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    Lot Id Lot Number Package Device Group Cust Device Cust Id Wafer Size Orientation Qty

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    amirulamir
    The document contains information about various lots including lot numbers, packages, customer devices, wafer sizes, orientations, quantities, operations, operators, and hold details if applicable. There are multiple lots listed with different package types, customer devices, and number of wafers ranging from 1 to 25 wafers. Some lots are listed as being on hold for issues like low yield, abnormal bond pads, or setup needs.

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    Lot Id Lot Number Package Device Group Cust Device Cust Id Wafer Size Orientation Qty

    Uploaded by

    amirulamir
    31 views4 pages
    The document contains information about various lots including lot numbers, packages, customer devices, wafer sizes, orientations, quantities, operations, operators, and hold details if applicable. There are multiple lots listed with different package types, customer devices, and number of wafers ranging from 1 to 25 wafers. Some lots are listed as being on hold for issues like low yield, abnormal bond pads, or setup needs.

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    The document contains information about various lots including lot numbers, packages, customer devices, wafer sizes, orientations, quantities, operations, operators, and hold details if applicable. There are multiple lots listed with different package types, customer devices, and number of wafers ranging from 1 to 25 wafers. Some lots are listed as being on hold for issues like low yield, abnormal bond pads, or setup needs.

    Copyright:

    © All Rights Reserved
    Download as XLS, PDF, TXT or read online from Scribd
    Download as xls, pdf, or txt
    31 views4 pages

    Lot Id Lot Number Package Device Group Cust Device Cust Id Wafer Size Orientation Qty

    Uploaded by

    amirulamir
    The document contains information about various lots including lot numbers, packages, customer devices, wafer sizes, orientations, quantities, operations, operators, and hold details if applicable. There are multiple lots listed with different package types, customer devices, and number of wafers ranging from 1 to 25 wafers. Some lots are listed as being on hold for issues like low yield, abnormal bond pads, or setup needs.

    Copyright:

    © All Rights Reserved
    Download as XLS, PDF, TXT or read online from Scribd
    Download as xls, pdf, or txt
    of 4

    LOT ID

    LOT NUMBER

    PACKAGE

    DEVICE GROUP

    CUST DEVICE

    CUST ID WAFER SIZE


    ORIENTATION QTY

    1551004130007

    2W60A00000

    08BALL-RDL

    RDL_ICPFER107CR ICPFER107CR

    SCO

    8 NOTCH

    1609009250000

    2WKYA00000

    08BALL-RP

    BD_ICPFER106CR ICPFER106CR

    SCO

    8 NOTCH

    25

    1605008590003

    2X2ZA00000

    08BALL-RP

    ICPFER207CR

    ICPFER207CR

    SCO

    8 NOTCH

    1608013100002

    2X4XA00000

    08BALL-RDL

    RDL_ICPFER107CR ICPFER107CR

    SCO

    8 NOTCH

    24

    1607001290000

    2X7RA00000

    08BALL-RDL

    RDL_ICPFER107CR ICPFER107CR

    SCO

    8 NOTCH

    25

    1608013070001

    2X91A00000

    08BALL-RP

    ICPFER207CR

    ICPFER207CR

    SCO

    8 NOTCH

    1608013070002

    2X91A00000

    08BALL-RP

    ICPFER207CR

    ICPFER207CR

    SCO

    8 NOTCH

    1608013130000

    2X9MA00000

    08BALL-RDL

    RDL_ICPFER107CR ICPFER107CR

    SCO

    8 NOTCH

    24

    1608013140003

    2XBCA00B31

    08BALL-RDL

    RDL_ICPFER107CR ICPFER107CR

    SCO

    8 NOTCH

    1605008620002

    54WHB00000

    08BALL-RP

    BD_ICPFER103CR ICPFER105CR

    SCO

    8 NOTCH

    1609009100000

    56VAB00B30

    08SOLDER(NI)

    SP12T/SWR120

    ICPSWR120CR(SP1 SCO

    8 NOTCH

    1605005020003

    57FDB00000

    08SOLDER(NI)

    SP12T/SWR120

    ICPSWR120CR(SP1 SCO

    8 NOTCH

    1609009030000

    57U1B00B30

    08SOLDER(NI)

    SP12T/SWR120

    ICPSWR120CR(SP1 SCO

    8 NOTCH

    1609009050000

    58FUB00000

    08SOLDER(NI)

