MC14060B 14-Bit Binary Counter and Oscillator: Marking Diagrams

MC14060B
14-Bit Binary Counter and

Oscillator
The MC14060B is a 14−stage binary ripple counter with an on−chip
oscillator buffer. The oscillator configuration allows design of either
RC or crystal oscillator circuits. Also included on the chip is a reset
function which places all outputs into the zero state and disables the http://onsemi.com
oscillator. A negative transition on Clock will advance the counter to
the next state. Schmitt trigger action on the input line permits very MARKING
slow input rise and fall times. Applications include time delay circuits, DIAGRAMS
counter controls, and frequency dividing circuits.
This device contains protection circuitry to guard against damage due 16
PDIP−16
MC14060BCP
to high static voltages or electric fields. However, precautions must be P SUFFIX
AWLYYWWG
taken to avoid applications of any voltage higher than maximum rated CASE 648
1
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS v (Vin or Vout) v VDD.
16
Unused inputs must always be tied to an appropriate logic voltage
SOIC−16 14060BG
level (e.g., either VSS or VDD). Unused outputs must be left open. D SUFFIX AWLYWW
Features CASE 751B
• Fully Static Operation 1
• Diode Protection on All Inputs 16

• Supply Voltage Range = 3.0 V to 18 V 14
• Capable of Driving Two Low−power TTL Loads or One TSSOP−16 060B
DT SUFFIX ALYW G
Low−power Schottky TTL Load Over the Rated Temperature CASE 948F G
Range 1
• Buffered Outputs Available from Stages 4 Through 10 and
12 Through 14 16
• Common Reset Line SOEIAJ−16
MC14060B
F SUFFIX
• Pin−for−Pin Replacement for CD4060B CASE 966
ALYWG
• These Devices are Pb−Free and are RoHS Compliant
1
MAXIMUM RATINGS (Voltages Referenced to VSS)
A = Assembly Location
Symbol Parameter Value Unit WL, L = Wafer Lot
VDD DC Supply Voltage Range −0.5 to +18.0 V YY, Y = Year
WW, W = Work Week
Vin, Input or Output Voltage Range −0.5 to VDD V
G or G = Pb−Free Package
Vout (DC or Transient) +0.5
(Note: Microdot may be in either location)
Iin, Input or Output Current ±10 mA
Iout (DC or Transient) per Pin
PD Power Dissipation, per Package 500 mW ORDERING INFORMATION
(Note 1) See detailed ordering and shipping information in the package
TA Ambient Temperature Range −55 to +125 °C dimensions section on page 2 of this data sheet.
Tstg Storage Temperature Range −65 to +150 °C

TL Lead Temperature (8 Second Soldering) 260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Temperature Derating: Plastic “P and D/DW” Packages: –7.0 mW/°C from
65°C To 125°C.
© Semiconductor Components Industries, LLC, 2011 1 Publication Order Number:

June, 2011 − Rev. 8 MC14060B/D
MC14060B
Q12 1 16 VDD Table 1. Truth Table

Q13 2 15 Q10 Clock Reset Output State
Q14 3 14 Q8 L No Change
L Advance to Next State
Q6 4 13 Q9 H H All Outputs are Low
Q5 5 12 RESET
X = Don’t Care
Q7 6 11 CLOCK
Q4 7 10 OUT 1
VSS 8 9 OUT 2
Figure 1. Pin Assignment
OUT 2
9 Q4 Q5 Q12 Q13 Q14
OUT 1 7 5 1 2 3
10
CLOCK
11 C Q C Q C Q C Q C Q C Q
C Q C Q C Q C Q C Q C Q
R R R R R R
RESET
12
Q6 = PIN 4 Q8 = PIN 14 Q10 = PIN 15 VDD = PIN 16
Q7 = PIN 6 Q9 = PIN 13 VSS = PIN 8
Figure 2. Logic Diagram
ORDERING INFORMATION
Device Package Shipping†
MC14060BCPG PDIP−16 500 Units / Rail
(Pb−Free)
MC14060BDG SOIC−16 48 Units / Rail

