US 20130079618Al

( 19) United Sta tes

( 12) Pa tent Applica tion Publica tion ( 10) Pub. N 0. : US 2013/0079618 A1
Sa ndmore et a l. ( 4 3) Pub. D a te: Ma r. 28, 2013
( 5 4 ) TECHN IQUE FOR REMAN UFACTURIN GA ( 5 2) US. Cl.
BIS SEN SOR USPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600/393; 29/4 0208
( 5 7) ABSTRACT
( 75 ) Inv entors : D onf lld R s a ndmore L y ons CO ( Us ) ; Rema nuf a ctured BIS s ens ors a nd meth ods f or rema nuf a ctur
D a v ld P Bes k o Th ornton CO ( Us ) ing us ed BIS s ens ors a re prov ided. Such a rema nuf a ctured
s ens or ma y include certa in components f rom a us ed medica l
( 73) As s ig nee: N ellcor Purita n Bennett L L C, Boulder, s ens or a nd certa in neW components . For ex a mple, a rema nu
CO ( U S) f a ctured BIS s ens or ma y include a ba ck ing la y er a nd a t lea s t
? rs t, s econd, a nd th ird electrodes dis pos ed on th e ba ck ing
( 21) APPI' N O; 13/24 5 , 04 0 la y er h a v ing a conductiv e ink . Th e ? rs t, s econd, a nd th ird
electrodes a re a da pted to be in electrica l conta ct With a pa tient
_ to perf orm BIS mea s urements . A f oa m la y er ma y be dis pos ed
( 22) Flled: s ep 26 2011 on a t lea s t a portion of th e ba ck ing la y er, a nd a n a dh es iv e ma y
be a tta ch ed to th e f oa m la y er a nd is con? g ured to s ecure th e
Publica tion Cla s s i? ca tion rema nuf a ctured BIS s ens or to th e pa tient. Th e ? rs t electrode,
th e s econd electrode, th e th ird electrode, th e ba ck ing la y er, or
( 5 1) Int. Cl. a combina tion th ereof , ma y be neW a nd th e f oa m la y er, th e
A61B 5 /04 ( 2006. 01) a dh es iv e, or a combina tion th ereof , ma y be f rom a us ed medi
B23P 6/00 ( 2006. 01) ca l s ens or.
Pa tent Applica tion Publica tion Ma r. 28, 2013 Sh eet 1 0f 15 US 2013/0079618 A1
mm
a ) 21 @ @
Emmi \
Q IOEw
, mm g em r ma ; /
% \ 21 g m
8
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Pa tent Applica tion Publica tion Ma r. 28, 2013 Sh eet 3 0f 15 US 2013/0079618 A1
120w
r122
OBTN N USED SEN SOR
v ( - 124
EN SPECT/TEST USED SEN SOR
IS 126
REMAN UFACTURE
APPROPRFATE
r128
D ISCARD
USED SEN SOR
r130
REFURBISH SEN SOR ACCORD IN G TO
D ESIRED REMAN UFACTURIN G PROCESS
v r132
PERFORM SEN SOR TESTlN G
v r134
PACK AGE SEN SOR 4
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14 0 i
r122
OBTAIN USED SEN SOR
I , 124
PREPARE USED
SEN SOR FOR REMAN UFACTURE PROCESS
I , 14 2
EXPOSE AT L EAST A
PORTION OF FL EXIBL E EL ECTROD E
I , 14 4
REMOVE cow nuonv e
GEL FROM EL ECTROD E WEL L AREA
I r14 6
REFURBISH AD HESIVE/FOAM L AY ER
I { 4 4 8
PL ACE GEL SUPPORT AN D
PREP SURFACE OVER EL ECTROD E
I { - 15 0
PROVID E CON D UCTIVE GEL
I { 15 2
REFURBISH MEMORY
I { 15 4
PL ACE SEN SOR ON L IN ER
FIG. 5
Pa tent Applica tion Publica tion Ma r. 28, 2013 Sh eet 5 0f 15 US 2013/0079618 A1
/162
REMOVE EL ECTROD E WEL L
STRUCTURE COVERIN G FL EXIBL E EL ECTROD E
T r164
PROVED E N EW AD HESIVE D OT
v r166
REMOVE CON D UCTWE GEL
FROM GEL SUPPORT AN D PREP SURFACE
V r168
PL ACE GEL SUPPORT, PREP SURFACE,
AN D N EW AD HESTVE D OT OVER EL ECTROD E 6
new
/172
REMOVE GEL SUPPORTAN D PREP SURFACE FROM
AD HESIVE D OT COVERTN G FL EXIBL E EL ECTROD E
T r166
REMOVE CON D UCTTVE GEL
FROM GEL SUPPORT AN D PREP SURFACE
V AD HERE CL EAN ED GEL SUPPORTAN D PREP
SURFACE TO EXISTL N G AD HESIVE D OT G 7
180w
r162
REMOVE EL ECTROD E WEL L
STRUCTURE COVERIN G FL EXIBL E EL ECTROD E
V r182
PROVTD E N EW
EL ECTROD E WEL L STRUCTURE
V ( 184
PL ACE N EW EL ECTROD E
WEL L STRUCTURE OVER EL ECTROD E F I G 8
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190w
r172
REMOVE GEL SUPPORT AN D PREP SURFACE FROM
AD HESIVE D OT COVERWG FL EXIBL E EL ECTROD E
v /- 192
PROVED E GEL SUPPORT AN D PREP SURFACE
V AD HERE N EW GEL SUPPORT- AN D PREP
SURFACE TO EXESTIN G AD HESIVE D OT 9
r 78, 80, 82
1s , 84
219w
, 4 62
REMOVE EL ECTROD E WEL L
STRUCTURE COVERIN G FL EXEBL E EL ECTROD E
v r212
PROVID E VISOOUS CON D UCTIVE GEL
J , /214
OISPOSE VISCOUS
CON D UCTIVE GEL WITHIN EL ECTROD E WEL L HQ, 1 ' 1
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MBA- N
, 220
REMOVE EXISTIN G FOAM AN D AD HESIVE L AY ERS
I , 222
PROVID E N EW PATIEN T
CON TACTIN G FOAM AN D AD HESIVE L AY ERS
I r224
AD HERE N EW FOAM AN D AD HESIVE
