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by MPXS4100A/D

SEMICONDUCTOR TECHNICAL DATA






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The Motorola MPXS4100A series Barometric Absolute Pressure (BAP) sensor for
engine control is designed to sense absolute air pressure.
Motorolas BAP sensor integrates onchip, bipolar op amp circuitry and thin film
resistor networks to provide a high output signal and temperature compensation. The
small form factor and high reliability of onchip integration make the Motorola BAP
sensor a logical and economical choice for the automotive system designer.

INTEGRATED
PRESSURE SENSOR
20 to 105 kPa (2.9 to 15.2 psi)
0.3 to 4.9 V OUTPUT

Features
1.8% Maximum Error Over 0 to 85C
Surface Mount Package
Available Tape and Reeled or in Sleeves

BASIC CHIP CARRIER

ELEMENT
CASE 47101, STYLE 1

Ideally Suited for Direct Microprocessor Interfacing

Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over 40 to +125C
Ideal for Nonautomotive applications

PIN NUMBER

Also Available in Unibody Package (see MPX4100A/D data sheet)

N/C

N/C

Application

N/C

VS
Gnd

N/C

Vout

N/C

Barometric Absolute Pressure for Engine Control

VS

NOTE: Pins 1, 5, 6, 7 and 8 are

internal device connections. Do not
connect to external circuitry or
ground.

THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1

Xducer
SENSING
ELEMENT

GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY

Vout

PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS

GND

Figure 1. Fully Integrated Pressure Sensor Schematic

MAXIMUM RATINGS(1)
Symbol

Value

Unit

Overpressure(2)

Rating

Pmax

400

kPa

Burst Pressure(2)

Pburst

1000

kPa

Tstg

40 to +125

TA

40 to +125

Storage Temperature
Operating Temperature

1. TC = 25C unless otherwise noted.

2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and Xducer are trademarks of Motorola, Inc.
REV 1

Motorola Sensor Device Data

Motorola, Inc. 1997

  

OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25C unless otherwise noted)
Characteristic

Symbol

Pressure Range

Min

Typ

Max

Unit

POP

20

105

kPa

Supply Voltage(1)

VS

4.85

5.1

5.35

Vdc

Supply Current

Io

7.0

10

mAdc

Minimum Pressure Offset(2)

(0 to 85C)

Voff

0.225

0.306

0.388

Vdc

Full Scale Output(3)

(0 to 85C)

VFSO

4.816

4.897

4.978

Vdc

Full Scale Span(4)

(0 to 85C)

VFSS

4.591

Vdc

Accuracy(5)

(0 to 85C)

1.8

%VFSS

V/P

54

mV/kPa

Response Time(6)

tR

1.0

ms

Output Source Current at Full Scale Output

Io+

0.1

mAdc

Warmup Time(7)

20

ms

Offset Stability(8)

0.65

%VFSS

Symbol

Min

Typ

Max

Unit

1.5

Grams

Sensitivity

MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 432)

NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25C due to all sources of error including the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with minimum specified
pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25C.
TcSpan:
Span deviation per C over the temperature range of 0 to 85C, as a percent of span at 25C.
TcOffset:
Output deviation per C with minimum pressure applied, over the temperature range of 0 to 85C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warmup Time is defined as the time required for the product to meet the specified output voltage.
8. Offset Stability is the products output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
9. Decoupling circuit shown in Figure 2 required to meet specification.

Motorola Sensor Device Data

  

MPXS4100A
SENSOR
OUTPUT
(PIN 4)
50 pF

A/D

51 k

PROCESSOR

Figure 2. Recommended Decoupling Filter for

Sensor to Microprocessor Interface

The MPXS4100A series piezoresistive transducer is a

stateoftheart, monolithic, signal conditioned, silicon
pressure sensor. This sensor, with its patented Xducer,
combines advanced micromachining techniques, thin film
metallization and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is
proportional to applied pressure. A vacuum is sealed behind
the sensor diaphragm providing a reliable pressure
reference.
This surface mount package (Case 471) is an absolute
sensing configuration package. A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon

diaphragm. The MPXS4100A series pressure sensor operating characteristics, internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor performance and longterm reliability. Contact the factory for information regarding media compatibility in your application.
Figure 2 shows the recommended decoupling circuit for interfacing the output of the integrated BAP sensor to the A/D
input of a microprocessor (see Note 9).
Figure 3 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are
shown for operation over 0 to 85C temperature range. (Output will saturate outside of the rated pressure range.)

