DESCRIPTION .MEDIUM SPEED OPERATION - 10MHz (typ.) AT VDD VSS = 10V .FULLYSTATIC OPERATION .QUIESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE .STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS .INPUT CURRENTOF 100nA AT 18V AND25C FOR HCC DEVICE .100% TESTEDFOR QUIESCENT CURRENT .5V, 10V, AND 15V PARAMETRIC RATINGS .MEETSALLREQUIREMENTSOFJEDECTEN- TATIVE STANDARD N o 13A, STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIESCMOS DEVICES June 1989 The HCC4018B (extended temperature range) and HCF4018B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF4018B types consist of 5 Johnson- Counter stages, buffered Q outputs from each stage, and counter preset control gating. CLOCK, RESET, DATA, PRESETENABLE, and 5 individual JAM inputs are provided. Divide by 10, 8, 6, 4, or 2 counter configurations canbe implementedbyfeed- ing the Q5, Q4, Q3, Q2, Q1 signals, respectively, back to the DATA input. Divide-by-9, 7, 5, or 3 counter configurations can be implemented by the use of a HCC/HCF4011B gate package to properly gate the feedback connection to the DATA input. Divide-by-functions greater than 10 can be achieved by use of multiple HCC/HCF 4018B units. The counter is advanced one count at the positive clock-signal transition. Schmitt Trigger action on the clock line permits unlimited clock rise and fall times. A high RESET signal clears the counter to an all-zero condition. A high PRESENT- ENABLE signal allows information on the JAM in- puts to preset the counter. Anti-lock gating is provided to assure the proper counting sequence. EY (Plastic Package) F (Ceramic Frit Seal Package) C1 (Plastic Chip Carrier) ORDERCODES : HCC4018BF HCF4018BM1 HCF4018BEY HCF4018BC1 PIN CONNECTIONS M1 (Micro Package) 1/12 FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V DD * Supply Voltage : HCC Types HCF Types 0.5 to + 20 0.5 to + 18 V V V i Input Voltage 0.5 to V DD + 0.5 V I I DC Input Current (any one input) 10 mA P t o t Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range 200 100 mW mW T op Operating Temperature : HCC Types HCF Types 55 to + 125 40 to + 85 C C T st g Storage Temperature 65 to + 150 C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit V DD Supply Voltage : HCC Types HCF Types 3 to 18 3 to 15 V V V I Input Voltage 0 to V DD V T o p Operating Temperature : HCC Types HCF Types 55 to + 125 40 to + 85 C C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec- tions of this specifi cation is not implied. Exposure to absolute maximum rating conditions for external peri ods may affect device reliabil ity. * All voltage values are refered to VSS pin voltage. HCC/HFC4018B 2/12 LOGIC DIAGRAM TIMING DIAGRAM HCC/HCF4018B 3/12 STATIC ELECTRICAL CHARACTERISTICS (under recommended operating conditions) Test Conditions Value V I V O |I O | V DD T Lo w * 25C T Hi gh * Symbol Parameter (V) (V) (A) (V) Min. Max. Min. Typ. Max. Min. Max. Unit I L Quiescent Current HCC Types 0/ 5 5 5 0.04 5 150 A 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000 HCF Types 0/ 5 5 20 0.04 20 150 0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600 V OH Output High Voltage 0/ 5 < 1 5 4.95 4.95 4.95 V 0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95 V OL Output Low Voltage 5/0 < 1 5 0.05 0.05 0.05 V V 