(Pb−Free)
MC14060BDR2G SOIC−16 2500 / Tape & Reel

(Pb−Free)
MC14060BDTR2G TSSOP−16* 2500 / Tape & Reel

MC14060BFELG SOEIAJ−16 2000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
2
MC14060B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ − 55°C 25°C 125°C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VDD Typ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol Characteristic Vdc Min Max Min (Note 2) Max Min Max Unit
VOL Output Voltage “0” Level 5.0 − 0.05 − 0 0.05 − 0.05 V
Vin = VDD or 0 10 − 0.05 − 0 0.05 − 0.05
VOH Vin = 0 or VDD “1” Level
15
5.0
−
4.95
0.05
−
−
4.95
0
5.0
0.05
−
−
4.95
0.05
− V
10 9.95 − 9.95 10 − 9.95 −
15 14.95 − 14.95 15 − 14.95 −
VIL
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
Input Voltage
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
(VO = 4.5 or 0.5 V)
“0” Level
5.0 − 1.5 − 2.25 1.5 − 1.5
V
(VO = 9.0 or 1.0 V) 10 − 3.0 − 4.50 3.0 − 3.0
(VO = 13.5 or 1.5 V) 15 − 4.0 − 6.75 4.0 − 4.0
VIH
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
(VO = 0.5 or 4.5 V)
ÎÎÎÎÎÎ“1” Level 5.0 3.5 − 3.5 2.75 − 3.5 − V
(VO = 1.0 or 9.0 V) 10 7.0 − 7.0 5.50 − 7.0 −
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
(VO = 1.5 or 13.5 V) 15 11.0 − 11.0 8.25 − 11.0 −
ÎÎ
VIL Input Voltage “0” Level Vdc
(VO = 4.5 Vdc) (For Input 11 5.0 − 1.0 − 2.25 1.0 − 1.0
(VO = 9.0 Vdc) and Output 10) 10 − 2.0 − 4.50 2.0 − 2.0
(VO = 13.5 Vdc) 15 − 2.5 − 6.75 2.5 − 2.5
VIH (VO = 0.5 Vdc) “1” Level 5.0 4.0 − 4.0 2.75 − 4.0 − Vdc
(VO = 1.0 Vdc) 10 8.0 − 8.0 5.50 − 8.0 −
(VO = 1.5 Vdc) 15 12.5 − 12.5 8.25 − 12.5 −
IOH Output Drive Current mA
(VOH = 2.5 V) (Except Source 5.0 –3.0 − –2.4 –4.2 − – 1.7 −
(VOH = 4.6 V) Pins 9 and 10) 5.0 –0.64 − –0.51 –0.88 − – 0.36 −
(VOH = 9.5 V) 10 –1.6 − –1.3 –2.25 − – 0.9 −
(VOH = 13.5 V) 15 – 4.2 − –3.4 –8.8 − – 2.4 −
IOL (VOL = 0.4 V) Sink 5.0 0.64 − 0.51 0.88 − 0.36 − mA
(VOL = 0.5 V) 10 1.6 − 1.3 2.25 − 0.9 −
(VOL = 1.5 V) 15 4.2 − 3.4 8.8 − 2.4 −
Iin Input Current 15 − ± 0.1 − ± 0.00001 ± 0.1 − ± 1.0 mA
Cin Input Capacitance (Vin = 0) − − − − 5.0 7.5 − − pF
IDD Quiescent Current 5.0 − 5.0 − 0.005 5.0 − 150 mA
(Per Package) 10 − 10 − 0.010 10 − 300
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
IT Total Supply Current (Notes 3, 4)
15
5.0
− 20 − 0.015 20
IT = (0.25 mA/kHz) f + IDD
− 600
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ
(Dynamic plus Quiescent, 10 IT = (0.54 mA/kHz) f + IDD
Per Package) 15 IT = (0.85 mA/kHz) f + IDD
(CL = 50 pF on all outputs,
all buffers switching)
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25°C.
4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL − 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.002.
http://onsemi.com
3
MC14060B
SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25°C)
VDD Typ
Symbol Characteristic Vdc Min (Note 5) Max Unit
tTLH Output Rise Time (Counter Outputs) 5.0 − 40 200 ns
10 − 25 100
15 − 20 80
tTHL Output Fall Time (Counter Outputs) 5.0 − 50 200 ns
10 − 30 100
15 − 20 80
tPLH Propagation Delay Time 5.0 − 415 740 ns
tPHL Clock to Q4 10 − 175 300
15 − 125 200
Clock to Q14 5.0 − 1.5 2.7 ms
10 − 0.7 1.3
15 − 0.4 1.0
twH Clock Pulse Width 5.0 100 65 − ns
10 40 30 −
ÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ff
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
Clock Pulse Frequency
15
5.0
30
−
20
5
−
3.5 MHz
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
10 − 14 8
15 − 17 12
tTLH Clock Rise and Fall Time 5.0 ns
tTHL 10 No Limit
ÎÎÎÎÎÎÎÎÎÎ
15
tw Reset Pulse Width 5.0 120 40 − ns
10 60 15 −
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ 15 40 10 −
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
tPHL
Propagation Delay Time
Reset to On
5.0
10
15
−
−
−
170
80
60
350
160
100
ns
5. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
VDD
PULSE CLOCK
500 mF ID 0.01 mF Q4
GENERATOR
NC OUT1 Q5
NC OUT2
Qn CL
R CL
PULSE CLOCK
Q4 VSS CL
GENERATOR
NC OUT1 Q5
NC OUT2 Qn CL
R 20 ns 20 ns
CL
VSS CL 90%
CLOCK
50%
10%
tWH
20 ns 20 ns tPLH tPHL
VDD
90% 90%
50% 50%
CLOCK 10% Q
VSS 10%
50% DUTY CYCLE tTLH tTHL
Figure 1. Power Dissipation Test Circuit Figure 2. Switching Time Test Circuit
and Waveform and Waveforms
http://onsemi.com
4
MC14060B
11
f [ 1
2.3 RtcCtc
if 1 kHz ≤ f ≤ 100 kHz
RESET 10OUT 1 9OUT 2 and 2Rtc < RS < 10Rtc
Rtc (f in Hz, R in ohms, C in farads)
The formula may vary for other frequencies. Recommended
maximum value for the resistors in 1 MW.
RS Ctc
Figure 3. Oscillator Circuit Using RC Configuration
TYPICAL RC OSCILLATOR CHARACTERISTICS
8.0 100
VDD = 10 V
VDD = 15 V 50
f, OSCILLATOR FREQUENCY (kHz)

