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SS98 Datasheet

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BSS 98

SIPMOS Small-Signal Transistor N channel Enhancement mode Logic Level

VGS(th) = 0.8...1.6 V
Pin 1 S Type BSS 98 Type BSS 98 BSS 98 BSS 98 Pin 2 G Marking SS98 Pin 3 D

VDS
50 V

ID
0.3 A

RDS(on)
3.5

Package TO-92

Ordering Code Q62702-S053 Q62702-S517 Q62702-S635

Tape and Reel Information E6288 E6296 E6325

Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values 50 50 Unit V

VDS V

DGR

RGS = 20 k
Gate source voltage Gate-source peak voltage,aperiodic Continuous drain current

VGS Vgs ID

14 20 A 0.3

TA = 25 C
DC drain current, pulsed

IDpuls
1.2

TA = 25 C
Power dissipation

Ptot
0.63

TA = 25 C

Semiconductor Group

12/05/1997

BSS 98

Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 200 E 55 / 150 / 56 K/W Unit C

Tj Tstg RthJA

Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit

Static Characteristics Drain- source breakdown voltage

V(BR)DSS
50 1.2 0.05 10 1.8 2.8 1.6 0.5 5 100 100

VGS = 0 V, ID = 0.25 mA, Tj = 25 C


Gate threshold voltage

VGS(th)
0.8

VGS=VDS, ID = 1 mA
Zero gate voltage drain current

IDSS
A nA nA 3.5 6

VDS = 50 V, VGS = 0 V, Tj = 25 C VDS = 50 V, VGS = 0 V, Tj = 125 C VDS = 30 V, VGS = 0 V, Tj = 25 C


Gate-source leakage current

IGSS RDS(on)

VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance

VGS = 10 V, ID = 0.3 A VGS = 4.5 V, ID = 0.3 A

Semiconductor Group

12/05/1997

BSS 98

Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit

gfs
0.12 0.23 40 15 5 -

S pF 55 25 8 ns 5 8

VDS 2 * ID * RDS(on)max, ID = 0.3 A


Input capacitance

Ciss Coss
-

VGS = 0 V, VDS = 25 V, f = 1 MHz


Output capacitance

VGS = 0 V, VDS = 25 V, f = 1 MHz


Reverse transfer capacitance

Crss
-

VGS = 0 V, VDS = 25 V, f = 1 MHz


Turn-on delay time

td(on)

VDD = 30 V, VGS = 10 V, ID = 0.29 A RG = 50


Rise time

tr
6 9

VDD = 30 V, VGS = 10 V, ID = 0.29 A RG = 50


Turn-off delay time

td(off)
12 16

VDD = 30 V, VGS = 10 V, ID = 0.29 A RG = 50


Fall time

tf
15 20

VDD = 30 V, VGS = 10 V, ID = 0.29 A RG = 50

Semiconductor Group

12/05/1997

BSS 98

Electrical Characteristics, at Tj = 25C, unless otherwise specified Symbol Values Parameter min. Reverse Diode Inverse diode continuous forward current IS typ. max.

Unit

A 1 0.3 1.2 V 1.4

TA = 25 C
Inverse diode direct current,pulsed

ISM
-

TA = 25 C
Inverse diode forward voltage

VSD

VGS = 0 V, IF = 0.6 A

Semiconductor Group

12/05/1997

BSS 98

Power dissipation Ptot = (TA)

Drain current ID = (TA) parameter: VGS 10 V


0.32

0.70 W 0.60

Ptot

0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20

ID

0.24

0.20

0.16

0.12

0.08 0.15 0.10 0.05 0.00 0 0.04 0.00 0

20

40

60

80

100

120

160

20

40

60

80

100

120

160

TA

TA

Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25C

Drain-source breakdown voltage V(BR)DSS = (Tj)

60 V 58

V(BR)DSS 57
56 55 54 53 52 51 50 49 48 47 46 45 -60

-20

20

60

100

160

Tj

Semiconductor Group

12/05/1997

BSS 98

Typ. output characteristics ID = (VDS) parameter: tp = 80 s , Tj = 25 C


0.70 A 0.60

Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C


11

Ptot = 1W
lk i h j g
VGS [V] a 2.0
b 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0

RDS (on)
9 8 7 6 5 4 3 2
b

a b

ID

0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20


c e f

c d e f g h

d i
j k l

g h i kl j

0.15 0.10 0.05 a 0.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

VGS [V] =

1 V 5.0 0 0.00

a 2.0

b 2.5

c 3.0

d 3.5

e f 4.0 4.5

g 5.0

h i 6.0 7.0

j 8.0

k l 9.0 10.0

0.10

0.20

0.30

0.40

0.60

VDS

ID

Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 s VDS 2 x ID x RDS(on)max


0.65 A 0.55

Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s, VDS2 x ID x RDS(on)max


0.30 S 0.26

ID

0.50 0.45

gfs

0.24 0.22 0.20

0.40 0.35 0.30 0.25 0.20 0.15

0.18 0.16 0.14 0.12 0.10 0.08 0.06

0.10 0.05 0.00 0 1 2 3 4 5 6 7 8 V VGS 10

0.04 0.02 0.00 0.00

0.10

0.20

0.30

0.40

A ID

0.55

Semiconductor Group

12/05/1997

BSS 98

Drain-source on-resistance RDS (on) = (Tj) parameter: ID = 0.3 A, VGS = 10 V


9

Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA


2.6 V 2.2

RDS (on)
7 6 5

VGS(th)

2.0 1.8 1.6 1.4

98%

98%
4 3 1.2 1.0 0.8

typ

2%

typ
2 1 0.2 0 -60 -20 20 60 100 C 160 0.0 -60 -20 20 60 100 C 160 0.6 0.4

Tj

Tj

Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz


10 3

Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s


10 1

pF C 10 2

IF
10 0

Ciss

10 1

Coss

10 -1

Tj = 25 C typ Crss Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)


10 0 0 10 -2 0.0

10

15

20

25

30

V VDS

40

0.4

0.8

1.2

1.6

2.0

2.4

3.0

VSD

Semiconductor Group

12/05/1997

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