74HC4053 74HCT4053: 1. General Description
74HC4053 74HCT4053: 1. General Description
74HC4053 74HCT4053: 1. General Description
1. General description
The 74HC4053; 74HCT4053 is a high-speed Si-gate CMOS device and is pin compatible
with the HEF4053B. It is specified in compliance with JEDEC standard no. 7A.
With E LOW, one of the two switches is selected (low-impedance ON-state) by S1 to S3.
With E HIGH, all switches are in the high-impedance OFF-state, independent of S1 to S3.
VCC and GND are the supply voltage pins for the digital control inputs (S1 to S3 and E).
The VCC to GND ranges are 2.0 V to 10.0 V for 74HC4053 and 4.5 V to 5.5 V for
74HCT4053. The analog inputs/outputs (nY0 and nY1, and nZ) can swing between VCC
as a positive limit and VEE as a negative limit. VCC − VEE may not exceed 10.0 V.
2. Features
■ Low ON resistance:
◆ 80 Ω (typical) at VCC − VEE = 4.5 V
◆ 70 Ω (typical) at VCC − VEE = 6.0 V
◆ 60 Ω (typical) at VCC − VEE = 9.0 V
■ Logic level translation:
◆ To enable 5 V logic to communicate with ±5 V analog signals
■ Typical ‘break before make’ built in
■ Complies with JEDEC standard no. 7A
■ ESD protection:
◆ HBM EIA/JESD22-A114-C exceeds 2000 V
◆ MM EIA/JESD22-A115-A exceeds 200 V
■ Multiple package options
■ Specified from −40 °C to +85 °C and from −40 °C to +125 °C
Philips Semiconductors 74HC4053; 74HCT4053
Triple 2-channel analog multiplexer/demultiplexer
3. Applications
■ Analog multiplexing and demultiplexing
■ Digital multiplexing and demultiplexing
■ Signal gating
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑{(CL + CS) × VCC2 × fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑{(CL + CS) × VCC2 × fo} = sum of outputs;
74HC_HCT4053_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
5. Ordering information
Table 2: Ordering information
Type number Package
Temperature range Name Description Version
74HC4053
74HC4053N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil); long SOT38-4
body
74HC4053D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width SOT109-1
3.9 mm
74HC4053DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body SOT338-1
width 5.3 mm
74HC4053PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
74HC4053BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
74HCT4053
74HCT4053N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil); long SOT38-4
body
74HCT4053D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width SOT109-1
3.9 mm
74HCT4053DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body SOT338-1
width 5.3 mm
74HCT4053PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
74HCT4053BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
6. Functional diagram
E VCC
6 16
13 1Y1
S1 11 LOGIC
LEVEL DECODER 12 1Y0
CONVERSION
14 1Z
1 2Y1
S2 10
2 2Y0
15 2Z
3 3Y1
S3 9
5 3Y0
4 3Z
8 7
GND VEE 001aae124
6
EN
11 S1 1Y0 12
10 S2 1Y1 13
MUX/DMUX
9 S3 1Z 14 11 # 0 12
× 0
2Y0 2 1
14 13
0/1 1
2Y1 1
10 # 2
2Z 15
15 1
3Y0 5
3Y1 3 9 # 5
6 E 3Z 4 4 3
001aae125
001aae126
VCC VEE
VCC VCC
VCC VEE
VEE Z
from
logic
001aad544
7. Pinning information
7.1 Pinning
74HC4053
74HCT4053
16 VCC
2Y1
terminal 1
index area
74HC4053
1
74HCT4053 2Y0 2 15 2Z
3Y1 3 14 1Z
2Y1 1 16 VCC
3Z 4 13 1Y1
2Y0 2 15 2Z
3Y1 3 14 1Z 3Y0 5 12 1Y0
3Z 4 13 1Y1 E 6 GND(1) 11 S1
3Y0 5 12 1Y0 VEE 7 10 S2
8
E 6 11 S1
GND
S3
VEE 7 10 S2
001aae128
GND 8 9 S3
Transparent top view
001aae127
8. Functional description
9. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
VEE = GND (ground = 0 V). [1]
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +11.0 V
IIK input clamping current VI < −0.5 V or VI > VCC + 0.5 V - ±20 mA
ISK switch clamping current VS < −0.5 V or VS > VCC + 0.5 V - ±20 mA
[1] To avoid drawing VCC current out of terminals nZ, when switch current flows in terminals nYn, the voltage
drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminals nZ, no
VCC current will flow out of terminals nYn. In this case there is no limit for the voltage drop across the switch,
but the voltages at nYn and nZ may not exceed VCC or VEE.
