MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MPX2010/D

10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors

The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors provide a very ac c ur at e and l i n e a r v o l ta g e o u tp u t d i r ec tl y proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thinfilm resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Features Temperature Compensated over 0C to +85C Ratiometric to Supply Voltage Differential and Gauge Options Application Examples Respiratory Diagnostics Air Movement Control Controllers Pressure Switching Figure 1 shows a block diagram of the internal circuitry on the standalone pressure sensor chip.
VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 GND

UNIBODY PACKAGE

MPX2010 MPXV2010G SERIES

Motorola Preferred Device

MPX2010D CASE 344

COMPENSATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) FULL SCALE SPAN: 25 mV

SMALL OUTLINE PACKAGE SURFACE MOUNT

MPX2010GP CASE 344B

MPXV2010GP CASE 1369

2 4

SENSING ELEMENT

Vout+ Vout-

MPX2010DP CASE 344C

MPXV2010DP CASE 1351

PIN NUMBER
1 2 MPX2010GS CASE 344E 3 4 Gnd +Vout VS Vout 5 6 7 8 N/C N/C N/C N/C

Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1).

NOTE: Pin 1 is noted by the notch in the lead.

MPX2010GSX CASE 344F

PIN NUMBER
Preferred devices are Motorola recommended choices for future use and best overall value.

1 2

Gnd +Vout

3 4

VS Vout

REV 9

NOTE: Pin 1 is noted by the notch in the lead.

Motorola Sensor Device Data Motorola, Inc. 2002

MPX2010 MPXV2010G SERIES

MAXIMUM RATINGS(NOTE)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 75 40 to +125 40 to +125 Unit kPa C C

NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.

OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Supply Range(1) Symbol POP VS Io VFSS Voff V/P (0 to 10 kPa) (40C to +125C) Span(5) TCVFSS TCVoff Zin Zout (10% to 90%) tR Min 0 24 1.0 1.0 1.0 1.0 1000 1400 Typ 10 6.0 25 2.5 0.1 0.5 1.0 20 0.5 Max 10 16 26 1.0 1.0 1.0 1.0 2550 3000 Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV ms ms %VFSS

Voltage(2)

Supply Current Full Scale Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) Span(3)

Temperature

Hysteresis(5)

Temperature Effect on Full Scale Temperature Effect on Offset(5) Input Impedance Output Impedance Response WarmUp Offset Stability(7) Time(6)

NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device selfheating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the products output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES ONCHIP TEMPERATURE COMPENSATION and CALIBRATION

VS = 10 Vdc TA = 25C P1 > P2
aMAX

30 OUTPUT (mVdc) 25 20 15 10 5 0 -5 kPa PSI

TYP

SPAN RANGE (TYP) MIN

2.5 0.362

5 0.725

7.5 1.09

10 1.45

OFFSET (TYP)

Figure 2. Output versus Pressure Differential

Figure 2 shows the output characteristics of the MPX2010/MPXV2010G series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics.

This performance over temperature is achieved by having both the shear stress strain gauge and the thinfilm resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation.

SILICONE DIE COAT WIRE BOND

STAINLESS STEEL METAL COVER DIE P1 EPOXY CASE

LEAD FRAME

Figure 3. Unibody Package CrossSectional Diagram (not to scale)

Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010/MPXV2010G series pressure sensor oper-

Motorola Sensor Device Data

P2

RTV DIE BOND

ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.

MPX2010 MPXV2010G SERIES

LINEARITY Linearity refers to how well a transducers output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 5) or (2) a least squares best line fit. While a least squares fit gives the best case linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the worst case error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorolas specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION

END POINT STRAIGHT LINE FIT

OFFSET 0 50 PRESSURE (% FULLSCALE) 100

Figure 4. Linearity Specification Comparison

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX
Part Number MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX MPXV2010GP MPXV2010DP Case Type 344 344C 344B 344E 344F 1369 1351

pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking

ORDERING INFORMATION UNIBODY PACKAGE (MPX2010 SERIES)

MPX Series Device Type Basic Element Ported Elements Differential Differential, Dual Port Gauge Gauge, Axial Gauge, Axial PC Mount Options Case Type 344 344C 344B 344E 344F Order Number MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX Device Marking MPX2010D MPX2010DP MPX2010GP MPX2010D MPX2010D