4.0 f AS A FUNCTION
FREQUENCY DEVIATION (%)
20
OF RTC
0 10 (C = 1000 pF)
(RS ≈ 2RTC)
1.0 V 5
- 4.0
2 f AS A FUNCTION
OF C
- 8.0 1 (RTC = 56 kW)
5.0 V
0.5 (RS = 120 k)
- 12
RTC = 56 kW RS=0, f=10.15kHz @ VDD=10, TA=25°C 0.2
C = 1000 pF RS=120 kW, f=7.8kHz @ VDD=10V, TA=25°C
- 16 0.1
- 55 - 25 0 25 50 75 100 125 1.0 k 10 k 100 k 1.0 M
TA, AMBIENT TEMPERATURE (°C) RTC, RESISTANCE (OHMS)
0.0001 0.001 0.01 0.1
C, CAPACITANCE (mF)
Figure 4. RC Oscillator Stability Figure 5. RC Oscillator Frequency as a
Function of RTC and C
CLOCK
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Table 2. Typical Data for Crystal Oscillator Circuit
11
500 kHz 32 kHz
RESET Characteristic Circuit Circuit Unit
10OUT 1 9OUT 2
Crystal Characteristics
18M
Resonant Frequency 500 32 kHz
Equivalent Resistance, RS 1.0 6.2 kW
RO
External Resistor/Capacitor Values
RO 47 750 kW
CS CT
CT 82 82 pF
CS 20 20 pF
Figure 6. Typical Crystal Oscillator Circuit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Frequency Stability
Frequency Changes as a
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Function of VDD (TA = 25°C)
VDD Change from 5.0 V to 10 V +6.0 +2.0 ppm
VDD Change from 10 V to 15 V +2.0 +2.0 ppm
Frequency Change as a Function of
Temperature (VDD = 10 V)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ TA Change from − 55°C to +100 +120 ppm
+ 25°C Complete Oscillator (Note 6)
TA Change from + 25°C to
+ 125°C Complete Oscillator –160 –560 ppm
(Note 6)
6. Complete oscillator includes crystal, capacitors, and resistors.
http://onsemi.com
5
MC14060B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
−A− NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9
3. DIMENSION L TO CENTER OF LEADS
B WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
1 8 MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F C
INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
S B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
SEATING
−T− PLANE
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
K M G 0.100 BSC 2.54 BSC
H J H 0.050 BSC 1.27 BSC
G J 0.008 0.015 0.21 0.38
D 16 PL K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
0.25 (0.010) M T A M
M 0_ 10 _ 0_ 10 _
S 0.020 0.040 0.51 1.01
http://onsemi.com
6
MC14060B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE K
−A− NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
16 9 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
−B− P 8 PL 5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
1 8
0.25 (0.010) M B S SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
G A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F
K R X 45 _ F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
C K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
−T− SEATING P 5.80 6.20 0.229 0.244
PLANE
M J R 0.25 0.50 0.010 0.019
D 16 PL
0.25 (0.010) M T B S A S
SOLDERING FOOTPRINT*
8X
6.40
16X 1.12
1 16
16X
0.58
1.27
PITCH
8 9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MC14060B
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F−01
ISSUE B
16X K REF
NOTES:
0.10 (0.004) M T U S V S 1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
0.15 (0.006) T U S K 2. CONTROLLING DIMENSION: MILLIMETER.
ÉÉÉ
ÇÇÇ
3. DIMENSION A DOES NOT INCLUDE MOLD
K1 FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
ÇÇÇ
ÉÉÉ
16 9 EXCEED 0.15 (0.006) PER SIDE.
2X L/2 J1 4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
B SECTION N−N NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
L −U− J DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
PIN 1
(0.003) TOTAL IN EXCESS OF THE K
IDENT. N DIMENSION AT MAXIMUM MATERIAL
1 8 0.25 (0.010) CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
M 7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
0.15 (0.006) T U S
A
N MILLIMETERS INCHES
−V− DIM MIN MAX MIN MAX
F A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
DETAIL E D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
C −W− H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
0.10 (0.004) K 0.19 0.30 0.007 0.012
−T− SEATING H DETAIL E K1 0.19 0.25 0.007 0.010
PLANE D G L 6.40 BSC 0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06
0.65
PITCH
16X 16X
0.36
1.26 DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
MC14060B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966−01
ISSUE A
NOTES:
16 9 LE 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Q1 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
E HE M_ MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
1 8 L 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
DETAIL P INCLUDE DAMBAR PROTRUSION. ALLOWABLE
Z DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
D TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
VIEW P
e A RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
c TO BE 0.46 ( 0.018).
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A --- 2.05 --- 0.081
A1 A1 0.05 0.20 0.002 0.008
b b 0.35 0.50 0.014 0.020
c 0.10 0.20 0.007 0.011
0.13 (0.005) M 0.10 (0.004) D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e 1.27 BSC 0.050 BSC
HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0_ 10 _ 0_ 10 _
Q1 0.70 0.90 0.028 0.035
Z --- 0.78 --- 0.031
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local
Email: orderlit@onsemi.com Phone: 81−3−5773−3850 Sales Representative
http://onsemi.com MC14060B/D
9

