Data Manual: TMS320F28335, TMS320F28334, TMS320F28332

TMS320F28335, TMS320F28334, TMS320F28332
Digital Signal Controllers (DSCs)
Data Manual
Literature Number: SPRS439

June 2007
PRODUCT PREVIEW information concerns products in the

formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
http://www.tms320.cn 提供DSP芯片解密,DSP破解等服务 010-62245566 13810019655

TMS320F28335, TMS320F28334, TMS320F28332
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SPRS439 – JUNE 2007
Contents
1 TMS320F28335, TMS320F28334, TMS320F28332 DSCs ............................................................. 7
1.1 Features ....................................................................................................................... 7
1.2 Getting Started ............................................................................................................... 8
2 Introduction......................................................................................................................... 9
2.1 Pin Assignments ............................................................................................................. 9
2.2 Signal Descriptions ......................................................................................................... 15
3 Functional Overview ........................................................................................................... 24
3.1 Memory Maps .............................................................................................................. 25
3.2 Brief Descriptions........................................................................................................... 32
3.2.1 C28x CPU ....................................................................................................... 32
3.2.2 Memory Bus (Harvard Bus Architecture) .................................................................... 32
3.2.3 Peripheral Bus .................................................................................................. 32
3.2.4 Real-Time JTAG and Analysis ................................................................................ 32
3.2.5 External Interface (XINTF) ..................................................................................... 33
3.2.6 Flash .............................................................................................................. 33
3.2.7 M0, M1 SARAMs ............................................................................................... 33
3.2.8 L0, L1, L2, L3, L4, L5, L6, L7 SARAMs ..................................................................... 33
3.2.9 Boot ROM ........................................................................................................ 33
3.2.10 Security .......................................................................................................... 35
3.2.11 Peripheral Interrupt Expansion (PIE) Block .................................................................. 35
3.2.12 External Interrupts (XINT1-XINT7, XNMI) .................................................................... 36
3.2.13 Oscillator and PLL .............................................................................................. 36
3.2.14 Watchdog ........................................................................................................ 36
3.2.15 Peripheral Clocking ............................................................................................. 36
3.2.16 Low-Power Modes .............................................................................................. 36
3.2.17 Peripheral Frames 0, 1, 2, 3 (PFn) ........................................................................... 37
3.2.18 General-Purpose Input/Output (GPIO) Multiplexer ......................................................... 37
3.2.19 32-Bit CPU-Timers (0, 1, 2) ................................................................................... 37
3.2.20 Control Peripherals ............................................................................................. 38
3.2.21 Serial Port Peripherals ......................................................................................... 38
3.3 Register Map ................................................................................................................ 39
3.4 Device Emulation Registers............................................................................................... 40
3.5 Interrupts .................................................................................................................... 41
3.5.1 External Interrupts .............................................................................................. 45
3.6 System Control ............................................................................................................. 45
3.6.1 OSC and PLL Block ............................................................................................ 47
3.6.2 Watchdog Block ................................................................................................. 50
3.7 Low-Power Modes Block .................................................................................................. 51
4 Peripherals ........................................................................................................................ 52
4.1 DMA Overview .............................................................................................................. 53
4.2 32-Bit CPU-Timers 0/1/2 .................................................................................................. 54
4.3 Enhanced PWM Modules (ePWM1/2/3/4/5/6) .......................................................................... 56
4.4 High-Resolution PWM (HRPWM) ........................................................................................ 58
4.5 Enhanced CAP Modules (eCAP1/2/3/4/5/6) ............................................................................ 59
4.6 Enhanced QEP Modules (eQEP1/2)..................................................................................... 61
4.7 Enhanced Analog-to-Digital Converter (ADC) Module ................................................................ 63
4.7.1 ADC Connections if the ADC Is Not Used ................................................................... 66
4.7.2 ADC Registers ................................................................................................... 66
4.8 Multichannel Buffered Serial Port (McBSP) Module ................................................................... 68
4.9 Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)..................................... 71
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4.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C) ........................................... 76
4.11 Serial Peripheral Interface (SPI) Module (SPI-A) ...................................................................... 80
4.12 Inter-Integrated Circuit (I2C) .............................................................................................. 83
4.13 GPIO MUX .................................................................................................................. 85
5 Device Support .................................................................................................................. 91
5.1 Device and Development Support Tool Nomenclature................................................................ 91
5.2 Documentation Support ................................................................................................... 93
6 Electrical Specifications ...................................................................................................... 96
6.1 Absolute Maximum Ratings ............................................................................................... 96
6.2 Recommended Operating Conditions ................................................................................... 97
6.3 Electrical Characteristics ................................................................................................. 97
Contents 3

TMS320F28335, TMS320F28334, TMS320F28332

List of Figures
2-1 F28335, F28334, F28332 176-Pin PGF LQFP (Top View) .................................................................. 10
2-2 F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Upper Left Quadrant) (Bottom View) .................... 11
2-3 F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Upper Right Quadrant) (Bottom View) .................. 12
2-4 F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Lower Left Quadrant) (Bottom View) .................... 13
2-5 F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Lower Right Quadrant) (Bottom View) .................. 14
3-1 Functional Block Diagram ....................................................................................................... 24
3-2 F28335 Memory Map ............................................................................................................. 26
3-3 F28334 Memory Map ............................................................................................................. 27
3-4 F28332 Memory Map ............................................................................................................. 28
3-5 External and PIE Interrupt Sources ............................................................................................. 41
3-6 External Interrupts ................................................................................................................ 42
3-7 Multiplexing of Interrupts Using the PIE Block ................................................................................ 43
3-8 Clock and Reset Domains ....................................................................................................... 46
3-9 OSC and PLL Block Diagram ................................................................................................... 47
3-10 Using a 3.3-V External Oscillator ............................................................................................... 48
3-11 Using a 1.8-V External Oscillator ............................................................................................... 48
3-12 Using the Internal Oscillator ..................................................................................................... 48
3-13 Watchdog Module ................................................................................................................. 50
4-1 DMA Functional Block Diagram ................................................................................................. 53
4-2 CPU-Timers ........................................................................................................................ 54
4-3 CPU-Timer Interrupt Signals and Output Signal .............................................................................. 54
4-4 Multiple PWM Modules in a 2833x System .................................................................................... 56
4-5 ePWM Sub-Modules Showing Critical Internal Signal Interconnections ................................................... 58
4-6 eCAP Functional Block Diagram ................................................................................................ 59
4-7 eQEP Functional Block Diagram ................................................................................................ 61
4-8 Block Diagram of the ADC Module ............................................................................................. 64
4-9 ADC Pin Connections With Internal Reference ............................................................................... 65
4-10 ADC Pin Connections With External Reference .............................................................................. 65
4-11 McBSP Module ................................................................................................................... 69
4-12 eCAN Block Diagram and Interface Circuit .................................................................................... 72
4-13 eCAN-A Memory Map ............................................................................................................ 73
4-14 eCAN-B Memory Map ............................................................................................................ 74
4-15 Serial Communications Interface (SCI) Module Block Diagram ............................................................ 79
4-16 SPI Module Block Diagram (Slave Mode) ..................................................................................... 82
4-17 I2C Peripheral Module Interfaces ............................................................................................... 84
4-18 GPIO MUX Block Diagram ....................................................................................................... 85
4-19 Qualification Using Sampling Window.......................................................................................... 90
5-1 Example of 2833x Device Nomenclature ...................................................................................... 92
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List of Tables
2-1 Hardware Features ................................................................................................................ 9
2-2 Signal Descriptions ............................................................................................................... 15
3-1 Addresses of Flash Sectors in F28335......................................................................................... 29
3-4 Handling Security Code Locations .............................................................................................. 30
3-5 Wait-states ......................................................................................................................... 31
3-6 Boot Mode Selection.............................................................................................................. 34
3-7 Peripheral Frame 0 Registers ................................................................................................... 39
3-11 Device Emulation Registers ..................................................................................................... 40
3-12 PIE Peripheral Interrupts ......................................................................................................... 43
3-13 PIE Configuration and Control Registers ...................................................................................... 44
3-14 External Interrupt Registers ...................................................................................................... 45
3-15 PLL, Clocking, Watchdog, and Low-Power Mode Registers ................................................................ 47
3-16 PLLCR Register Bit Definitions .................................................................................................. 49
3-17 CLKIN Divide Options ............................................................................................................ 49
3-18 Possible PLL Configuration Modes ............................................................................................. 49
3-19 Low-Power Modes ................................................................................................................ 51
4-1 CPU-Timers 0, 1, 2 Configuration and Control Registers ................................................................... 55
4-2 ePWM Control and Status Registers ........................................................................................... 57
4-3 eCAP Control and Status Registers ............................................................................................ 60
4-4 eQEP Control and Status Registers ............................................................................................ 62
4-5 ADC Registers ..................................................................................................................... 66
4-6 McBSP Register Summary ...................................................................................................... 70
4-7 3.3-V eCAN Transceivers ....................................................................................................... 72
4-8 CAN Register Map ................................................................................................................ 75
4-9 SCI-A Registers ................................................................................................................... 77
4-10 SCI-B Registers ................................................................................................................... 77
4-11 SCI-C Registers ................................................................................................................... 78
4-12 SPI-A Registers ................................................................................................................... 81
4-13 I2C-A Registers.................................................................................................................... 84
4-14 GPIO Registers ................................................................................................................... 86
4-15 GPIO-A Mux Peripheral Selection Matrix ..................................................................................... 87
4-16 GPIO-B Mux Peripheral Selection Matrix ..................................................................................... 88
4-17 GPIO-C Mux Peripheral Selection Matrix ..................................................................................... 89
List of Tables 5

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1 TMS320F28335, TMS320F28334, TMS320F28332 DSCs
1.1 Features
• High-Performance Static CMOS Technology • Enhanced Control Peripherals
– Up to 150 MHz (6.67-ns Cycle Time) – Up to 18 PWM Outputs
– 1.9-V Core, 3.3-V I/O Design – Up to 6 HRPWM Outputs With 150 ps MEP
• High-Performance 32-Bit CPU (TMS320C28x) Resolution
– IEEE-754 Single-Precision Floating-Point – Up to 6 Event Capture Inputs
Unit (FPU) – Up to 2 Quadrature Encoder Interfaces
– 16 x 16 and 32 x 32 MAC Operations – Up to 6 32-bit/Six 16-bit Timers
– 16 x 16 Dual MAC • Serial Port Peripherals
– Harvard Bus Architecture – Up to 2 CAN Modules
– Fast Interrupt Response and Processing – Up to 3 SCI (UART) Modules
PRODUCT PREVIEW
– Unified Memory Programming Model – Up to 2 McBSP/SPI Modules
– Code-Efficient (in C/C++ and Assembly) – Dedicated SPI Module
• Six Channel DMA Controller (for ADC, McBSP, – One Inter-Integrated-Circuit (I2C) Bus
XINTF, and SARAM) • 12-Bit ADC, 16 Channels
• 16-bit or 32-bit External Memory Interface – 80-ns Conversion Rate
(XINTF) – 2 x 8 Channel Input Multiplexer
• On-Chip Memory – Two Sample-and-Hold
– F28335: 256K x 16 Flash, 34K x 16 SARAM – Single/Simultaneous Conversions
– F28334:128K x 16 Flash, 34K x 16 SARAM – Internal or External Reference
– F28332: 64K x 16 Flash, 26K x 16 SARAM • Up to 88 Individually Programmable,
– 1K x 16 OTP ROM Multiplexed GPIO Pins With Input Filtering
• Boot ROM (8K x 16) • JTAG Boundary Scan Support (1)
– With Software Boot Modes (via SCI, SPI, • Advanced Emulation Features
CAN, I2C, McBSP, XINTF, and Parallel I/O) – Analysis and Breakpoint Functions
– Standard Math Tables – Real-Time Debug via Hardware
• Clock and System Control • Development Support Includes
– Dynamic PLL Ratio Changes Supported – ANSI C/C++ Compiler/Assembler/Linker
– On-Chip Oscillator – Code Composer Studio™ IDE
– Watchdog Timer Module – DSP/BIOS™
• Any GPIO Pin Can Be Connected to One of the – Digital Motor Control and Digital Power
Eight External Core Interrupts Software Libraries
• Peripheral Interrupt Expansion (PIE) Block • Low-Power Modes and Power Savings
That Supports All 58 Peripheral Interrupts – IDLE, STANDBY, HALT Modes Supported
• 128-Bit Security Key/Lock – Disable Individual Peripheral Clocks
– Protects Flash/OTP/RAM Blocks • Package Options
– Prevents Firmware Reverse Engineering – Lead-free Green Packaging
• Three 32-Bit CPU Timers – Thin Quad Flatpack (PGF)
– MicroStar BGA™ (ZHH)
• Temperature Options:
– A: -40°C to 85°C
– S: -40°C to 125°C
(1) IEEE Standard 1149.1-1990 Standard Test Access Port and

Boundary Scan Architecture
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
Code Composer Studio, DSP/BIOS, MicroStar BGA, TMS320C28x, C28x, TMS320C2000, TMS320C54x, TMS320C55x are trademarks of
Texas Instruments.
PRODUCT PREVIEW information concerns products in the Copyright © 2007, Texas Instruments Incorporated
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.

