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TPS54332
SLVS875C – JANUARY 2009 – REVISED NOVEMBER 2014

TPS54332 3.5-A, 28-V, 1-MHz, step-down dc-dc converter with Eco-Mode™

1 Features 3 Description
•
1 3.5-V to 28-V input voltage range The TPS54332 is a 28-V, 3.5-A non-synchronous
buck converter that integrates a low-RDS(on) high-side
• Adjustable output voltage down to 0.8 V MOSFET. To increase efficiency at light loads, a
• Integrated 80-mΩ high-side MOSFET supports up pulse-skipping Eco-Mode feature is automatically
to 3.5-A continuous output current activated. Furthermore, the 1-μA shutdown supply
• High efficiency at light loads with a pulse-skipping current allows the device to be used in battery-
Eco-Mode™ powered applications. Current mode control with
internal slope compensation simplifies the external
• Fixed 1-MHz switching frequency compensation calculations and reduces component
• Typical 1-μA shutdown quiescent current count while allowing the use of ceramic output
• Adjustable slow-start limits inrush currents capacitors. A resistor divider programs the hysteresis
of the input undervoltage lockout. An overvoltage
• Programmable UVLO threshold
transient protection circuit limits voltage overshoots
• Overvoltage transient protection during start-up and transient conditions. A cycle-by-
• Cycle-by-Cycle current limit, frequency foldback cycle current limit scheme, frequency foldback and
and thermal shutdown protection thermal shutdown protect the device and the load in
the event of an overload condition. The TPS54332 is
• Available in thermally enhanced 8-Pin SOIC
available in an 8-pin SOIC PowerPAD™ package.
PowerPAD™ package
• Supported by WEBENCH™ tool Device Information(1)
(http://www.ti.com/lsds/ti/analog/webench/overvie PART NUMBER PACKAGE BODY SIZE (NOM)
w.page) TPS54332 SO PowerPAD (8) 4.90 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at
2 Applications the end of the datasheet.
• Consumer applications such as set-top boxes,
CPE equipment, LCD displays, peripherals, and
battery chargers
• Industrial and car audio power supplies
• 5-V, 12-V and 24-V distributed power systems
Simplified Schematic Efficiency
100
Ren1 VO = 2.5 V
EN VIN VIN 95
Ren2 CI VI = 5 V
90 VI = 12 V
TPS54332
Efficiency - %

CBOOT 85
BOOT
LO 80
PH VOUT
SS 75 VI = 15 V
D1 CO RO1
COMP 70

CSS C1 65
C2 VSENSE
R3 60
0 0.5 1 1.5 2 2.5 3 3.5
GND RO2 IO - Output Current - A

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 10
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 13
3 Description ............................................................. 1 8 Application and Implementation ........................ 14
4 Revision History..................................................... 2 8.1 Application Information............................................ 14
8.2 Typical Application .................................................. 14
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 24
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 24
6.2 Handling Ratings....................................................... 4 10.1 Layout Guidelines ................................................. 24
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 25
6.4 Thermal Information .................................................. 5 10.3 Estimated Circuit Area .......................................... 25
6.5 Electrical Characteristics........................................... 6 10.4 Electromagnetic Interference (EMI)
Considerations ......................................................... 25
6.6 Switching Characteristics .......................................... 6
6.7 Typical Characteristics: Characterization Curves ..... 7
11 Device and Documentation Support ................. 26
11.1 Device Support...................................................... 26
6.8 Typical Characteristics: Supplemental Application
Curves........................................................................ 8 11.2 Trademarks ........................................................... 26
7 Detailed Description .............................................. 9 11.3 Electrostatic Discharge Caution ............................ 26
7.1 Overview ................................................................... 9 11.4 Glossary ................................................................ 26
7.2 Functional Block Diagram ....................................... 10 12 Mechanical, Packaging, and Orderable
Information ........................................................... 26

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (Feburary 2013) to Revision C Page

• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1

Changes from Revision A (January 2013) to Revision B Page

• Deleted Swift™ from the data sheet title ................................................................................................................................ 1

• Deleted feature Item: For SWIFT™ Documentation, See the TI Website at www.ti.com/swift.............................................. 1

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Changes from Original (March 2007) to Revision A Page

• Changed the ABSOLUTE MAXIMUM RATINGS table, Input Voltage - EN pin max value From: 5V to 6V.......................... 4

5 Pin Configuration and Functions

DDA PACKAGE
(TOP VIEW)

BOOT 1 8 PH

VIN 2 PowerPAD 7 GND

(Pin 9)
EN 3 6 COMP

SS 4 5 VSENSE

Pin Functions
PIN I/O DESCRIPTION
NAME NO.
BOOT 1 O A 0.1-μF bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor falls below the
minimum requirement, the high-side MOSFET is forced to switch off until the capacitor is refreshed.
VIN 2 I Input supply voltage, 3.5 V to 28 V.
EN 3 I Enable pin. Pull below 1.25 V to disable. Float to enable. Programming the input undervoltage lockout with two
resistors is recommended.
SS 4 I Slow-start pin. An external capacitor connected to this pin sets the output rise time.
VSENS 5 I Inverting node of the gm error amplifier.
E
COMP 6 O Error amplifier output, and input to the PWM comparator. Connect frequency compensation components to this
pin.
GND 7 - Ground.
PH 8 O The source of the internal high-side power MOSFET.
PowerP 9 - GND pin must be connected to the exposed pad for proper operation.
AD

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6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input Voltage VIN –0.3 30 V
EN –0.3 6
BOOT 38
VSENSE –0.3 3
COMP –0.3 3
SS –0.3 3
Output Voltage BOOT-PH 8 V
PH –0.6 30
PH (10 ns transient from ground to negative peak) –5
Source Current EN 100 μA
BOOT 100 mA
VSENSE 10 μA
PH 9.25 A
Sink Current VIN 9.25 A
COMP 100 μA
SS 200
Operating Junction –40 150 °C
Temperature