L AY ER TO SEN SOR SUBSTRATE L AY ER 1 2
/25 0
REMOVE PORTION OF EXISTIN G
PATIEN T- CON TACTIN G FOAM AN D AD HESIVE L AY ER
I r25 2
PROVID E N EW
PATIEN T- CON TACTIN G FOAM AN D AD HESIVE L AY ER
I r25 4
AD HERE N EW PATIEN T~ CON TACTIN G FOAM AN D
AD HESIVE L AY ER TO REMAIN IN G PORTION OF EXISTIN G
PATIEN T- CON TACTIN G FOAM AN D AD HESIVE L AY ER 1 4
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14 6C \
r260
REMOVE AD HESIVE L AY ER FROM FOAM L AY ER I
I , - 262
PROVID E N EW
PATIEN T- CON TACTIN G AD HESIVE L AY ER
I r264
AD HERE N EW PATIEN T- CON TACTIN G
AD HESIVE L AY ER TO EXISTIN G FOAM L AY ER 1 5
14 6D - N
r270
PROVID E N EW AD HESIVE TRAN SFER TAPE
I [ 272
AD HERE N EW TRAN SFER TAPE TO EXISTIN G
PATIEN T- CON TACTIN G AD HESIVE AN D FOAM L AY ER
FIG. 17
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12- 282
280
FIG. I8<
62
\ 60
US 2013/0079618 A1
r260
REMOVE AD HESIVE L AY ER FROM FOAM L AY ER
I ( - 290
PROVID E PL URAL ITY OF N EW L AMIN ATED
PATIEN T- CON TACTIN G AD HESIVE L AY ERS
I r292
AD HERE N EW PATIEN T- CON TACTIN G
AD HESIVE L AY ERS TO EXISTIN G FOAM L AY ER
FIG. 19
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300 N
, 122
OBTAIN USED SEN SOR
I ( 124
PREPARE USED
SEN SOR FOR REMAN UFACTURE PROCESS
I r14 2
EXPOSE AT L EASTA
PORTION OF FL EXIBL E EL ECTROD E
I r14 4
REMOVE CON D UCTIVE
GEL FROM EL ECTROD E WEL L AREA
I { 14 6
REFURBISHAD HESIVEIFOAM L AY ER
I { 302
REFURBISH FL EXIBL E CON D UCTIVE
EL ECTROD E AN D ! OR CIRCUIT TRACES
I r 14 8
PL ACE GEL SUPPORT AN D
PREP SURFACE OVER EL ECTROD E
I r15 0
PROVID E CON OUCTIVE GEL
I { ' 5 2
REFURBISH MEMORY
I r15 4
PL ACE SEN SOR ON L IN ER
FIG. 20
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CL EAN EXPOSED PORTION OF CJ RCUET
If
RE- ION iZ E EXPOSED CON D UC' FIVE EN K
3028 w
[ 310
CL EAN EXPOSED PORTION S OF CIRCUIT
i ( 320
PROViD E N EW COMD UCTIEVE iN K
l1 r322
D ISPOSE N EW CON D UCTIVE
IN K OVER EXPOSED iN K OF CIRCUIT
FIG. 23
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3020K t
[ 310
CL EAN EXPOSED PORTION OF CiRCUET
T /330
PROVID E METAL IN K
T /332
D ISPOSE METAL IN K
OVER EXPOSED PORTION OF CIRCUIT
T /334
ION lZ E METAL IN K
15 2k
r34 0
REMOVE PAD D L E CON N ECTOR AN D MEMORY UN iT
T r34 2
PROVID E N EW
PAD D L E CON N ECTOR AN D MEMORY UN IT
J r r34 4
ATTACH N EW PAD D L E CON N ECTOR TO SEN SOR
FIG. 26
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15 2Bw
r35 0
PROVID E MEMORY AL TERATION D EVICE
V CON N ECT PAD D L E CON N ECTOR/MEMORY
UN IT TO MEMORY AL TERATION D EVICE
\ r r 35 4
RE- PROGRAMICL EAN MEMORY UN IT
I r35 6
REMOVE MEMORY UN IT
FROM MEMORY AL TERATION D EVICE
FIG. 27
16A
15 20 N
, 370
PROVID E AD APTER FOR MEMORY UN IT
I , 372
CON N ECT PAD D L E
CON N ECTOR/MEMORY UN IT TO AD APTER
I r374
RETAIN AD APTER AS PART OF PAD D L E CON N ECTOR
FIG. 29
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15 20
N /380
PROVID E MEMORY EMUL ATOR AN D N EW MEMORY UN ET
l , 382
ATTACH USED MEMORY UN IT TO MEMORY EMUL ATOR
l , 384
EMUL ATE CON FTGURATION OF
USED MEMORY UN IT ON N EW MEMORY UN IT
i /386
REMOVE USED MEMORY UN TT
l , 388
ATTACH N EW MEMORY UN IT TO SEN SOR
390w
, 122
OBTAIN USED SEN SOR
T r34 0
REMOVE PAD D L E CON N ECTOR AN D MEMORY UN IT
[ 1 /15 2B, 15 2C
REFURBISH PAD D L E CON N ECTOR/MEMORY UN IT
T [ 392
PROViD E N EW SEN SOR
T r394
ATTACH REFURBISHED
CON N ECTOR/MEMORY UN lT TO N EW EEG SEN SOR
FIG. 31
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r122
| OBTAIN USED SEN SOR |
I r4 22
I STERlL iZ E USED SEN SOR I
I r4 24
] OISASSEMBL E uSEO SEN SOR |
I , 4 26
OBTAIN N EW SEN SOR MATERIAL HAVIN G
D IFFEREN T CON FIGURATION THAN USED SEN SOR
I /4 28
REMAN UFACTURE USED SEN SOR COMPON EN TS TO
CON FORM TO CON FIGURATION OF N EW SEN SOR MATERIAL S
I r4 30
IN TEGRATE USED SEN SOR
COMPON EN TS WITH N EW SEN SOR MATERIAL S
I r4 62
I COMPL ETE ASSEMBL Y OF N EW SERSOR |
I { 15 4
| PL ACE SEN SOR ON L IN ER I
FIG. 33
US 2013/0079618 A1
TECHN IQUE FOR REMAN UFACTURIN G A
BIS SEN SOR
BACK GROUN D
[ 0001] Th e pres ent dis clos ure rela tes g enera lly to rema nu
f a ctured medica l dev ices a nd, more pa rticula rly , to rema nu
f a cturing s ens ors us ed f or s ens ing ph y s iolog ica l pa ra meters
of a pa tient.
