Semiconductor Technical Data: L Suffix
Semiconductor Technical Data: L Suffix
Semiconductor Technical Data: L Suffix
The MC14522B BCD counter and the MC14526B binary counter are
constructed with MOS P–channel and N–channel enhancement mode
devices in a monolithic structure.
These devices are presettable, cascadable, synchronous down counters L SUFFIX
with a decoded “0” state output for divide–by–N applications. In single stage CERAMIC
applications the “0” output is applied to the Preset Enable input. The CASE 620
Cascade Feedback input allows cascade divide–by–N operation with no
additional gates required. The Inhibit input allows disabling of the pulse
counting function. Inhibit may also be used as a negative edge clock. P SUFFIX
These complementary MOS counters can be used in frequency synthesiz- PLASTIC
ers, phase–locked loops, and other frequency division applications requiring CASE 648
low power dissipation and/or high noise immunity.
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
DW SUFFIX
• Logic Edge–Clocked Design — Incremented on Positive Transition of
SOIC
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Clock or Negative Transition of Inhibit CASE 751G
• Asynchronous Preset Enable
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
• Capable of Driving Two Low–power TTL Loads or One Low–power ORDERING INFORMATION
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Schottky TTL Load Over the Rated Temperature Range MC14XXXBCP Plastic
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS* (Voltages Referenced to VSS) MC14XXXBCL Ceramic
MC14XXXBDW SOIC
Symbol Parameter Value Unit
TA = – 55° to 125°C for all packages.
VDD DC Supply Voltage – 0.5 to + 18.0 V
Vin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current (DC or Transient), ± 10 mA PIN ASSIGNMENT
per Pin
PD Power Dissipation, per Package† 500 mW Q3 1 16 VDD
* Maximum Ratings are those values beyond which damage to the device may occur. INHIBIT 4 13 CF
†Temperature Derating: P0 5 12 “0”
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C CLOCK 6 11 P1
FUNCTION TABLE Q0 7 10 RESET
Inputs Output VSS 8 9 Q1
Preset Cascade Resulting
Clock Reset Inhibit Enable Feedback “0” Function
X H X L L L Asynchronous reset*
X H X H L H Asynchronous reset This device contains protection circuitry to
X H X X H H Asynchronous reset guard against damage due to high static
voltages or electric fields. However, pre-
X L X H X L Asynchronous preset cautions must be taken to avoid applications of
L H L X L Decrement inhibited any voltage higher than maximum rated volt-
L L L X L Decrement inhibited ages to this high–impedance circuit. For proper
operation, Vin and Vout should be constrained
H
L
L
L L
L
L
L
L
L
No change** (inactive edge)
No change** (inactive edge)
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an
L L L L L Decrement** appropriate logic voltage level (e.g., either VSS
H L L L L Decrement** or VDD). Unused outputs must be left open.
X = Don’t Care
NOTES:
* Output “0” is low when reset goes high only it PE and CF are low.
** Output “0” is high when reset is low, only if CF is high and count is 0000.
REV 3
1/94
CF Q0 CF Q0
PE PE
P0 Q1 P0 Q1
P1 P1
P2 Q2 P2 Q2
P3 IOH P3 IOL
RESET Q3 RESET Q3
INHIBIT INHIBIT
CLOCK “0” CLOCK “0”
EXTERNAL EXTERNAL
VSS VSS
POWER POWER
SUPPLY SUPPLY
VDD
CF Q0
PE
P0 Q1
P1
P2 Q2
P3 CL
RESET Q3 TEST POINT
CL
INHIBIT CL
CLOCK “0” Q or “0”
CL DEVICE
VSS CL UNDER
TEST CL*
PULSE
GENERATOR 20 ns 20 ns
90% VDD
CLOCK 50%
10% VSS
VARIABLE
WIDTH 50% DUTY CYCLE * Includes all probe and jig capacitance.
tr tf tf tr
VDD VDD
90% 90%
CLOCK 50% INHIBIT 50%
10% VSS 10%
VSS
tw tw
1/fmax 1/fmax
tPLH tPHL tPLH tPHL
Figure 5. Figure 6.
tw
VDD
RESET 50%
VSS
tr tf
tPHL
VDD
90%
ANY P 50%
10% ANY Q 50%
VSS
tPLH tPHL
trem
ANY Q VDD
50%
CLOCK
50%
VSS
Figure 7. Figure 8.