(1) Stresses beyond those listed under Absolute Maxmium Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage Temperature –65 150 °C
Electrostatic Discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS- 2 kV
001, all pins (1)
V(ESD)
Charged device model (CDM), per JEDEC specification 500 V
JESD22-C101, all pins (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating Input Voltage on (VIN pin) 3.5 28 V
Operating junction temperature, TJ –40 150 °C

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6.4 Thermal Information

TPS54332
THERMAL METRIC (1) HSOP UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 48.7
RθJC(top) Junction-to-case (top) thermal resistance 52.4
RθJB Junction-to-board thermal resistance 25.3
°C/W
ψJT Junction-to-top characterization parameter 8.4
ψJB Junction-to-board characterization parameter 25.2
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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6.5 Electrical Characteristics

TJ = –40°C to 150°C, VIN = 3.5 V to 28 V (unless otherwise noted)
DESCRIPTION TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN PIN)
Internal undervoltage lockout threshold Rising and Falling 3.5 V
Shutdown supply current EN = 0 V, VIN = 12 V, –40°C to 85°C 1 4 μA
Operating – non switching supply current VSENSE = 0.85 V 82 120 μA
ENABLE AND UVLO (EN PIN)
Enable threshold Rising and Falling 1.25 1.35 V
Input current Enable threshold – 50 mV -1 μA
Input current Enable threshold + 50 mV -4 μA
VOLTAGE REFERENCE
Voltage reference 0.772 0.8 0.828 V
HIGH-SIDE MOSFET
BOOT-PH = 3 V, VIN = 3.5 V 115 200
On resistance mΩ
BOOT-PH = 6 V, VIN = 12 V 80 150
ERROR AMPLIFIER
Error amplifier transconductance (gm) –2 μA < ICOMP < 2 μA, V(COMP) = 1 V 92 μmhos
Error amplifier DC gain (1) VSENSE = 0.8 V 800 V/V
Error amplifier unity gain bandwidth (1) 5 pF capacitance from COMP to GND pins 2.7 MHz
Error amplifier source/sink current V(COMP) = 1.0 V, 100-mV overdrive ±7 μA
Switch current to COMP transconductance VIN = 12 V 12 A/V
PULSE-SKIPPING ECO-MODE
Pulse-skipping Eco-Mode switch current threshold 160 mA
CURRENT LIMIT
Current limit threshold VIN = 12 V 4.2 6.5 A
THERMAL SHUTDOWN
Thermal Shutdown 165 °C
SLOW-START (SS PIN)
Charge current V(SS) = 0.4 V 2 μA
SS to VSENSE matching V(SS) = 0.4 V 10 mV

(1) Specified by design

6.6 Switching Characteristics

PARAMETERS TEST CONDITIONS MIN TYP MAX UNIT
TPS54332 Switching Frequency VIN = 12 V, 25°C 800 1000 1200 kHz
Minimum controllable on time VIN = 12 V, 25°C 110 135 ns
(1)
Maximum controllable duty ratio BOOT-PH = 6 V 90% 93%

(1) Specified by design

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6.7 Typical Characteristics: Characterization Curves

120 8
VIN = 12 V EN = 0 V
110 TJ = 150°C

Isd - Shutdown Current - mA

Rdson - On Resistance - mW

6
100
TJ = -40°C

90 4

80

2 TJ = 25°C
70

60
0
-50 -25 0 25 50 75 100 125 150 8 18 23 28
3 13
TJ - Junction Temperature - °C VI - Input Voltage - V

Figure 1. On Resistance vs Junction Temperature Figure 2. Shutdown Quiescent Current vs Input Voltage
1020 0.824
VIN = 12 V VIN = 12 V
0.818
fsw - Oscillator Frequency - kHz

Vref - Voltage Reference - V

1010 0.812

0.806

1000 0.8

0.794

990 0.788

0.782

0.776
980
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ - Junction Temperature - °C TJ - Junction Temperature - °C

Figure 3. Switching Frequency vs Junction Temperature Figure 4. Voltage Reference vs Junction Temperature
140 14
VIN = 12 V
Dmin - Minimum Controllable Duty Ratio - %
Tonmin - Minimum Controllable On Time - ns

13.5
VIN = 12 V

130 13

12.5

120 12

11.5

110 11

10.5

100 10

9.5
90 9
-50 -25 0 25 50 75 100 125 150
-50 -25 0 25 50 75 100 125 150
TJ - Junction Temperature - °C TJ - Junction Temperature - °C

Figure 5. Minimum Controllable on Time vs Junction Figure 6. Minimum Controllable Duty Ratio vs Junction
Temperature Temperature

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Typical Characteristics: Characterization Curves (continued)

2.1 7
TJ = 25°C
VIN = 12 V
6.5
TJ = 150°C

Current Limit Threshold - A

ISS - SS Charge Current - mA

2.05 6

5.5 TJ = -40°C

2 5

4.5

1.95 4

3.5

1.9 3
-50 -25 0 25 50 75 100 125 150 3 8 13 18 23 28
TJ - Junction Temperature - °C VI - Input Voltage - V

Figure 7. SS Charge Current vs Junction Temperature Figure 8. Current Limit Threshold vs Input Voltage

6.8 Typical Characteristics: Supplemental Application Curves

3.75 30

3.25 25
VO - Output Voltage - V

VO - Output Voltage - V

2.75 20

IO = 3.5 A IO = 3.5 A
2.25 15

1.75 10

1.25 5

0.75 0
3 8 13 18 23 28 3 8 13 18 23 28
VI - Input Voltage - V VI - Input Voltage - V

Figure 9. Typical Minimum Output Voltage vs Input Voltage Figure 10. Typical Maximum Output Voltage vs Input
Voltage