TMS320F28335, TMS320F28334, TMS320F28332

1.2 Getting Started

This section gives a brief overview of the steps to take when first developing for a C28x device. For more
detail on each of these steps, see the following:
• Getting Started With TMS320C28x™ Digital Signal Controllers (literature number SPRAAM0).
• C2000 Getting Started Website (http://www.ti.com/c2000getstarted)
PRODUCT PREVIEW
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2 Introduction
The TMS320F28335, TMS320F28334, and TMS320F28332, devices, members of the TMS320C28x™
DSC generation, are highly integrated, high-performance solutions for demanding control applications.
Throughout this document, TMS320F28335, TMS320F28334, and TMS320F28332, are abbreviated as
F28335, F28334, and F28332, respectively. Table 2-1 provides a summary of features for each device.
Table 2-1. Hardware Features
FEATURE F28335 (150 MHz) F28334 (150 MHz) F28332 (100 MHz)
Instruction cycle 6.67 ns 6.67 ns 10 ns
Floating-point Unit Yes Yes Yes
3.3-V on-chip flash (16-bit word) 256K 128K 64K
Single-access RAM (SARAM) (16-bit word) 34K 34K 26K
PRODUCT PREVIEW
Code security for on-chip flash/SARAM/OTP blocks Yes Yes Yes
Boot ROM (8K X16) Yes Yes Yes
One-time programmable (OTP) ROM
1K 1K 1K
(16-bit word)
6-channel Direct Memory Access (DMA) Yes Yes Yes
PWM outputs ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6
ePWM1A/2A/3A/4A/5A/ ePWM1A/2A/3A/4A/5A/
HRPWM channels ePWM1A/2A/3A/4A
6A 6A
32-bit Capture inputs or auxiliary PWM outputs 6 6 4
32-bit QEP channels (four inputs/channel) 2 2 2
Watchdog timer Yes Yes Yes
No. of channels 16 16 16
12-Bit ADC MSPS 12.5 12.5 12.5
Conversion time 80 ns 80 ns 80 ns
32-Bit CPU timers 3 3 3
Multichannel Buffered Serial Port (McBSP)/SPI 2 2 1
Serial Peripheral Interface (SPI) 1 1 1
Serial Communications Interface (SCI) 3 3 2
Enhanced Controller Area Network (eCAN) 2 2 2
Inter-Integrated Circuit (I2C) 1 1 1
Digital I/O pins (shared) 88 88 88
External interrupts 8 8 8
100-Pin PGF Yes Yes Yes
Packaging
100-Ball ZHH Yes Yes Yes
Temperature options A: -40°C to 85°C (PGF, ZHH) (PGF, ZHH) (PGF, ZHH)
Product status TMX TMX TMX
2.1 Pin Assignments

The 176-pin PZ low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2-1. The 179-ball
ZHH ball grid array (BGA) terminal assignments are shown in Figure 2-2 through Figure 2-5. Table 2-2
describes the function(s) of each pin.
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TMS320F28335, TMS320F28334, TMS320F28332

GPIO55/SPISOMIA/XD24
GPIO54/SPISIMOA/XD25
GPIO62/SCIRXDC/XD17
GPIO63/SCITXDC/XD16
GPIO57/SPISTEA/XD22
GPIO56/SPICLKA/XD23
GPIO60/MCLKRB/XD19
GPIO58/MCLKRA/XD21
GPIO52/EQEP1S/XD27
GPIO51/EQEP1B/XD28
GPIO50/EQEP1A/XD29
GPIO53/EQEP1I/XD26
GPIO61/MFSRB/XD18
GPIO59/MFSRA/XD20
GPIO49/ECAP6/XD30
GPIO69/XD10
GPIO67/XD12
GPIO66/XD13
GPIO65/XD14
GPIO64/XD15
GPIO68/XD11
GPIO75/XD4
GPIO74/XD5
GPIO73/XD6
GPIO72/XD7
GPIO71/XD8
GPIO70/XD9
XCLKIN
VDDIO
VDDIO
VDDIO
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
X1
X2
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
GPIO76/XD3 133 88 GPIO48/ECAP5/XD31
GPIO77/XD2 134 87 TCK
GPIO78/XD1 135 86 EMU1
GPIO79/XD0 136 85 EMU0
GPIO38/XWE0 137 84 VDD3VFL
XCLKOUT 138 83 VSS
VDD 139 82 TEST2
GPIO28/SCIRXDA/XZCS6 140
VSS 81 TEST1
GPIO28/SCIRXDA/XZCS6 141 80 XRS
GPIO34/ECAP1/XREADY 142 79 TMS
VDDIO 143 78 TRST
VSS 144 77 TDO
GPIO36/SCIRXDA/XZCS0 145 76 TDI
VDD 146 75 GPIO33/SCLA/EPWMSYNCO/ADCSOCBO
VSS 147 74 GPIO32/SDAA/EPWMSYNCI/ADCSOCAO
GPIO35/SCITXDA/XR/W 148 73 GPIO27/ECAP4/EQEP2S/MFSXB
XRD 149 72 GPIO26/ECAP3/EQEP2I/MCLKXB
PRODUCT PREVIEW
GPIO37/ECAP2/XZCS7 150 71 VDDIO

GPIO40/XA0/XWE1 151 70 VSS
GPIO41/XA1 152 69 GPIO25/ECAP2/EQEP2B/MDRB
GPIO42/XA2 153 68 GPIO24/ECAP1/EQEP2A/MDXB
VDD 154 67 GPIO23/EQEP1I/MFSXA/SCIRXDB
VSS 155 66 GPIO22/EQEP1S/MCLKXA/SCITXDB
GPIO43/XA3 156 65 GPIO21/EQEP1B/MDRA/CANRXB
GPIO44/XA4 157 64 GPIO20/EQEP1A/MDXA/CANTXB
GPIO45/XA5 158 63 GPIO19/SPISTEA/SCIRXDB/CANTXA
VDDIO 159 62 GPIO18/SPICLKA/SCITXDB/CANRXA
VSS 160 61 VDD
GPIO46/XA6 161 60 VSS
GPIO47/XA7 162 59 VDD2A18
GPIO80/XA8 163 58 VSS2AGND
GPIO81/XA9 164 57 ADCRESEXT
GPIO82/XA10 165 56 ADCREFP
VSS 166 55 ADCREFM
VDD 167 54 ADCREFIN
GPIO83/XA11 168 53 ADCINB7
VDDIO 170 51 ADCINB5
VSS 171 50 ADCINB4
GPIO31/CANTXA/XA17 176 45 VDDAIO
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
11
1
2
3
4
5
6
7
8
9
GPIO5/EPWM3B/MFSRA/ECAP1
ADCINA1
GPIO1/EPWM1B/ECAP6/MFSRB
GPIO3/EPWM2B/ECAP5/MCLKRB
GPIO7/EPWM4B/MCLKRA/ECAP2
GPIO12/TZ1/CANTXB/MDXB
GPIO13/TZ2/CANRXB/MDRB
GPIO14/TZ3/XHOLD/SCITXDB/MCLKXB
GPIO15/TZ4/XHOLDA/SCIRXDB/MFSXB
ADCINA2
VSS
VDD
VSS
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO
VSS
VDD
GPIO11/EPWM6B/SCIRXDB/ECAP4
VSS
VDD
VDD
VSS
VSS1AGND
VSSA2
VDDA2
ADCINA4
ADCINA0
GPIO30/CANRXA/XA18
GPIO29/SCITXDA/XA19
GPIO9/EPWM5B/SCITXDB/ECAP3
ADCINA7
ADCINA6
ADCINA3
ADCLO
VDD1A18
ADCINA5
VSSAIO
VDDIO
GPIO0/EPWM1A
GPIO2/EPWM2A
GPIO4/EPWM3A
GPIO8/EPWM5A/CANTXB/ADCSOCAO
GPIO10/EPWM6A/CANRXB/ADCSOCBO
GPIO16/SPISIMOA/CANTXB/TZ5
GPIO17/SPISOMIA/CANRXB/TZ6
Figure 2-1. F28335, F28334, F28332 176-Pin PGF LQFP (Top View)
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1 2 3 4 5 6 7
GPIO21/
VSSAIO VSS EQEP1B/
P ADCINB0 ADCINB2 ADCINB6 ADCREFP P
MDRA/
CANRXB
GPIO22/
VDDAIO VDD EQEP1S/
N ADCINA1 ADCINB1 ADCINB5 ADCREFM N
MCLKXA/
SCITXDB
GPIO23/
VDD2A18 EQEP1I/
M ADCINA2 ADCLO ADCINA0 ADCINB4 ADCRESEXT M
MFSXA/
SCIRXDB
PRODUCT PREVIEW
GPIO18/ GPIO20/
SPICLKA/ EQEP1A/
L ADCINA5 ADCINA4 ADCINA3 ADCINB3 ADCREFIN L
SCITXDB/ MDXA/
CANRXA CANTXB
GPIO19/
VSS1AGND VDDA2 VSSA2 VSS2AGND SPISTEA/
K ADCINA7 ADCINB7 K
SCIRXDB/
CANTXA
6 7
GPIO17/
SPISOMIA/ VDD VSS VDD1A18
J ADCINA6 J
CANRXB/
TZ6
GPIO14/ GPIO13/ GPIO15/ GPIO16/

VDD TZ3/XHOLD/ TZ2/ TZ4/XHOLDA/ SPISIMOA/
H H
SCITXDB/ CANRXB/ SCIRXDB/ CANTXB/
MCLKXB MDRB MFSXB TZ5
1 2 3 4 5
Figure 2-2. F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Upper Left Quadrant) (Bottom View)

TMS320F28335, TMS320F28334, TMS320F28332

8 9 10 11 12 13 14
GPIO33/
GPIO48/ GPIO50/
VSS SCLA/
P TMS TEST2 EMU1 ECAP5/ EQEP1A/ P
EPWMSYNCO/
XD31 XD29
ADCSOCBO
GPIO25/ GPIO32/
GPIO49/
ECAP2/ SDAA/ VSS VSS VDDIO
N TCK ECAP6/ N
EQEP2B/ EPWMSYNCI/
XD30
MDRB ADCSOCAO
GPIO24/
GPIO51/ GPIO52/
ECAP1/ VDD3VFL VSS
M TDI TRST EQEP1B/ EQEP1S/ M
EQEP2A/
XD28 XD27
MDXB
PRODUCT PREVIEW
GPIO27/
GPIO53/ GPIO54/ GPIO55/
VDDIO ECAP4/
L XRS EMU0 EQEP1I/ SPISIMOA/ SPISOMIA/ L
EQEP2S/
XD26 XD25 XD24
MFSXB
GPIO26/
ECAP3/ VDD
K TDO TEST1 SPICLKA/ MCLKRA/ SPISTEA/ K
EQEP2I/
XD23 XD21 XD22
MCLKXB
8 9
J VSS X2 VSS X1 XCLKIN J
GPIO59/
H VSS VDDIO VDD VSS MFSRA/ H
XD20
10 11 12 13 14
Figure 2-3. F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Upper Right Quadrant) (Bottom View)

TMS320F28335, TMS320F28334, TMS320F28332
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1 2 3 4 5

VSS EPWM6B/ TZ1/ EPWM6A/ EPWM5B/
G G
SCIRXDB/ CANTXB/ CANRXB/ SCITXDB/
ECAP4 MDXB ADCSOCBO ECAP3
GPIO8/ GPIO7/
EPWM5A/ EPWM4B/ VDD VSS VDDIO
F F
CANTXB/ MCLKRA/
ADCSOCAO ECAP2 6 7
PRODUCT PREVIEW
EPWM4A/ GPIO4/ EPWM3B/ EPWM2B/ GPIO84/ GPIO81/ VDDIO
E E
EPWMSYNCI/ EPWM3A MFSRA/ ECAP5/ XA12 XA9
EPWMSYNCO ECAP1 MCLKRB
GPIO1/
VSS GPIO2/ EPWM1B/ GPIO86/ GPIO83/ VSS GPIO45/
D D
EPWM2A ECAP6/ XA14 XA11 XA5
MFSRB
GPIO29/
GPIO0/ VSS GPIO85/ GPIO82/ GPIO80/ VSS
C SCITXDA/ C
EPWM1A XA13 XA10 XA8
XA19
GPIO30/
VDD GPIO39/ VSS VDD GPIO46/ GPIO43/
B CANRXA/ B
XA16 XA6 XA3
XA18
GPIO31/
GPIO87/ VDDIO VSS GPIO47/ GPIO44/
A CANTXA/ A
XA15 XA7 XA4
XA17
1 2 3 4 5 6 7
Figure 2-4. F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Lower Left Quadrant) (Bottom View)

TMS320F28335, TMS320F28334, TMS320F28332

10 11 12 13 14

GPIO64/
G SCITXDC/ MFSRB/ SCIRXDC MCLKRB/ G
XD15
XD16 XD18 XD17 XD19
GPIO69/ GPIO66/ VSS VDD GPIO65/

F F
XD10 XD13 XD14
8 9
PRODUCT PREVIEW
GPIO28/
VSS VDD GPIO68/ VDDIO GPIO67/ VSS
E SCIRXDA/ E
XD11 XD12
XZCS6

GPIO38/ GPIO70/ VDD VSS
D XA0/ ECAP2/ ECAP1/ D
XWE0 XD9
XWE1 XZCS7 XREADY
GPIO36/
VDD VSS GPIO73/ GPIO74/ GPIO71/
C SCIRXDA/ XCLKOUT C
XD6 XD5 XD8
XZCS0
GPIO42/ VDDIO VDD GPIO78/ GPIO76/ GPIO72/

B XRD B
XA2 XD1 XD3 XD7
GPIO35/
GPIO41/ VSS VSS GPIO79/ GPIO77/ GPIO75/
A SCITXDA/ A
XA1 XD0 XD2 XD4
XR/W
8 9 10 11 12 13 14
Figure 2-5. F28335, F28334, F28332 179-Ball ZHH MicroStar BGA™ (Lower Right Quadrant) (Bottom View)

