Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

FEATURES
Very low threshold voltage Fast switching Logic level compatible Subminiature surface mount package

BSH205

SYMBOL
s

QUICK REFERENCE DATA VDS = -12 V ID = -0.75 A RDS(ON) 0.5 (VGS = -2.5 V) VGS(TO) 0.4 V
d

GENERAL DESCRIPTION
P-channel, enhancement mode, logic level, field-effect power transistor. This device has low threshold voltage and extremely fast switching making it ideal for battery powered applications and high speed digital interfacing. The BSH205 is supplied in the SOT23 subminiature surface mounting package.

PINNING
PIN 1 2 3 gate source drain DESCRIPTION

SOT23

3 Top view

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL VDS VDGR VGS ID IDM Ptot Tstg, Tj PARAMETER Drain-source voltage Drain-gate voltage Gate-source voltage Drain current (DC) Drain current (pulse peak value) Total power dissipation Storage & operating temperature CONDITIONS RGS = 20 k Ta = 25 C Ta = 100 C Ta = 25 C Ta = 25 C Ta = 100 C MIN. - 55 MAX. -12 -12 8 -0.75 -0.47 -3 0.417 0.17 150 UNIT V V V A A A W W C

THERMAL RESISTANCES
SYMBOL Rth j-a PARAMETER Thermal resistance junction to ambient CONDITIONS FR4 board, minimum footprint TYP. 300 MAX. UNIT K/W

August 1998

Rev 1.000

Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

ELECTRICAL CHARACTERISTICS
Tj= 25C unless otherwise specified SYMBOL PARAMETER V(BR)DSS VGS(TO) RDS(ON) Drain-source breakdown voltage Gate threshold voltage Drain-source on-state resistance CONDITIONS VGS = 0 V; ID = -10 A VDS = VGS; ID = -1 mA Tj = 150C VGS = -4.5 V; ID = -430 mA VGS = -2.5 V; ID = -430 mA VGS = -1.8 V; ID = -210 mA VGS = -2.5 V; ID = -430 mA; Tj = 150C Forward transconductance VDS = -9.6 V; ID = -430 mA Gate source leakage current VGS = 8 V; VDS = 0 V Zero gate voltage drain VDS = -9.6 V; VGS = 0 V; current Tj = 150C Total gate charge Gate-source charge Gate-drain (Miller) charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Input capacitance Output capacitance Feedback capacitance ID = -0.5 A; VDD = -10 V; VGS = -4.5 V MIN. -12 -0.4 -0.1 0.5 -

BSH205

TYP. MAX. UNIT V V V S nA nA A nC nC nC ns ns ns ns pF pF pF

gfs IGSS IDSS Qg(tot) Qgs Qgd td on tr td off tf Ciss Coss Crss

-0.68 0.18 0.4 0.32 0.5 0.42 0.6 0.48 0.75 1.6 10 100 -50 -100 -11 -100 3.8 0.4 1.0 2 4.5 45 20 200 95 41 -

VDD = -10 V; ID = -0.5 A; VGS = -8 V; RG = 6 Resistive load VGS = 0 V; VDS = -9.6 V; f = 1 MHz

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PARAMETER Continuous reverse drain current Pulsed reverse drain current Diode forward voltage Reverse recovery time Reverse recovery charge CONDITIONS Ta = 25 C IF = -0.38 A; VGS = 0 V IF = -0.5 A; -dIF/dt = 100 A/s; VGS = 0 V; VR = -9.6 V MIN. TYP. -0.72 75 69 MAX. -0.75 -3 -1.3 UNIT A A V ns nC

August 1998

Rev 1.000

Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

BSH205

Normalised Power Dissipation, PD (%)

120 100 100 80 60 40 1 20 10 1000

Peak Pulsed Drain Current, IDM (A)

BSH105

D = 0.5 0.2 0.1 0.05 0.02 single pulse T P D tp D = tp/T

0 0 25 50 75 100 125 150 Ambient Temperature, Ta (C)

0.1 1E-06

1E-05

1E-04

1E-03

1E-02

1E-01

1E+00 1E+01

Pulse width, tp (s)

Fig.1. Normalised power dissipation. PD% = 100PD/PD 25 C = f(Ta)

Fig.4. Transient thermal impedance. Zth j-a = f(t); parameter D = tp/T

Normalised Drain Current, ID (%)