10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05 V IH Input High Voltage 0.5/4.5 < 1 5 3.5 3.5 3.5 1/9 < 1 10 7 7 7 1.5/13.5 < 1 15 11 11 11 V IL Input Low Voltage 4.5/0.5 < 1 5 1.5 1.5 1.5 V 9/1 < 1 10 3 3 3 13.5/1.5 < 1 15 4 4 4 I OH Output Drive Current HCC Types 0/ 5 2.5 5 2 1.6 3.2 1.15 mA 0/ 5 4.6 5 0.64 0.51 1 0.36 0/10 9.5 10 1.6 1.3 2.6 0.9 0/15 13.5 15 4.2 3.4 6.8 2.4 HCF Types 0/ 5 2.5 5 1.53 1.36 3.2 1.1 0/ 5 4.6 5 0.52 0.44 1 0.36 0/10 9.5 10 1.3 1.1 2.6 0.9 0/15 13.5 15 3.6 3.0 6.8 2.4 I OL Output Sink Current HCC Types 0/ 5 0.4 5 0.64 0.51 1 0.36 mA 0/10 0.5 10 1.6 1.3 2.6 0.9 0/15 1.5 15 4.2 3.4 6.8 2.4 HCF Types 0/ 5 0.4 5 0.52 0.44 1 0.36 0/10 0.5 10 1.3 1.1 2.6 0.9 0/15 1.5 15 3.6 3.0 6.8 2.4 I IH , I IL Input Leakage Current HCC Types 0/18 Any Input 18 0.1 10 5 0.1 1 A HCF Types 0/15 15 0.3 10 5 0.3 1 C I Input Capacitance Any Input 5 7.5 pF * TLow = 55C for HCC device : 40C for HCF device. * THigh = +125C for HCC device : + 85C for HCF device. The Noise Margin for both 1 and 0 level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V. HCC/HFC4018B 4/12 DYNAMIC ELECTRICAL CHARACTERISTICS (T amb = 25C, C L = 50pF, R L = 200k, typical temperature coefficient for all V DD values is 0.3%/C, all input rise and fall times = 20ns) Val ue Symbol Parameter Test Conditions V DD (V) Min. Typ. Max. Unit t PL H , t PHL Propagation Delay Time 5 200 400 ns 10 90 180 15 65 130 t THL , t TL H Transition Time 5 100 200 ns 10 50 100 15 40 80 f CL Maximum Clock Input Frequency 5 3 6 MHz 10 7 14 15 8.5 17 t W Clock Input Width 5 160 80 ns 10 70 35 15 50 25 t r , t f Clock Input Rise or Fall Time 5 Unlimited s 10 15 t set up Data Input Set-up Time 5 40 20 ns 10 12 6 15 6 3 t H Data Input Hold-time 5 140 70 ns 10 80 40 15 60 30 PRESET* OR RESET OPERATI ON t PL H , t PHL Propagation Delay Time (reset or reset to Q) 5 275 550 ns 10 125 250 15 90 180 t W Preset or Reset Pulse Width 5 160 80 ns 10 70 35 15 50 25 t re m Preset or Reset Removal Time 5 80 40 ns 10 30 15 15 20 10 At PRESET ENABLE OR JAM inputs HCC/HCF4018B 5/12 Typical Output Low (sink) Current Characteristics. Typical Output high (source) Current Charac- teristics. Minimum Output High (source) Current Charac- teristics. typical Output low (sink) Current Characteristics. HCC/HFC4018B 6/12 TYPICAL APPLICATIONS External connections for divide by 10, 9, 8, 7, 6, 5, 4, 3, 2 operation. DIVIDEBY 10 Q 5 DIVIDEBY 8 Q4 DIVIDEBY 6 Q3 DIVIDEBY 4 Q 2 DIVIDEBY 2 Q1 CONNECTED BACKTO DATA NO EXTERNAL COMPONENTS REQUIRED NO CONNECTED HCC/HCF4018B 7/12 Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a1 0.51 0.020 B 0.77 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 P001C HCC/HFC4018B 8/12 Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015 e3 17.78 0.700 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406 P 7.8 8.05 0.307 0.317 Q 5.08 0.200 P053D HCC/HCF4018B 9/12 SO16 (Narrow) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45 (typ.) D 9.8 10 0.385 0.393 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.62 0.024 S 8 (max.) P013H HCC/HFC4018B 10/12 PLCC20 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A HCC/HCF4018B 11/12 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproductsare not authorized for use ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A HCC/HFC4018B 12/12