MC14060B 14-Bit Binary Counter and Oscillator: Marking Diagrams

Uploaded by

Copyright:

Available Formats

MC14060B 14-Bit Binary Counter and Oscillator: Marking Diagrams

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

MC14060B 14-Bit Binary Counter and Oscillator: Marking Diagrams

Uploaded by

Copyright:

Available Formats

MC14060B

14-Bit Binary Counter and

• Fully Static Operation 1

• Diode Protection on All Inputs 16

Tstg Storage Temperature Range −65 to +150 °C

© Semiconductor Components Industries, LLC, 2011 1 Publication Order Number:

Q12 1 16 VDD Table 1. Truth Table

Figure 1. Pin Assignment

Figure 2. Logic Diagram

MC14060BDG SOIC−16 48 Units / Rail

MC14060BDR2G SOIC−16 2500 / Tape & Reel

MC14060BDTR2G TSSOP−16* 2500 / Tape & Reel

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VDD Typ

Figure 3. Oscillator Circuit Using RC Configuration

TYPICAL RC OSCILLATOR CHARACTERISTICS

f, OSCILLATOR FREQUENCY (kHz)

Figure 6. Typical Crystal Oscillator Circuit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Function of VDD (TA = 25°C)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ TA Change from − 55°C to +100 +120 ppm

*For additional information on our Pb−Free strategy and soldering

*For additional information on our Pb−Free strategy and soldering

PUBLICATION ORDERING INFORMATION

You might also like