[ 0002] Th is s ection is intended to introduce th e rea der to
v a rious a s pects of a rt th a t ma y be rela ted to v a rious a s pects of
th e pres ent dis clos ure, Wh ich a re des cribed a nd/or cla imed
beloW. Th is dis cus s ion is believ ed to be h elpf ul in prov iding
th e rea der With ba ck g round inf orma tion to f a cilita te a better
unders ta nding of th e v a rious a s pects of th e pres ent dis clos ure.
According ly , it s h ould be unders tood th a t th es e s ta tements a re
to be rea d in th is lig h t, a nd not a s a dmis s ions of prior a rt.
[ 0003] In th e ? eld of medicine, doctors of ten des ire to
monitor certa in ph y s iolog ica l ch a ra cteris tics of th eir pa tients .
According ly , a Wide v a riety of dev ices h a v e been dev eloped
f or monitoring certa in ph y s iolog ica l ch a ra cteris tics of a
pa tient. Such dev ices prov ide doctors a nd oth er h ea lth ca re
pers onnel With th e inf orma tion th ey need to prov ide th e bes t
pos s ible h ea lth ca re f or th eir pa tients . As a res ult, s uch moni
toring dev ices h a v e become a n indis pens a ble pa rt of modern
medicine.
[ 0004 ] One tech niq ue f or monitoring certa in ph y s iolog ica l
ch a ra cteris tics of a pa tient is commonly ref erred to a s elec
troenceph a log ra ph y ( EEG) , a nd th e dev ices built ba s ed upon
electroenceph a log ra ph ic tech niq ues a re commonly ref erred
to a s EEG monitors . EEG monitors us e non- inv a s iv e electro
ph y s iolog ica l monitoring to ev a lua te g loba l ch a ng es in a
pa tients condition, f or ex a mple, during s urg ica l procedures .
Ex a mples of g loba l ch a ng es ma y include a s s es s ing th e ef f ects
of a nes th etics , ev a lua ting a s y mmetric a ctiv ity betWeen th e
lef t a nd rig h t h emis ph eres of th e bra in in order to detect
cerebra l is ch emia , a nd detecting burs t s uppres s ion. One s uch
tech niq ue includes bis pectra l index ( BIS) monitoring to mea
s ure th e lev el of cons cious nes s by a lg orith mic a na ly s is of a
pa tients EEG during g enera l a nes th es ia .
[ 0005 ] EEG mea s urements a re ca ptured us ing EEG moni
toring dev ices , a nd s ens ors a s s ocia ted With th es e monitoring
dev ices a re a pplied to th e pa tient. Ty pica lly , th e s ens ors
include electrodes th a t ma y be a pplied to v a rious a na tomies
of th e pa tient ( e. g . , th e temple a nd/or f oreh ea d) . For ex a mple,
s ens ors f or BIS monitoring ma y include a s ing le s trip th a t
includes s ev era l electrodes f or pla cement on th e f oreh ea d to
noninv a s iv ely a cq uire a n EEG s ig na l. Beca us e th e BIS s en
s ors a re pla ced in direct conta ct With a pa tient, a nd pos s ibly
pa tient ? uids , BIS s ens ors a re ty pica lly intended f or us e With
a s ing le pa tient. Th us , BIS s ens ors a re ty pica lly dis ca rded
a f ter us e.
BRIEF D ESCRIPTION OF THE D RAWIN GS
[ 0006] Adv a nta g es of th e dis clos ed tech niq ues ma y
become a ppa rent upon rea ding th e f olloWing deta iled
des cription a nd upon ref erence to th e dra Wing s in Wh ich :
[ 0007] FIG. 1 is a f ront v ieW of a n embodiment of a moni
toring s y s tem con? g ured to be us ed With a s ens or f or per
f orming BIS mea s urements , in a ccorda nce With a n a s pect of
th e pres ent dis clos ure;
[ 0008] FIG. 2 is a n ex ploded pers pectiv e v ieW of a n
embodiment of th e s ens or of FIG. 1, in a ccorda nce With a n
a s pect of th e pres ent dis clos ure;
Ma r. 28, 2013
[ 0009] FIG. 3 is a s ch ema tic repres enta tion of a n embodi
ment of th e s ens or of FIG. 2 in pa ck a g ed f orm, in a ccorda nce
With a n a s pect of th e pres ent dis clos ure;
[ 0010] FIG. 4 is a proces s How dia g ra m of a n embodiment
of a g enera l meth od f or rema nuf a cturing th e s ens or of FIGS.
1- 3, in a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0011] FIG. 5 is a proces s How dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing th e s ens or of FIGS. 1- 3,
including ref urbis h ing th e body of th e s ens or, in a ccorda nce
With a n a s pect of th e pres ent dis clos ure;
[ 0012] FIG. 6 is a proces s How dia g ra m of a n embodiment
of a meth od f or remov ing a nd repla cing f ea tures dis pos ed
With in electrode Wells of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0013] FIG. 7 is a proces s How dia g ra m of a n embodiment
of a meth od f or remov ing a nd repla cing f ea tures dis pos ed
With in electrode Wells of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0014 ] FIG. 8 is a proces s How dia g ra m of a n embodiment
of a meth od f or remov ing a nd repla cing f ea tures dis pos ed
With in electrode Wells of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0015 ] FIG. 9 is a proces s How dia g ra m of a n embodiment
of a meth od f or remov ing a nd repla cing f ea tures dis pos ed
With in electrode Wells of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0016] FIG. 10 is a cros s - s ectiona l v ieW, ta k en a long line
10- 10, of a n embodiment of th e s ens or of FIGS. 1- 3 h a v ing a
s elf - s upporting conductiv e g el, in a ccorda nce With a n a s pect
of th e pres ent dis clos ure;
[ 0017] FIG. 11 is a proces s How dia g ra m of a n embodiment
of a meth od f or remov ing f ea tures dis pos ed With in electrode
Wells of th e s ens or of FIGS. 1- 3 a nd repla cing th e f ea tures
With th e s elf - s upporting conductiv e g el of FIG. 10, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0018] FIG. 12 is a proces s How dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing a body of th e s ens or of FIGS.