TMS320F28335, TMS320F28334, TMS320F28332
www.ti.com
2.2 Signal Descriptions

Table 2-2 describes the signals on the 2833x devices. All digital inputs are TTL-compatible. All outputs are
3.3 V with CMOS levels. Inputs are not 5-V tolerant.
Table 2-2. Signal Descriptions
PIN NO.
NAME DESCRIPTION (1)
PGF ZHH
PIN # BALL #
JTAG
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of
the operations of the device. If this signal is not connected or driven low, the device operates in its
functional mode, and the test reset signals are ignored.
NOTE: Do not use pullup resistors on TRST; it has an internal pull-down device. TRST is an active
high test pin and must be maintained low at all times during normal device operation. In a low-noise
PRODUCT PREVIEW
TRST 78 M10
environment, TRST may be left floating. In other instances, an external pulldown resistor is highly
recommended. The value of this resistor should be based on drive strength of the debugger pods
applicable to the design. A 2.2-kΩ resistor generally offers adequate protection. Since this is
application-specific, it is recommended that each target board be validated for proper operation of
the debugger and the application. (I, ↓)
TCK 87 N12 JTAG test clock with internal pullup (I, ↑)
JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP
TMS 79 P10
controller on the rising edge of TCK. (I, ↑)
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction
TDI 76 M9
or data) on a rising edge of TCK. (I, ↑)
JTAG scan out, test data output (TDO). The contents of the selected register (instruction or data)
TDO 77 K9
are shifted out of TDO on the falling edge of TCK. (O/Z 8 mA drive)
Emulator pin 0. When TRST is driven high, this pin is used as an interrupt to or from the emulator
system and is defined as input/output through the JTAG scan. This pin is also used to put the device
into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low
state, a rising edge on the TRST pin would latch the device into boundary-scan mode. (I/O/Z, 8 mA
EMU0 85 L11 drive ↑)
NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be
based on the drive strength of the debugger pods applicable to the design. A 2.2-kΩ to 4.7-kΩ
resistor is generally adequate. Since this is application-specific, it is recommended that each target
board be validated for proper operation of the debugger and the application.
Emulator pin 1. When TRST is driven high, this pin is used as an interrupt to or from the emulator
system and is defined as input/output through the JTAG scan. This pin is also used to put the device
into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low
state, a rising edge on the TRST pin would latch the device into boundary-scan mode. (I/O/Z, 8 mA
EMU1 86 P12 drive ↑)
NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be
based on the drive strength of the debugger pods applicable to the design. A 2.2-kΩ to 4.7-kΩ
resistor is generally adequate. Since this is application-specific, it is recommended that each target
board be validated for proper operation of the debugger and the application.
FLASH
VDD3VFL 84 M11 3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.
TEST1 81 K10 Test Pin. Reserved for TI. Must be left unconnected. (I/O)
TEST2 82 P11 Test Pin. Reserved for TI. Must be left unconnected. (I/O)
CLOCK
Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half the
frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by the bits 1, 0
XCLKOUT 138 C11 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal
can be turned off by setting XCLKOUTDIV to 3. Unlike other GPIO pins, the XCLKOUT pin is not
placed in high-impedance state during a reset. (O/Z, 8 mA drive).
External Oscillator Input. This pin is to feed a clock from an external 3.3-V oscillator. In this case, the
XCLKIN 105 J14 X1 pin must be tied to GND. If a crystal/resonator is used (or if an external 1.8-V oscillator is used to
feed clock to X1 pin), this pin must be tied to GND. (I)
(1) I = Input, O = Output, Z = High impedance, OD = Open drain, ↑ = Pullup, ↓ = Pulldown

TMS320F28335, TMS320F28334, TMS320F28332

Table 2-2. Signal Descriptions (continued)

PIN NO.
PGF ZHH
PIN # BALL #
Internal/External Oscillator Input. To use the internal oscillator, a quartz crystal or a ceramic
resonator may be connected across X1 and X2. The X1 pin is referenced to the 1.8-V core digital
X1 104 J13 power supply. A 1.8-V external oscillator may be connected to the X1 pin. In this case, the XCLKIN
pin must be connected to ground. If a 3.3-V external oscillator is used with the XCLKIN pin, X1 must
be tied to GND. (I)
Internal Oscillator Output. A quartz crystal or a ceramic resonator may be connected across X1 and
X2 102 J11
X2. If X2 is not used it must be left unconnected. (O)
RESET
Device Reset (in) and Watchdog Reset (out).
Device reset. XRS causes the device to terminate execution. The PC will point to the address
contained at the location 0x3FFFC0. When XRS is brought to a high level, execution begins at the
PRODUCT PREVIEW
location pointed to by the PC. This pin is driven low by the DSC when a watchdog reset occurs.
XRS 80 L10
During watchdog reset, the XRS pin is driven low for the watchdog reset duration of 512 OSCCLK
cycles. (I/OD, ↑)
The output buffer of this pin is an open-drain with an internal pullup. It is recommended that this pin
be driven by an open-drain device.
ADC SIGNALS
ADCINA7 35 K4 ADC Group A, Channel 7 input (I)
ADCINA6 36 J5 ADC Group A, Channel 6 input (I)
ADCINA5 37 L1 ADC Group A, Channel 5 input (I)
ADCINA2 40 M1 ADC Group A, Channel 2 input (I)
ADCINA1 41 N1 ADC Group A, Channel 1 input (I)
ADCINA0 42 M3 ADC Group A, Channel 0 input (I)
ADCINB7 53 K5 ADC Group B, Channel 7 input (I)
ADCINB6 52 P4 ADC Group B, Channel 6 input (I)
ADCINB5 51 N4 ADC Group B, Channel 5 input (I)
ADCINB4 50 M4 ADC Group B, Channel 4 input (I)
ADCINB3 49 L4 ADC Group B, Channel 3 input (I)
ADCINB1 47 N3 ADC Group B, Channel 1 input (I)
ADCLO 43 M2 Low Reference (connect to analog ground) (I)
ADCRESEXT 57 M5 ADC External Current Bias Resistor. Connect a 22-kΩ resistor to analog ground.
ADCREFIN 54 L5 External reference input (I)
Internal Reference Positive Output. Requires a low ESR (50 mΩ - 1.5 Ω) ceramic bypass capacitor
ADCREFP 56 P5
of 2.2 µF to analog ground. (O)
Internal Reference Medium Output. Requires a low ESR (50 mΩ - 1.5 Ω) ceramic bypass capacitor
ADCREFM 55 N5
of 2.2 µF to analog ground. (O)
CPU AND I/O POWER PINS
VDDA2 34 K2 ADC Analog Power Pin
VSSA2 33 K3 ADC Analog Ground Pin
VDDAIO 45 N2 ADC Analog I/O Power Pin
VSSAIO 44 P1 ADC Analog I/O Ground Pin
VDD1A18 31 J4 ADC Analog Power Pin
VSS1AGND 32 K1 ADC Analog Ground Pin
VDD2A18 59 M6 ADC Analog Power Pin
VSS2AGND 58 K6 ADC Analog Ground Pin

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PIN NO.
PGF ZHH
PIN # BALL #
VDD 4 B1
VDD 15 B5
VDD 23 B11
VDD 29 C8
VDD 61 D13
VDD 101 E9
VDD 109 F3 CPU and Logic Digital Power Pins
VDD 117 F13
VDD 126 H1
PRODUCT PREVIEW
VDD 139 H12
VDD 146 J2
VDD 154 K14
VDD 167 N6
VDDIO 9 A4
VDDIO 71 B10
VDDIO 93 E7
VDDIO 107 E12
Digital I/O Power Pin
VDDIO 121 F5
VDDIO 143 L8
VDDIO 159 H11
VDDIO 170 N14
VSS 3 A5
VSS 8 A10
VSS 14 A11
VSS 22 B4
VSS 30 C3
VSS 60 C7
VSS 70 C9
VSS 83 D1
VSS 92 D6
VSS 103 D14
VSS 106 E8
VSS 108 E14
Digital Ground Pins
VSS 118 F4
VSS 120 F12
VSS 125 G1
VSS 140 H10
VSS 144 H13
VSS 147 J3
VSS 155 J10
VSS 160 J12
VSS 166 M12
VSS 171 N10
VSS N11
VSS P6

TMS320F28335, TMS320F28334, TMS320F28332


PIN NO.
PGF ZHH
PIN # BALL #
VSS P8 Digital Ground Pins
GPIOA AND PERIPHERAL SIGNALS (2) (3)
GPIO0 General purpose input/output 0 (I/O/Z) (4)
EPWM1A Enhanced PWM1 Output A and HRPWM channel (O)
5 C1
- -
- -
EPWM1B Enhanced PWM1 Output B (O)
6 D3
ECAP6 Enhanced Capture 6 input/output (I/O)
MFSRB McBSP-B receive frame synch (I/O)
PRODUCT PREVIEW
EPWM2A Enhanced PWM2 Output A and HRPWM channel (O)

7 D2
- -
- -
EPWM2B Enhanced PWM2 Output B (O)
10 E4
ECAP5 Enhanced Capture 5 input/output (I/O)
MCLKRB McBSP-B clock receive (I/O)
EPWM3A Enhanced PWM3 output A and HRPWM channel (O)
11 E2
- -
- -
EPWM3B Enhanced PWM3 output B (O)
12 E3
MFSRA McBSP-A receive frame synch (I/O)
ECAP1 Enhanced Capture input/output 1 (I/O)
EPWM4A Enhanced PWM4 output A and HRPWM channel (O)
13 E1
EPWMSYNCI External ePWM sync pulse input (I)
EPWMSYNCO External ePWM sync pulse output (O)
16 F2
MCLKRA McBSP-A Clock Receive (I/O)
ECAP2 Enhanced capture input/output 2 (I/O)
GPIO8 General Purpose Input/Output 8 (I/O/Z) (4)
EPWM5A Enhanced PWM5 output A (O)
17 F1
CANTXB Enhanced CAN-B transmit (O)
ADCSOCAO ADC start-of-conversion A (O)
18 G5
SCITXDB SCI-B transmit data(O)
ECAP3 Enhanced capture input/output 3 (I/O)
EPWM6A Enhanced PWM6 output A (O)
19 G4
CANRXB Enhanced CAN-B receive (I)
ADCSOCBO ADC start-of-conversion B (O)
20 G2
SCIRXDB SCI-B receive data (I)
ECAP4 Enhanced CAP Input/Output 4 (I/O)
(2) Some peripheral functions may not be available in all devices. See Table 2-1 for details.
(3) All GPIO pins are I/O/Z, 4-mA drive typical (unless otherwise indicated), and have an internal pullup, which can be selectively
enabled/disabled on a per-pin basis. This feature only applies to the GPIO pins. The GPIO function (shown in Italics) is the default at
reset. The peripheral signals that are listed under them are alternate functions.
(4) The pullups on GPIO0-GPIO11 pins are not enabled at reset.

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PIN NO.
PGF ZHH
PIN # BALL #
TZ1 Trip Zone input 1 (I)
21 G3
MDXB McBSP-B transmit serial data (O)
24 H3
MDRB McBSP-B receive serial data (I)
Trip Zone input 3/External Hold Request. XHOLD, when active (low), requests the external memory
interface (XINTF) to release the external bus and place all buses and strobes into a high-impedance
TZ3/XHOLD
25 H2 state. The XINTF will release the bus when any current access is complete and there are no
PRODUCT PREVIEW
pending accesses on the XINTF. (I)
SCITXDB SCI-B Transmit (I)
MCLKXB McBSP-B clock transmit (I/O)
Trip Zone input 4/External Hold Acknowledge. XHOLDA is driven active (low) when the XINTF has
granted an XHOLD request. All XINTF buses and strobe signals will be in a high-impedance state.
TZ4/XHOLDA
26 H4 XHOLDA is released when the XHOLD signal is released. External devices should only drive the
external bus when XHOLDA is active (low). (I)
SCIRXDB SCI-B receive (I)
MFSXB McBSP-B transmit frame synch (I/O)
SPISIMOA SPI slave in, master out (I/O)
27 H5
SPISOMIA SPI-A slave out, master in (I/O)
28 J1
TZ6 Trip zone input 6 (I)
SPICLKA SPI-A clock input/output (I/O)
62 L6
SCITXDB SCI-B transmit (O)
CANRXA Enhanced CAN-A receive (I)
SPISTEA SPI-A slave transmit enable input/output (I/O)
63 K7
CANTXA Enhanced CAN-A transmit (O)
EQEP1A Enhanced QEP1 input A (I)
64 L7
MDXA McBSP-A transmit serial data (O)
EQEP1B Enhanced QEP1 input B (I)
65 P7
MDRA McBSP-A receive serial data (I)
EQEP1S Enhanced QEP1 strobe (I/O)
66 N7
MCLKXA McBSP-A clock transmit (I/O)
SCITXDB SCI-B transmit (O)
EQEP1I Enhanced QEP1 index (I/O)
67 M7
MFSXA McBSP-A transmit frame synch (I/O)
(5) The pullups on GPIO12-GPIO34 are enabled upon reset.

TMS320F28335, TMS320F28334, TMS320F28332


PIN NO.
PGF ZHH
PIN # BALL #
ECAP1 Enhanced capture 1 (I/O)
68 M8
EQEP2A Enhanced QEP2 input A (I)
MDXB McBSP-B transmit serial data (O)
69 N8
EQEP2B Enhanced QEP2 input B (I)
MDRB McBSP-B receive serial data (I)
72 K8
EQEP2I Enhanced QEP2 index (I/O)
MCLKXB McBSP-B clock transmit (O)
PRODUCT PREVIEW

73 L9
EQEP2S Enhanced QEP2 strobe (I/O)
MFSXB McBSP-B transmit frame synch (I/O)
SCIRXDA 141 E10 SCI receive data (I)
XZCS6 External memory interface zone 6 chip select (O)
GPIO29 General purpose input/output 29. (I/O/Z) (5)
SCITXDA 2 C2 SCI transmit data (O)
XA19 External Memory Interface Address Line 19 (O)
CANRXA 1 B2 Enhanced CAN-A receive (I)
CANTXA 176 A2 Enhanced CAN-A transmit (O)
SDAA I2C data open-drain bidirectional port (I/OD)
74 N9
EPWMSYNCI Enhanced PWM external sync pulse input (I)
ADCSOCAO ADC start-of-conversion A (O)
GPIO33 General-Purpose Input/Output 33 (I/O/Z) (5)
SCLA I2C clock open-drain bidirectional port (I/OD)
75 P9
EPWMSYNCO Enhanced PWM external synch pulse output (O)
ADCSOCBO ADC start-of-conversion B (O)
GPIO34 General-Purpose Input/Output 34 (I/O/Z) (5)
ECAP1 142 D10 Enhanced Capture input/output 1 (I/O)
XREADY External memory interface Ready signal
GPIO35 General-Purpose Input/Output 35 (I/O/Z)
SCITXDA 148 A9 SCI-A transmit data (O)
XR/W External memory interface read, not write strobe
SCIRXDA 145 C10 SCI receive data (I)
ECAP2 150 D9 Enhanced Capture input/output 2 (I/O)
- 137 D11 -
XWE0 External memory interface Write Enable 0 (O)
- 175 B3 -
- 151 D8 -
XA0/XWE1 External Memory Interface Address Line 0/External memory interface Write Enable 1 (O)