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7 Detailed Description

7.1 Overview
The TPS54332 is a 28-V, 3.5-A, step-down (buck) converter with an integrated high-side, N-channel MOSFET.
To improve performance during line and load transients, the device implements a constant-frequency, current
mode control, which reduces output capacitance and simplifies external frequency compensation design. The
TPS54332 has a pre-set switching frequency of 1 MHz.
The TPS54332 needs a minimum input voltage of 3.5 V to operate normally. The EN pin has an internal pullup
current source that can be used to adjust the input voltage undervoltage lockout (UVLO) with two external
resistors. In addition, the pullup current provides a default condition when the EN pin is floating for the device to
operate. The operating current is 82 μA typically when not switching and under no load. When the device is
disabled, the supply current is 1 μA typically.
The integrated 80-mΩ high-side MOSFET allows for high-efficiency power supply designs with continuous output
currents up to 3.5 A.
The TPS54332 reduces the external component count by integrating the boot recharge diode. The bias voltage
for the integrated high-side MOSFET is supplied by an external capacitor on the BOOT to PH pin. The boot
capacitor voltage is monitored by an UVLO circuit and will turn the high-side MOSFET off when the voltage falls
below a preset threshold of 2.1 V typically. The output voltage can be stepped down to as low as the reference
voltage.
By adding an external capacitor, the slow-start time of the TPS54332 can be adjustable which enables flexible
output filter selection.
To improve the efficiency at light load conditions, the TPS54332 enters a special pulse-skipping Eco-Mode when
the peak inductor current drops below 160 mA typically.
The frequency foldback reduces the switching frequency during start-up and over current conditions to help
control the inductor current. The thermal shutdown gives the additional protection under fault conditions.

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7.2 Functional Block Diagram

EN VIN

165 C
Thermal
Shutdown
1 mA 3 mA
Shutdown
Shutdown
Logic
1.25 V
Enable Enable
Threshold Comparator Boot
Charge

™
ECO-MODE Boot
Minimum Clamp UVLO BOOT

2.1V
Error 12 A/V
VSENSE Amplifier PWM PWM Current
Comparator Latch Sense
2 mA Gate R Q 80 mW
gm = 92 mA/V
DC gain = 800 V/V Drive
BW = 2.7 MHz Logic
S
SS Voltage
Reference
Slope
2 kW 0.8 V Shutdown
S Compensation
Discharge PH
Logic
VSENSE Frequency
Oscillator
Shift

COMP GND

Maximum
Clamp

7.3 Feature Description

7.3.1 Fixed Frequency PWM Control
The TPS54332 uses a fixed-frequency, peak-current mode control. The internal switching frequency of the
TPS54332 is fixed at 1 MHz.

7.3.2 Voltage Reference (Vref)

The voltage reference system produces a ±2% initial accuracy voltage reference (±3.5% over temperature) by
scaling the output of a temperature stable band-gap circuit. The typical voltage reference is designed at 0.8 V.

7.3.3 Bootstrap Voltage (BOOT)

The TPS54332 has an integrated boot regulator and requires a 0.1-μF ceramic capacitor between the BOOT and
PH pin to provide the gate drive voltage for the high-side MOSFET. A ceramic capacitor with an X7R or X5R
grade dielectric is recommended because of the stable characteristics over temperature and voltage. To improve
dropout, the TPS54332 is designed to operate at 100% duty cycle as long as the BOOT to PH pin voltage is
greater than 2.1 V typically.

7.3.4 Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)

The EN pin has an internal pullup current source that provides the default condition of the TPS54332 operating
when the EN pin floats.

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Feature Description (continued)

The TPS54332 is disabled when the VIN pin voltage falls below internal VIN UVLO threshold. TI recommends
using an external VIN UVLO to add Hysteresis unless VIN is greater than (VOUT + 2 V). To adjust the VIN UVLO
with Hysteresis, use the external circuitry connected to the EN pin as shown in Figure 11. Once the EN pin
voltage exceeds 1.25 V, an additional 3 μA of hysteresis is added. Use Equation 1 and Equation 2 to calculate
the resistor values needed for the desired VIN UVLO threshold voltages. The VSTART is the input start threshold
voltage, the VSTOP is the input stop threshold voltage and the VEN is the enable threshold voltage of 1.25 V. The
VSTOP should always be greater than 3.5 V.

TPS54332

VIN

Ren1 1 mA 3 mA

EN +
Ren2 1.25 V -

Figure 11. Adjustable Input Undervoltage Lockout

VSTART - VSTOP
Ren1 =
3 mA (1)
VEN
Ren2 =
VSTART - VEN
+ 1 mA
Ren1 (2)

7.3.5 Programmable Slow-Start Using SS Pin

TI highly recommends programing the slow-start time externally because no slow-start time is implemented
internally. The TPS54332 effectively uses the lower voltage of the internal voltage reference or the SS pin
voltage as the power supply’s reference voltage fed into the error amplifier and will regulate the output
accordingly. A capacitor (CSS) on the SS pin-to-ground implements a slow-start time. The TPS54332 has an
internal pullup current source of 2 μA that charges the external slow-start capacitor. The equation for the slow-
start time (10% to 90%) is shown in Equation 3 . The Vref is 0.8V and the ISS current is 2 μA.
CSS (nF ) ´ Vref (V )
TSS (ms ) =
ISS (mA ) (3)
The slow-start time should be set between 1 ms to 10 ms to ensure good start-up behavior. The slow-start
capacitor should be no more than 27 nF.
If during normal operation, the input voltage drops below the VIN UVLO threshold, or the EN pin is pulled below
1.25 V, or a thermal shutdown event occurs, the TPS54332 stops switching.

7.3.6 Error Amplifier

The TPS54332 has a transconductance amplifier for the error amplifier. The error amplifier compares the
VSENSE voltage to the internal effective voltage reference presented at the input of the error amplifier. The
transconductance of the error amplifier is 92 μA/V during normal operation. Frequency compensation
components are connected between the COMP pin and ground.

7.3.7 Slope Compensation

In order to prevent the sub-harmonic oscillations when operating the device at duty cycles greater than 50%, the
TPS54332 adds a built-in slope compensation which is a compensating ramp to the switch current signal.