1- 3, in a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0019] FIG. 13 is a cros s - s ectiona l v ieW, ta k en a long line
10- 10, of a n embodiment of th e s ens or of FIGS. 1- 3 h a v ing
multiple f oa m la y ers , in a ccorda nce With a n a s pect of th e
pres ent dis clos ure;
[ 0020] FIG. 14 is a proces s How dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing a body of th e s ens or of FIGS.
1- 3, in a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0021] FIG. 15 is a proces s How dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing a body of th e s ens or of FIGS.
1- 3, in a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0022] FIG. 16 is a cros s - s ectiona l v ieW, ta k en a long line
10- 10, of a n embodiment of th e s ens or of FIGS. 1- 3 h a v ing a n
a dditiona l pa tient- conta cting a dh es iv e dis pos ed ov er a us ed
pa tient- conta cting a dh es iv e, in a ccorda nce With a n a s pect of
th e pres ent dis clos ure;
[ 0023] FIG. 17 is a proces s How dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing a body of th e s ens or of FIGS.
1- 3, in a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0024 ] FIG. 18 is a n ex ploded pers pectiv e v ieW of a n
embodiment of th e s ens or of FIGS. 1- 3 a nd illus tra ting a
plura lity of pa tient- conta cting la y ers la mina ted ov er a f oa m
la y er of th e s ens or, in a ccorda nce With a n a s pect of th e pres ent
dis clos ure;
[ 0025 ] FIG. 19 is a proces s How dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing a body of th e s ens or of FIGS.
1- 3, in a ccorda nce With a n a s pect of th e pres ent dis clos ure;
US 2013/0079618 A1
[ 0026] FIG. 20 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing th e s ens or of FIGS. 1- 3
including replenis h ing th e conductiv e ink of th e electrodes
a nd/ or conductors of th e s ens or, in a ccorda nce With a n a s pect
of th e pres ent dis clos ure;
[ 0027] FIG. 21 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or replenis h ing th e conductiv e ink of th e elec
trodes a nd/or conductors of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0028] FIG. 22 is a cros s - s ectiona l v ieW, ta k en a long line
10- 10, of a n embodiment of th e s ens or of FIGS. 1- 3 h a v ing a
neW conductiv e ink dis pos ed ov er a us ed conductiv e ink , in
a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0029] FIG. 23 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or replenis h ing th e conductiv e ink of th e elec
trodes a nd/or conductors of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0030] FIG. 24 is a s ch ema tic depiction of a n embodiment
of a proces s f or ioniZ ing a meta llic ink dis pos ed on th e s ens or
of FIGS. 1- 3, in a ccorda nce With a n a s pect of th e pres ent
dis clos ure;
[ 0031] FIG. 25 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or replenis h ing th e conductiv e ink of th e elec
trodes a nd/or conductors of th e s ens or of FIGS. 1- 3, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0032] FIG. 26 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or ref urbis h ing th e memory unit of th e s ens or of
FIGS. 1- 3, including repla cing th e connector of th e s ens or, in
a ccorda nce With a n a s pect of th e pres ent dis clos ure;
[ 0033] FIG. 27 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or ref urbis h ing th e memory unit of th e s ens or of
FIGS. 1- 3, including re- prog ra mming th e memory unit con
ta ined With in th e connector of th e s ens or, in a ccorda nce With
a n a s pect of th e pres ent dis clos ure;
[ 0034 ] FIG. 28 is a f ront v ieW of a n embodiment of th e
s ens or of FIGS. 1- 3 h a v ing a n a da pter coupled to th e connec
tor f or a ltering th e opera bility of th e memory unit, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0035 ] FIG. 29 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or ref urbis h ing th e memory unit of th e s ens or of
FIGS. 1- 3, including prov iding a n a da ptor f or th e time- out
f ea ture conta ined With in th e connector of th e s ens or, in a ccor
da nce With a n a s pect of th e pres ent dis clos ure;
[ 0036] FIG. 30 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or ref urbis h ing memory unit of th e s ens or of
FIGS. 1- 3, including emula ting th e memory unit on a neW
memory unit, in a ccorda nce With a n a s pect of th e pres ent
dis clos ure;
[ 0037] FIG. 31 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing th e s ens or of FIGS. 1- 3
including reta ining only th e connector a nd memory unit a nd
repla cing th e us ed s ens or With a neW s ens or, in a ccorda nce
With a n a s pect of th e pres ent dis clos ure;
[ 0038] FIG. 32 is a f ront v ieW of a n embodiment of a s ens or
h a v ing neW components a nd rema nuf a ctured components
f rom th e s ens or of FIGS. 1- 3, in a ccorda nce With a n a s pect of
th e pres ent dis clos ure; a nd
[ 0039] FIG. 33 is a proces s ? oW dia g ra m of a n embodiment
of a meth od f or rema nuf a cturing th e s ens or of FIGS. 1- 3 to
produce th e s ens or of FIG. 32, in a ccorda nce With a n a s pect of
th e pres ent dis clos ure.
Ma r. 28, 2013
D ETAIL ED D ESCRIPTION OF SPECIFIC
EMBOD IMEN TS
[ 004 0] One or more s peci? c embodiments of th e pres ent
tech niq ues Will be des cribed beloW. In a n ef f ort to prov ide a
concis e des cription of th es e embodiments , not a ll f ea tures of
a n a ctua l implementa tion a re des cribed in th e s peci? ca tion. It
s h ould be a pprecia ted th a t in th e dev elopment of a ny s uch
a ctua l implementa tion, a s in a ny eng ineering or des ig n
proj ect, numerous implementa tion- s peci? c decis ions mus t be
ma de to a ch iev e th e dev elopers s peci? c g oa ls , s uch a s com
plia nce With s y s tem- rela ted a nd bus ines s - rela ted cons tra ints ,
Wh ich ma y v a ry f rom one implementa tion to a noth er. More
ov er, it s h ould be a pprecia ted th a t s uch a dev elopment ef f ort
mig h t be complex a nd time cons uming , but Would nev erth e
les s be a routine underta k ing of des ig n, f a brica tion, a nd
ma nuf a cture f or th os e of ordina ry s k ill h a v ing th e bene? t of
th is dis clos ure.