VALID
tr tf VDD
VDD ANY P 50%
PRESET 90%
ENABLE 50% VSS
10% GND
tsu th
tPHL tPLH VDD
PRESET
ENABLE 50%
“0” 50% VSS
tw
Preset Enable (Pin 3) — If Reset is low, a high level on other than all zeroes, the “0” output is valid after the rising
the Preset Enable input asynchronously loads the counter edge of Preset Enable (when Cascade Feedback is high).
with the programmed values on P0, P1, P2, and P3. See the Function Table.
Inhibit (Pin 4) — A high level on the Inhibit input pre– Cascade Feedback (Pin 13) — If the Cascade Feedback
vents the Clock from decrementing the counter. With Clock input is high, a high level is generated at the “0” output when
(pin 6) held high, Inhibit may be used as a negative edge the count is all zeroes. If Cascade Feedback is low, the “0”
clock input. output depends on the Preset Enable input level. See the
Function Table.
Clock (Pin 6) — The counter decrements by one for each
rising edge of Clock. See the Function Table for level require- P0, P1, P2, P3 (Pins 5, 11, 14, 2) — These are the preset
ments on the other inputs. data inputs. P0 is the LSB.
Reset (Pin 10) — A high level on Reset asynchronously Q0, Q1, Q2, Q3 (Pins 7, 9, 15, 1) — These are the syn-
forces Q0, Q1, Q2, and Q3 low and, if Cascade Feedback is chronous counter outputs. Q0 is the LSB.
high, causes the “0” output to go high.
VSS (Pin 8) — The most negative power supply potential.
“0” (Pin 12) — The “0” (Zero) output issues a pulse one This pin is usually ground.
clock period wide when the counter reaches terminal count
(Q0 = Q1 = Q2 = Q3 = low) if Cascade Feedback is high and VDD (Pin 16) — The most positive power supply potential.
Preset Enable is low. When presetting the counter to a value VDD may range from 3 to 18 V with respect to VSS.
STATE DIAGRAMS
MC14522B MC14526B
0 1 2 3 4 0 1 2 3 4
15 5 15 5
14 6 14 6
13 7 13 7
12 11 10 9 8 12 11 10 9 8
P0 Q0 P1 Q1 P2 Q2 P3 Q3
5 7 11 9 14 15 2 1
D R D RQ D RQ D RQ
C C C C
T PE Q T PE Q T PE Q T PE Q
VSS
13
CF
3
PE
4
INHIBIT
12
“0”
CLOCK 6
10
RESET
P0 Q0 P1 Q1 P2 Q2 P3 Q3
5 7 11 9 14 15 2 1
D R D RQ D RQ D RQ
C C C C
T PE Q T PE Q T PE Q T PE Q
VDD VDD
13
CF
PE 3
INHIBIT 4
12
“0”
CLOCK 6
10
RESET
Divide–By–N, Single Stage The Inhibit pin may be used to stop pulse counting. When
this pin is taken high, decrementing is inhibited.
P0 Q0
P1 Q1
N
P2 Q2
P3 Q3 BUFFER
VDD fin
CF
“0” N
RESET
VSS INHIBIT
fin CLOCK
PE
LSB MSB
N0 N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11
VDD
P0 P1 P2 P3 Q0 Q1 Q2 Q3 P0 P1 P2 P3 Q0 Q1 Q2 Q3 P0 P1 P2 P3 Q0 Q1 Q2 Q3
fin CLOCK CLOCK CLOCK
CF CF CF
INHIBIT INHIBIT INHIBIT
VSS RESET “0” PE VSS RESET “0” PE VSS RESET “0” PE
VDD
LOAD
N BUFFER
10 KΩ
fin
VSS N
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
16 9
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
–B– FORMED PARALLEL.
1 8 4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
C L BODY.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
–T– C ––– 0.200 ––– 5.08
N K D 0.015 0.020 0.39 0.50
SEATING
PLANE E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
E M H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
F G J 16 PL
L 0.300 BSC 7.62 BSC
D 16 PL 0.25 (0.010) M T B S M 0_ 15 _ 0_ 15 _
N 0.020 0.040 0.51 1.01
0.25 (0.010) M T A S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
–T– PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–02
ISSUE A
–A–
16 9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B– 8X P 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
0.010 (0.25) M B M
PROTRUSION.
1 8 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
J PROTRUSION. ALLOWABLE DAMBAR
16X D PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
0.010 (0.25) M T A S B S MATERIAL CONDITION.
F MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
R X 45 _ B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
C F 0.50 0.90 0.020 0.035
–T– G 1.27 BSC 0.050 BSC
SEATING M J 0.25 0.32 0.010 0.012
14X G K PLANE K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
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*MC14522B/D*
MC14522B MC14526B ◊ MOTOROLA CMOS LOGIC DATA
MC14522B/D
10