    SP12T/SWR120

    ICPSWR120CR(SP1 SCO

    8 NOTCH

    23

    1609009070000

    58FVB00000

    08SOLDER(NI)

    SP12T/SWR120

    ICPSWR120CR(SP1 SCO

    8 NOTCH

    24

    1609009260000

    596FB00000

    08BALL-RP

    BD_ICPFER103CR ICPFER105CR

    SCO

    8 NOTCH

    22

    1609009280000

    5986B00000

    08BALL-RP

    BD_ICPFER203CR ICPFER205CR

    SCO

    8 NOTCH

    25

    1609009270000

    5AZ7B00B30

    08BALL-RP

    BD_ICPFER103CR ICPFER105CR

    SCO

    8 NOTCH

    1609001920000

    B1/3_TXRX

    06BALL-RP

    BAND-1/3(M)

    BAND-1/3

    SCO

    6 SEMI

    1609001920001

    B1/3_TXRX

    06BALL-RP

    BAND-1/3(M)

    BAND-1/3

    SCO

    6 SEMI

    LAYER

    OPER

    NEXT OPER

    OPER DAYS CUM DAYS


    62.56

    COMM DATE

    79.85 29Dec15

    HOLD BY

    HOLD DATE

    OQA

    PACK

    MJHA

    02Feb16 05:43PM

    L4

    PEW2

    PRD2

    0.04

    -1.15 16Mar16

    FV

    F/V

    OQA

    15.85

    25.85 18Feb16

    AMIR

    20Feb16 12:10PM

    L3

    DBK4

    SPC3

    0.31

    9.85 09Mar16

    OQA

    OQA

    PACK

    0.15

    16.85 03Mar16

    L3

    VSP DEV

    CUR

    7.84

    6.85 08Mar16

    FAZILAH

    07Mar16 06:51AM

    AMIR

    L3

    DBK

    SPC

    8.64

    6.85 08Mar16

    HALIMAHTON 03Mar16 06:09PM

    05Mar16 01:18PM

    L3

    ALG3

    PEW3

    0.05

    7.85 12Mar16

    PLT2

    HBK2

    DES4

    0.08

    7.85 12Mar16

    FV

    F/V

    OQA

    7.19

    20.85 23Feb16

    PR

    PRSCAN

    VSP DEV

    0.93

    0.85 14Mar16

    FV

    F/V

    OQA

    16.89

    31.85 12Feb16

    PR

    PRSCAN

    VSP DEV

    0.93

    1.85 13Mar16

    PR

    VSP DEV

    PDBK

    0.12

    0.85 14Mar16

    PR

    PRSCAN

    VSP DEV

    0.66

    1.85 13Mar16

    L4

    DES

    VSP DES

    0.15

    -0.15 15Mar16

    PLT2

    HBK

    DES2

    0.07

    -2.15 17Mar16

    L4

    VSP DEV

    VSP DEV

    0.04

    -0.15 15Mar16

    OQA

    SHR TST

    WCN

    0.72

    4.85 07Mar16

    ETH

    VSP TIE

    DBK3

    1.61

    4.85 07Mar16

    AMIR

    29Feb16 10:11AM

    AMIR

    20Feb16 01:08AM

    PGLIEW

    05Mar16 05:51PM

    HOLD DUR

    HOLD REMARK

    33.61 HC-MJHA-20160202174322:(Contact:760) on hold for QA Dines


    15.85 HMF-AMIR-20160220121048:(Contact:800) void check fail and individual wafer yield is 89.01%(missing bump)
    0.07 HQ-FAZILAH-20160307065108:(Contact:804) VERIFY FOR DINESWARAN
    1.8 HMF-AMIR-20160305131839:(Contact:687) on hold eng disposition due to abnormal bond pad
    3.6 HMF-HALIMAHTON-20160303180900:(Contact:687) on hold eng disposition due to abnormal bond pad

    6.93 HMF-AMIR-20160229101145:(Contact:805) on hold low yield due to rough bump (82.93%)


    16.31 HMF-AMIR-20160220010859:(Contact:805) low yield due to bump height failure

    1.61 HE-PGLIEW-20160305175154:ON Hold for BAL 04 Job File set up (Contact MIOR) & Spilt 4 wafers for Evaluation (PG LIEW/ CAROL).[FUTURE

    L).[FUTURE HOLD]PGLIEW

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