[2] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 °C.
[3] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.
[4] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 °C.
[5] For DHVQFN16 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.
001aad545 001aad546
10 10
VCC − GND VCC − GND
(V) (V)
8 8
6 operating area 6
operating area
4 4
2 2
0 0
0 2 4 6 8 10 0 2 4 6 8 10
VCC − VEE (V) VCC − VEE (V)
[1] At supply voltages (VCC − VEE) approaching 2.0 V the analog switch ON resistance becomes extremely non-linear. Therefore, it is
recommended that these devices be used to transmit digital signals only, when using these supply voltages.
mnb047
110
(1)
RON
(Ω)
90
HIGH
(from select input) 70
VS (2)
nYn nZ (3)
50
30
VEE
001aae129
10
0 1.8 3.6 5.4 7.2 9.0
Vis (V)
LOW Sn HIGH Sn
(select input) (select input)
nYn nZ nYn nZ
A A A
VEE VEE
001aae130 001aae131
Fig 10. Test circuit for measuring OFF-state leakage Fig 11. Test circuit for measuring ON-state leakage
current current
[1] CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + ∑{(CL + CS) × VCC2 × fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑{(CL + CS) × VCC2 × fo} = sum of outputs;
CL = output load capacitance in pF;
CS = maximum switch capacitance in pF;
VCC = supply voltage in V.
[1] CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + ∑{(CL + CS) × VCC2 × fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑{(CL + CS) × VCC2 × fo} = sum of outputs;
CL = output load capacitance in pF;
CS = maximum switch capacitance in pF;
VCC = supply voltage in V.
13. Waveforms
Vis input 50 %
tPLH tPHL
Vos output 50 %
001aad555
VI
E, Sn inputs VM
0V
tPZL
tPLZ
Vos output 50 %
10 %
tPHZ tPZH
90 %
50 %
Vos output
001aae330
tW
VI
90 %
negative
pulse VM VM
10 %
0V
tf tr
tr tf
VI
90 %
positive
pulse VM VM
10 %
0V
tW
VI Vos RL S1
PULSE
DUT open
GENERATOR
RT CL
GND
VEE
001aae382
[1] VI values:
a) For 74HC4053: VI = VCC.
b) For 74HCT4053: VI = 3 V.
feed-through Figure 16
attenuation VCC = 2.25 V; VEE = −2.25 V - −50 - dB
VCC = 4.5 V; VEE = −4.5 V - −50 - dB
Vct(sw-sw) crosstalk between RL = 600 Ω; CL = 50 pF; fi = 1 MHz; see [1]
switches Figure 17
VCC = 2.25 V; VEE = −2.25 V - −60 - dB
VCC = 4.5 V; VEE = −4.5 V - −60 - dB
Vct(d-sw) crosstalk between VCC = 4.5 V; RL = 600 kΩ; CL = 50 pF; [2]
[1] Adjust input voltage Vis to 0 dBm level (0 dBm = 1 mW into 600 Ω).
[2] Control input E or Sn, with square-wave between VCC and GND.