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Feature Description (continued)

7.3.8 Current Mode Compensation Design
To simplify design efforts using the TPS54332, the typical designs for common applications are listed in Table 1.
For designs using ceramic output capacitors, proper derating of ceramic output capacitance is recommended
when doing the stability analysis. This is because the actual ceramic capacitance drops considerably from the
nominal value when the applied voltage increases. Advanced users may refer to the Detailed Design Procedure
in the Application and Implementation section for the detailed guidelines, or use the WEBENCH tool
(http://www.ti.com/lsds/ti/analog/webench/overview.page).

Table 1. Typical Designs (Referring to Simplified Schematic on Page 1)

VIN VOUT Fsw Lo Co RO1 RO2 C2 C1 R3
(V) (V) (kHz) (μH) (kΩ) (kΩ) (pF) (pF) (kΩ)
12 5 1000 3.3 Ceramic 22-μF 10 1.91 18 470 24.9
12 3.3 1000 2.7 Ceramic 22-μF x 2 10 3.24 18 1800 39.2
12 5 1000 3.3 Aluminum 330-μF / 160-mohm 10 1.91 22 47 10
12 3.3 1000 2.7 Aluminum 330-μF / 160-mohm 10 3.24 39 100 29.4

7.3.9 Overcurrent Protection and Frequency Shift

The TPS54332 implements current mode control that uses the COMP pin voltage to turn off the high-side
MOSFET on a cycle-by-cycle basis. Every cycle, the switch current and the COMP pin voltage are compared;
when the peak inductor current intersects the COMP pin voltage, the high-side switch is turned off. During
overcurrent conditions that pull the output voltage low, the error amplifier responds by driving the COMP pin high,
causing the switch current to increase. The COMP pin has a maximum clamp internally, which limit the output
current.
The TPS54332 provides robust protection during short circuits. There is potential for overcurrent runaway in the
output inductor during a short circuit at the output. The TPS54332 solves this issue by increasing the off-time
during short circuit conditions by lowering the switching frequency. The switching frequency is divided by 8, 4, 2,
and 1 as the voltage ramps from 0 V to 0.8 V on VSENSE pin. The relationship between the switching frequency
and the VSENSE pin voltage is shown in Table 2.

Table 2. Switching Frequency Conditions

SWITCHING FREQUENCY VSENSE PIN VOLTAGE
1 MHz VSENSE ≥ 0.6 V
1 MHz / 2 0.6 V > VSENSE ≥ 0.4 V
1 MHz / 4 0.4 V > VSENSE ≥ 0.2 V
1 MHz / 8 0.2 V > VSENSE

7.3.10 Overvoltage Transient Protection

The TPS54332 incorporates an overvoltage transient protection (OVTP) circuit to minimize output voltage
overshoot when recovering from output fault conditions or strong unload transients. The OVTP circuit includes an
overvoltage comparator to compare the VSENSE pin voltage and internal thresholds. When the VSENSE pin
voltage goes above 109% × Vref, the high-side MOSFET will be forced off. When the VSENSE pin voltage falls
below 107% × Vref, the high-side MOSFET will be enabled again.

7.3.11 Thermal Shutdown

The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 165°C.
The thermal shutdown forces the device to stop switching when the junction temperature exceeds the thermal
trip threshold. Once the die temperature decreases below 165°C, the device reinitiates the power-up sequence.

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7.4 Device Functional Modes

7.4.1 Operation With VIN < 3.5 V
The device is recommended to operate with input voltages above 3.5 V. The typical VIN UVLO threshold is not
specified and the device may operate at input voltages down to the UVLO voltage. At input voltages below the
actual UVLO voltage, the device will not switch. If EN is externally pulled up or left floating, when VIN passes the
UVLO threshold the device will become active. Switching will commenced when the soft-start sequence is
initiated.

7.4.2 Operation With EN Control

The enable threshold voltage is 1.25 V typical. With EN held below that voltage the device is disabled and
switching is inhibited even if VIN is above its UVLO threshold. The IC quiescent current is reduced in this state. If
the EN voltage is increased above the threshold while VIN is above its UVLO threshold, the device becomes
active. Switching is enabled, and the slow-start sequence is initiated.

7.4.3 Eco-Mode
The device is designed to operate in pulse-skipping Eco-Mode at light-load currents to boost light-load efficiency.
When the peak inductor current is lower than pulse skip threshold, the COMP pin voltage falls to 0.5 V (typical)
and the device enters Eco-Mode . When the device is in Eco-Mode, the COMP pin voltage is clamped at 0.5 V
internally which prevents the high-side integrated MOSFET from switching. The peak inductor current must rise
above 160 mA for the COMP pin voltage to rise above 0.5 V and exit Eco-Mode. Because the integrated current
comparator catches the peak inductor current only, the average load current entering Eco-Mode varies with the
applications and external output filters.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS54332 is typically used as step down converters, which convert a voltage from 3.5 V - 28 V to a lower
voltage. WEBENCH software is available to aid in the design and analysis of circuits.

TPS54231 TPS54232 TPS54233 TPS54331 TPS54332

IO(Max) 2A 2A 2A 3A 3.5 A
Input Voltage Range 3.5 V - 28 V 3.5 V - 28 V 3.5 V - 28 V 3.5 V - 28 V 3.5 V - 28 V
Switching Freq. (Typ) 570 kHz 1000 kHz 285 kHz 570 kHz 1000 kHz
Switch Current Limit (Min) 2.3 A 2.3 A 2.3 A 3.5 A 4.2 A
Pin/Package 8/SOIC 8/SOIC 8/SOIC 8/SOIC 8/SO PowerPAD™

8.2 Typical Application

Figure 12. Typical Application Schematic

8.2.1 Design Requirements

For this design example, use the following as the input parameters:

DESIGN PARAMETER EXAMPLE VALUE

Input voltage range 5 V to 15 V
Output voltage 2.5 V
Input ripple voltage 200 mV
Output ripple voltage 20 mV
Output current rating 3.5 A
Operating Frequency 1 MHz

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8.2.2 Detailed Design Procedure

The following design procedure can be used to select component values for the TPS54332. Alternately, the
WEBENCH Tool may be used to generate a complete design. The WEBENCH Tool uses an iterative design
procedure and accesses a comprehensive database of components when generating a design. This section
presents a simplified discussion of the design process.

