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    RT Duroid 5870 5880 Data Sheet

    Uploaded by

    Anonymous yz5MQGt
    datasheet5880

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    of 2

    Advanced Circuit Materials Division

    100 S. Roosevelt Avenue


    Chandler, AZ 85226
    Tel: 480-961-1382, Fax: 480-961-4533
    www.rogerscorp.com

    Advanced Circuit Materials

    Data Sheet

    RT/duroid 5870/5880 Laminates

    RT/duroid 5870 /5880 High Frequency Laminates

    Features:

    Lowest electrical loss for reinforced PTFE material


    Low moisture absorption
    Isotropic
    Uniform electrical properties over frequency
    Excellent chemical resistance

    Some Typical Applications:

    Commercial Airline Broadband Antennas

    RT/duroid 5870 and 5880 glass microfiber reinforced


    PTFE composites are designed for exacting stripline and
    microstrip circuit applications.
    Glass reinforcing microfibers are randomly oriented to
    maximize benefits of fiber reinforcement in the directions most valuable to circuit producers and in the final
    circuit application.
    The dielectric constant of RT/duroid 5870 and 5880
    laminates is uniform from panel to panel and is

    Microstrip and Stripline Circuits

    constant over a wide frequency range.

    Millimeter Wave Applications

    Its low dissipation factor extends the usefulness of

    Military Radar Systems

    RT/duroid 5870 and 5880 laminates to Ku-band and

    Missile Guidance Systems


    Point to Point Digital Radio Antennas

    above.
    RT/duroid 5870 and 5880 laminates are easily cut,
    sheared and machined to shape. They are resistant to
    all solvents and reagents, hot or cold, normally used in
    etching printed circuits or in plating edges and holes.

    Normally supplied as a laminate with electrodeposited copper


    of to 2 ounces/ ft.2 (8to 70m) or reverse treated EDC on both
    sides, RT/duroid 5870 and 5880 composites can also be clad with
    rolled copper foil for more critical electrical applications. Cladding
    with aluminum, copper or brass plate may also be specified.
    When ordering RT/duroid 5870 and 5880 laminates, it is important to
    specify dielectric thickness, tolerance, rolled, electrodeposited or
    reverse treated copper foil, and weight of copper foil required.

    The world runs better with Rogers.

    RT/duroid 5870/5880 Laminates


    PROPERTY

    TYPICAL VALUE [2]

    DIRECTION

    UNITS[3]

    CONDITION

    TEST METHOD

    2.20
    2.20 0.02 spec.

    Z
    Z

    N/A

    C24/23/50
    C24/23/50

    1 MHz IPC-TM-650 2.5.5.3


    10 GHz IPC-TM 2.5.5.5

    2.33

    2.20

    N/A

    8 GHz - 40 GHz

    Differential Phase Length


    Method

    Dissipation Factor, tan

    0.0005
    0.0012

    0.0004
    0.0009

    Z
    Z

    N/A

    C24/23/50
    C24/23/50

    1 MHz IPC-TM-650, 2.5.5.3


    10 GHz IPC-TM-2.5.5.5

    Thermal Coefficient of r

    -115

    -125

    -50 - 150C

    IPC-TM-650, 2.5.5.5

    RT/duroid 5870

    RT/duroid 5880

    Dielectric Constant, r

    2.33
    2.33 0.02 spec.

    Dielectric Constant, r

    [1]

    Process
    [4]

    Design

    Volume Resistivity

    2 X 10

    Surface Resistivity

    2 X 107

    Tensile Modulus

    ultimate stress

    ultimate strain

    Compressive Modulus

    ultimate stress

    ultimate strain

    ppm/C

    Mohm cm

    C96/35/90

    ASTM D257

    3 X 107

    Mohm

    C/96/35/90

    ASTM D257

    ASTM D638

    ASTM D695

    2 X 10

    Test at
    23C

    Test at
    100C

    Test at
    23C

    Test at
    100C

    N/A

    1300 (189)

    490 (71)

    1070 (156)

    450 (65)

    1280 (185)

    430 (63)

    860 (125)

    380 (55)

    50 (7.3)

    34 (4.8)

    29 (4.2)

    20 (2.9)

    42 (6.1)