TMS320F28335, TMS320F28334, TMS320F28332
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PIN NO.
PGF ZHH
PIN # BALL #
- 152 A8 -
- 153 B8 -
- 156 B7 -
- 157 A7 -
PRODUCT PREVIEW
- 158 D7 -
- 161 B6 -
- 162 A6 -
ECAP5 88 P13 Enhanced Capture input/output 5 (I/O)
XD31 External Memory Interface Data Line 31 (O)
ECAP6 89 N13 Enhanced Capture input/output 6 (I/O)
EQEP1A 90 P14 Enhanced QEP 1input A (I)
EQEP1B 91 M13 Enhanced QEP 1input B (I)
EQEP1S 94 M14 Enhanced QEP 1Strobe (I/O)
EQEP1I 95 L12 Enhanced CAP1 lndex (I/O)
SPISIMOA 96 L13 SPI-A slave in, master out (I/O)
SPISOMIA 97 L14 SPI-A slave out, master in (I/O)
SPICLKA 98 K11 SPI-A clock (I/O)
SPISTEA 99 K13 SPI-A slave transmit enable (I/O)
MCLKRA 100 K12 McBSP-A receive clock (I/O)
MFSRA 110 H14 McBSP-A receive frame synch (I/O)

TMS320F28335, TMS320F28334, TMS320F28332


PIN NO.
PGF ZHH
PIN # BALL #
MCLKRB 111 G14 McBSP-B receive clock (I/O)
MFSRB 112 G12 McBSP-B receive frame synch (I/O)
SCIRXDC 113 G13 SCI-C receive data (I)
SCITXDC 114 G11 SCI-C transmit data (O)
PRODUCT PREVIEW

- 115 G10 -
- 116 F14 -
- 119 F11 -
- 122 E13 -
- 123 E11 -
- 124 F10 -
- 127 D12 -
- 128 C14 -
- 129 B14 -
- 130 C12 -
- 131 C13 -
- 132 A14 -
- 133 B13 -
- 134 A13 -
- 135 B12 -

TMS320F28335, TMS320F28334, TMS320F28332
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PIN NO.
PGF ZHH
PIN # BALL #
- 136 A12 -
- 163 C6 -
- 164 E6 -
- 165 C5 -
PRODUCT PREVIEW
- 168 D5 -
GPIO84
General-Purpose Input/Output 84 (I/O/Z)
- 169 E5
External Memory Interface Address Line 12 (O)
XA12
- 172 C4 -
- 173 D4 -
- 174 A3 -
XRD 149 B9 External memory interface Read Enable

TMS320F28335, TMS320F28334, TMS320F28332

3 Functional Overview
M0 SARAM 1Kx16 L0 SARAM 4Kx16 OTP 2Kx16

(0-Wait) (0-Wait, Dual Map)
M1 SARAM 1Kx16 L1 SARAM 4Kx16
(0-Wait) (0-Wait, Dual Map)
Flash
L2 SARAM 4Kx16 256Kx16
(0-Wait, Dual Map) Code 8 Sectors
Security
Memory Bus
L3 SARAM 4Kx16 Module
(0-Wait, Dual Map)
L4 SARAM 4Kx16 TEST2
(0-W Data, 1-W Prog) Pump
TEST1
L5 SARAM 4Kx16 PSWD
Boot ROM (0-W Data, 1-W Prog) Flash
8Kx16 Wrapper
L6 SARAM 4Kx16
(0-W Data, 1-W Prog)
L7 SARAM 4Kx16
PRODUCT PREVIEW
(0-W Data, 1-W Prog)
Memory Bus
XD31:0
FPU
TCK
XHOLDA
TDI
XHOLD
TMS
XREADY
CPU
TDO
88 GPIOs GPIO XR/W (150 MHZ @ 1.9 V)
XINTF
MUX TRST
XZCS0
EMU0
XZCS7
EMU1
XZCS6
Memory Bus
XWE0
DMA Bus
XCLKIN
XA0/XWE1 CPU Timer 0
OSC, X1
DMA PLL,
XA19:1 CPU Timer 1
6 Ch LPM, X2
WD
CPU Timer 2 XRS
XCLKOUT
XRD PIE
(Interrupts)
88 GPIOs 8 External Interrupts

GPIO
MUX
A7:0
Memory Bus
12-Bit
B7:0
ADC
2-S/H DMA Bus
REFIN
32-bit peripheral bus

16-bit peripheral bus 32-bit peripheral bus
(DMA accessible)
FIFO FIFO FIFO

(16 Levels) (16 Levels) (16 Levels) EPWM-1/../6
CAN-A/B
McBSP-A/B ECAP-1/../6 EQEP-1/2 (32-mbox)
SCI-A/B/C SPI-A I2C HRPWM-1/../6
SPISIMOx
SPISOMIx
EPWMxA
EPWMxB
SCIRXDx
SCITXDx
SPICLKx
ESYNCO
MCLKRx
SPISTEx
MCLKXx
CANRXx
EQEPxA
EQEPxB
EQEPxS
CANTXx
ESYNCI
EQEPxI
MFSRx
MFSXx
ECAPx
MDXx
MRXx
SDAx
TZxn
SCLx
GPIO MUX
88 GPIOs
Figure 3-1. Functional Block Diagram
24 Functional Overview Submit Documentation Feedback

TMS320F28335, TMS320F28334, TMS320F28332
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3.1 Memory Maps

In Figure 3-2 through Figure 3-4, the following apply:
• Memory blocks are not to scale.
• Peripheral Frame 0, Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 memory maps
are restricted to data memory only. A user program cannot access these memory maps in program
space.
• Protected means the order of Write followed by Read operations is preserved rather than the pipeline
order.
• Certain memory ranges are EALLOW protected against spurious writes after configuration.
PRODUCT PREVIEW
Submit Documentation Feedback Functional Overview 25

TMS320F28335, TMS320F28334, TMS320F28332

Block
On-Chip Memory External Memory XINTF
Start Address
Data Space Prog Space Data Space Prog Space
0x00 0000
M0 Vector - RAM (32 x 32)
(Enable if VMAP = 0)
0x00 0040 M0 SARAM (1K x 16)

0x00 0400 M1 SARAM (1K x 16)
0x00 0800 Peripheral Frame 0
0x00 0D00 PIE Vector - RAM Reserved

(256 x16)
(Enabled if Reserved
VMAP = 1,
ENPIE =1)
0x00 0E00
Peripheral Frame 0
0x00 2000
(24x/240x Equivalent Data Space)
PRODUCT PREVIEW
Reserved 0x00 4000

XINTF Zone 0 (4K x 16,XZCS0)
(Protected, DMA Accessible)
0x00 5000 0x00 5000
Peripheral Frame 3 (Protected, DMA Accessable)
Low 64K
0x00 6000
Peripheral Frame 1
(Protected)
Reserved
0x00 7000
Peripheral Frame 2
(Protected)
0x00 8000
L0 SARAM (4K x16, Secure Zone Dual Mapped)
0x00 9000 L1 SARAM (4K x 16, Secure Zone Dual Mapped)
0x0000-A000
L2 SARAM (4Kx16, Secure Zone, Dual Mapped)
0x0000-B000
0x0000-C000 Reserved
L4 SARAM (4Kx16, DMA Accessilbe)
0x0000-D000
L5 SARAM (4Kx16, DMA Accessible)
0x0000-E000
0x0000-F000
L7 SARAM (4Kx16, DMA Accessiible)
0x0001-0000
Reserved
0x30 0000 FLASH (256 K x 16, Secure Zone)
0x33 FFF8 128-bit Password
0x34 0000
Reserved
0x10 0000
XINTF Zone 6 (1 M x 16, XZCS6)
0x38 0400 OTP (IK x 16, Secure Zone) 0x20 0000
0x3F 8000 L0 SARAM (4K x 16, Secure Zone Dual Mapped) 0x30 0000
0x3F 9000 L1 SARAM (4K x 16, Secure Zone Dual Mapped)

(24x/240x Equivalent
0x3F A000 L2 SARAM (4K x 16, Secure Zone Dual Mapped)

Program Space)
0x3F B000 L3 SARAM (4K x 16, Secure Zone Dual Mapped)

High 64K
0x3F C000 Reserved

Reserved
0x3F E000
Boot ROM (8K x 16)
0x3F FFC0 BROM Vector - ROM (32 x 32) XINTF Vector - RAM (32 x32)
(Enable if VMAP = 1, ENPIE = 0) (Enable if VMAP = 1, ENPIR = 0)
LEGEND:
Only one of these vector maps*M0 vector, PIE vector, BROM vector, XINTF vector*should be enabled at a time.
Figure 3-2. F28335 Memory Map

TMS320F28335, TMS320F28334, TMS320F28332
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Block
Start Address
0x00 0000
0x00 0040
M0 SARAM (1K x 16)
0x00 0400 M1 SARAM (1K x 16)
0x00 0800
Peripheral Frame 0
0x00 0D00 Reserved

PIE Vector - RAM
(256 x16) Reserved
Peripheral Frame 0 (Enabled if
VMAP = 1,
ENPIE =1)
0x00 0E00 Peripheral Frame 0
0x00 2000
PRODUCT PREVIEW
Reserved XINTF Zone 0 (4K x 16,XZCS0) 0x00 4000
0x00 5000 (Protected, DMA Accessible) 0x00 5000
Low 64K
0x00 6000
Peripheral Frame 1
(Protected)
Reserved
0x00 7000
Peripheral Frame 2
(Protected)
0x00 8000
0x0000-A000
0x0000-B000
0x0000-C000
Reserved
0x0000-D000
0x0000-E000
0x0000-F000
L7 SARAM (4Kx16, DMA Accessiible)
0x0001-0000
Reserved
0x34 0000
Reserved
0x10 0000


Program Space)
Reserved
High 64K
0x3F C000
Reserved
0x3F E000 XINTF Zone 7 (16K x 15, XZCS6AND7)

(Enable if MP/MC = 1)
Boot ROM (8K x 16)
LEGEND:

TMS320F28335, TMS320F28334, TMS320F28332

Block
Start Address
0x00 0000
0x00 0040
M0 SARAM (1K x 16)
0x00 0400 M1 SARAM (1K x 16)
0x00 0800
Peripheral Frame 0
Reserved
0x00 0D00 PIE Vector - RAM
(256 x16)
(Enabled if Reserved
VMAP = 1,
ENPIE =1)
0x00 0E00 Peripheral Frame 0

0x00 2000
PRODUCT PREVIEW
XINTF Zone 0 (4K x 16,XZCS0) 0x00 4000

Reserved
0x00 5000 (Protected, DMA Accessible) 0x00 5000
Low 64K
0x00 6000
Peripheral Frame 1
(Protected)
Reserved
0x00 7000
Peripheral Frame 2
(Protected)
0x00 8000
0x0000-A000
0x0000-B000
Reserved
0x0000-C000
0x0000-D000
0x0000-E000
Reserved
0x34 0000
Reserved
0x10 0000


Program Space)
Reserved
High 64K
0x3F C000
Reserved
0x3F E000 XINTF Zone 7 (16K x 15, XZCS6AND7)

(Enable if MP/MC = 1)
Boot ROM (8K x 16)
LEGEND:

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Table 3-1. Addresses of Flash Sectors in F28335
ADDRESS RANGE PROGRAM AND DATA SPACE

0x30 0000 - 0x30 7FFF Sector H (32K x 16)
0x30 8000 - 0x30 FFFF Sector G (32K x 16)
0x31 0000 - 0x31 7FFF Sector F (32K x 16)
0x31 8000 - 0x31 FFFF Sector E (32K x 16)
0x32 0000 - 0x32 7FFF Sector D (32K x 16)
0x32 8000 - 0x32 FFFF Sector C (32K x 16)
0x33 0000 - 0x33 7FFF Sector B (32K x 16)
0x33 8000 - 0x33 FFFF Sector A (32K x 16)
Program to 0x0000 when using the
0x33 FF80 - 0x33 FFF5
Code Security Module
Boot-to-Flash Entry Point
PRODUCT PREVIEW
0x33 FFF6 - 0x33 FFF7
(program branch instruction here)
Security Password
0x33 FFF8 - 0x33 FFFF
(128-Bit) (Do Not Program to all zeros)

0x32 0000 - 0x32 3FFF Sector H (16K x 16)
0x32 4000 - 0x32 7FFF Sector G (16K x 16)
0x32 8000 - 0x32 BFFF Sector F (16K x 16)
0x32 C000 - 0x32 FFFF Sector E (16K x 16)
0x33 0000 - 0x33 3FFF Sector D (16K x 16)
0x33 4000 - 0x33 7FFFF Sector C (16K x 16)
0x33 8000 - 0x33 BFFF Sector B (16K x 16)
0x33 C000 - 0x33 FFFF Sector A (16K x 16)
0x33 FF80 - 0x33 FFF5 Program to 0x0000 when using the
Code Security Module
0x33 FFF6 - 0x33 FFF7 Boot-to-Flash Entry Point
(program branch instruction here)
0x33 FFF8 - 0x33 FFFF Security Password (128-Bit)
(Do Not Program to all zeros)

0x33 0000 - 0x33 3FFF Sector D (16K x 16)
0x33 4000 - 0x33 7FFFF Sector C (16K x 16)
0x33 8000 - 0x33 BFFF Sector B (16K x 16)
0x33 C000 - 0x33 FFFF Sector A (16K x 16)
0x33 FF80 - 0x33 FFF5 Program to 0x0000 when using the Code Security
Module
0x33 FFF6 - 0x33 FFF7 Boot-to-Flash Entry Point (program branch
instruction here)
0x33 FFF8 - 0x33 FFFF Security Password (128-Bit) (Do Not Program to all
zeros)

TMS320F28335, TMS320F28334, TMS320F28332

NOTE
• When the code-security passwords are programmed, all addresses between
0x33FF80 and 0x33FFF5 cannot be used as program code or data. These locations
must be programmed to 0x0000.
• If the code security feature is not used, addresses 0x33FF80 through 0x33FFEF may
be used for code or data. Addresses 0x33FFF0 – 0x33FFF5 are reserved for data and
should not contain program code. .
Table 3-4 shows how to handle these memory locations.
Table 3-4. Handling Security Code Locations
ADDRESS FLASH
Code security enabled Code security disabled
PRODUCT PREVIEW
0x33FF80 - 0x33FFEF Application code and data

Fill with 0x0000
0x33FFF0 - 0x33FFF5 Reserved for data only
Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 are grouped together to enable these
blocks to be write/read peripheral block protected. The protected mode ensures that all accesses to these
blocks happen as written. Because of the C28x pipeline, a write immediately followed by a read, to
different memory locations, will appear in reverse order on the memory bus of the CPU. This can cause
problems in certain peripheral applications where the user expected the write to occur first (as written).
The C28x CPU supports a block protection mode where a region of memory can be protected so as to
make sure that operations occur as written (the penalty is extra cycles are added to align the operations).
This mode is programmable and by default, it will protect the selected zones.
The wait-states for the various spaces in the memory map area are listed in Table 3-5.