8.2.2.1 Switching Frequency

The switching frequency for the TPS54332 is fixed at 1 MHz.

8.2.2.2 Output Voltage Set Point

The output voltage of the TPS54332 is externally adjustable using a resistor divider network. In the application
circuit of Figure 12, this divider network is comprised of R5 and R6. The relationship of the output voltage to the
resistor divider is given by Equation 4 and Equation 5.
R5 ´ VREF
R6 =
VOUT - VREF (4)
é R5 ù
VOUT = VREF ´ ê +1ú
ë R6 û (5)
Choose R5 to be approximately 10 kΩ. Slightly increasing or decreasing R5 can result in closer output voltage
matching when using standard value resistors. In this design, R4 = 10.2 kΩ and R = 4.75 kΩ, resulting in a 2.5-V
output voltage.

8.2.2.3 Input Capacitors

The TPS54332 requires an input decoupling capacitor and depending on the application, a bulk-input capacitor.
The typical recommended value for the decoupling capacitor is 10 μF. A high-quality ceramic type X5R or X7R is
recommended. The voltage rating should be greater than the maximum input voltage. A smaller value may be
used as long as all other requirements are met; however 10 μF has been shown to work well in a wide variety of
circuits. Additionally, some bulk capacitance may be needed, especially if the TPS54332 circuit is not located
within about 2 inches from the input voltage source. The value for this capacitor is not critical but should be rated
to handle the maximum input voltage including ripple voltage, and should filter the output so that input ripple
voltage is acceptable. For this design, a single 10-μF capacitor is used for the input decoupling capacitor. It is
X5R dielectric rated for 25 V. The equivalent series resistance (ESR) is approximately 3 mΩ, and the current
rating is 3 A.
This input ripple voltage can be approximated by Equation 6.
IOUT(MAX) ´ 0.25
DVIN =
CBULK ´ fSW
(
+ IOUT(MAX) ´ ESRMAX )
(6)
Where IOUT(MAX) is the maximum load current, fSW is the switching frequency (derated by a factor of 0.8), CBULK is
the bulk capacitor value and ESRMAX is the maximum series resistance of the bulk capacitor.
The maximum RMS imput ripple current also needs to be checked. For worst case conditions, this can be
approximated by Equation 7.

(7)
In this case, the input ripple voltage would be 98 mV and the RMS ripple current would be 1.75 A. It is also
important to note that the actual input voltage ripple will be greatly affected by parasitic associated with the layout
and the output impedance of the voltage source. The actual input voltage ripple for this circuit is shown in Design
Parameters and is larger than the calculated value. This measured value is still below the specified input limit of
200 mV. The maximum voltage across the input capacitors would be VIN max plus ΔVIN/2. The chosen bypass
capacitor is rated for 25 V and the ripple current capacity is greater than 3 A, providing ample margin. It is
important that the maximum ratings for voltage and current are not exceeded under any circumstance.

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8.2.2.4 Output Filter Components

Two components need to be selected for the output filter, the output inductor L1 and the output capacitance.
Since the TPS54332 is an externally compensated device, a wide range of filter component types and values can
be supported.

8.2.2.5 Inductor Selection

To calculate the minimum value of the output inductor, use Equation 8.

LMIN =
VOUT(MAX) ´ (VIN(MAX) - VOUT )
VIN(MAX) ´ KIND ´ IOUT ´ FSW ´ 0.8
(8)
KIND is a coefficient that represents the amount of inductor ripple current relative to the maximum output current.
In general, this value is at the discretion of the designer; however, the following guidelines may be used. For
designs using low-ESR output capacitors such as ceramics, a value as high as KIND = 0.4 may be used. When
using higher ESR output capacitors, KIND = 0.2 yields better results.
For this design example, use KIND = 0.3 and the minimum inductor value is calculated to be 2.48 μH. For this
design, a l 2.5-μH inductor is chosen.
For the output filter inductor, it is important that the RMS current and saturation current ratings not be exceeded.
The peak-to-peak inductor current is calculated using Equation 9.

ILPP =
(
VOUT × VIN(MAX) - VOUT )
VIN(MAX) × LOUT ´ ƒSW ´ 0.8 (9)
The RMS inductor current can be found from Equation 10.

( )
2
1 æ VOUT ´ VIN(MAX) - VOUT ö
IL(RMS) = 2
IOUT(MAX) + ´ ç ÷
12 ç VIN(MAX) ´ LOUT ´ FSW ´ 0.8 ÷
è ø
(10)
And the peak inductor current can be determined with Equation 11.

IL(PK) = IOUT(MAX) +
VOUT ´ (VIN(MAX) - VOUT )
1.6 ´ VIN(MAX) ´ LOUT ´ FSW
(11)
(12)
For this design, the RMS inductor current is 3.51 A and the peak inductor current is 4.15 A. The chosen inductor
is a Coilcraft MSS1038-252NX_ 2.5-μH. It has a saturation current rating of 7.62 A and an RMS current rating of
6.55 A, meeting these requirements. Smaller or larger inductor values can be used depending on the amount of
ripple current the designer wishes to allow so long as the other design requirements are met. Larger value
inductors will have lower AC current and result in lower output voltage ripple, while smaller inductor values will
increase ac current and output voltage ripple. In general, inductor values for use with the TPS54332 are in the
range of 1 μH to 47 μH.