[ 004 1] Th e pres ent dis clos ure is g enera lly directed to th e
rema nuf a cturing of bis pectra l index ( BIS) s ens ors h a v ing one
or more electrodes f or monitoring bra in a ctiv ity of a pa tient.
For ex a mple, th e s ens ors des cribed h erein ma y include one or
more electrodes , s uch a s a t lea s t tWo electrodes , f or ca pturing
electrica l da ta f rom a pa tients bra in, a nd f ea tures f or f a cili
ta ting th e ca pture a nd tra ns mitta l of th e da ta f rom th e pa tient
to a pa tient monitor. Th us , th e BIS s ens ors des cribed h erein
ma y be cons tructed us ing a combina tion of neW ma teria ls
( i. e. , ma teria ls th a t h a v e not been incorpora ted into a BIS
s ens or) a nd components ta k en f rom one or more us ed BIS
s ens ors ( e. g . , a n electrode) . For ex a mple, a BIS s ens or ma y
include a ba s e la y er s upporting a ? ex ible a rra y of electrodes
con? g ured to ca pture electrica l da ta f rom a pa tient, a conduc
tiv e g el to f a cilita te th e tra ns mis s ion of th e electrica l s ig na ls
f rom th e pa tient to th e s ens or, one or more f oa m pieces to pa d
th e BIS s ens or, a nd a n a dh es iv e la y er f or a tta ch ing th e s ens or
to th e pa tient, s uch a s to th e pa tient s f oreh ea d a nd/ or temple.
According ly , BIS s ens ors cons tructed us ing th e rema nuf a c
turing tech niq ues des cribed h erein ma y incorpora te us ed
f oa m la y ers , ? ex ible circuits , a nd, in certa in embodiments ,
ex is ting but unus ed a dh es iv e la y ers , or a ny combina tion
th ereof .
[ 004 2] By Wa y of ex a mple, a BISTM s ens or a v a ila ble f rom
As pect Medica l Sy s tems , Inc. , s uch a s a BISTM Qua ttro s en
s or, a BISTM ex tend s ens or, a BISTM pedia tric s ens or, or a
BISTM bila tera l s ens or, Wh ich include a plura lity of printed
electrodes on a ? ex ible s ubs tra te, repres ent one ty pe of EEG
s ens or. It s h ould be noted, h oWev er, th a t th e pres ent dis clo
s ure is a pplica ble to a ny EEG or s imila r s ens or h a v ing s imila r
or th e s a me ma teria ls a nd/ or con? g ura tion a s th os e des cribed
h erein. Furth er, oth er s ens ors h a v ing s ome or a ll of th e com
ponents des cribed h erein ( e. g . , ECG s ens ors , g enera l EEG
s ens ors , puls e ox imetry s ens ors , or s ens ors us ed f or mea s ur
ing Wa ter f ra ction or h ema tocrit) ma y bene? t f rom th e dis
clos ed tech niq ues . Th e BIS s ens ors dis clos ed h erein ma y be
us ed in conj unction With a ny s uita ble monitoring s y s tem,
Wh ich is des cribed With res pect to FIG. 1. An ex a mple BIS
s ens or a nd its components a re dis cus s ed With res pect to FIG.
2, a nd a pa ck a g ed EEG s ens or is dis cus s ed With res pect to
FIG. 3. As noted a bov e, th es e s ens ors a re g enera lly k noWn to
be one- time- us e s ens ors th a t ma y be dis ca rded a f ter us e by
one pa tient. Th oug h dis pos a ble, s ome components of th es e
us ed s ens ors , s uch a s th e conductors , connectors , a nd
memory units a s s ocia ted th ereWith , ma y be employ ed in th e
cons truction of rema nuf a ctured s ens ors . Reus ing th es e com
ponents to recons truct a s ens or ma y reduce Wa s te ( e. g . , pla s tic
US 2013/0079618 A1
Wa s te ma teria ls ) , cons eq uently reducing a n impa ct on th e
env ironment, Wh ile a ccording ly reducing cos ts . Va rious
embodiments of rema nuf a cturing tech niq ues a nd th e con
? g ura tions th a t res ult a re dis cus s ed With res pect to FIGS.
4 - 33.
[ 004 3] With th e f oreg oing in mind, FIG. 1 is a f ront v ieW of
a n embodiment of a pa tient monitoring s y s tem 10. Th e moni
toring s y s tem 10 ma y include a s ens or 12 a nd a n EEG monitor
14 . Th e s ens or 12 ma y include electrodes 16 ( e. g . , f our elec
trodes 16A, 16B, 16C, a nd 16D ) th a t ma y be s elf a dh erent a nd
s elf prepping to temple a nd f oreh ea d a rea s of a pa tient a nd
th a t a re us ed to a cq uire EEG s ig na ls . As dis cus s ed in deta il
beloW, th e electrodes 16 ma y include a printed conductiv e ink
s upported With in a ? ex ible s ens or body 18 to prov ide
enh a nced ? ex ibility a nd conf orma nce to pa tient tis s ue. Th e
s ens or 12 ma y include a pa ddle connector 20, Wh ich couples
th roug h a connector 22 to a ca ble 24 ( e. g . , a pa tient interf a ce
ca ble) , Wh ich in turn ma y be coupled to a ca ble 26 ( e. g . , a
pig ta il ca ble) . In certa in embodiments , th e s ens or 12 ma y be
coupled to th e ca ble 26 th ereby elimina ting th e ca ble 24 . Th e
ca ble 26 ma y be coupled to a dig ita l s ig na l conv erter 28,
Wh ich in turn is coupled to th e ca ble 30 ( e. g . , a monitor
interf a ce ca ble) . In certa in embodiments , th e dig ita l s ig na l
conv erter 28 ma y be embedded in th e monitor 14 to elimina te
th e ca bles 26 a nd 30. Ca ble 26 ma y be coupled to th e monitor
14 v ia a port 32 ( e. g . , a dig ita l s ig na l conv erter port) .
