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    Syllabus

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    hassaneldib
    This document provides information about the ECE 5210 course on MEMS at Virginia Tech for Spring 2011. The course will cover topics including microfabrication techniques, materials used in MEMS, sensing and actuation mechanisms, and case studies of MEMS devices. It will be taught by Professor Agah on Tuesdays and Thursdays from 2-3:15pm. The course aims to describe MEMS technologies and applications, demonstrate understanding of fabrication processes, and design MEMS systems. Students will work in teams on a term project and there will be homework assignments, a midterm, and final project presentations.

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    Syllabus

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    63 views3 pages
    This document provides information about the ECE 5210 course on MEMS at Virginia Tech for Spring 2011. The course will cover topics including microfabrication techniques, materials used in MEMS, sensing and actuation mechanisms, and case studies of MEMS devices. It will be taught by Professor Agah on Tuesdays and Thursdays from 2-3:15pm. The course aims to describe MEMS technologies and applications, demonstrate understanding of fabrication processes, and design MEMS systems. Students will work in teams on a term project and there will be homework assignments, a midterm, and final project presentations.

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    This document provides information about the ECE 5210 course on MEMS at Virginia Tech for Spring 2011. The course will cover topics including microfabrication techniques, materials used in MEMS, sensing and actuation mechanisms, and case studies of MEMS devices. It will be taught by Professor Agah on Tuesdays and Thursdays from 2-3:15pm. The course aims to describe MEMS technologies and applications, demonstrate understanding of fabrication processes, and design MEMS systems. Students will work in teams on a term project and there will be homework assignments, a midterm, and final project presentations.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    63 views3 pages

    Syllabus

    Uploaded by

    hassaneldib
    This document provides information about the ECE 5210 course on MEMS at Virginia Tech for Spring 2011. The course will cover topics including microfabrication techniques, materials used in MEMS, sensing and actuation mechanisms, and case studies of MEMS devices. It will be taught by Professor Agah on Tuesdays and Thursdays from 2-3:15pm. The course aims to describe MEMS technologies and applications, demonstrate understanding of fabrication processes, and design MEMS systems. Students will work in teams on a term project and there will be homework assignments, a midterm, and final project presentations.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 3

    ECE 5210 1

    ECE 5210: MEMS from Fabrication to Application


    Virginia Tech
    Spring 2011

    General Information

    Instructor: Professor Masoud Agah


    Office: 469 Whittemore Hall
    E-mail: agah at vt dot edu
    Phone: (540) 231-2653
    www.ece.vt.edu/Agah
    www.ece.vt.edu/mems

    Course Lecture: T/R 2 p.m. – 3:15 p.m.


    Office Hours: By appointment

    Course Description:
    MicroElectroMechanical Systems (MEMS) are “very small systems” or “systems made of very
    small components.” The course focuses on the design, fabrication, and application of MEMS.
    The course builds on the science and engineering base provided by most undergraduate degrees
    in such fields as biology, bioengineering, chemistry, chemical engineering, electrical
    engineering, materials science, mechanical engineering, and physics, and creates a unique
    opportunity for interdisciplinary interactions. The course consists of lectures, readings from the
    current literature, and discussion by students along with a team project. The major topics covered
    are: materials in MEMS; microfabrication techniques; sensing and actuating mechanisms; wafer-
    level packaging; and case-study of some MEMS-based devices and lab-on-a-chip systems.

    Course Objectives:

     Describe various microsystems and MEMS technologies and their applications


     Demonstrate an understanding of various semiconductor processes,
    microfabrication techniques and wafer-level packaging technologies
     Demonstrate a basic understanding of different materials and their properties
    in MEMS
     Demonstrate an understanding of different sensing and actuating mechanisms
    in microsystems
     Design various MEMS systems using microfabrication techniques and
    transduction mechanisms
     Develop skills in multidisciplinary collaboration
     Develop interests and skills in MEMS/BioMEMS research
    ECE 5210 2

    Course Prerequisites:
    Graduate Standing or Senior Undergraduate (needs instructor’s approval)

    Textbooks:
    Required: M. J. Madou, Fundamentals of Microfabrication, The Science of Miniaturization (2E),
    CRC Press, 2002

    Recommended: Stephen D. Senturia, Microsystem Design, Springer, 2004

    References:

     IEEE JMEMS
     Sensors and Actuators
     IEEE J. Micromechanics and Microengineering
     IEEE Transducers Conferences
     IEEE MEMS Conferences
     Lab On Chip

    Grading Method:

     Class participation and interaction 15%


     HW and Midterm 15% and 35%
     Project 35%

    Policy on Cooperation:
    The essence of this course is interdisciplinary interaction and cooperation. For term projects, a
    single report from each team is to be presented. For homework assignments, however, each
    student must write his/her own work (trivial but wanted to say).
    Note: I will not accept any complain about your teammates two weeks after the teams are
    formed.

    Term Projects:
    Term projects can be in various disciplines and can address different needs of the technology:
     The project report will be based on existing NSF and NIH grant proposal guidelines.
     Specific guidelines will be given in the class.

    The project grading consists of three parts: proposal presentation (5%), final project presentation
    and the report (30%).
    ECE 5210 3

    Tentative Syllabus:
    There will be 5-7 homework assignments.

    # Material Covered Comments


    1 Administration - Overview
    2 Semiconductor Processing
    3 Semiconductor Processing
    4 Semiconductor Processing
    5 Semiconductor Processing
    6 Case Study: Diode and Transistor
    7 Bulk Micromachining
    8 Bulk Micromachining
    9 Case Study: Buried Channel Techniques
    10 Surface Micromachining Groups
    11 Surface Micromachining
    12 Beam Theory
    13 Continue Beam Theory
    Case Study: Sensor Applications
    14 Capacitive Sensing & Electrostatic Actuating Project Topics
    15 Spring Break
    16 Spring Break
    17 Continue Capacitive
    Case Study: Sensor & Actuator Applications
    18 NSF Guidelines -- Project Proposals
    19 Wafer Bonding and Packaging
    20 Case Study: DWP Process
    21 Case Study: Implantable Microsystems
    22 Midterm
    23 Midterm Review
    Cleanroom Visitation Plenty of time to
    24 Midterm Review work on your team
    25 Scaling in Miniaturized Systems project.
    26 Nanotechnology
    27 Other issues in MEMS (System Integration)
    28 Case Study: MEMS and Nano Integration
    29 Project Presentation
    30 Project Presentation
    31 Report Due Report Due

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