8.2.2.6 Capacitor Selection

The important design factors for the output capacitor are DC voltage rating, ripple current rating, and equivalent
series resistance (ESR). The DC voltage and ripple current ratings cannot be exceeded. The ESR is important
because along with the inductor current it determines the amount of output ripple voltage. The actual value of the
output capacitor is not critical, but some practical limits do exist. Consider the relationship between the desired
closed-loop crossover frequency of the design and LC corner frequency of the output filter. In general, it is
desirable to keep the closed-loop crossover frequency at less than 1/5 of the switching frequency. With high-
switching frequencies such as the 1 MHz frequency of this design, internal circuit limitations of the TPS54332
limit the practical maximum crossover frequency to about 75 kHz. In general, the closed-loop crossover
frequency should be higher than the corner frequency determined by the load impedance and the output
capacitor. This limits the minimum capacitor value for the output filter to:

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CO _ min = 1 /(2 ´ p ´ RO ´ FCO _ max )

(13)
Where RO is the output load impedance (VO/IO) and fCO is the desired crossover frequency. For a desired
maximum crossover of 75 kHz the minimum value for the output capacitor is around 3.2 μF. This may not satisfy
the output ripple voltage requirement. The output ripple voltage consists of two components; the voltage change
due to the charge and discharge of the output filter capacitance and the voltage change due to the ripple current
times the ESR of the output filter capacitor. The output ripple voltage can be estimated by:

é ( D - 0 .5 ) ù
V O PP = I LPP ê + R ESR ú
ë 4 ´ F SW ´ C O û (14)
Where CO is the total effective output capacitance.
The maximum ESR of the output capacitor can be determined from the amount of allowable output ripple as
specified in the initial design parameters. The contribution to the output ripple voltage due to ESR is the inductor
ripple current times the ESR of the output filter, so the maximum specified ESR as listed in the capacitor data
sheet is given by Equation 15.
VOPPMAX (D - 0.5 )
ESRmax = -
ILPP 4 ´ FSW ´ CO
(15)
Where VOPPMAX is the desired maximum peak-to-peak output ripple. The maximum RMS ripple current in the
output capacitor is given by Equation 16.

ICOUT(RMS) =
1
× ç
(
æ VOUT × VIN(MAX) - VOUT ö
÷
)
12 ç VIN(MAX) × LOUT × FSW × NC ÷
è ø (16)
The minimum switching frequency should be used in the above equations (derated by a factor of 0.8). For this
design example, two 47-μF ceramic output capacitors are chosen for C2 and C3. These are rated at 10 V with a
maximum ESR of 3 mΩ and a ripple current rating in excess of 3 A. The calculated total RMS ripple current is
300 mA (150 mA each) and the total ESR required is 20 mΩ or less. These output capacitors exceed the
requirements by a wide margin and will result in a reliable, high-performance design. it is important to note that
the actual capacitance in circuit may be less than the catalog value when the output is operating at the desired
output of 2.5 V. 10-V rated capacitors are used to minimize the this reduction in capacitance due to dc voltage on
the output. The selected output capacitor must be rated for a voltage greater than the desired output voltage plus
½ the ripple voltage. Any derating amount must also be included. Other capacitor types work well with the
TPS54332, depending on the needs of the application.

8.2.2.7 Compensation Components

The external compensation used with the TPS54332 allows for a wide range of output filter configurations. A
large range of capacitor values and types of dielectric are supported. The design example uses ceramic X5R
dielectric output capacitors, but other types are supported.
A Type II compensation scheme is recommended for the TPS54332. The compensation components are chosen
to set the desired closed-loop crossover frequency and phase margin for output filter components. The type II
compensation has the following characteristics; a DC gain component, a low-frequency pole, and a mid-
frequency zero or pole pair.
The DC gain is determined by Equation 17.
Vggm ´ VREF
GDC =
VO (17)
Where:
Vggm = 800
VREF = 0.8 V
The low-frequency pole is determined by Equation 18.

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FPO = 1/ (2 ´ p ´ ROO ´ CZ )
(18)
ROA = 8.696 MΩ.
The mid-frequency zero is determined by Equation 19.
FZ1 = 1/ (2 ´ p ´ R Z ´ CZ )
(19)
And, the mid-frequency pole is given by Equation 20.
FP1 = 1/ (2 ´ p ´ R Z ´ CP )
(20)
The first step is to choose the closed-loop crossover frequency. The closed-loop crossover frequency should be
less than 1/8 of the minimum operating frequency, but for the TPS54332 it is recommended that the maximum
closed-loop crossover frequency be not greater than 75 kHz. Next, the required gain and phase boost of the
crossover network needs to be calculated. By definition, the gain of the compensation network must be the
inverse of the gain of the modulator and output filter. For this design example, where the ESR zero is much
higher than the closed-loop crossover frequency, the gain of the modulator and output filter can be approximated
by Equation 21.
Gain = - 20 log (2 ´ p ´ RSENSE ´ FCO ´ CO )
(21)
Where:
RSENSE = 1 Ω / 12
FCO = Closed-loop crossover frequency
CO = Output capacitance
The phase loss is given by Equation 22.
PL = a tan (2 ´ p ´ FCO ´ RESR ´ CO ) - a tan (2 ´ p ´ FCO ´ RO ´ CO ) - 10dB
(22)
Where:
RESR = Equivalent series resistance of the output capacitor
RO = VO/IO
The measured overall loop response for the circuit is given in Figure 20. Note that the actual closed-loop
crossover frequency is higher than intended at about 25 kHz. This is primarily due to variation in the actual
values of the output filter components and tolerance variation of the internal feed-forward gain circuitry. Overall
the design has greater than 60 degrees of phase margin and will be completely stable over all combinations of
line and load variability.
Now that the phase loss is known the required amount of phase boost to meet the phase margin requirement
can be determined. The required phase boost is given by Equation 23.
PB = (PM - 90 deg ) - PL
(23)
Where PM = the desired phase margin.
A zero / pole pair of the compensation network will be placed symmetrically around the intended closed-loop
frequency to provide maximum phase boost at the crossover point. The amount of separation can be determined
by Equation 24 and the resultant zero and pole frequencies are given by Equation 25 and Equation 26.
æ PB ö
k = tanç + 45 deg ÷
è 2 ø (24)
FCO
FZ 1 =
k (25)

FP1 = FCO ´ k
(26)