ORDERING INFORMATION SMALL OUTLINE PACKAGE (MPXV2010G SERIES)

Device Type Ported Elements Options Gauge, Side Port, SMT Differential, Dual Port, SMT Case No. 1369 1351 MPX Series Order No. MPXV2010GP MPXV2010DP Packing Options Trays Trays Marking MPXV2010G MPXV2010G

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS

2 PLACES 4 TIPS

0.008 (0.20) C A B A E e
5 4 GAGE PLANE

e/2 .014 (0.35) L DETAIL G A1

1 8X

b 0.004 (0.1)

C A B

E1

NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7

N K

A
8X

0.004 (0.1)
SEATING PLANE

DETAIL G C

CASE 136901 ISSUE O

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES SMALL OUTLINE PACKAGE DIMENSIONSCONTINUED

2 PLACES 4 TIPS

0.006 (0.15) C A B A E e
5 4 GAGE PLANE

e/2 .014 (0.35) L DETAIL G A1

1 8X

b 0.004 (0.1)

C A B

E1

STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.

GND +Vout Vs -Vout N/C N/C N/C N/C

STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.

N/C Vs GND Vout N/C N/C N/C N/C

NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7

8X

0.004 (0.1)
SEATING PLANE

DETAIL G C

CASE 135101 ISSUE O

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES UNIBODY PACKAGE DIMENSIONS

NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00

C R M
1

A N
PIN 1
1 2 3 4

T J
SEATING PLANE

G F
4 PL

F Y

0.136 (0.005)

T A

DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. F 8 PL

DIM A B C D F G J L M N R Y Z

STYLE 1: PIN 1. 2. 3. 4.

GROUND + OUTPUT + SUPPLY - OUTPUT

STYLE 2: PIN 1. 2. 3. 4.

VCC - SUPPLY + SUPPLY GROUND

STYLE 3: PIN 1. 2. 3. 4.

GND -VOUT VS +VOUT

CASE 34415 ISSUE Z

SEATING PLANE

T R H N
PORT #1 POSITIVE PRESSURE (P1)

A U L

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC

B
PIN 1
1 2 3 4

K S F G D 4 PL 0.13 (0.005)

P 0.25 (0.010) J C
M

T Q

T S

STYLE 1: PIN 1. 2. 3. 4.

GROUND + OUTPUT + SUPPLY - OUTPUT

CASE 344B01 ISSUE B

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES UNIBODY PACKAGE DIMENSIONS CONTINUED

V R
PORT #2 PORT #1

A U W H
PORT #2 VACUUM (P2)

L
PORT #1 POSITIVE PRESSURE (P1)

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38

Q
SEATING PLANE

SEATING PLANE PIN 1

1 2 3 4

P T J C 0.13 (0.005)
M

K
S

0.25 (0.010)

T Q

S G D 4 PL

T S

STYLE 1: PIN 1. 2. 3. 4.

GROUND + OUTPUT + SUPPLY - OUTPUT

CASE 344C01 ISSUE B

PORT #1 POSITIVE PRESSURE (P1)

C
BACK SIDE VACUUM (P2)

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93

V
4 3 2 1 PIN 1

K J R
SEATING PLANE

S G F D 4 PL 0.13 (0.005)
M

T B

GROUND + OUTPUT + SUPPLY - OUTPUT

CASE 344E01 ISSUE B

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES UNIBODY PACKAGE DIMENSIONS CONTINUED

T C E A U Q

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92

N R
PORT #1 POSITIVE PRESSURE (P1)

P 0.25 (0.010)
M

PIN 1

T Q

S K

F D 4 PL 0.13 (0.005)

G T P Q
STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT

CASE 344F01 ISSUE B

Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES

NOTES

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Motorola Sensor Device Data

MPX2010 MPXV2010G SERIES

NOTES

Motorola Sensor Device Data

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MPX2010 MPXV2010G SERIES

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 13036752140 or 18004412447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3201, MinamiAzabu. Minatoku, Tokyo 1068573 Japan. 81334403569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 85226668334 Technical Information Center: 18005216274 HOME PAGE: http://www.motorola.com/semiconductors/

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Motorola Sensor Device Data

MPX2010/D