3.155J/6.

152J Lecture 1:
Introduction
Prof. Martin A. Schmidt

Massachusetts Institute of Technology

9/7/2005

Outline

Introductions

Motivation
Course Organization

Staff
You

Handout

Lab Assignments
Safety
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Tiny Technologies

A definition which captures two

extremes:

Miniaturization

Making things smaller, often using Integrated

Circuit process technologies

Atom-level Manipulation/Assembly/Growth

Often to achieve a unique material property

e.g. Carbon Nanotubes

We will focus on the former

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The Driver: Microelectronics

Image removed due to copyright restrictions.

www.ibm.com

Figure by MIT OCW.

www.intel.com
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Transistors the size of DNA

Figure removed for copyright reasons.

www.intel.com

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Brooklyn Bridge, New York City

Rocket

Hoover Dam
Boeing 747

Engineering Challenges of the 21st Century:

DECREASING SCALE

Portable, Distributed Systems

Manipulation of Small Things

Drugs
Biological Cells
Biological Matter

DNA
Proteins

Atoms

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MIT Tiny Technologies

Low Power DSP
(Chandrakasan)

Displays
(Akinwande)

Transistors
(delAlamo)

Microengines

mm

nm

Microchemical
Plants
(Jensen)
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temanalysis.eps

~ 1.6 nm radius circle

Connectors
(Slocum)

Biosensors
(Manalis)

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Nanotips
(Akinwande)
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Organization

Pre-Req
Total overhaul two years ago

Three lab modules

Spring 03 was trial run

IC
MEMS
Microfluidics

Lecture alignment with labs

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Laboratory

Each session is 4 hours (9-1 or 1-5)

Each lab is 3 sessions

2 for processing, 1 for testing

Three labs

Tuesday, Thursday, Friday

Groups A,B,C,D,E,F

IC : MOS Capacitor
MEMS : Silicon Nitride Nanocantilever
Fluids : Micromixer

Lab report for each lab

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Lecture Schedule

13 Topical Lectures

3 Lab Overview Lectures

Given in first week of lab

3 Lab Report Lectures

Oxidation, Diffusion/Implantation, Vacuum Systems,

CVD, Sputtering, Evaporation, Lithography, Etching,
CMOS, and Advanced Silicon Devices

Given in last week of lab

Two In-Class Quizzes

Two Take-Home Quiz / Patents Lectures
Two Advanced Topic Lectures (Guests)
Writing Lectures (embedded in other lectures)
Analog Devices MEMS Fab Tour
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Grading

Quizzes (15% each)

Take Home (15%)

Covers 13 Topical Lectures

An Integrated Design Problem

Lab Reports

IC Lab (15% technical, 5% writing)

MEMS Lab (15%)

Fluids Lab (5%) Simplified report

Homework (10%)

Satisfies CIM

Eight written assignments

Advanced topic lecture participation counts as 2 homeworks

Lab Participation (5%)

Lab instructor evaluations

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Policy for Academic Conduct

Homework

Take-Home and Quizzes

Collaboration OK, everyone must contribute

Contributors must be identified
No collaboration

Lab Reports

Each group shares the same data, but

Data reduction, analysis, discussion MUST be
done individually

Use of old lab reports not permitted

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Books, References

Lecturer will handout notes

Copies of chapters when appropriate
Recommended book:

Plummer

Other references

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Schedule 1st Half

Day Date Lecturer

Topic

Lab

9/7

M AS

Overview/Safety /Lab assignment*

9/12

M AS

IC Lab - Overview

9/14

M AS

Oxidation

9/19

9/21

RCOH

Diffusion

9/26

M AS

IC Lab: Testing*

9/28

RCOH

Diffusion/Imp lantation

10/3

M AS

M EM S Lab: Overview

10/5

RCOH

Vacuum Sy stem

10/10

Columbus Day-Holiday

10/12 RCOH

CVD

10/17 MAS

M EM S Lab: Testing*

10/19 Staff

Quiz 1: Through CVD

10/24 M AS

Fluids Lab: Overview

10/26 RCOH

Sputtering

10/31 RCOH

Evap oration

Holiday

M.A. Schmidt

Assignments Out

Assignments Due

HW1 (IC Process) - M AS

IC-1: Gate oxide/p oly
HW2 (Oxidation) - M AS

HW1 (IC Process)

HW3 (Diffusion) - RCOH

HW2 (Oxidation)

IC-2: Backside Etch

IC-3: Test

IC Lab Rep ort

M EM S-1: Photolith

HW3 (Diffusion)
HW4 (Vac/CVD) - RCOH

IC Lab Rep ort (in lab)

MEMS Lab Report

HW4 (Vac/CVD)

HW5 (Sput/Evap ) - RCOH

IC Lab Rep ort-Resubmit

M EM S-2: KOH etch

MEMS-3: Test

Fluids-1: Photolith

Fluids-2: M olding

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Schedule 2nd Half

10/24 M AS

Fluids Lab: Overview

10/26 RCOH

Sputtering

10/31 RCOH

Evaporation

11/2

M AS

Lithography*

11/7

M AS

Lithography, Soft Lithography

11/9

RCOH

Etching (wet)

11/14 M AS

Fluids Lab: Testing

11/16 RCOH

Etching (dry)

11/21 M AS

CM OS

11/23 M AS

Advanced Silicon Devices

11/28 M AS

Take Home Introduction / Patents No Lab

11/30 Staff

Quiz 2: Through Adv.Si.Dev.

12/5

Guest

Take Home Discussion

12/7

Guest

Advanced Topics

12/12 Guest

Advanced Topics

12/14

Analog Devices Fab Tour

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Fluids-1: Photolith
HW5 (Sput/Evap) - RCOH

IC Lab Report-Resubmit

HW6 (Litho) - M AS

HW5 (Sput/Evap)

Fluids-2: M olding

No Lab (Veterans Day)

HW7 (Etching) - RCOH

M EM S Lab Report

Fluids-3: Test

Fluids Lab Report

HW6 (Litho)

No Lab

HW8 (CM OS) - M AS

HW7 (Etching)

Take Home Exam

HW8 (CM OS)

No Lab
Fluids Lab Report
No Lab
Take Home Quiz

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Lab Assignments

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Safety

Sleep

Better safe than sorry

Be responsible
Ask questions
Respect but dont fear

No injuries in the history of the class

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