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The low-frequency pole is set so that the gain at the crossover frequency is equal to the inverse of the gain of the
modulator and output filter. Due to the relationships established by the pole and zero relationships, the value of
RZ can be derived directly by Equation 27 .
2 × p × FCO × VO × CO × ROA
RZ =
GMICOMP × Vggm × VREF
(27)
Where:
VO = Output voltage
CO = Output capacitance
FCO = Desired crossover frequency
ROA = 8.696 MΩ
GMCOMP = 12 A/V
Vggm = 800
VREF = 0.8 V
With RZ known, CZ and CP can be calculated using Equation 28 and Equation 29.
1
CZ =
2 ´ p ´ FZ 1 ´ Rz
(28)
1
CP =
2 ´ p ´ FP1 ´ Rz
(29)
For this design, the two 47-μF output capacitors are used. For ceramic capacitors, the actual output capacitance
is less than the rated value when the capacitors have a DC bias voltage applied. This is the case in a dc/dc
converter. The actual output capacitance may be as low as 54 μF. The combined ESR is approximately .001 Ω.
Using Equation 21 and Equation 22, the output stage gain and phase loss are equivalent as:
Gain = –6.94 dB
and
PL - –93.94 degrees
For 70 degrees of phase margin, Equation 23 requires 63.64 degrees of phase boost.
Equation 24, Equation 25, and Equation 26 are used to find the zero and pole frequencies of:
FZ1 = 11.57 kHz
And
FP1 = 216 kHz
RZ, CZ, and CP are calculated using Equation 27, Equation 28, and Equation 29.
2 ´ p ´ 50000 ´ 2.5 ´ 82 ´ 10-6 ´ 8.696 ´ 106
Rz = = 72.92 kW
12 ´ 800 ´ 0.8 (30)
1
Cz = = 183 pF
2 ´ p ´ 11570 ´ 75000 (31)
1
Cp = = 9.8 pF
2 ´ p ´ 216000 ´ 75000 (32)
Using standard values for R3, C6, and C7 in the application schematic of Figure 12.
R3 = 75 kΩ
C6 = 180 pF
C7 = 10 pF

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8.2.2.8 Bootstrap Capacitor

Every TPS54332 design requires a bootstrap capacitor, C4. The bootstrap capacitor must be 0.1 μF. The
bootstrap capacitor is located between the PH pins and BOOT pin. The bootstrap capacitor should be a high-
quality, ceramic type with X7R or X5R grade dielectric for temperature stability.

8.2.2.9 Catch Diode

The TPS54332 is designed to operate using an external catch diode between PH and GND. The selected diode
must meet the absolute maximum ratings for the application: Reverse voltage must be higher than the maximum
voltage at the PH pin, which is Vin(max) + 0.5 V. Peak current must be greater than IOUTMAX plus on half the
peak-to-peak inductor current. Forward-voltage drop should be small for higher efficiencies. It is important to note
that the catch diode conduction time is typically longer than the high-side FET on time, so attention paid to diode
parameters can make a marked improvement in overall efficiency. Additionally, check that the device chosen is
capable of dissipating the power losses. For this design, a Diodes, Inc. B340A is chosen, with a reverse voltage
of 40 V, forward current of 3 A, and a forward voltage drop of 0.5 V.

8.2.2.10 Output Voltage Limitations

Due to the internal design of the TPS54332, there are both upper and lower output voltage limits for any given
input voltage. The upper limit of the output voltage set point is constrained by the maximum duty cycle of 91%
and is given by Equation 33.
VO(max) = 0.91 x ((VIN(min) – IO(max) x RDS(on) max) + VD) – (IO(max) x RL) – VD (33)
Where:
VIN(min) = Minimum input voltage
IO(max) = Maximum load current
VD = Catch diode forward voltage
RL = Output inductor series resistance
The equation assumes maximum on resistance for the internal high-side FET.
The lower limit is constrained by the minimum controllable on time which may be as high as 130 ns. The
approximate minimum output voltage for a given input voltage and minimum load current is given by Equation 32.
VO(min) = 0.118 x ((VIN(max) - IOmin x RDS(on) max) + VD) - IO(min) x RL) - VD (34)
Where:
VIN(max) = Maximum input voltage
IO(min) = Minimum load current
VD = Catch diode forward voltage
RL = Output inductor series resistance
This equation assumes nominal on-resistance for the high-side FET and accounts for worst case variation of
operating frequency set point. Any design operating near the operational limits of the device should be carefully
checked to assure proper functionality.

8.2.2.11 Power Dissipation Estimate

The following formulas show how to estimate the device power dissipation under continuous conduction mode
operations. They should not be used if the device is working in the discontinuous conduction mode (DCM) or
pulse-skipping Eco-Mode.
The device power dissipation includes:
1. Conduction loss: Pcon = Iout2 x RDS(on) x VOUT/VIN
2. Switching loss: Psw = 0.55 x 10-9 x VIN2 x IOUT x Fsw
3. Gate charge loss: Pgc = 22.8 x 10-9 x Fsw
4. Quiescent current loss: Pq = 0.082 x 10-3 x VIN
Where:
• IOUT is the output current (A).

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• RDS(on) is the on-resistance of the high-side MOSFET (Ω).

• VOUT is the output voltage (V).
• VIN is the input voltage (V).
• Fsw is the switching frequency (Hz).
• Ptot = Pcon + Psw + Pgc + Pq
• For given TA , TJ = TA + Rth x Ptot.
• For given TJMAX = 150°C, TAMAX = TJMAX– Rth x Ptot.
Where:
• Ptot is the total device power dissipation (W).
• TA is the ambient temperature (°C).
• TJ is the junction temperature (°C) .
• Rth is the thermal resistance of the package (°C/W).
• TJMAX is maximum junction temperature (°C).
• TAMAX is maximum ambient temperature (°C).