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Table 3-5. Wait-states
Area Wait-States CPU Comments

M0 and M1 SARAMs 0-wait Fixed
Peripheral Frame 0 1-wait (reads) This applies to all PF0 peripherals except
the floating-point unit (FPU) (0-wait reads)
0-wait (writes)
Peripheral Frame 3 0-wait (writes) Assumes no conflicts between CPU and
DMA.
2-wait (reads)
Peripheral Frame 1 0-wait (writes) Cycles can be extended by peripheral
generated ready.
2-wait (reads) Consecutive writes to the CAN will
experience a 1-cycle pipeline hit.
Peripheral Frame 2 0-wait (writes) Fixed. Cycles cannot be extended by the
peripheral.
2-wait (reads)
PRODUCT PREVIEW
L0 SARAM 0-wait data and prog Assumes no CPU conflicts
L1 SARAM
L2 SARAM
L3 SARAM
L4 SARAM 0-wait data (read) Assumes no conflicts between CPU and
DMA.
L5 SARAM 0-wait data (write)
L6 SARAM 1-wait prog (read)
L7 SARAM 1-wait prog (write)
XINTF Programmable Programmed via the XTIMING registers or
extendable via external XREADY signal.
1-wait minimum 1-wait is minimum wait states allowed on
external waveforms for both reads and
writes on XINTF.
0-wait minimum writes with 0-wait minimum for writes assumes write
write buffer enabled buffer enabled and not full.
Assumes no conflicts between CPU and
DMA. When DMA and CPU attempt
simultaneous conflict, 1-cycle delay is
added for arbitration.
OTP Programmable Programmed via the Flash registers.
1-wait minimum 1-wait is minimum number of wait states
allowed. 1-wait-state operation is possible
at a reduced CPU frequency.
FLASH Programmable Programmed via the Flash registers.
1-wait Paged min 0-wait minimum for paged access is not
allowed
1-wait Random min
Random > Paged
FLASH Password Programmable, Wait states of password locations are
fixed.
16-wait fixed
Boot-ROM 1-wait 0-wait speed is not possible.

TMS320F28335, TMS320F28334, TMS320F28332

3.2 Brief Descriptions
3.2.1 C28x CPU

The C28x™ DSC generation is the newest member of the TMS320C2000™ DSC platform. The C28x is a
very efficient C/C++ engine, hence enabling users to develop not only their system control software in a
high-level language, but also enables math algorithms to be developed using C/C++. The C28x is as
efficient in DSC math tasks as it is in system control tasks that typically are handled by microcontroller
devices. This efficiency removes the need for a second processor in many systems. The 32 x 32-bit MAC
capabilities of the C28x and its 64-bit processing capabilities, enable the C28x to efficiently handle higher
numerical resolution problems. Add to this the fast interrupt response with automatic context save of
critical registers, resulting in a device that is capable of servicing many asynchronous events with minimal
latency. The C28x has an 8-level-deep protected pipeline with pipelined memory accesses. This pipelining
enables the C28x to execute at high speeds without resorting to expensive high-speed memories. Special
branch-look-ahead hardware minimizes the latency for conditional discontinuities. Special store conditional
PRODUCT PREVIEW
operations further improve performance.
3.2.2 Memory Bus (Harvard Bus Architecture)

As with many DSC type devices, multiple busses are used to move data between the memories and
peripherals and the CPU. The C28x memory bus architecture contains a program read bus, data read bus
and data write bus. The program read bus consists of 22 address lines and 32 data lines. The data read
and write busses consist of 32 address lines and 32 data lines each. The 32-bit-wide data busses enable
single cycle 32-bit operations. The multiple bus architecture, commonly termed Harvard Bus, enables the
C28x to fetch an instruction, read a data value and write a data value in a single cycle. All peripherals and
memories attached to the memory bus will prioritize memory accesses. Generally, the priority of memory
bus accesses can be summarized as follows:
Highest: Data Writes (Simultaneous data and program writes cannot occur on the memory bus.)
Program Writes (Simultaneous data and program writes cannot occur on the memory bus.)
Data Reads
Program Reads (Simultaneous program reads and fetches cannot occur on the memory bus.)
Lowest: Fetches (Simultaneous program reads and fetches cannot occur on the memory bus.)
3.2.3 Peripheral Bus

To enable migration of peripherals between various Texas Instruments (TI) DSC family of devices, the
2833x devices adopt a peripheral bus standard for peripheral interconnect. The peripheral bus bridge
multiplexes the various busses that make up the processor Memory Bus into a single bus consisting of 16
address lines and 16 or 32 data lines and associated control signals. Three versions of the peripheral bus
are supported on the 2833x. One version supports only 16-bit accesses (called peripheral frame 2).
Another version supports both 16- and 32-bit accesses (called peripheral frame 1). The third version
supports DMA access and both 16- and 32-bit accesses (called peripheral frame 3).
3.2.4 Real-Time JTAG and Analysis

The 2833x implements the standard IEEE 1149.1 JTAG interface. Additionally, the 2833x supports
real-time mode of operation whereby the contents of memory, peripheral and register locations can be
modified while the processor is running and executing code and servicing interrupts. The user can also
single step through non-time critical code while enabling time-critical interrupts to be serviced without
interference. The 2833x implements the real-time mode in hardware within the CPU. This is a unique
feature to the 2833x, no software monitor is required. Additionally, special analysis hardware is provided
which allows the user to set hardware breakpoint or data/address watch-points and generate various
user-selectable break events when a match occurs.

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3.2.5 External Interface (XINTF)

This asynchronous interface consists of 19 address lines, 32 data lines, and three chip-select lines. The
chip-select lines are mapped to three external zones, Zones 0, 6, and 7. Each of the three zones can be
programmed with a different number of wait states, strobe signal setup and hold timing and each zone can
be programmed for extending wait states externally or not. The programmable wait-state, chip-select and
programmable strobe timing enables glueless interface to external memories and peripherals.
3.2.6 Flash
The F28335 contains 256K × 16 of embedded flash memory, segregated into eight 32K × 16 sectors. The
F28334 contains 128K × 16 of embedded flash memory, segregated into eight 16K × 16 sectors. The
F28332 device contains 64K ×16 of embedded flash, segregated into four 16K × 16 sectors. All the
devices also contain a single 1K × 16 of OTP memory at address range 0x380400 – 0x3807FF. The user
can individually erase, program, and validate a flash sector while leaving other sectors untouched.
However, it is not possible to use one sector of the flash or the OTP to execute flash algorithms that
PRODUCT PREVIEW
erase/program other sectors. Special memory pipelining is provided to enable the flash module to achieve
higher performance. The flash/OTP is mapped to both program and data space; therefore, it can be used
to execute code or store data information. Note that addresses 0x33FFF0 – 0x33FFF5 are reserved for
data variables and should not contain program code.
NOTE
The F28335/F28334/F28332 Flash and OTP wait-states can be configured by the
application. This allows applications running at slower frequencies to configure the flash to
use fewer wait-states.
Flash effective performance can be improved by enabling the flash pipeline mode in the
Flash options register. With this mode enabled, effective performance of linear code
execution will be much faster than the raw performance indicated by the wait-state
configuration alone. The exact performance gain when using the Flash pipeline mode is
application-dependent.
For more information on the Flash options, Flash wait-state, and OTP wait-state registers,
see the TMS320x280x, 2801x, 2804x System Control and Interrupts Reference Guide
(literature number SPRU712).
3.2.7 M0, M1 SARAMs

All 2833x devices contain these two blocks of single access memory, each 1K × 16 in size. The stack
pointer points to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks
on C28x devices, are mapped to both program and data space. Hence, the user can use M0 and M1 to
execute code or for data variables. The partitioning is performed within the linker. The C28x device
presents a unified memory map to the programmer. This makes for easier programming in high-level
languages.
3.2.8 L0, L1, L2, L3, L4, L5, L6, L7 SARAMs

The F28335 and F28334 each contain an additional 32K × 16 of single-access RAM, divided into 8 blocks
(L0-L7 with 4K each). The F28332 contains an additional 24K × 16 of single-access RAM, divided into
6 blocks (L0-L5 with 4K each). Each block can be independently accessed to minimize CPU pipeline
stalls. Each block is mapped to both program and data space. L4, L5, L6, and L7 are DMA accessible
3.2.9 Boot ROM

The Boot ROM is factory-programmed with boot-loading software. Boot-mode signals are provided to tell
the bootloader software what boot mode to use on power up. The user can select to boot normally or to
download new software from an external connection or to select boot software that is programmed in the
internal Flash/ROM. The Boot ROM also contains standard tables, such as SIN/COS waveforms, for use
in math related algorithms.

TMS320F28335, TMS320F28334, TMS320F28332

Table 3-6. Boot Mode Selection
GPIO87/XA15 GPIO86/XA14 GPIO85/XA13 GPIO84/XA12 MODE (1)

1 1 1 1 Jump to Flash
1 1 1 0 SCI-A boot
1 1 0 1 SPI-A boot
1 1 0 0 I2C-A boot
1 0 1 1 eCAN-A boot
1 0 1 0 McBSP-A boot
1 0 0 1 Jump to XINTF x16
1 0 0 0 Jump to XINTF x32
0 1 1 1 Jump to OTP
0 1 1 0 Parallel GPIO I/O boot
PRODUCT PREVIEW
0 1 0 1 Parallel XINTF boot

0 1 0 0 Jump to SARAM
0 0 1 1 Branch to check boot mode
0 0 1 0 Branch to Flash, skip ADC CAL
0 0 0 1 Branch to SARAM, skip ADC CAL
0 0 0 0 Branch to SCI, skip ADC CAL
(1) All four GPIO pins have an internal pullup.

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3.2.10 Security
The 2833x devices support high levels of security to protect the user firmware from being reverse
engineered. The security features a 128-bit password (hardcoded for 16 wait-states), which the user
programs into the flash. One code security module (CSM) is used to protect the flash/OTP and the
L0/L1/L2/L3 SARAM blocks. The security feature prevents unauthorized users from examining the
memory contents via the JTAG port, executing code from external memory or trying to boot-load some
undesirable software that would export the secure memory contents. To enable access to the secure
blocks, the user must write the correct 128-bit KEY value, which matches the value stored in the password
locations within the Flash.
NOTE
• When the code-security passwords are programmed, all addresses between
0x33FF80 and 0x33FFF5 cannot be used as program code or data. These locations
must be programmed to 0x0000.
PRODUCT PREVIEW
• If the code security feature is not used, addresses 0x33FF80 through 0x33FFEF may
be used for code or data. Addresses 0x33FFF0 – 0x33FFF5 are reserved for data and
should not contain program code. .
The 128-bit password (at 0x33 FFF8 – 0x33 FFFF) must not be programmed to zeros.
Doing so would permanently lock the device.
NOTE
Code Security Module Disclaimer
THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS
DESIGNED TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED
MEMORY (EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS
INSTRUMENTS (TI), IN ACCORDANCE WITH ITS STANDARD TERMS AND
CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS FOR THE
WARRANTY PERIOD APPLICABLE FOR THIS DEVICE.
TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE
COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED
MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER,
EXCEPT AS SET FORTH ABOVE, TI MAKES NO WARRANTIES OR
REPRESENTATIONS CONCERNING THE CSM OR OPERATION OF THIS DEVICE,
INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR
A PARTICULAR PURPOSE.
IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL,
INDIRECT, INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN
ANY WAY OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT
TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED
DAMAGES INCLUDE, BUT ARE NOT LIMITED TO LOSS OF DATA, LOSS OF
GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR OTHER
ECONOMIC LOSS.
3.2.11 Peripheral Interrupt Expansion (PIE) Block

The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The
PIE block can support up to 96 peripheral interrupts. On the 2833x, 58 of the possible 96 interrupts are
used by peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of 12

TMS320F28335, TMS320F28334, TMS320F28332

CPU interrupt lines (INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a
dedicated RAM block that can be overwritten by the user. The vector is automatically fetched by the CPU
on servicing the interrupt. It takes 8 CPU clock cycles to fetch the vector and save critical CPU registers.
Hence the CPU can quickly respond to interrupt events. Prioritization of interrupts is controlled in
hardware and software. Each individual interrupt can be enabled/disabled within the PIE block.
3.2.12 External Interrupts (XINT1-XINT7, XNMI)

The 2833x supports eight masked external interrupts (XINT1-XINT7, XNMI). XNMI can be connected to
the INT13 or NMI interrupt of the CPU. Each of the interrupts can be selected for negative, positive, or
both negative and positive edge triggering and can also be enabled/disabled (including the XNMI). The
masked interrupts also contain a 16-bit free running up counter, which is reset to zero when a valid
interrupt edge is detected. This counter can be used to accurately time stamp the interrupt. Unlike the
281x devices, there are no dedicated pins for the external interrupts. Rather, any Port A GPIO pin can be
configured to trigger any external interrupt.
PRODUCT PREVIEW
3.2.13 Oscillator and PLL

The 2833x can be clocked by an external oscillator or by a crystal attached to the on-chip oscillator circuit.
A PLL is provided supporting up to 10 input-clock-scaling ratios. The PLL ratios can be changed on-the-fly
in software, enabling the user to scale back on operating frequency if lower power operation is desired.
Refer to the Electrical Specification section for timing details. The PLL block can be set in bypass mode.
3.2.14 Watchdog
The 2833x devices contain a watchdog timer. The user software must regularly reset the watchdog
counter within a certain time frame; otherwise, the watchdog will generate a reset to the processor. The
watchdog can be disabled if necessary.
3.2.15 Peripheral Clocking

The clocks to each individual peripheral can be enabled/disabled so as to reduce power consumption
when a peripheral is not in use. Additionally, the system clock to the serial ports (except I2C and eCAN)
and the ADC blocks can be scaled relative to the CPU clock. This enables the timing of peripherals to be
decoupled from increasing CPU clock speeds.
3.2.16 Low-Power Modes

The 2833x devices are full static CMOS devices. Three low-power modes are provided:
IDLE: Place CPU into low-power mode. Peripheral clocks may be turned off selectively and only
those peripherals that need to function during IDLE are left operating. An enabled interrupt
from an active peripheral or the watchdog timer will wake the processor from IDLE mode.
STANDBY: Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL functional.
An external interrupt event will wake the processor and the peripherals. Execution begins
on the next valid cycle after detection of the interrupt event
HALT: Turns off the internal oscillator. This mode basically shuts down the device and places it in
the lowest possible power consumption mode. A reset or external signal can wake the
device from this mode.

