Analysis of Heat Transfer Phenomena From Different Fin Geometries Using CFD Simulation in ANSYS® PDF
Analysis of Heat Transfer Phenomena From Different Fin Geometries Using CFD Simulation in ANSYS® PDF
Analysis of Heat Transfer Phenomena From Different Fin Geometries Using CFD Simulation in ANSYS® PDF
Abstract:
Heat transfer has always been one of the dominating fields in design of electrical components, chemical reaction vessels,
apparatus, heat exchangers, insulation materials etc. In various applications, it is necessary to prevent loss of heat, whereas in
some, it is crucial to dissipate excess heat quickly into the surrounding atmosphere to prevent overheating. Finned surfaces
provide additional support to facilitate faster heat transfer and thus act as efficient heat sinks. In this study, we aim to simulate the
heat transfer phenomena through various finned surfaces of different geometries and material using ANSYS Workbench ®, to
better understand the factors affecting heat transfer along the length of the fin. The fins were designed in the ANSYS Workbench
environment, keeping the total exposed surface area constant. The models were rendered and subjected to simulation, with
varying operating conditions and parameters. The results are compiled and tabulated in this study. For this experiment, Pin Fin,
Plate Fin and Elliptical Pin fin geometries have been used, and simulated in ANSYS 2016 ® CFD interface.
Keywords: Computational Fluid Dynamics (CFD), Heat Sink, Pin Fin, Plate Fin, Elliptical Pin Fin.
1. INTRODUCTION: conduction of coolants within. While the car is moving, the air
is directed through the radiator, which in turn cools the liquid
In the study of heat transfer, fins are surfaces that extend from within.
an object to increase the rate of heat transfer to or from the • Computer CPU heatsinks: The heat sink has a thermal
environment by increasing convection. The amount of conductor that carries heat away from the CPU into fins that
conduction, convection, or radiation of an object determines provide a large surface area for the heat to dissipate throughout
the amount of heat it transfers. Increasing the temperature the rest of the computer, thus cooling both the heat sink and
gradient between the object and the environment, increasing processor.
the convection heat transfer coefficient, or increasing the • Heat exchangers in power plants: Radial fins are generally
surface area of the object increases the heat transfer. in TENV(Totally Enclosed Non-Ventilated) roller table duty
Sometimes it is not feasible or economical to change the first motors and the purpose of radial fins is to reduce accumulation
two options. Thus, adding a fin to an object, increases the of melted iron on the surface of motor.
surface area and can sometimes be an economical solution to • Electric motor and transformers: Longitudinal fins in
heat transfer problems.With the increase in heat dissipation motor are for natural cooling of motor. In Totally enclosed fan
from microelectronics devices and the reduction in overall cooled motors, air of fan passes through the fins to cool the
form factors, thermal management becomes a more important motor. Radial fins are generally in Totally enclosed non
element of electronic product design. Both the performance ventilated roller table duty motors and the purpose of radial
reliability and life expectancy of electronic equipment are fins is to reduce accumulation of melted iron on the surface of
inversely related to the component temperature of the motor. Fins are surfaces that extend from an object to increase
equipment. The effective use of an electrical component is the rate of heat transfer to or from the environment by
limited by its maximum operational junction temperature. To increasing convection and hence are used in hydrogen fuel
achieve a desired component temperature, excess heat cells.
dissipated by the device must be transferred to the • Fins are used in Evaporators and condensers of
environment. The most common method for transferring heat refrigeration and air conditioning systems: The coolant
from the component to the environment is to use a heat sink. flows through the pipe, the many thin wires that run between
To estimate a component’s junction temperature, a required the pipes acts as simple radiator fins that help to carry heat
value is the heat sink’s thermal resistance. The thermal away from the pipes and dissipate to atmosphere.
resistance of heat sink can be determined analytically or
experimentally. In electronic systems, a heat sink is a passive 2. CFD MODELLING:
component that cools a device by dissipating heat into the
surrounding air. Fins are most commonly used in heat Computational Fluid Dynamics (CFD) is the science of
exchanging devices such as radiators in cars, computer CPU determining numerical solution of governing equation for the
heatsinks, and heat exchangers in power plants. They are also fluid flow whilst advancing the solution through space or time
used in newer technology such as hydrogen fuel cells. Nature to obtain a numerical description of the complete flow field of
has also taken advantage of the phenomena of fins. The ears of interest. The equation can represent steady or unsteady,
jackrabbits and fennec foxes act as fins to release heat from the Compressible or Incompressible, and in viscid or viscous
blood that flows through them. flows, including non-ideal and reacting fluid behaviour. The
particular form chosen depends on intended application. The
• Radiators in cars: The thin fins of a radiator improve the state of the art is characterized by the complexity of the
surface area of the device, thereby improving the heat geometry, the flow physics, and the computing time required
12. REFERENCES:
13. RESULTS:
Figure.4. Pressure Distribution of air with pin fin at static
temperature
1. Results Obtained from Static Fin Temperature Analysis:
(a) Cylindrical Pin Fins:
Figure.1. Velocity Distribution of air with pin fin at static Figure.5. Temperature Distribution of air with pin fin at
temperature static temperature
Figure.6. Velocity Distribution of air with plate fin at static (c) EllipticalPin Fins:
temperature
Figure.8. Pressure Distribution of air with plate fin at static Figure.12. Streamlines of air with Elliptical pin fin at static
temperature temperature
Figure.9. Eddy Viscosity Distribution of air with plate fin Figure.13. Eddy Viscosity Distribution of air with plate fin
at static temperature at static temperature
2. Results Obtained from Steady State Heated Fin Figure.19. Streamlines of air with Elliptical pin fin
Analysis:
(b) PlateFins:
(a) EllipticalPin Fins:
Figure.16. Temperature Distribution of air with Elliptical Figure.20. Temperature Distribution of air with Elliptical
pin fin pin fin
Figure.23. Streamlines of air with Plate fin Figure.26. Velocity Distribution of air with Cylindrical pin
fin
(c) CylindricalPin Fins:
Figure.24. Temperature Distribution of air with Figure.27. Streamlines of air with Cylindrical pin fin
Cylindrical pin fin
15. Data Tables:
Table.2. Results obtained from Steady State conduction with constant base temperature.
Fin Heat
Total
Velocity Pressure Efficiency Thermal Ambient Base Fin Tip Convective Transfer
Temp.
Geometry of air Drop of fin Conductivity air temp Temp Temp Area Coefficient
drop
(m/s) (Pa) η of fin, k (K) Tb Tend (K) mm2 of air @298
(K)
(K) K
Plate Fin 4 34.8569 64.5013 16.27 298 1000 491.04 508.9592 54816 25
Pin Fin 4 15.2843 91.475 16.27 298 1000 272.6 727.4 54816 25
Elliptical
4 21.64 89.563 16.27 298 1000 285.15 714.852 54816 25
Pin Fin