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Bcr3Am: Mitsubishi Semiconductor Triac

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MITSUBISHI SEMICONDUCTOR TRIAC

BCR3AM
LOW POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE

BCR3AM

OUTLINE DRAWING

Dimensions
in mm

10 MAX

0.5

3.20.2
23.70.5

4
3.20.1
TYPE NAME
VOLTAGE
CLASS

8 MAX

4 MAX
12 MIN

1.20.1
0.8
0.8

1.5 MIN

4.5 MAX

2.5 2.5

1.550.1

IT (RMS) ........................................................................ 3A
VDRM ..............................................................400V/600V
IFGT !, IRGT !, IRGT # ......................... 30mA (15mA) 6

123

10 MAX
24
1
2
3
34
1

0.5

Measurement point of
case temperature

T1 TERMINAL
T2 TERMINAL
GATE TERMINAL
T2 TERMINAL

TO-202

APPLICATION
Contactless AC switches, light dimmer, electric blankets,
control of household equipment such as electric fan,
solenoid drivers, small motor control, other general
purpose control applications

MAXIMUM RATINGS
Symbol

Voltage class

Parameter

12

Unit

VDRM

Repetitive peak off-state voltage 1

400

600

VDSM

Non-repetitive peak off-state voltage 1

500

720

Conditions

Parameter

Symbol
IT (RMS)

RMS on-state current

Commercial frequency, sine full wave 360 conduction, Tc =86C

ITSM

Surge on-state current

60Hz sinewave 1 full cycle, peak value, non-repetitive

I2t

I2t for fusing

Value corresponding to 1 cycle of half wave 60Hz, surge on-state


current

PGM

Peak gate power dissipation

PG (AV)

Average gate power dissipation

VGM

Ratings

Unit

30

3.7

A2s

0.3

Peak gate voltage

IGM

Peak gate current

0.5

Tj

Junction temperature

40 ~ +125

40 ~ +125

1.6

Storage temperature

Tstg

Weight

Typical value

1. Gate open.

Feb.1999

MITSUBISHI SEMICONDUCTOR TRIAC

BCR3AM
LOW POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE

ELECTRICAL CHARACTERISTICS
Limits
Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

IDRM

Repetitive peak off-state current

Tj=125C, VDRM applied

2.0

mA

VTM

On-state voltage

Tc=25C, ITM=4.5A, Instantaneous measurement

1.5

1.5

1.5

VFGT !
VRGT !

Gate trigger voltage 2

Tj=25C, VD=6V, RL=6, RG=330

VRGT #

1.5

IFGT !

30 6

mA

30 6

mA

30 6

mA

IRGT !

Gate trigger current 2

Tj=25C, VD=6V, RL=6, RG=330

IRGT #

VGD

Gate non-trigger voltage

Tj=125C, VD=1/2VDRM

0.2

Rth (j-c)

Thermal resistance

Junction to case 4 5

10

C/ W

(dv/dt)c

Critical-rate of rise of off-state


commutating voltage

V/s

2. Measurement using the gate trigger characteristics measurement circuit.


3. The critical-rate of rise of the off-state commutating voltage is shown in the table below.
4. Case temperature is measured at the T2 terminal 1.5mm away from the molded case.
5. The contact thermal resistance Rth (c-f) in case of greasing is 3C/W.
6. High sensitivity (IGT15mA) is also available. (IGT item 1)

Voltage
class

VDRM
(V)

400

(dv/dt) c
Min.

SUPPLY
VOLTAGE

1. Junction temperature
Tj=125C
5

12

Commutating voltage and current waveforms


(inductive load)

Test conditions

Unit

600

V/s

TIME

2. Rate of decay of on-state commutating current


(di/dt)c=1.5A/ms

MAIN CURRENT

3. Peak off-state voltage


VD=400V

MAIN
VOLTAGE

(di/dt)c
TIME
TIME

(dv/dt)c

VD

PERFORMANCE CURVES
RATED SURGE ON-STATE CURRENT
40
TC = 25C

101
7
5
3
2
100
7
5
3
2
101
0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8
ON-STATE VOLTAGE (V)

SURGE ON-STATE CURRENT (A)

ON-STATE CURRENT (A)

MAXIMUM ON-STATE CHARACTERISTICS


102
7
5
3
2

35
30
25
20
15
10
5
0
100

2 3 4 5 7 101

2 3 4 5 7 102

CONDUCTION TIME
(CYCLES AT 60Hz)

Feb.1999

MITSUBISHI SEMICONDUCTOR TRIAC

BCR3AM
LOW POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE

GATE TRIGGER CURRENT VS.