5.0
4.5

OUTPUT (Volts)

4.0
3.5
3.0

TRANSFER FUNCTION:
Vout = Vs* (.01059*P.152) Error
VS = 5.1 Vdc
TEMP = 0 to 85C
20 kPA TO 105 kPA
MPXS4100A

MAX
TYP

2.5
2.0
1.5
1.0

MIN

5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110

0.5

Pressure (ref: to sealed vacuum) in kPa

Figure 3. Output versus Absolute Pressure

Motorola Sensor Device Data

  

Transfer Function (MPXS4100A)
Nominal Transfer Value: Vout = VS (P x 0.01059 0.1518)
+/ (Pressure Error x Temp. Factor x 0.01059 x VS)
VS = 5.1 V 0.25 Vdc

Temperature Error Band

MPXS4100A Series

4.0

Break Points

3.0
Temperature
Error
Factor

2.0

Temp

Multiplier

40
0 to 85
125

3
1
3

1.0
0.0
40

20

20

40

80

60

100

120

140

Temperature in C
NOTE: The Temperature Multiplier is a linear response from 0C to 40C and from 85C to 125C

Pressure Error Band

Error Limits for Pressure

3.0

Pressure Error (kPa)

2.0
1.0
0.0
20

40

60

80

100

120

Pressure (in kPa)

1.0
2.0
3.0

Pressure

Error (Max)

20 to 105 (kPa)

1.5 (kPa)

ORDERING INFORMATION
The MPXS4100A series BAP silicon pressure sensors are available shipped in sleeves or tape and reeled.
Device Type Options

Case No
No.

MPX Series Order No

No.

Marking

Sleeve Pack

47101

MPXS4100A6U

MPXS4100A

Tape and Reel

47101

MPXS4100A6T1

MPXS4100A

Device
MPXS4100A6T1

Reel Size
13 dia.

Tape Width
44 mm

Quantity
250

Motorola Sensor Device Data

  

INFORMATION FOR USING THE SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct
pad geometry, the packages will self align when subjected to
a solder reflow process.

0.835
0.100 TYP

0.060 TYP 8X
NOT TO SCALE

0.300

0.080 TYP 8X

SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of this device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device damage and/or failure.
Therefore, the following items should always be observed in
order to minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
zones should be 100C or less.*
When preheating and soldering, the temperature of the
leads and the case, including the port, must not exceed
the maximum temperature ratings as shown on the data
sheet. When using infrared heating with the reflow
soldering method, the difference between the leads and
the case shall be a maximum of 10C.
Wave soldering is not recommended for the pressure
sensor surface mount package due to the exposure of
the die to the environment.

Motorola Sensor Device Data

The soldering temperature and time shall not exceed

240C for more than 5 seconds.
When shifting from preheating to soldering zones, the
maximum temperature gradient or rise rate shall be
2C/second or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
Recommend usage of a noclean solder paste to avoid
circuit board cleaning.

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the
device.

  

PACKAGE DIMENSIONS

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

G
B
4

DIM
A
B
C
D
F
G
J
M
P
R
Y

A
P

T
M

MILLIMETERS
MIN
MAX
16.71
16.97
13.74
13.99
5.31
5.87
1.17
1.37
0.94
1.34
2.54 BSC
0.23
0.28
0_
7_
21.74
22.35
12.78
13.28
0.05
0.25

INCHES
MIN
MAX
0.658
0.668
0.541
0.551
0.209
0.231
0.046
0.054
0.037
0.053
0.100 BSC
0.009
0.011
0_
7_
0.856
0.880
0.503
0.523
0.002
0.010

D 8 PL
0.25 (0.010)

SEATING
PLANE
M

T B

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.

NC
VSUPPLY
GROUND
VOUT
NC
NC
NC
NC

CASE 47101
ISSUE O

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals
must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
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INTERNET: http://motorola.com/sps

Motorola Sensor MPXS4100A/D

Device Data