[ 004 4 ] Th e monitor 14 ma y be ca pa ble of ca lcula ting
ph y s iolog ica l ch a ra cteris tics rela ting to th e EEG s ig na l
receiv ed f rom th e s ens or 12. For ex a mple, th e monitor ma y be
ca pa ble of a lg orith mica lly ca lcula ting BIS f rom th e EEG
s ig na l. BIS is a mea s ure of a pa tients lev el of cons cious nes s
during g enera l a nes th es ia . Furth er, th e monitor 14 ma y
include a dis pla y 34 ca pa ble of dis pla y ing ph y s iolog ica l ch a r
a cteris tics , h is torica l trends of ph y s iolog ica l ch a ra cteris tics ,
oth er inf orma tion a bout th e s y s tem ( e. g . , ins tructions f or
pla cement of th e s ens or 12 on th e pa tient) , a nd/or a la rm
indica tions . Th e monitor 14 ma y dis pla y a pa tients BIS v a lue
36. Th e BIS v a lue 36 repres ents a dimens ionles s number
( e. g . , ra ng ing f rom 0, i. e. , s ilence, to 100, i. e. , f ully a Wa k e a nd
a lert) output f rom a multiv a ria te dis crimina te a na ly s is th a t
q ua nti? es th e ov era ll bis pectra l properties ( e. g . , f req uency ,
poWer, a nd ph a s e) of th e EEG s ig na l. For ex a mple, a BIS
v a lue 36 betWeen 4 0 a nd 60 ma y indica te a n a ppropria te lev el
f or g enera l a nes th es ia . Th e monitor 14 ma y a ls o dis pla y a
s ig na l q ua lity index ( SQI) ba r g ra ph 38 ( e. g . , ra ng ing f rom 0
to 100) Wh ich mea s ures th e s ig na l q ua lity of th e EEG ch a nnel
s ource( s ) ba s ed on impeda nce da ta , a rtif a cts , a nd oth er v a ri
a bles . Th e monitor 14 ma y y et a ls o dis pla y a n electromy o
g ra ph ( EMG) ba r g ra ph 4 0 ( e. g . , ra ng ing f rom 30 to 5 5
decibels ) Wh ich indica tes th e poWer ( e. g . , in decibels ) in th e
f req uency ra ng e of 70 to 110 HZ . Th e f req uency ra ng e ma y
include poWer f rom mus cle a ctiv ity a nd oth er h ig h - f req uency
a rtif a cts . Th e monitor 14 ma y f urth er dis pla y a s uppres s ion
ra tio ( SR) 4 2 ( e. g . , ra ng ing f rom 0 to 100 percent) , Wh ich
repres ents th e percenta g e of epoch s ov er a g iv en time period
( e. g . , th e pa s t 63 s econds ) in Wh ich th e EEG s ig na l is cons id
ered s uppres s ed ( i. e. , loW a ctiv ity ) . In certa in embodiments ,
th e monitor 14 ma y a ls o dis pla y a burs t count f or th e number
of EEG burs ts per minute, Wh ere a burs t is de? ned a s a s h ort
period of EEG a ctiv ity preceded a nd f olloWed by periods of
ina ctiv ity or s uppres s ion. Th e monitor 14 ma y y et f urth er
dis pla y th e EEG Wa v ef orm 4 4 . In certa in embodiments , th e
EEG Wa v ef orm 4 2 ma y be ? ltered. Th e monitor 14 ma y s till
f urth er dis pla y trends 4 6 ov er a certa in time period ( e. g . , one
Ma r. 28, 2013
h our) f or EEG, SR, EMG, SQL a nd/or oth er pa ra meters . In
certa in embodiments , th e monitor 14 ma y dis pla y s tepWis e
ins tructions f or pla cing th e s ens or 12 on th e pa tient. In a ddi
tion, th e monitor 14 ma y dis pla y a v eri? ca tion s creen v erif y
ing th e proper pla cement of ea ch electrode 16 of th e s ens or 12
on th e pa tient. In certa in embodiments , th e monitor 14 ma y
s tore ins tructions on a memory s peci? c to a s peci? c s ens or
ty pe or model, Wh ich is dis cus s ed in f urth er deta il beloW. In
oth er embodiments , th e s ens or 12 ma y include a memory th a t
prov ides th e ins tructions to th e monitor 14 .
[ 004 5 ] Additiona lly , th e monitor 14 ma y include v a rious
a ctiv a tion mech a nis ms 4 8 ( e. g . , buttons a nd s Witch es ) to
f a cilita te ma na g ement a nd opera tion of th e monitor 14 . For
ex a mple, th e monitor 14 ma y include f unction k ey s ( e. g . , k ey s
With v a ry ing f unctions ) , a poWer s Witch , a dj us tment buttons ,
a n a la rm s ilence button, a nd s o f orth . It s h ould be noted th a t in
oth er embodiments , th e pa ra meters des cribed a bov e a nd th e
a ctiv a tion mech a nis ms 4 8 ma y be a rra ng ed on dif f erent pa rts
of th e monitor 14 . In oth er Words , th e pa ra meters a nd a ctiv a
tion mech a nis ms 4 8 need not be loca ted on a f ront pa nel 5 0 of
th e monitor 14 . Indeed, in s ome embodiments , a ctiv a tion
mech a nis ms 4 8 a re v irtua l repres enta tions in a dis pla y or
a ctua l components dis pos ed on s epa ra te dev ices . In a ddition,
th e a ctiv a tion mech a nis ms 4 8 ma y a lloW s electing or input
ting of a s peci? c s ens or ty pe or model in order to a cces s
ins tructions s tored With in th e memory of th e s ens or 12.
[ 004 6] One embodiment of th e v a rious components of th e
s ens or 12 is illus tra ted With res pect to FIG. 2, Wh ich ma y
g enera lly repres ent th e BISTM Qua ttro s ens or, th e BISTM
ex tend s ens or, th e BISTM pedia tric s ens or, or th e BISTM bila t
era l s ens or mentioned a bov e. For ex a mple, th e embodiment
of th e s ens or 12 illus tra ted in FIG. 2 ma y repres ent a BISTM
Qua ttro s ens or, Wh erein electrode 16A is con? g ured to f unc
tion a s a s ens ing electrode, electrode 16B is con? g ured to
monitor a rtif a cts res ulting f rom mus cula r mov ement, s uch a s
ey e tWitch ing , electrode 16C is con? g ured to f unction a s a
g rounding electrode, a nd electrode 16D is con? g ured to f unc
tion a s a ref erence electrode. It s h ould be noted th a t in certa in
embodiments , th e s ens or 12 ma y be ca pa ble of perf orming
BIS mea s urements With f eWer th a n f our electrodes 16, or
more th a n f our electrodes 16. For ex a mple, in one embodi
ment, th e s ens or 12 ma y be ca pa ble of perf orming BIS mea
s urements us ing only electrodes 16A, 16C, a nd 16D . In oth er
embodiments , s uch a s Wh ere th e s ens or 12 is a BISTM bila tera l
s ens or, th e electrodes 16 ma y include a ref erence electrode
con? g ured to be pla ced a t th e center of th e pa tient s f oreh ea d,
tWo electrodes ea ch con? g ured to be pla ced a bov e a n ey e of
th e pa tient to monitor a rtif a cts f rom ey e tWitch ing or mov e
ment, one g round electrode, a nd tWo electrodes ea ch con? g
ured to be pla ced a g a ins t th e pa tient s temples f or monitoring .