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8.2.3 Application Curves

100 100
VO = 2.5 V VO = 2.5 V
95 VI = 5 V
95
VI = 5 V 90
90
85
VI = 12 V VI = 12 V
VI = 15 V
85

Efficiency - %
Efficiency - %

80

80 75

70
75 VI = 15 V
65
70
60
65
55

60 50
0 0.5 1 1.5 2 2.5 3 3.5 0 0.025 0.05 0.075 0.1 0.125 0.15 0.175 0.2 0.225 0.25
IO - Output Current - A IO - Output Current - A

Figure 13. TPS54332 Efficiency Figure 14. TPS54332 Low-Current Efficiency

1 0.025

0.9 0.02
0.8
0.015
Output Voltage Regulation - %

0.7 VI = 15 V Output Regulation - %

0.01
0.6
0.005
0.5 VI = 12 V IO = 1 A
0
0.4

VI = 5 V -0.005
0.3

0.2 -0.01

0.1 -0.015

0 -0.02
-0.1 -0.025
0 0.5 1 1.5 2 2.5 3 3.5 5 6 7 8 9 10 11 12 13 14 15
IO - Output Current - A VI - Input Voltage - V

Figure 15. TPS54332 Load Regulation Figure 16. TPS54332 Line Regulation

60 180
50 150
VOUT 40 120
Gain
30 90
10mV/div Phase
20 60
Phase - deg

10 30
Gain - dB

IOUT .75 to 2.5 A Step 0 0

-10 -30

-20 -60

-30 -90

-40 -120
-50 -150
-60 -180
t - Time - 500 ms/div 10 100 1k 10k 100k 1M
f - Frequency - Hz

Figure 17. TPS54332 Transient Response Figure 18. TPS54332 Loop Response

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VIN 100 mV/div

VOUT 20 mV/div

PH 5 V/div PH 5 V/div

t - Time - 1 ms/div t - Time - 1 ms/div

Figure 19. TPS54332 Output Ripple Figure 20. TPS54332 Input Ripple

VOUT 1 V/div VOUT 20 mV/div

PH 5 V/div
VIN 5 V/div

t - Time - 2 ms/div t - Time - 2 ms/div

Figure 21. TPS54332 Start-Up Figure 22. TPS54332 Output Ripple during Eco-Mode
Operation

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9 Power Supply Recommendations

The devices are designed to operate from an input voltage supply range between 3.5 V and 28 V. This input
supply should be well regulated. If the input supply is located more than a few inches from the converter
additional bulk capacitance may be required in addition to the ceramic bypass capacitors. An electrolytic
capacitor with a value of 100 μF is a typical choice.

10 Layout

10.1 Layout Guidelines

The VIN pin should be bypassed to ground with a low-ESR, ceramic bypass capacitor. Take care to minimize the
loop area formed by the bypass capacitor connections, the VIN pin, and the anode of the catch diode. The typical
recommended bypass capacitance is 10-μF ceramic with a X5R or X7R dielectric and the optimum placement is
closest to the VIN pins and the source of the anode of the catch diode. See Figure 23 for a PCB layout example.
The GND D pin should be tied to the PCB ground plane at the pin of the IC. The source of the low-side MOSFET
should be connected directly to the top-side PCB ground area used to tie together the ground sides of the input
and output capacitors, as well as the anode of the catch diode. The PH pin should be routed to the cathode of
the catch diode and to the output inductor. Since the PH connection is the switching node, the catch diode and
output inductor should be located very close to the PH pins, and the area of the PCB conductor minimized to
prevent excessive capacitive coupling. For operation at full rated load, the top-side ground area must provide
adequate heat dissipating area. The TPS54332 uses a fused lead frame so that the GND pin acts as a
conductive path for heat dissipation from the die. Many applications have larger areas of internal or back side
ground plane available, and the top-side ground area can be connected to these areas using multiple vias under
or adjacent to the device to help dissipate heat. The additional external components can be placed approximately
as shown. It may be possible to obtain acceptable performance with alternate layout schemes, however this
layout has been shown to produce good results and is intended as a guideline.

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10.2 Layout Example

OUTPUT
FILTER Vout
TOPSIDE CAPACITOR Feedback Trace
GROUND
AREA
Route BOOT CAPACITOR OUTPUT
trace on other layer to provide CATCH INDUCTOR
Wide path for top side ground DIODE

INPUT PH
BYPASS
CAPACITOR BOOT
BOOT PH CAPACITOR

VIN GND
Vin
EN COMP
UVLO
RESISTOR SS VSENSE
DIVIDER
COMPENSATION RESISTOR
SLOW START NETWORK DIVIDER
CAPACITOR

Exposed PowerPAD area

Thermal VIA Signal VIA

Figure 23. TPS54332 Board Layout

10.3 Estimated Circuit Area

The estimated printed circuit board area for the components used in the design of Figure 12 is 0.58 in2. This area
does not include test points or connectors.

10.4 Electromagnetic Interference (EMI) Considerations

As EMI becomes a rising concern in more and more applications, the internal design of the TPS54332 takes
measures to reduce the EMI. The high-side MOSFET gate-drive is designed to reduce the PH pin voltage
ringing. The internal IC rails are isolated to decrease the noise sensitivity. A package bond wire scheme is used
to lower the parasitics effects.
To achieve the best EMI performance, external component selection and board layout are equally important.
Follow the Detailed Design Procedure to prevent potential EMI issues.

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support
For the WEBENCH Tool, go to http://www.ti.com/lsds/ti/analog/webench/overview.page.

11.2 Trademarks
Eco-Mode, PowerPAD, WEBENCH are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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www.ti.com 15-Jan-2019

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TPS54332DDA ACTIVE SO PowerPAD DDA 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 150 54332
& no Sb/Br)
TPS54332DDAR ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 150 54332
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

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Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 15-Jan-2019

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS54332DDAR SO DDA 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Power
PAD

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS54332DDAR SO PowerPAD DDA 8 2500 367.0 367.0 35.0

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
DDA 8 PowerPAD TM SOIC - 1.7 mm max height
PLASTIC SMALL OUTLINE

Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4202561/G
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