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3.2.17 Peripheral Frames 0, 1, 2, 3 (PFn)

The 2833x device segregates peripherals into three sections. The mapping of peripherals is as follows:
PF0: PIE: PIE Interrupt Enable and Control Registers Plus PIE Vector Table
Flash: Flash Control, Programming, Erase, Verify Registers
XINTF: External Interface Registers
DMA DMA Registers
FPU: Floating-Point Unit Registers
Timers: CPU-Timers 0, 1, 2 Registers
CSM: Code Security Module KEY Registers
ADC: ADC Result Registers (dual-mapped)
PRODUCT PREVIEW
PF1: eCAN: eCAN Mailbox and Control Registers
GPIO: GPIO MUX Configuration and Control Registers
ePWM: Enhanced Pulse Width Modulator Module and Registers
eCAP: Enhanced Capture Module and Registers
eQEP: Enhanced Quadrature Encoder Pulse Module and Registers
PF2: SYS: System Control Registers
SCI: Serial Communications Interface (SCI) Control and RX/TX Registers
SPI: Serial Port Interface (SPI) Control and RX/TX Registers
ADC: ADC Status, Control, and Result Register
I2C: Inter-Integrated Circuit Module and Registers
XINTF External Interface Registers
PF3: McBSP Multichannel Buffered Serial Port Registers
3.2.18 General-Purpose Input/Output (GPIO) Multiplexer

Most of the peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. This
enables the user to use a pin as GPIO if the peripheral signal or function is not used. On reset, GPIO pins
are configured as inputs. The user can individually program each pin for GPIO mode or peripheral signal
mode. For specific inputs, the user can also select the number of input qualification cycles. This is to filter
unwanted noise glitches. The GPIO signals can also be used to bring the device out of specific low-power
modes.
3.2.19 32-Bit CPU-Timers (0, 1, 2)

CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock
prescaling. The timers have a 32-bit count down register, which generates an interrupt when the counter
reaches zero. The counter is decremented at the CPU clock speed divided by the prescale value setting.
When the counter reaches zero, it is automatically reloaded with a 32-bit period value. CPU-Timer 2 is
reserved for Real-Time OS (RTOS)/BIOS applications. CPU-Timer 1 is also reserved for TI system
functions. CPU-Timer 2 is connected to INT14 of the CPU. CPU-Timer 1 can be connected to INT13 of
the CPU. CPU-Timer 0 is for general use and is connected to the PIE block.

TMS320F28335, TMS320F28334, TMS320F28332

3.2.20 Control Peripherals

The 2833x devices support the following peripherals which are used for embedded control and
communication:
ePWM: The enhanced PWM peripheral supports independent/complementary PWM generation,
adjustable dead-band generation for leading/trailing edges, latched/cycle-by-cycle trip
mechanism. Some of the PWM pins support HRPWM features.
eCAP: The enhanced capture peripheral uses a 32-bit time base and registers up to four
programmable events in continuous/one-shot capture modes.
This peripheral can also be configured to generate an auxiliary PWM signal.
eQEP: The enhanced QEP peripheral uses a 32-bit position counter, supports low-speed
measurement using capture unit and high-speed measurement using a 32-bit unit timer.
This peripheral has a watchdog timer to detect motor stall and input error detection logic
PRODUCT PREVIEW
to identify simultaneous edge transition in QEP signals.

ADC: The ADC block is a 12-bit converter, single ended, 16-channels. It contains two
sample-and-hold units for simultaneous sampling.
3.2.21 Serial Port Peripherals

The 2833x devices support the following serial communication peripherals:
eCAN: This is the enhanced version of the CAN peripheral. It supports 32 mailboxes, time
stamping of messages, and is CAN 2.0B-compliant.
McBSP: The multichannel buffered serial port (McBSP) connects to E1/T1 lines, phone-quality
codecs for modem applications or high-quality stereo audio DAC devices. The McBSP
receive and transmit registers are supported by the DMA to significantly reduce the
overhead for servicing this peripheral.
SPI: The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of
programmed length (one to sixteen bits) to be shifted into and out of the device at a
programmable bit-transfer rate. Normally, the SPI is used for communications between the
DSC and external peripherals or another processor. Typical applications include external
I/O or peripheral expansion through devices such as shift registers, display drivers, and
ADCs. Multi-device communications are supported by the master/slave operation of the
SPI. On the 2833x, the SPI contains a 16-level receive and transmit FIFO for reducing
interrupt servicing overhead.
SCI: The serial communications interface is a two-wire asynchronous serial port, commonly
known as UART. On the 2833x, the SCI contains a 16-level receive and transmit FIFO for
reducing interrupt servicing overhead.
I2C: The inter-integrated circuit (I2C) module provides an interface between a DSC and other
devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus) specification version
2.1 and connected by way of an I2C-bus. External components attached to this 2-wire
serial bus can transmit/receive up to 8-bit data to/from the DSC through the I2C module.
On the 2833x, the I2C contains a 16-level receive and transmit FIFO for reducing interrupt
servicing overhead.

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3.3 Register Map

The 2833x devices contain four peripheral register spaces. The spaces are categorized as follows:
Peripheral These are peripherals that are mapped directly to the CPU memory bus.
Frame 0: See Table 3-7
Peripheral These are peripherals that are mapped to the 32-bit peripheral bus.
Frame 1 See Table 3-8
Peripheral These are peripherals that are mapped to the 16-bit peripheral bus.
Frame 2: See Table 3-9
Peripheral These are peripherals that are mapped to the 32-bit DMA-accessible peripheral
Frame 3: bus.
See Table 3-10
PRODUCT PREVIEW
Table 3-7. Peripheral Frame 0 Registers (1)
NAME ADDRESS RANGE SIZE (×16) ACCESS TYPE (2)

Device Emulation Registers 0x00 0880 - 0x00 09FF 384 EALLOW protected
FLASH Registers (3) 0x00 0A80 - 0x00 0ADF 96 EALLOW protected
Code Security Module Registers 0x00 0AE0 - 0x00 0AEF 16 EALLOW protected
ADC registers (dual-mapped) (0 wait, read only) 0x00 0B00 - 0x00 0B1F 32 Not EALLOW protected
XINTF Registers 0x00 0B20 - 0x00 0B3F 32 Not EALLOW protected
CPU–TIMER0/1/2 Registers 0x00 0C00 - 0x00 0C3F 64 Not EALLOW protected
PIE Registers 0x00 0CE0 - 0x00 0CFF 32 Not EALLOW protected
PIE Vector Table 0x00 0D00 - 0x00 0DFF 256 EALLOW protected
DMA Registers 0x00 1000 - 0x00 11FF 512 EALLOW protected
(1) Registers in Frame 0 support 16-bit and 32-bit accesses.
(2) If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction
disables writes to prevent stray code or pointers from corrupting register contents.
(3) The Flash Registers are also protected by the Code Security Module (CSM).
Table 3-8. Peripheral Frame 1 Registers
NAME ADDRESS RANGE SIZE (×16)

ECAN-A Registers 0x0000 6000 - 0x0000 61FF 512
ECAN-B Registers 0x0000 6200 - 0x0000 63FF 512
EPWM1 + HRPWM1 Registers 0x0000 6800 - 0x0000 683F 64
EPWM3 + HRPWM3 Registers 0x0000 6880 - 0x0000 68BF 64
EPWM4 + HRPWM4 Registers 0x0000 68C0 - 0x0000 68FF 64
ECAP1 Registers 0x0000 6A00 - 0x0000 6A1F 32
ECAP6 Registers 0x0000 6AA0 - 0x0000 6ABF 32
EQEP1 Registers 0x0000 6B00 - 0x0000 6B3F 64
EQEP2 Registers 0x0000 6B40 - 0x0000 6B7F 64
GPIO Registers 0x0000 6F80 - 0x0000 6FFF 128

TMS320F28335, TMS320F28334, TMS320F28332


System Control Registers 0x0000 7010 - 0x0000 702F 32
SPI-A Registers 0x0000 7040 - 0x0000 704F 16
SCI-A Registers 0x0000 7050 - 0x0000 705F 16
External Interrupt Registers 0x0000 7070 - 0x0000 707F 16
ADC Registers 0x0000 7100 - 0x0000 711F 32
SCI-B Registers 0x0000 7750 - 0x0000 775F 16
SCI-C Registers 0x0000 7770 - 0x0000 777F 16
I2C-A Registers 0x0000 7900 - 0x0000 793F 64
PRODUCT PREVIEW

McBSP-A Registers 0x0000 5000 - 0x0000 503F 64
McBSP-B Registers 0x0000 5040 - 0x0000 507F 64
3.4 Device Emulation Registers

These registers are used to control the protection mode of the C28x CPU and to monitor some critical
device signals. The registers are defined in Table 3-11.
Table 3-11. Device Emulation Registers
ADDRESS
NAME SIZE (x16) DESCRIPTION
RANGE
0x0880
DEVICECNF 2 Device Configuration Register
0x0881
PARTID 0x0882 1 Part ID Register 0x00F8 (1) - F28332
0x00F9 - F28334
0x00FA - F28335
REVID 0x0883 1 Revision ID Register 0x0000 - Silicon Rev. 0 - TMX
PROTSTART 0x0884 1 Block Protection Start Address Register
PROTRANGE 0x0885 1 Block Protection Range Address Register
(1) The first byte (00) denotes flash devices. FF denotes ROM devices. Other values are reserved for future devices.

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3.5 Interrupts
Figure 3-5 shows how the various interrupt sources are multiplexed within the 2833x devices.
Peripherals
(SPI, SCI, I2C, CAN, McBSP,
Clear EPWM, ECAP, EQEP, ADC)
DMA
WDINT
WAKEINT Watchdog
Sync LPMINT
Low Power Models
DMA SYSCLKOUT
XINT1 XINT1
MUX
Interrupt Control Latch
INT1
96 Interrupts
to
PRODUCT PREVIEW
XINT1CR(15:0)
INT12
PIE
XINT1CTR(15:0)
C28 GPIOXINT1SEL(4:0) XINT2
Core
DMA ADC XINT2SOC
XINT2
MUX
XINT2CR(15:0)
XINT2CTR(15:0)
GPIOXINT2SEL(4:0)
DMA
TINT0
CPU Timer 0
DMA
TINT2
INT14 CPU Timer 2
TINT1 TOUT1
CPU Timer 1
MUX
INT13
Flash Wrapper
XNMI_ GPIO0.int
XINT13
MUX
GPIO
MUX
Mux
NMI XNMICR(15:0) GPIO31.int
1
XNMICTR(15:0)
GPIOXNMISEL(4:0)
DMA
Figure 3-5. External and PIE Interrupt Sources

TMS320F28335, TMS320F28334, TMS320F28332

DMA
XINT3
Mux
XINT3CR(15:0)
GPIOXINT3SEL(4:0)
DMA
XINT4
Mux
XINT4CR(15:0)
GPIOXINT4SEL(4:0)
DMA
PRODUCT PREVIEW
96 Interrupts
INT1
to XINT5
Mux
PIE Interrupt Control Latch
INT12
XINT5CR(15:0)
C28
Core
GPIOXINT5SEL(4:0)
DMA
XINT6
Mux
XINT6CR(15:0)
GPIOXINT6SEL(4:0)
DMA
GPIO32.int
XINT7
Mux
GPIO
Mux
GPIO63.int
XINT7CR(15:0)
GPIOXINT7SEL(4:0)
Figure 3-6. External Interrupts
Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with 8
interrupts per group equals 96 possible interrupts. On the 2833x, 58 of these are used by peripherals as
shown in Table 3-12.

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IFR(12:1) IER(12:1) INTM
INT1
INT2
1
MUX CPU
0
INT11
INT12 Global
(Flag) (Enable) Enable
INTx.1
INTx.2
INTx.3
From
INTx INTx.4
Peripherals or
PRODUCT PREVIEW
MUX INTx.5 External
INTx.6 Interrupts
INTx.7
PIEACKx INTx.8
(Enable) (Flag)
(Enable/Flag)
PIEIERx(8:1) PIEIFRx(8:1)
Figure 3-7. Multiplexing of Interrupts Using the PIE Block
Table 3-12. PIE Peripheral Interrupts (1)
CPU PIE INTERRUPTS

INTERRUPTS INTx.8 INTx.7 INTx.6 INTx.5 INTx.4 INTx.3 INTx.2 INTx.1
WAKEINT TINT0 ADCINT SEQ2INT SEQ1INT
INT1 XINT2 XINT1 reserved
(LPM/WD) (TIMER 0) (ADC) (ADC) (ADC)
EPWM6_TZINT EPWM5_TZINT EPWM4_TZINT EPWM3_TZINT EPWM2_TZINT EPWM1_TZINT
INT2 reserved reserved
(ePWM6) (ePWM5) (ePWM4) (ePWM3) (ePWM2) (ePWM1)
EPWM6_INT EPWM5_INT EPWM4_INT EPWM3_INT EPWM2_INT EPWM1_INT
(ePWM6) (ePWM5) (ePWM4) (ePWM3) (ePWM2) (ePWM1)
ECAP6_INT ECAP5_INT ECAP4_INT ECAP3_INT ECAP2_INT ECAP1_INT
(ECAP6) (ECAP5) (eCAP4) (eCAP3) (eCAP2) (eCAP1)
EQEP2_INT EQEP1_INT
INT5 reserved reserved reserved reserved reserved reserved
(eQEP2) (eQEP1)
MXINTA MRINTA MXINTB MRXINTB SPITXINTA SPIRXINTA
(McBSP-A) (McBSP-A) (McBSP-B) (McBSP-B) (SPI-A) (SPI-A)
DINTCH6 DINTCH5 DINTCH4 DINTCH3 DINTCH2 DINTCH1
(DMA) (DMA) (DMA) (DMA) (DMA) (DMA)
SCITXINTC SCIRXINTC I2CINT2A I2CINT1A
INT8 reserved reserved reserved reserved
(SCI-C) (SCI-C) (I2C-A) (I2C-A)
ECAN1_INTB ECAN0_INTB ECAN1_INTA ECAN0_INTA SCITXINTB SCIRXINTB SCITXINTA SCIRXINTA
INT9
(CAN-B) (CAN-B) (CAN-A) (CAN-A) (SCI-B) (SCI-B) (SCI-A) (SCI-A)
INT10 reserved reserved reserved reserved reserved reserved reserved reserved
INT11 reserved reserved reserved reserved reserved reserved reserved reserved
LUF LVF
INT12 reserved XINT7 XINT6 XINT5 XINT4 XINT3
(FPU) (FPU)
(1) Out of the 96 possible interrupts, 58 interrupts are currently used. The remaining interrupts are reserved for future devices. These
interrupts can be used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group is
being used by a peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while
modifying the PIEIFR. To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts:
1) No peripheral within the group is asserting interrupts.
2) No peripheral interrupts are assigned to the group (example PIE group 11).

