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Predictive dynamic thermal management for multimedia applications

Published: 23 June 2003 Publication History

Abstract

Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cooling costs for general-purpose processors. However, when invoked, these techniques result in a significant performance degradation. This paper concerns performance-effective DTM for multimedia applications. We make two contributions: (1) Current DTM algorithms are reactive in nature. We propose a predictive DTM algorithm targeted at multimedia applications, which allows the efficient use of response mechanisms that have high invocation overhead. We find that for our applications, our predictive algorithm performs significantly better than existing reactive DTM algorithms. (2) We evaluate the effectiveness of different DTM response mechanisms. Specifically, we demonstrate the importance of tailoring DTM response mechanisms to the thermal "hot-spots" on the chip and the current thermal limit, and show that a predictive combination of architecture adaptation and dynamic voltage scaling (DVS) performs the best across a broad range of applications and thermal limits.

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  • (2024)NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN PerformanceACM Transactions on Embedded Computing Systems10.1145/367717823:6(1-30)Online publication date: 11-Sep-2024
  • (2023)An Application-Oriented Approach to Designing Hybrid CPU Architectures2023 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)10.1109/ISPASS57527.2023.00018(92-102)Online publication date: Apr-2023
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  1. Predictive dynamic thermal management for multimedia applications

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    Published In

    cover image ACM Conferences
    ICS '03: Proceedings of the 17th annual international conference on Supercomputing
    June 2003
    380 pages
    ISBN:1581137338
    DOI:10.1145/782814
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    New York, NY, United States

    Publication History

    Published: 23 June 2003

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    Author Tags

    1. adaptive architectures
    2. low power
    3. thermal management

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    ICS03
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    ICS03: International Conference on Supercomputing 2003
    June 23 - 26, 2003
    CA, San Francisco, USA

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    ICS '03 Paper Acceptance Rate 36 of 171 submissions, 21%;
    Overall Acceptance Rate 629 of 2,180 submissions, 29%

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    Cited By

    View all
    • (2024)NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN PerformanceACM Transactions on Embedded Computing Systems10.1145/367717823:6(1-30)Online publication date: 11-Sep-2024
    • (2023)An Application-Oriented Approach to Designing Hybrid CPU Architectures2023 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)10.1109/ISPASS57527.2023.00018(92-102)Online publication date: Apr-2023
    • (2023)Speculative Register Reclamation2023 IEEE International Symposium on High-Performance Computer Architecture (HPCA)10.1109/HPCA56546.2023.10071122(1182-1194)Online publication date: Feb-2023
    • (2023)A Thermal-Aware Scheduling Algorithm for Reducing Thermal Risks in DAG-Based Applications in Cyber-Physical SystemsUbiquitous Security10.1007/978-981-99-0272-9_34(497-508)Online publication date: 16-Feb-2023
    • (2023)Recent Trends in Artificial Intelligence-Inspired Electronic Thermal management—A ReviewRecent Advances in Thermal Sciences and Engineering10.1007/978-981-19-7214-0_13(165-175)Online publication date: 6-May-2023
    • (2021)Thermal Aware Power Save Policy For Hot And Cold Jobs2021 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT)10.1109/CONECCT52877.2021.9622715(1-7)Online publication date: 9-Jul-2021
    • (2020)Temperature-Aware DRAM Cache Management—Relaxing Thermal Constraints in 3-D SystemsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2019.292752839:10(1973-1986)Online publication date: Oct-2020
    • (2020)Power, Performance And Thermal Management Using Hardware Performance Counters2020 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT)10.1109/CONECCT50063.2020.9198372(1-7)Online publication date: Jul-2020
    • (2019)Understanding the Impact of Socket Density in Density Optimized Servers2019 IEEE International Symposium on High Performance Computer Architecture (HPCA)10.1109/HPCA.2019.00066(687-700)Online publication date: Feb-2019
    • (2018)Scheduling based energy optimization technique in multiprocessor embedded systems2018 International Conference on Engineering and Emerging Technologies (ICEET)10.1109/ICEET1.2018.8338643(1-8)Online publication date: Feb-2018
    • Show More Cited By

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