[ 004 7] As illus tra ted, th e s ens or 12 includes a ba s e s truc
tura l la y er 60, a f oa m la y er 62, a ? rs t a dh es iv e 64 con? g ured
to s ecure th e f oa m la y er 62 to th e ba s e s tructura l la y er 60, a nd
a pa tient- conta cting a dh es iv e 66 con? g ured to s ecure th e
s ens or 12 to a pa tient. Th e ba s e s tructura l la y er 60 ma y be
cons tructed f rom a ny ? ex ible poly meric ma teria l s uita ble f or
us e in medica l dev ices , s uch a s poly es ter, poly ureth a ne,
poly propy lene, poly eth y lene, poly v iny lch loride, a cry lics ,
nitrile, PVC ? lms , a ceta tes , or s imila r ma teria ls th a t f a cilita te
conf orma nce of th e s ens or 12 to th e pa tient. On th e oth er
h a nd, th e f oa m la y er 62 ma y be rela tiv ely rig id compa red to
th e ba s e s tructura l la y er 60 to prov ide pa dding a nd a dditiona l
comf ort to th e pa tient. As a n ex a mple, th e f oa m la y er 62 ma y
include a ny f oa m ma teria l s uita ble f or us e in medica l a ppli
US 2013/0079618 A1
ca tions , s uch a s poly es ter f oa m, poly eth y lene f oa m, poly ure
th a ne f oa m, or th e lik e. Th e ? rs t a dh es iv e 64 a nd th e pa tient
conta cting a dh es iv e 66 ma y include pres s ure s ens itiv e
a dh es iv es s uch a s a n a cry lic- ba s ed a dh es iv e, a s upported
tra ns f er ta pe, a n uns upported tra ns f er ta pe, or a ny combina
tion th ereof . In certa in embodiments , th e pa tient- conta cting
a dh es iv e 66 ma y include a h y drocolloid or s imila r a dh es iv e
f or pa tients With s ens itiv e s k in. It s h ould be noted th a t th e
f oa m la y er 62 a nd a dh es iv es 64 , 66 ma y be prov ided a s
dis crete la y ers a s illus tra ted, or ma y be prov ided a s a s ing le
piece. Th a t is , th e f oa m la y er 62 a nd th e a dh es iv es 64 , 66 ma y
be prov ided a s a double- coa ted f oa m la y er. In embodiments
Wh ere th e a dh es iv es 64 , 66 a re prov ided a s dis crete la y ers , th e
f oa m la y er 62 a nd th e a dh es iv es 64 , 66 ma y a ls o include
res pectiv e ta bs 63, 65 , 67 to f a cilita te remov a l of ea ch la y er
62, 64 , 66 during rema nuf a cture. Tog eth er, th e ba s e s tructura l
a nd f oa m la y ers 60, 62 a nd a dh es iv es 64 , 66, f orm th e s ens or
body 18, Wh ich is th e s tructura l s upport in Wh ich th e f ea tures
f or collecting EEG- rela ted da ta f rom th e pa tient a re dis pos ed.
[ 004 8] Th e s ens or body 18 ma y be con? g ured to f a cilita te
proper pla cement of th e s ens or 12 on a pa tients h ea d. For
ex a mple, th e s ens or body 18 ma y include a ? rs t body portion
68 a nd a s econd body portion 70 th a t a re j oined by a th in
bridg e 72 of th e ba s e s tructura l la y er 60, a nd a re s epa ra ted by
a dis continua tion 74 in th e f oa m la y er 62 a nd a dh es iv es 64 ,
66. Beca us e th e ba s e s tructura l la y er 60 ma y be cons tructed
f rom a ? ex ible poly meric ma teria l, th e bridg e 72 is a ble to
bend With a rela tiv ely h ig h deg ree of f reedom ( e. g . , compa red
to th e f oa m la y er 62) . In certa in con? g ura tions , th e electrodes
16B, 16C, a nd 16D , Wh ich a re loca ted on th e ? rs t body
portion 68, ma y be pla ced on a pa tients f oreh ea d, Wh ile
electrode 16A, Wh ich is loca ted on th e s econd body portion
70, is pla ced on th e pa tients temple. Th eref ore, beca us e th e
bridg e 72 ca n ea s ily bend, th e s ens or 12 is a ble to a ccommo
da te a v a riety of dis ta nces betWeen th e f oreh ea d a nd temple
a rea s ( i. e. , h ea d s iZ es ) by ena bling th e s ens or 12 to a rch , tWis t,
or ? ex betWeen th e ? rs t a nd s econd body portions 68, 70.
[ 004 9] It s h ould be noted th a t th e illus tra ted pla cement of
th e bridg e 72 is only one embodiment, a nd th a t th e bridg e 72
ma y be pla ced betWeen oth er electrodes 16 in oth er con? g u
ra tions . For ex a mple, in embodiments Wh ere th e s ens or 12 is
a BISTM pedia tric s ens or or s imila r s ens or, th e bridg e 72 ma y
be betWeen th e electrode 16B a nd th e electrode 16C ra th er
th a n th e illus tra ted pla cement. Furth er, th e s ens or 12 ma y
include more th a n one bridg e 72, s uch a s tWo or more bridg es
72 dis pos ed betWeen th e electrodes 16 ( e. g . , in a BISTM bila t
era l s ens or) . Furth ermore, a leng th l 1 of th e bridg e 72 ma y be
v a ried depending on th e end us e of th e s ens or 12 ( e. g . , pedi
a tric, s ma ll, reg ula r, or la rg e s iZ es ) . Alterna tiv ely or a ddition
a lly , a s dis cus s ed beloW, th e s ens or 12 ma y not include a
bridg e portion a nd ma y include con? g ura tions s imila r to
th os e des cribed in US. pa tent a pplica tion Ser. N o. 13/074 ,
127 entitled Meth od a nd Sy s tem f or Pos itioning a Sens or,
? led Ma r. 28, 201 1, Wh ich is incorpora ted by ref erence h erein
in its entirety f or a ll purpos es .