JUNCTION TEMPERATURE
100 (%)

102
7
5
3
2

PGM = 3W
PG(AV) = 0.3W

101
7
5
3
2

IGM =
0.5A

VGT

100
7
5
3
2

IRGT I

IFGT I, IRGT III VGD = 0.2V


101
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103

GATE TRIGGER CURRENT (Tj = tC)


GATE TRIGGER CURRENT (Tj = 25C)

GATE VOLTAGE (V)

GATE CHARACTERISTICS
103
7
5
4
3
2

101
60 40 20 0 20 40 60 80 100 120 140
JUNCTION TEMPERATURE (C)

MAXIMUM TRANSIENT THERMAL


IMPEDANCE CHARACTERISTICS

7
5
4
3
2
101
60 40 20 0 20 40 60 80 100 120 140

TRANSIENT THERMAL IMPEDANCE (C/W)

102

102 2 3 5 7 103 2 3 5 7 104 2 3 5 7 105


102
7 JUNCTION TO AMBIENT
5
3
2
101
7
5
3
2
100
7
5
3
2
101
101 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
CONDUCTION TIME
(CYCLES AT 60Hz)

MAXIMUM ON-STATE POWER


DISSIPATION

ALLOWABLE CASE TEMPERATURE


VS. RMS ON-STATE CURRENT

5.0

130

4.5

120

4.0

360
3.5 CONDUCTION
3.0 RESISTIVE,
INDUCTIVE
2.5 LOADS
2.0
1.5
1.0
0.5
0

JUNCTION TO CASE

JUNCTION TEMPERATURE (C)

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0


RMS ON-STATE CURRENT (A)

CASE TEMPERATURE (C)

ON-STATE POWER DISSIPATION (W)

GATE TRIGGER VOLTAGE (Tj = tC)


GATE TRIGGER VOLTAGE (Tj = 25C)

100 (%)

GATE TRIGGER VOLTAGE VS.


JUNCTION TEMPERATURE
TYPICAL EXAMPLE

IRGT III

102
IFGT I, IRGT I
7
5
4
3
2

GATE CURRENT (mA)

103
7
5
4
3
2

TYPICAL EXAMPLE

CURVES APPLY REGARDLESS


OF CONDUCTION ANGLE

110
100
90
80
70
60 360
CONDUCTION
50 RESISTIVE,
40 INDUCTIVE
LOADS
30
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
RMS ON-STATE CURRENT (A)

Feb.1999

MITSUBISHI SEMICONDUCTOR TRIAC

BCR3AM
LOW POWER USE

70
60
50
40
0

20
0

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

REPETITIVE PEAK OFF-STATE


CURRENT VS. JUNCTION
TEMPERATURE

HOLDING CURRENT VS.


JUNCTION TEMPERATURE
100 (%)
HOLDING CURRENT (Tj = tC)
HOLDING CURRENT (Tj = 25C)

103
7
5
4
3
2

TYPICAL EXAMPLE

102
7
5
4
3
2
101
60 40 20 0 20 40 60 80 100 120 140

102
60 40 20 0 20 40 60 80 100 120 140

100

40

RMS ON-STATE CURRENT (A)

103
7
5
3
2

101
7
5
3
2

60

RMS ON-STATE CURRENT (A)

104
7
5
3
2

102
7
5
3
2

80

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

105
7 TYPICAL EXAMPLE
5
3
2

103
7
5
3
2

ALLOWABLE AMBIENT TEMPERATURE


VS. RMS ON-STATE CURRENT
160
NATURAL CONVECTION
NO FINS
140
CURVES APPLY REGARDLESS
OF CONDUCTION ANGLE
120
RESISTIVE, INDUCTIVE
100
LOADS

30 30 t1.2

JUNCTION TEMPERATURE (C)

JUNCTION TEMPERATURE (C)

LACHING CURRENT VS.


