No. 4, pp. 662-665. Apr. 1998.
[2]
P. J. Restle. A. Deutsch, "Designing the Best Clock Distribution Network",S~vmposium on I.ZSI (~ireuits Digest of Technical Papers, Jtme '98, pp. 2-5. tkmolulu. HI
[3]
A. E. Ruehli. "Inductance Calculntions in a C.omplex Integrated Circuit l:',nvironment", IBAt.I. Res. Devehq~. Vol. 16. pp. 47()-481, Sept. 1972.
[4]
M. Kamon. F. Wang, J. White, "Recent hnprovements tbr Fast Inductance Extraction ond Simulation", h~ Digest ~?f Electr. Pe~.'f. Electronic Packaging, Vol 7, pp. 281-284, Oct. 1998. West Point, NY.
[5]
A. E. Ruehli, "Equivalent Circuit Models tbr Three Dimensional Multi-Conductor Systems", IEEE 7)'ans. ~?f A ticro,ave Theorv and Techniques, MTT-22 (3), pp. 216-221 March. 1974.
[6]
J.N. Burghartz, A. E. Ruehli, K. A. Jel~kins, M. Soyuer, D. Nguyen-Ngoc, "Novel Substrate Contact for High-Q Silicon-hltegrated Spiral Inductors", IEDM Technical Digest, Dec. 1997, pp. 55-58.
[7]
D. Edelstein et. al., "Full Copper Wiring in a Sub-0.25 lm CM()S ULSI Teclmology", IEEE Inter. Electron Den,ice A leering Tech. Dig. pp. 773-6, Dec. 1997
[8]
A. Deutsch, G. V. Kopcsay, P. Restle, et al, "When are Transmission-I_,ine Effects Important for On Chip Intercom~ections'?", IEEE Trans. Microwave Theoty Teeh. (USA) Vol. 45, No. I0, pt. 2, pp. 1836-46, Oct. 1997.
[9]
Yehia Massoud, Steve Maiors, Tareq Bustami, Jacob White, "I~avout Tectmiques for Minimizing On-Chip Interco~mect Sell'-hlductance", Proceedings of Design Automation Conf., pp 566-571, June 1998. Sml Fransico CA.

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  • (2016)On-Chip Power Distribution NetworksOn-Chip Power Delivery and Management10.1007/978-3-319-29395-0_8(129-144)Online publication date: 27-Apr-2016
  • (2013)ReferencesFoundations of Interconnect and Microstrip Design10.1002/9781118894514.refs(475-497)Online publication date: 8-Dec-2013
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cover image ACM Conferences
DAC '99: Proceedings of the 36th annual ACM/IEEE Design Automation Conference
June 1999
1000 pages
ISBN:1581131097
DOI:10.1145/309847
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 01 June 1999

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Cited By

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  • (2018)General Issues of Gate-Level Simulation and Optimization of Digital Circuits with Consideration of Destabilizing FactorsSimulation and Optimization of Digital Circuits10.1007/978-3-319-71637-4_1(1-75)Online publication date: 13-Apr-2018
  • (2016)On-Chip Power Distribution NetworksOn-Chip Power Delivery and Management10.1007/978-3-319-29395-0_8(129-144)Online publication date: 27-Apr-2016
  • (2013)ReferencesFoundations of Interconnect and Microstrip Design10.1002/9781118894514.refs(475-497)Online publication date: 8-Dec-2013
  • (2012)Reduction of Signal Overshoots in High-Speed Interconnects Using Adjacent Ground TracksJournal of Electromagnetic Waves and Applications10.1163/15693931079128521824:7(941-950)Online publication date: 3-Apr-2012
  • (2011)Myth bustersProceedings of the International Conference on Computer-Aided Design10.5555/2132325.2132394(271-275)Online publication date: 7-Nov-2011
  • (2010)Analysis of high-performance clock networks with RLC and transmission line effectsProceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction10.1145/1811100.1811113(51-58)Online publication date: 13-Jun-2010
  • (2005)Impact of On-chip Inductance on Power Distribution Network Design for Nanometer Scale Integrated CircuitsProceedings of the 6th International Symposium on Quality of Electronic Design10.1109/ISQED.2005.64(346-351)Online publication date: 21-Mar-2005
  • (2003)A metric for analyzing effective on-chip inductive couplingProceedings of the 2003 Asia and South Pacific Design Automation Conference10.1145/1119772.1119803(156-161)Online publication date: 21-Jan-2003
  • (2002)Signal IntegrityJournal of Electronic Testing: Theory and Applications10.1023/A:101651412929618:4-5(539-554)Online publication date: 1-Aug-2002
  • (2002)Physical Verification and Design Sign-offSystem-on-a-Chip Verification10.1007/0-306-46995-2_8(347-358)Online publication date: 2002
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