    34 (4.8)

    27 (3.9)

    18 (2.6)

    9.8

    8.7

    6.0

    7.2

    9.8

    8.6

    4.9

    5.8

    1210 (176)

    680 (99)

    710 (103)

    500 (73)

    1360 (198)

    860 (125)

    710 (103)

    500 (73)

    803 (120)

    520 (76)

    940 (136)

    670 (97)

    30 (4.4)

    23 (3.4)

    27 (3.9)

    22 (3.2)

    37 (5.3)

    25 (3.7)

    29 (5.3)

    21 (3.1)

    54 (7.8)

    37 (5.3)

    52 (7.5)

    43 (6.3)

    4.0

    4.3

    8.5

    8.4

    3.3

    3.3

    7.7

    7.8

    8.7

    8.5

    12.5

    17.6

    MPa (kpsi)

    MPa (kpsi)

    0.96 (0.23)

    0.96 (0.23)

    N/A

    J/g/K
    (cal/g/C)

    N/A

    Calculated

    Moisture Absorption

    0.02

    0.02

    N/A

    .062 (1.6mm)
    D48/50

    ASTM D570

    Thermal
    Conductivity

    0.22

    0.20

    W/m/K

    80C

    ASTM C518

    Coefficient of
    Thermal Expansion

    22
    28
    173

    31
    48
    237

    X
    Y
    Z

    ppm/C

    0-100C

    IPC-TM-650, 2.4.41

    Td

    500

    500

    N/A

    C TGA

    N/A

    ASTM D3850

    Density

    2.2

    2.2

    N/A

    gm/cm

    N/A

    ASTM D792

    Specific Heat

    1 oz (35m) EDC foil

    IPC-TM-650 2.4.8

    Copper Peel

    27.2 (4.8)

    31.2 (5.5)

    N/A

    pli (N/mm)

    Flammability

    V-0

    V-0

    N/A

    N/A

    N/A

    UL94

    Lead-Free Process
    Compatible

    Yes

    Yes

    N/A

    N/A

    N/A

    N/A

    after solder float

    [1] Specification values are measured per IPC-TM-650, method 2.5.5.5 @ ~10GHz, 23C. Testing based on 1 oz. electrodeposited copper foil. r values and tolerance reported by
    IPC-TM-650 method 2.5.5.5 are the basis for quality acceptance, but for some products these values may be incorrect for design purposes, especially microstrip designs. We
    recommend that prototype boards for new designs be verified for desired electrical performance.
    [2] Typical values should not be used for specification limits, except where noted.
    [3] SI unit given first with other frequently used units in parentheses.
    [4] The design Dk is an average number from several different tested lots of material and on the most common thickness/s. If more detailed information is required, please contact
    Rogers Corporation. Refer to Rogers technical paper Dielectric Properties of High Frequency Materials available at http://www.rogerscorp.com/acm.
    STANDARD THICKNESS

    STANDARD PANEL SIZE

    STANDARD COPPER CLADDING

    0.005 (0.127mm),
    0.010 (0.254mm),
    0.015 (0.381mm),
    0.020 (0.508mm),
    0.031 (0.787mm)
    0.062 (1.575mm)
    0.125 (3.175mm)

    18 X 12 (457 X 305mm)
    18 X 24 (457 X 610mm)
    18 X 36 (457 X 915mm)
    18 X 48 (457 X 1.224m)

    oz. (9 m) electrodeposited copper foil depending on dielectric thickness


    oz. (17m), 1 oz. (35m), 2 oz. (70m) electrodeposited reverse treated EDC and rolled
    copper foil.
    Thick metal cladding are also available. Contact customer service for available
    claddings and panel sizes.

    The information in this data sheet is intended to assist you in designing with Rogers circuit materials. It is not intended to and does not create any warranties express or implied,
    including any warranty of merchantability or fitness for a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular purpose. The user
    should determine the suitability of Rogers circuit materials for each application.
    These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law
    prohibited.
    RT/duroid, The world runs better with Rogers. and the Rogers logo are licensed trademarks of Rogers Corporation. 2014 Rogers Corporation, Printed in U.S.A. All rights reserved.
    Revised 1087 050614 Publication #92-101

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