TMS320F28335, TMS320F28334, TMS320F28332

Table 3-13. PIE Configuration and Control Registers
NAME ADDRESS SIZE (X16) DESCRIPTION (1)

PIECTRL 0x0CE0 1 PIE, Control Register
PIEACK 0x0CE1 1 PIE, Acknowledge Register
PIEIER1 0x0CE2 1 PIE, INT1 Group Enable Register
PIEIFR1 0x0CE3 1 PIE, INT1 Group Flag Register
PRODUCT PREVIEW

PIEIER5 0x0CEA 1 PIE, INT5 Group Enable Register
PIEIFR5 0x0CEB 1 PIE, INT5 Group Flag Register
PIEIER6 0x0CEC 1 PIE, INT6 Group Enable Register
PIEIFR6 0x0CED 1 PIE, INT6 Group Flag Register
PIEIER7 0x0CEE 1 PIE, INT7 Group Enable Register
PIEIFR7 0x0CEF 1 PIE, INT7 Group Flag Register
PIEIER8 0x0CF0 1 PIE, INT8 Group Enable Register
PIEIFR8 0x0CF1 1 PIE, INT8 Group Flag Register
Reserved 0x0CFA 6 Reserved
0x0CFF
(1) The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector table
is protected.

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3.5.1 External Interrupts
Table 3-14. External Interrupt Registers
Name Address Size (x16) Description

XINT1CR 0x0000 7070 1 XINT1 configuration register
XNMICR 0x0000 7077 1 XNMI configuration register
PRODUCT PREVIEW
XINT1CTR 0x0000 7078 1 XINT1 counter register
XINT2CTR 0x0000 7079 1 XINT2 counter register
reserved 0x0000 707A - 0x0000 5
707E
XNMICTR 0x0000 707F 1 XNMI counter register
Each external interrupt can be enabled/disabled or qualified using positive, negative, or both positive and
negative edge. For more information, see the TMS320x280x, 2801x, 2804x System Control and Interrupts
Reference Guide (literature number SPRU712).
3.6 System Control

This section describes the 2833x oscillator, PLL and clocking mechanisms, the watchdog function and the
low power modes. Figure 3-8 shows the various clock and reset domains in the 2833x devices that will be
discussed.

TMS320F28335, TMS320F28334, TMS320F28332

C28x Core
SYSCLKOUT
Clock Enables System

Control
Register
LSPCLK
LOSPCP Bridge
I/O
Peripheral
SPI-A, SCI-A/B/C, I2C-A Registers
Clock Enables
Peripheral Bus
Memory Bus
/2
I/O
Peripheral
PRODUCT PREVIEW
eCAN-A/B Registers
GPIO Clock Enables

Mux Bridge
I/O
EPWM1/../6, HRPWM1/../6, Peripheral
ECAP1/../6, EQEP1/2 Registers
Clock Enables
LOSPCP
LSPCLK
I/O
Peripheral
McBSP-A/B Registers Bridge
Clock Enables
HISPCP
HSPCLK
Bridge
16 Channels ADC
12-Bit ADC Registers
DMA
Bus
Result
Registers
Clock Enables DMA
A. CLKIN is the clock into the CPU. It is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same frequency
as SYSCLKOUT).
Figure 3-8. Clock and Reset Domains

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The PLL, clocking, watchdog and low-power modes, are controlled by the registers listed in Table 3-15.
Table 3-15. PLL, Clocking, Watchdog, and Low-Power Mode Registers
Name Address Size (x16) Description

XCLK 0x0000-7010 1 XCLKOUT Pin Control and X1/XCLKIN Status Register
PLLSTS 0x0000-7011 1 PLL Status Register
reserved 0x0000-7012 - 0x0000-7018 7
HISPCP 0x0000-701A 1 High-Speed Peripheral Clock Pre-Scaler Register
LOSPCP 0x0000-701B 1 Low-Speed Peripheral Clock Pre-Scaler Register
PCLKCR0 0x0000-701C 1 Peripheral Clock Control Register 0
PCLKCR1 0x0000-701D 1 Peripheral Clock Control Register 1
LPMCR0 0x0000-701E 1 Low Power Mode Control Register 0
PRODUCT PREVIEW
reserved 0x0000-701F 1 Low Power Mode Control Register 1
PCLKCR3 0x0000-7020 1 Peripheral Clock Control Register 3
PLLCR 0x0000-7021 1 PLL Control Register
SCSR 0x0000-7022 1 System Control and Status Register
WDCNTR 0x0000-7023 1 Watchdog Counter Register
reserved 0x0000-7024 1
WDKEY 0x0000-7025 1 Watchdog Reset Key Register
reserved 0x0000-7026 - 0x0000-7028 3
WDCR 0x0000-7029 1 Watchdog Control Register
reserved 0x0000-702A - 0x0000-702F 6
3.6.1 OSC and PLL Block

Figure 3-9 shows the OSC and PLL block on the 2833x.
OSCCLK OSCCLK
XCLKIN
xor 0 OSCCLK or
(3.3-V clock input)
VCOCLK CLKIN
PLLSTS[OSCOFF] VCOCLK
PLL
n n≠0 /2
PLLSTS[PLLOFF]
X1 PLLSTS[CLKINDIV]
On chip
4-bit PLL Select (PLLCR)
oscillator
X2
Figure 3-9. OSC and PLL Block Diagram
The on-chip oscillator circuit enables a crystal/resonator to be attached to the 2833x devices using the X1
and X2 pins. If the on-chip oscillator is not used, an external oscillator can be used in either one of the
following configurations:
1. A 3.3-V external oscillator can be directly connected to the XCLKIN pin. The X2 pin should be left
unconnected and the X1 pin tied low. The logic-high level in this case should not exceed VDDIO.
2. A 1.8-V external oscillator can be directly connected to the X1 pin. The X2 pin should be left
unconnected and the XCLKIN pin tied low. The logic-high level in this case should not exceed VDD.
The three possible input-clock configurations are shown in Figure 3-10 through Figure 3-12

TMS320F28335, TMS320F28334, TMS320F28332

XCLKIN X1 X2
External Clock Signal NC

(Toggling 0 −VDDIO)
Figure 3-10. Using a 3.3-V External Oscillator
XCLKIN X1 X2
External Clock Signal NC

PRODUCT PREVIEW
(Toggling 0 −VDD)
Figure 3-11. Using a 1.8-V External Oscillator
XCLKIN X1 X2
CL1 CL2
Crystal
Figure 3-12. Using the Internal Oscillator
3.6.1.1 External Reference Oscillator Clock Option

The typical specifications for the external quartz crystal for a frequency of 20 MHz are listed below:
• Fundamental mode, parallel resonant
• CL (load capacitance) = 12 pF
• CL1 = CL2 = 24 pF
• Cshunt = 6 pF
• ESR range = 30 to 60 Ω
TI recommends that customers have the resonator/crystal vendor characterize the operation of their
device with the DSC chip. The resonator/crystal vendor has the equipment and expertise to tune the tank
circuit. The vendor can also advise the customer regarding the proper tank component values that will
produce proper start up and stability over the entire operating range.
3.6.1.2 PLL-Based Clock Module
The 2833x devices have an on-chip, PLL-based clock module. This module provides all the necessary
clocking signals for the device, as well as control for low-power mode entry. The PLL has a 4-bit ratio
control PLLCR[DIV] to select different CPU clock rates. The watchdog module should be disabled before
writing to the PLLCR register. It can be re-enabled (if need be) after the PLL module has stabilized, which
takes 131072 OSCCLK cycles.

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Table 3-16. PLLCR Register Bit Definitions
SYSCLKOUT
PLLCR[DIV] (1)
(CLKIN) (2)
0000 (PLL bypass) OSCCLK/n
0001 (OSCCLK*1)/n
0010 (OSCCLK*2)/n
0011 (OSCCLK*3)/n
0100 (OSCCLK*4)/n
0101 (OSCCLK*5)/n
0110 (OSCCLK*6)/n
0111 (OSCCLK*7)/n
1000 (OSCCLK*8)/n
1001 (OSCCLK*9)/n
PRODUCT PREVIEW
1010 (OSCCLK*10)/n
1011-1111 reserved
(1) This register is EALLOW protected.
(2) CLKIN is the input clock to the CPU. SYSCLKOUT is the output
clock from the CPU. The frequency of SYSCLKOUT is the same as
CLKIN. If CLKINDIV = 0, n = 2; if CLKINDIV = 1, n = 1.
Table 3-17. CLKIN Divide Options
PLLSTS [DIVSEL] CLKIN DIVIDE

0 /4
1 /4
2 /2
3 /1
The PLL-based clock module provides two modes of operation:

• Crystal-operation - This mode allows the use of an external crystal/resonator to provide the time base
to the device.
• External clock source operation - This mode allows the internal oscillator to be bypassed. The device
clocks are generated from an external clock source input on the X1 or the XCLKIN pin.
Table 3-18. Possible PLL Configuration Modes
SYSCLKOUT
PLL MODE REMARKS PLLSTS[CLKINDIV]
(CLKIN)
Invoked by the user setting the PLLOFF bit in the PLLSTS register. The PLL block 0 OSCCLK/2
is disabled in this mode. This can be useful to reduce system noise and for low
PLL Off power operation. The PLLCR register must first be set to 0x0000 (PLL Bypass)
before entering this mode. The CPU clock (CLKIN) is derived directly from the 1 OSCCLK
input clock on either X1/X2, X1 or XCLKIN.
PLL Bypass is the default PLL configuration upon power-up or after an external 0 OSCCLK/2
reset (XRS). This mode is selected when the PLLCR register is set to 0x0000 or
PLL Bypass
while the PLL locks to a new frequency after the PLLCR register has been 1 OSCCLK
modified. In this mode, the PLL itself is bypassed but the PLL is not turned off.
Achieved by writing a non-zero value n into the PLLCR register. Upon writing to the
PLL Enable 0 OSCCLK*n/2
PLLCR the device will switch to PLL Bypass mode until the PLL locks.

TMS320F28335, TMS320F28334, TMS320F28332

3.6.1.3 Loss of Input Clock

In PLL-enabled and PLL-bypass mode, if the input clock OSCCLK is removed or absent, the PLL will still
issue a limp-mode clock. The limp-mode clock continues to clock the CPU and peripherals at a typical
frequency of 1-5 MHz. Limp mode is not specified to work from power-up, only after input clocks have
been present initially. In PLL bypass mode, the limp mode clock from the PLL is automatically routed to
the CPU if the input clock is removed or absent.
Normally, when the input clocks are present, the watchdog counter decrements to initiate a watchdog
reset or WDINT interrupt. However, when the external input clock fails, the watchdog counter stops
decrementing (i.e., the watchdog counter does not change with the limp-mode clock). In addition to this,
the device will be reset and the “Missing Clock Status” (MCLKSTS) bit will be set. These conditions could
be used by the application firmware to detect the input clock failure and initiate necessary shut-down
procedure for the system.
PRODUCT PREVIEW
NOTE
Applications in which the correct CPU operating frequency is absolutely critical should
implement a mechanism by which the DSC will be held in reset, should the input clocks
ever fail. For example, an R-C circuit may be used to trigger the XRS pin of the DSC,
should the capacitor ever get fully charged. An I/O pin may be used to discharge the
capacitor on a periodic basis to prevent it from getting fully charged. Such a circuit would
also help in detecting failure of the flash memory and the VDD3VFL rail.
3.6.2 Watchdog Block

The watchdog block on the 2833x is similar to the one used on the 240x and 281x devices. The watchdog
module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit watchdog up
counter has reached its maximum value. To prevent this, the user disables the counter or the software
must periodically write a 0x55 + 0xAA sequence into the watchdog key register which will reset the
watchdog counter. Figure 3-13 shows the various functional blocks within the watchdog module.
WDCR (WDPS[2:0]) WDCR (WDDIS)
WDCNTR(7:0)
OSCCLK Watchdog WDCLK 8-Bit

/512 Watchdog
Prescaler
Counter
CLR
Clear Counter
Internal
Pullup
WDKEY(7:0)
Generate WDRST
Watchdog Output Pulse WDINT
55 + AA Good Key (512 OSCCLKs)
Key Detector
XRS
Core-reset Bad
WDCHK SCSR (WDENINT)
Key
WDCR (WDCHK[2:0])
1 0 1
WDRST(A)
A. The WDRST signal is driven low for 512 OSCCLK cycles.
Figure 3-13. Watchdog Module
The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode.