[3] Adjust input voltage Vis to 0 dBm level at Vos for 1 MHz (0 dBm = 1 mW into 50 Ω).
nYn nZ
10 µF
or or
nZ nYn
Vis Vos
RL CL dB
channel
GND
ON
001aae132
001aae332
0
α(OFF)(ft)
(dB)
−20
−40
−60
−80
−100
10 102 103 104 105 106
fi (kHz)
nYn nZ
0.1 µF or or
nZ nYn
Vis Vos
RL CL dB
channel
GND
OFF
001aae133
b. Test circuit
Fig 16. Typical switch OFF signal feed-through as a function of frequency
nYn nZ
0.1 µF
or or
RL
nZ nYn
Vis Vos
RL CL dB
channel
GND
ON
001aae134
a. Switch ON
nYn nZ
or or
nZ nYn
Vis Vos
RL channel RL CL dB
OFF
GND
001aae259
b. Switch OFF
Fig 17. Test circuits for measuring crosstalk between any two switches
VCC Sn or E VCC
2RL 2RL
nYn nZ
Vct(d-sw) or nZ or nYn
DUT
GND
VEE
001aae135
Fig 18. Test circuit for measuring crosstalk between digital inputs and switch
001aad551
5
Vos
(dB)
3
−1
−3
−5
10 102 103 104 105 106
f (kHz)
nYn nZ
10 µF
or or
nZ nYn
Vis Vos
RL CL dB
channel
GND
ON
001aae132
b. Test circuit
Fig 19. Typical frequency response
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b b2
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.25 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 0.76
1.30 0.38 0.85 0.23 18.55 6.20 3.05 7.80 8.3
inches 0.068 0.021 0.049 0.014 0.77 0.26 0.14 0.32 0.39
0.17 0.02 0.13 0.1 0.3 0.01 0.03
0.051 0.015 0.033 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
95-01-14
SOT38-4
03-02-13
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
D E A
X
c
y HE v M A
16 9
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 8 detail X
w M
e bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT338-1 MO-150
03-02-19
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3)
A
A1
pin 1 index
θ
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm SOT763-1
D B A
A
A1
E c
terminal 1 detail X
index area
terminal 1 C
e1
index area
e b v M C A B y1 C y
w M C
2 7
1 8
Eh e
16 9
15 10
Dh
X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT
max.
A1 b c D (1) Dh E (1) Eh e e1 L v w y y1
02-10-17
SOT763-1 --- MO-241 ---
03-01-27
16. Abbreviations
Table 15: Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
HBM Human Body Model
ESD ElectroStatic Discharge
MM Machine Model
DUT Device Under Test
Level Data sheet status [1] Product status [2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is Right to make changes — Philips Semiconductors reserves the right to
extracted from a full data sheet with the same type number and title. For make changes in the products - including circuits, standard cells, and/or
detailed information see the relevant data sheet or data handbook. software - described or contained herein in order to improve design and/or
Limiting values definition — Limiting values given are in accordance with performance. When the product is in full production (status ‘Production’),
the Absolute Maximum Rating System (IEC 60134). Stress above one or relevant changes will be communicated via a Customer Product/Process
more of the limiting values may cause permanent damage to the device. Change Notification (CPCN). Philips Semiconductors assumes no
These are stress ratings only and operation of the device at these or at any responsibility or liability for the use of any of these products, conveys no
other conditions above those given in the Characteristics sections of the license or title under any patent, copyright, or mask work right to these
specification is not implied. Exposure to limiting values for extended periods products, and makes no representations or warranties that these products are
may affect device reliability. free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
21. Trademarks
Notice — All referenced brands, product names, service names and
20. Disclaimers trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
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23. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3
6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 4
7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Functional description . . . . . . . . . . . . . . . . . . . 6
8.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Recommended operating conditions. . . . . . . . 7
11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
12 Dynamic characteristics . . . . . . . . . . . . . . . . . 14
13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
14 Additional dynamic characteristics . . . . . . . . 22
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26
16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 31
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 31
18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 32
19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
21 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
22 Contact information . . . . . . . . . . . . . . . . . . . . 32