JUNCTION TEMPERATURE

BREAKOVER VOLTAGE VS.


JUNCTION TEMPERATURE

T2 , G
TYPICAL
EXAMPLE

,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
DISTRIBUTION

T2+, G+ TYPICAL

T2 , G EXAMPLE

100 (%)

REPETITIVE PEAK OFF-STATE CURRENT (Tj = tC)


REPETITIVE PEAK OFF-STATE CURRENT (Tj = 25C)

100 (%)

30

LACHING CURRENT (mA)

50 50 t1.2

AMBIENT TEMPERATURE (C)

ALLOWABLE AMBIENT TEMPERATURE


VS. RMS ON-STATE CURRENT
130
NATURAL CONVECTION
120
ALL FINS ARE BLACK PAINTED
IRON AND GREASED
110
CURVES APPLY REGARDLESS
100
OF CONDUCTION ANGLE
RESISTIVE, INDUCTIVE
90
LOADS
80

BREAKOVER VOLTAGE (Tj = tC)


BREAKOVER VOLTAGE (Tj = 25C)

AMBIENT TEMPERATURE (C)

NON-INSULATED TYPE, PLANAR PASSIVATION TYPE

160
TYPICAL EXAMPLE
140
120
100
80
60
40
20

60 40 20 0 20 40 60 80 100 120 140

0
60 40 20 0 20 40 60 80 100120 140

JUNCTION TEMPERATURE (C)

JUNCTION TEMPERATURE (C)

Feb.1999

MITSUBISHI SEMICONDUCTOR TRIAC

BCR3AM
LOW POWER USE

BREAKOVER VOLTAGE VS.


RATE OF RISE OF
OFF-STATE VOLTAGE
160
TYPICAL EXAMPLE

Tj = 125C

BREAKOVER VOLTAGE (dv/dt = xV/s )


BREAKOVER VOLTAGE (dv/dt = 1V/s )

140
120
100
80
60
40

III QUADRANT

20

I QUADRANT
0
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104

CRITICAL RATE OF RISE OF OFF-STATE


COMMUTATING VOLTAGE (V/s)

100 (%)

NON-INSULATED TYPE, PLANAR PASSIVATION TYPE

COMMUTATION CHARACTERISTICS
102 VOLTAGE WAVEFORM
TYPICAL
7
t
EXAMPLE
5 (dv/dt)C
VD
Tj = 125C
4
IT = 4A
3 CURRENT WAVEFORM
(di/dt)C
= 500s
IT
2
VD = 200V

t
f = 3Hz
101
7
I QUADRANT
5
4
III QUADRANT
3
MINIMUM
2 CHARACTERISTICS
VALUE

100 0
10

100 (%)
GATE TRIGGER CURRENT (tw)
GATE TRIGGER CURRENT (DC)

103
7
5
4
3
2

2 3 4 5 7 102

RATE OF DECAY OF ON-STATE


COMMUTATING CURRENT (A/ms)

RATE OF RISE OF OFF-STATE VOLTAGE (V/s)

GATE TRIGGER CURRENT VS.


GATE CURRENT PULSE WIDTH

2 3 4 5 7 101

GATE TRIGGER CHARACTERISTICS TEST CIRCUITS


6

TYPICAL EXAMPLE
IRGT III

6V

IRGT I

IFGT I

TEST PROCEDURE 1

102
7
5
4
3
2

6V
RG

RG

TEST PROCEDURE 2

6V
101 0
10

2 3 4 5 7 101

2 3 4 5 7 102

GATE CURRENT PULSE WIDTH (s)

RG

TEST PROCEDURE 3

Feb.1999

This datasheet has been download from:


www.datasheetcatalog.com
Datasheets for electronics components.

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