Article

Analysis of non-uniform temperature-dependent interconnect performance in high performance ICs

Authors:

Kaustav Banerjee,

Massoud Pedram,

Lukas P. P. P. van GinnekenAuthors Info & Claims

DAC '01: Proceedings of the 38th annual Design Automation Conference

Pages 567 - 572

https://doi.org/10.1145/378239.379025

Published: 22 June 2001 Publication History

Abstract

Non-uniform temperature profiles along global interconnect lines in high-performance ICs can significantly impact the performance of these lines. This paper presents a detailed analysis and modeling of the interconnect performance degradation due to non-uniform temperature profiles that exist along their lengths, which in turn arise due to the thermal gradients in the underlying substrate. A non-uniform temperature-dependent distributed RC interconnect delay model is proposed for the first time. The model has been applied to a wide variety of interconnect layouts and temperature distributions to quantify the impact on signal integrity issues including clock skew fluctuations.

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Wang JCai YZhou Q(2021)Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid NetworksJournal of Computer Science and Technology10.1007/s11390-021-0909-836:5(1133-1144)Online publication date: 30-Sep-2021
https://doi.org/10.1007/s11390-021-0909-8
Jiang JParto KCao WBanerjee K(2019)Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and ChallengesIEEE Journal of the Electron Devices Society10.1109/JEDS.2019.29251507(878-887)Online publication date: 2019
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cover image ACM Conferences

DAC '01: Proceedings of the 38th annual Design Automation Conference

June 2001

863 pages

ISBN:1581132972

DOI:10.1145/378239

Chairman:
Jan Rabaey
Univ. of California

Copyright © 2001 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 22 June 2001

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Cited By

Chee YEtzion TKiah HVardy A(2021)Domination mappings into the hamming ball: Existence, constructions, and algorithmsAdvances in Mathematics of Communications10.3934/amc.2021036(0)Online publication date: 2021
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Wang JCai YZhou Q(2021)Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid NetworksJournal of Computer Science and Technology10.1007/s11390-021-0909-836:5(1133-1144)Online publication date: 30-Sep-2021
https://doi.org/10.1007/s11390-021-0909-8
Jiang JParto KCao WBanerjee K(2019)Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and ChallengesIEEE Journal of the Electron Devices Society10.1109/JEDS.2019.29251507(878-887)Online publication date: 2019
https://doi.org/10.1109/JEDS.2019.2925150
Bhattacharya SDas DRahaman H(2019)Analysis of Temperature-Dependent Crosstalk for Graphene Nanoribbon and Copper InterconnectsIETE Journal of Research10.1080/03772063.2019.167419368:3(1789-1800)Online publication date: 20-Oct-2019
https://doi.org/10.1080/03772063.2019.1674193
Ravelo BThakur ASaini AThakur P(2019)Temperature Effect Analysis on Microstrip StructureAnalytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution10.1007/978-981-15-0552-2_11(215-229)Online publication date: 22-Nov-2019
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Chee YEtzion TKiah HVardy A(2018)Cooling CodesIEEE Transactions on Information Theory10.1109/TIT.2017.277124564:4-P2(3062-3085)Online publication date: 1-Apr-2018
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Jiang JParto KCao WBanerjee K(2018)Monolithic-3D Integration with 2D Materials: Toward Ultimate Vertically-Scaled 3D-ICs2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)10.1109/S3S.2018.8640131(1-3)Online publication date: Oct-2018
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Sabry MAtienza D(2014)Temperature-Aware Design and Management for 3D Multi-Core ArchitecturesFoundations and Trends in Electronic Design Automation10.1561/10000000328:2(117-197)Online publication date: 27-Jan-2014
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Merkel CKudithipudi D(2014)Temperature Sensing RRAM Architecture for 3-D ICsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2013.225637822:4(878-887)Online publication date: 1-Apr-2014
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Jun Yong Shin Dutt NKurdahi F(2013)Vision-inspired global routing for enhanced performance and reliabilityInternational Symposium on Quality Electronic Design (ISQED)10.1109/ISQED.2013.6523616(239-244)Online publication date: Mar-2013
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