Lec1 PDF
Lec1 PDF
Lec1 PDF
http://www.ida.liu.se/~zebpe/teaching/test/index.html
Contents
Testing of system-on-chip.
Course Organization
General lectures.
Lecture I: Introduction
What is Testing?
Specification Validation
Verification Test
Design Review Preparation
Inspection
Simulation
Implementation
Manufacturing
Production Test
System Test
Operation and
Maintenance
Physical failures
- wear-out
- environmental factors
Another Classification
Logic (functional) faults the logic function of CUT (circuit under test)
is wrong.
Bed of nails.
Probes:
- Mechanical probe.
- Electron-beam probe.
Number of access ports remains constant -> Long test application time.
To take into account the testing aspects during the design process so
that more testable designs will be generated.
Advantages of DFT:
Diagnosis Detection and location of faults (fault site and fault type).
- Repair.
- Manufacturing process optimization (reduce manufacturing errors).
- Re-design.
Types of Testing
Production (manufacturing) test test individual products to check
whether faults are introduced during the manufacturing phase.
Operation and maintenance test test a product in the filed for diagno-
sis or "preventive" purpose.
Prototype test testing to check for design faults during the system
development phase. Diagnosis is required.
Test Classification
Test Strategy
Selection
Test Generation
Test Evaluation
Test Application
Manufacturing
Analysis and Design
Diagnosis
Test Mechanism
Testing time
- Test development time.
- Test application time (maybe very long for "burn-in" purpose).
>$500.00
$50.00
$5.00
$0.50
DFT facilitates more efficient production test, i.e., lower fault levels and
shorter test application times.
BIST can reduce the need for expensive test equipment and supports
field test.
Better design verification reduces the need for functional test which has
long test application time.
Summary