120 100 80 60 40 20

Drain current, ID (A) -1.4 4.5 V -1.2 -2.5 V -1.8 V

BSH205 Tj = 25 C VGS = -1.4 V

-1 -1.3 V -0.8 -0.6 -0.4 -0.2 -1.2 V -1.1 V -1 V -0.9 V

0 0 25 50 75 100 125 150 0 0 -0.5 -1 -1.5 Drain-Source Voltage, VDS (V) -2 Ambient Temperature, Ta (C)

Fig.2. Normalised continuous drain current. ID% = 100ID/ID 25 C = f(Ta); conditions: VGS -10 V

Fig.5. Typical output characteristics, Tj = 25 C. ID = f(VDS); parameter VGS

Drain-Source On Resistance, RDS(on) (Ohms) 100 Peak Pulsed Drain Current, IDM (A) BSH205 3 2.8 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 -0.9 V -1V -1.1 V -1.2 V -1.3 V -1.4 V

BSH205 Tj = 25 C

10

RDS(on) = VDS/ ID

tp = 100 us 1 ms

10 ms 100 ms

-2.5 V

0.1

d.c.

-1.8 V

VGS = -4.5V -0.2 -0.4 -0.6 -0.8 Drain Current, ID (A) -1 -1.2 -1.4

0.01 0.1 1 10 Drain-Source Voltage, VDS (V) 100

Fig.3. Safe operating area. Ta = 25 C ID & IDM = f(VDS); IDM single pulse; parameter tp

Fig.6. Typical on-state resistance, Tj = 25 C. RDS(ON) = f(ID); parameter VGS

August 1998

Rev 1.000

Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

BSH205

Drain Current, ID (A) -3 -2.5 -2 -1.5 -1 -0.5 0 0 -0.5 -1 -1.5 -2 Gate-Source Voltage, VGS (V) VDS > ID X RDS(on) Tj = 25 C 150 C

BSH205 0.7 0.6 0.5 0.4

Threshold Voltage, VGS(to), (V)

typical

minimum 0.3 0.2 0.1 0 0 -2.5 -3 25 50 75 100 125 150 Junction Temperature, Tj (C)

Fig.7. Typical transfer characteristics. ID = f(VGS)

Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS

Transconductance, gfs (S) 3.5 VDS > ID X RDS(on) 3 2.5 2 1.5 1 0.5 0 0 Tj = 25 C

BSH205 1E-01 1E-02 150 C 1E-03 1E-04 1E-05 1E-06

Drain Current, ID (A)

BSH205 VDS = -5 V Tj = 25 C

-0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 -2.6 Drain Current, ID (A)

1E-07 -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Gate-Source Voltage, VGS (V) 0

Fig.8. Typical transconductance, Tj = 25 C. gfs = f(ID)

Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 C

Normalised Drain-Source On Resistance

2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0 RDS(ON) @ Tj RDS(ON) @ 25C VGS = -4.5 V -1.8 V

Capacitances, Ciss, Coss, Crss (pF) 1000

BSH205

-2.5 V Ciss 100 Coss Crss

25

50

75

100

125

150

Junction Temperature, Tj (C)

10 -0.1

-1.0 -10.0 Drain-Source Voltage, VDS (V)

-100.0

Fig.9. Normalised drain-source on-state resistance. RDS(ON)/RDS(ON)25 C = f(Tj)

Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz

August 1998

Rev 1.000

Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

BSH205

Gate-source voltage, VGS (V) -6 -5 -4 -3 -2 -1 0 0 1 2 3 Gate charge, (nC) 4 VDD = 10 V RD = 20 Ohms Tj = 25 C

BSH205 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0

Source-Drain Diode Current, IF (A)

BSH205

150 C

Tj = 25 C

0 5

0.2

0.4

0.6

0.8

1.2

1.4

Drain-Source Voltage, VSDS (V)

Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG)

Fig.14. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj

August 1998

Rev 1.000

Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

MECHANICAL DATA
Plastic surface mounted package; 3 leads SOT23

BSH205

HE

v M A

Q A A1

1
e1 e bp

2
w M B detail X Lp

1 scale

2 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1

OUTLINE VERSION SOT23

REFERENCES IEC JEDEC EIAJ

EUROPEAN PROJECTION

ISSUE DATE 97-02-28

Fig.15. SOT23 surface mounting package.

Notes 1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling. 2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18. 3. Epoxy meets UL94 V0 at 1/8".

August 1998

Rev 1.000

Philips Semiconductors

Product specification

P-channel enhancement mode MOS transistor

DEFINITIONS
Data sheet status Objective specification Product specification Limiting values

BSH205

This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

August 1998

Rev 1.000