[ 005 0] Th e ba s e s tructura l la y er 60 of th e s ens or 12 a ls o
includes a plura lity of electrode portions 76 ea ch h a v ing a
pa rticula r s h a pe. Th e s h a pe of th e electrode portions 76 ma y
be con? g ured to f a cilita te retention of th e s ens or 12 on th e
pa tient, a nd, more s peci? ca lly , to ma inta in pres s ure of th e
corres ponding electrode 16 on th e electrode portion 76
a g a ins t th e pa tients f oreh ea d or temple. As illus tra ted, th e
electrodes 16 a re g enera lly pos itioned a t th e center of th eir
res pectiv e electrode portion 76. Th e s h a pes of th e electrode
Ma r. 28, 2013
portions 76 ma y a ls o be re? ected in th e s h a pe of th e f oa m
la y er 62 a nd th e a dh es iv es 64 , 66, a nd, more s peci? ca lly , th e
portions of th e f oa m la y er 62 a nd th e a dh es iv es 64 , 66 th a t
ma y a tta ch to corres ponding electrode portions 76 of th e ba s e
s tructura l la y er 60. Th e f oa m la y er 62 a nd th e a dh es iv es 64 ,
66 a ls o include res pectiv e h oles 78, 80, 82 corres ponding to
th e pos ition of th e electrodes 16 to f a cilita te electrica l conta ct
With th e pa tient.
[ 005 1] As Will be a pprecia ted, th e electrodes 16 a re con
s tructed f rom conductiv e ma teria ls to ena ble th e s ens or 12 to
perf orm electrica l mea s urements on th e pa tient. Speci? ca lly ,
in a ccorda nce With certa in embodiments , th e electrodes 16
a re f ormed f rom ? ex ible conductiv e ma teria ls , s uch a s one or
more conductiv e ink s . For ex a mple, th e electrodes 16 ma y be
produced by printing ( e. g . , s creen printing or ? ex og ra ph ic
printing ) a conductiv e ink on th e ba s e s tructura l la y er 60 a nd
a lloWing th e ink to dry a nd/ or cure. In certa in embodiments ,
th e ink ma y be th erma lly cured. Th e s ens or 12 ma y a ls o
include a plura lity of conductors 84 dis pos ed ( e. g . , s creen or
? ex og ra ph ica lly printed) on th e ba s e s tructura l la y er 60 to
tra ns mit s ig na ls to a nd f rom ea ch of th e electrodes 16 a nd to
enh a nce ? ex ibility of th e s ens or 12. Th e conductors 84 ma y
be f ormed f rom th e s a me or a dif f erent conductiv e ink th a n th e
electrodes 16. Suita ble conductiv e ink s f or th e electrodes 16
a nd th e conductors 84 ma y include ink s h a v ing one or more
conductiv e ma teria ls s uch a s meta ls ( e. g . , copper ( Cu) or
s ilv er ( Ag ) ) a nd/or meta l ions ( e. g . , s ilv er ch loride ( Ag Cl) ) ,
? ller- impreg na ted poly mers ( e. g . , poly mers mix ed With con
ductiv e ? llers s uch a s g ra ph ene, conductiv e na notubes , meta l
pa rticles ) , or a ny ink h a v ing a conductiv e ma teria l ca pa ble of
prov iding conductiv ity a t lev els s uita ble f or perf orming th e
EEG or oth er electrica l mea s urements . As a n ex a mple, th e
electrodes 16 a nd/or conductors 84 ma y be f ormed f rom a n
ink h a v ing a mix ture of Ag a nd Ag Cl. Indeed, in certa in
embodiments , s ilv er a nd s a lts th ereof ( e. g . , Ag /Ag Cl) ma y be
des ira ble to us e f or th e electrodes 16 a nd conductors 84 due to
its enh a nced s ta bility ( e. g . , compa red to copper a nd copper
s a lts ) during certa in medica l procedures , s uch a s de? brilla
tion. For ex a mple, th e Ag /Ag Cl ma y ena ble th e s ens or to
depola riZ e With in a des ired a mount of time ( e. g . , s econds
ra th er th a n minutes ) . Th is depola riZ a tion With in a s h ort
a mount of time ma y ena ble th e s ens or 12 to be us ed a s h ort
time a f ter th e de? brilla tion or s imila r procedure. HoWev er, in
a g enera l s ens e, a ny s uita ble conductiv e ma teria l ma y be us ed
f or th e electrodes 16 a nd th e conductors 84 .
[ 005 2] Th e conductors 84 , a s noted a bov e, a re g enera lly
con? g ured to tra ns mit s ig na ls to a nd/or f rom th e electrodes
16. Th us , th e conductors 84 ma y be con? g ured tra ns mit s ig
na ls s uch a s poWer, da ta , a nd th e lik e, collected a t or tra ns
mitted to ea ch of th e electrodes 16 to or f rom a ta il portion 86
of th e ba s e s tructura l la y er 60. Th e ta il portion 86 of th e ba s e
s tructura l la y er 60 includes a n interf a ce reg ion 88 in Wh ich
th e s ens or 12 is con? g ured to couple to a noth er connector or
th e monitor 14 to ena ble th e monitor 14 to perf orm BIS
mea s urements . Additiona lly , th e ta il portion 86 ma y be a ? a t,
? ex ible protrus ion f rom th e body portion 18 of th e s ens or 12
to ena ble th e s ens or 12 to be Worn by th e pa tient With minima l
dis comf ort by reducing th e bulk a nd Weig h t of th e s ens or 12
on th e pa tient.
[ 005 3] Th e ta il portion 86 a nd th e pa ddle connector 20
interf a ce With one a noth er a t res pectiv e ov erla pping connec
tion reg ions 90, 92. Th is ena bles th e s ens or 12 to ph y s ica lly
couple to th e connector 22 or th e monitor 14 of FIG. 1. As a n
ex a mple, th e pa ddle connector 20 ma y be con? g ured to