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In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains
functional is the watchdog. The WATCHDOG module will run off OSCCLK. The WDINT signal is fed to the
LPM block so that it can wake the device from STANDBY (if enabled). See Section Section 3.7,
Low-Power Modes Block, for more details.
In IDLE mode, the WDINT signal can generate an interrupt to the CPU, via the PIE, to take the CPU out of
IDLE mode.
In HALT mode, this feature cannot be used because the oscillator (and PLL) are turned off and hence so
is the WATCHDOG.
3.7 Low-Power Modes Block

The low-power modes on the 2833x are similar to the 240x devices. Table 3-19 summarizes the various
modes.
PRODUCT PREVIEW
Table 3-19. Low-Power Modes
MODE LPMCR0(1:0) OSCCLK CLKIN SYSCLKOUT EXIT (1)

XRS, Watchdog interrupt, any enabled
IDLE 00 On On On (2)
interrupt, XNMI
On XRS, Watchdog interrupt, GPIO Port A
STANDBY 01 Off Off
(watchdog still running) signal, debugger (3), XNMI
Off
XRS, GPIO Port A signal, XNMI,
HALT 1X (oscillator and PLL turned off, Off Off
debugger (3)
watchdog not functional)
(1) The Exit column lists which signals or under what conditions the low power mode will be exited. A low signal, on any of the signals, will
exit the low power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise the
IDLE mode will not be exited and the device will go back into the indicated low power mode.
(2) The IDLE mode on the C28x behaves differently than on the 24x/240x. On the C28x, the clock output from the CPU (SYSCLKOUT) is
still functional while on the 24x/240x the clock is turned off.
(3) On the C28x, the JTAG port can still function even if the CPU clock (CLKIN) is turned off.
The various low-power modes operate as follows:

IDLE Mode: This mode is exited by any enabled interrupt or an XNMI that is recognized by
the processor. The LPM block performs no tasks during this mode as long as the
LPMCR0(LPM) bits are set to 0,0.
STANDBY Mode: Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY
mode. The user must select which signal(s) will wake the device in the
GPIOLPMSEL register. The selected signal(s) are also qualified by the OSCCLK
before waking the device. The number of OSCCLKs is specified in the LPMCR0
register.
HALT Mode: Only the XRS and any GPIO port A signal (GPIO[31:0]) can wake the device
from HALT mode. The user selects the signal in the GPIOLPMSEL register.
NOTE
The low-power modes do not affect the state of the output pins (PWM pins included).
They will be in whatever state the code left them in when the IDLE instruction was
executed. See the TMS320x280x, 2801x, 2804x System Control and Interrupts Reference
Guide (literature number SPRU712) for more details.

TMS320F28335, TMS320F28334, TMS320F28332

4 Peripherals
The integrated peripherals of the 2833x are described in the following subsections:
• Three 32-bit CPU-Timers
• Up to six enhanced PWM modules (ePWM1, ePWM2, ePWM3, ePWM4, ePWM5, ePWM6)
• Up to six enhanced capture modules (eCAP1, eCAP2, eCAP3, eCAP4, eCAP5, eCAP6)
• Up to two enhanced QEP modules (eQEP1, eQEP2)
• Enhanced analog-to-digital converter (ADC) module
• Up to two enhanced controller area network (eCAN) modules (eCAN-A, eCAN-B)
• Up to three serial communications interface modules (SCI-A, SCI-B, SCI-C)
• One serial peripheral interface (SPI) module (SPI-A)
• Inter-integrated circuit module (I2C)
• Up to two multichannel buffered serial port (McBSP-A, McBSP-B) modules
PRODUCT PREVIEW
• Digital I/O and shared pin functions
52 Peripherals Submit Documentation Feedback

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4.1 DMA Overview

Features:
• 6 Channels with independent PIE interrupts
• Trigger Sources:
– ADC Sequencer 1 and Sequencer 2
– McBSP-A and McBSP-B transmit and receive logic
– XINT1-7 and XINT13
– CPU Timers
– Software
• Data Sources/Destinations:
– L4-L7 16k x 16 SARAM
– All XINTF zones
PRODUCT PREVIEW
– ADC Memory Bus mapped RESULT registers
– McBSP-A and McBSP-B transmit and receive buffers
• Word Size: 16-bit or 32-bit (McBSPs limited to 16-bit)
• Throughput: 4 cycles/word (5 cycles/word for McBSP reads)
Memory Bus
Dual Port
ADC
Control
ADC
0/1-wait
Peripheral Bus
Registers
(16 x 16)
DMA Event Triggers
CPU Timers
Interrupts
McBSP-B
McBSP-A
DMA
External
Dual Port
L4 Type 0
XINTF
CPU
SARAM
(4K x 16) 6-Ch
L5
Dual Ports
SARAM
DINT[CH1:CH6]
(4K x 16)
L6
SARAM
SYSCLKOUT
(4K x 16)
L7
SARAM
(4K x 16) PIE
DMA Bus
Figure 4-1. DMA Functional Block Diagram
Submit Documentation Feedback Peripherals 53

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4.2 32-Bit CPU-Timers 0/1/2

There are three 32-bit CPU-timers on the 2833x devices (CPU-TIMER0/1/2).
CPU-Timer 1 is reserved for TI system functions and Timer 2 is reserved for DSP/BIOS™. CPU-Timer 0
can be used in user applications. These timers are different from the timers that are present in the ePWM
modules.
NOTE
NOTE: If the application is not using DSP/BIOS, then CPU-Timer 2 can be used in the
application.
Reset
PRODUCT PREVIEW
Timer Reload
16-Bit Timer Divide-Down

32-Bit Timer Period
TDDRH:TDDR
PRDH:PRD
16-Bit Prescale Counter

SYSCLKOUT
PSCH:PSC
TCR.4 32-Bit Counter
(Timer Start Status) Borrow TIMH:TIM
Borrow
TINT
Figure 4-2. CPU-Timers
In the 2833x devices, the timer interrupt signals (TINT0, TINT1, TINT2) are connected as shown in
Figure 4-3.
INT1 TINT0
to PIE CPU-TIMER 0
INT12
C28x
TINT1 CPU-TIMER 1
INT13 (Reserved for TI
system functions)
XINT13
TINT2 CPU-TIMER 2
INT14 (Reserved for
DSP/BIOS)
A. The timer registers are connected to the memory bus of the C28x processor.
B. The timing of the timers is synchronized to SYSCLKOUT of the processor clock.
C. While TIMER1 is reserved, INT13 is not reserved and the user can use XINT13 connected to INT13.
Figure 4-3. CPU-Timer Interrupt Signals and Output Signal

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The general operation of the timer is as follows: The 32-bit counter register "TIMH:TIM" is loaded with the
value in the period register "PRDH:PRD". The counter register decrements at the SYSCLKOUT rate of the
C28x. When the counter reaches 0, a timer interrupt output signal generates an interrupt pulse. The
registers listed in Table 4-1 are used to configure the timers. For more information, see the TMS320x280x,
2801x, 2804x System Control and Interrupts Reference Guide (literature number SPRU712).
Table 4-1. CPU-Timers 0, 1, 2 Configuration and Control Registers
NAME ADDRESS SIZE (x16) DESCRIPTION

TIMER0TIM 0x0C00 1 CPU-Timer 0, Counter Register
TIMER0TIMH 0x0C01 1 CPU-Timer 0, Counter Register High
TIMER0PRD 0x0C02 1 CPU-Timer 0, Period Register
TIMER0PRDH 0x0C03 1 CPU-Timer 0, Period Register High
TIMER0TCR 0x0C04 1 CPU-Timer 0, Control Register
PRODUCT PREVIEW
reserved 0x0C05 1
TIMER0TPR 0x0C06 1 CPU-Timer 0, Prescale Register
TIMER0TPRH 0x0C07 1 CPU-Timer 0, Prescale Register High
TIMER1PRD 0x0C0A 1 CPU-Timer 1, Period Register
TIMER1PRDH 0x0C0B 1 CPU-Timer 1, Period Register High
TIMER1TCR 0x0C0C 1 CPU-Timer 1, Control Register
reserved 0x0C0D 1
TIMER1TPR 0x0C0E 1 CPU-Timer 1, Prescale Register
TIMER1TPRH 0x0C0F 1 CPU-Timer 1, Prescale Register High
TIMER2PRD 0x0C12 1 CPU-Timer 2, Period Register
TIMER2PRDH 0x0C13 1 CPU-Timer 2, Period Register High
TIMER2TCR 0x0C14 1 CPU-Timer 2, Control Register
reserved 0x0C15 1
TIMER2TPR 0x0C16 1 CPU-Timer 2, Prescale Register
TIMER2TPRH 0x0C17 1 CPU-Timer 2, Prescale Register High
0x0C18
reserved 40
0x0C3F

TMS320F28335, TMS320F28334, TMS320F28332

4.3 Enhanced PWM Modules (ePWM1/2/3/4/5/6)

The 2833x device contains up to six enhanced PWM Modules (ePWM). Figure 4-4 shows a block diagram
of multiple ePWM modules. Figure 4-4 shows the signal interconnections with the ePWM. See the
TMS320x280x Enhanced Pulse Width Modulator (ePWM) Module Reference Guide (literature number
SPRU791) for more details.
EPWM1SYNCI
EPWM1SYNCI
EPWM1INT
EPWM1A
EPWM1SOC
ePWM1 module EPWM1B
PRODUCT PREVIEW
TZ1 to TZ6
to eCAP1 EPWM1SYNCO
. EPWM1SYNCO
module
(sync in)
EPWM2SYNCI
EPWM2INT EPWM2A
PIE EPWM2SOC GPIO

ePWM2 module EPWM2B
MUX
TZ1 to TZ6
EPWM2SYNCO
EPWMxSYNCI
EPWMxINT EPWMxA
EPWMxSOC
ePWMx module EPWMxB
TZ1 to TZ6
EPWMxSYNCO
ADCSOCx0
Peripheral Bus
ADC
Figure 4-4. Multiple PWM Modules in a 2833x System
Table 4-2 shows the complete ePWM register set per module.

TMS320F28335, TMS320F28334, TMS320F28332
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Table 4-2. ePWM Control and Status Registers
SIZE (x16) /
NAME EPWM1 EPWM2 EPWM3 EPWM4 EPWM5 EPWM6 DESCRIPTION
#SHADOW
TBCTL 0x6800 0x6840 0x6880 0x68C0 0x6900 0x6940 1/0 Time Base Control Register
TBSTS 0x6801 0x6841 0x6881 0x68C1 0x6901 0x6941 1/0 Time Base Status Register
TBPHSHR 0x6802 0x6842 0x6882 0x68C2 N/A N/A 1/0 Time Base Phase HRPWM Register
TBPHS 0x6803 0x6843 0x6883 0x68C3 0x6903 0x6943 1/0 Time Base Phase Register
TBCTR 0x6804 0x6844 0x6884 0x68C4 0x6904 0x6944 1/0 Time Base Counter Register
TBPRD 0x6805 0x6845 0x6885 0x68C5 0x6905 0x6945 1/1 Time Base Period Register Set
CMPCTL 0x6807 0x6847 0x6887 0x68C7 0x6907 0x6947 1/0 Counter Compare Control Register
CMPAHR 0x6808 0x6848 0x6888 0x68C8 N/A N/A 1/1 Time Base Compare A HRPWM Register
CMPA 0x6809 0x6849 0x6889 0x68C9 0x6909 0x6949 1/1 Counter Compare A Register Set
CMPB 0x680A 0x684A 0x688A 0x68CA 0x690A 0x694A 1/1 Counter Compare B Register Set
AQCTLA 0x680B 0x684B 0x688B 0x68CB 0x690B 0x694B 1/0 Action Qualifier Control Register For Output A
AQCTLB 0x680C 0x684C 0x688C 0x68CC 0x690C 0x694C 1/0 Action Qualifier Control Register For Output B
AQSFRC 0x680D 0x684D 0x688D 0x68CD 0x690D 0x694D 1/0 Action Qualifier Software Force Register
AQCSFRC 0x680E 0x684E 0x688E 0x68CE 0x690E 0x694E 1/1 Action Qualifier Continuous S/W Force Register Set
DBCTL 0x680F 0x684F 0x688F 0x68CF 0x690F 0x694F 1/1 Dead-Band Generator Control Register
DBRED 0x6810 0x6850 0x6890 0x68D0 0x6910 0x6950 1/0 Dead-Band Generator Rising Edge Delay Count Register
DBFED 0x6811 0x6851 0x6891 0x68D1 0x6911 0x6951 1/0 Dead-Band Generator Falling Edge Delay Count Register
TZSEL 0x6812 0x6852 0x6892 0x68D2 0x6912 0x6952 1/0 Trip Zone Select Register (1)
TZCTL 0x6814 0x6854 0x6894 0x68D4 0x6914 0x6954 1/0 Trip Zone Control Register (1)
TZEINT 0x6815 0x6855 0x6895 0x68D5 0x6915 0x6955 1/0 Trip Zone Enable Interrupt Register (1)
TZFLG 0x6816 0x6856 0x6896 0x68D6 0x6916 0x6956 1/0 Trip Zone Flag Register
TZCLR 0x6817 0x6857 0x6897 0x68D7 0x6917 0x6957 1/0 Trip Zone Clear Register (1)
TZFRC 0x6818 0x6858 0x6898 0x68D8 0x6918 0x6958 1/0 Trip Zone Force Register (1)
ETSEL 0x6819 0x6859 0x6899 0x68D9 0x6919 0x6959 1/0 Event Trigger Selection Register
ETPS 0x681A 0x685A 0x689A 0x68DA 0x691A 0x695A 1/0 Event Trigger Prescale Register
ETFLG 0x681B 0x685B 0x689B 0x68DB 0x691B 0x695B 1/0 Event Trigger Flag Register
ETCLR 0x681C 0x685C 0x689C 0x68DC 0x691C 0x695C 1/0 Event Trigger Clear Register
ETFRC 0x681D 0x685D 0x689D 0x68DD 0x691D 0x695D 1/0 Event Trigger Force Register
PCCTL 0x681E 0x685E 0x689E 0x68DE 0x691E 0x695E 1/0 PWM Chopper Control Register
HRCNFG 0x6820 0x6860 0x68A0 0x68E0 0x6920 0x6960 1/0 HRPWM Configuration Register (1)
(1) Registers that are EALLOW protected.

TMS320F28335, TMS320F28334, TMS320F28332

Time−base (TB)
Sync
TBPRD shadow (16) CTR=ZERO in/out
select EPWMxSYNCO
CTR=CMPB
TBPRD active (16) Mux
Disabled
CTR=PRD
TBCTL[SYNCOSEL]
TBCTL[CNTLDE]
Counter EPWMxSYNCI
up/down TBCTL[SWFSYNC]
(16 bit) (software forced sync)
CTR=ZERO
TBCNT
active (16) CTR_Dir
TBPHSHR (8)
16 8
PRODUCT PREVIEW
Phase CTR = PRD

TBPHS active (24) Event EPWMxINT
control CTR = ZERO trigger
CTR = CMPA and EPWMxSOCA
CTR = CMPB interrupt
(ET) EPWMxSOCB
Counter compare (CC) Action CTR_Dir
qualifier
CTR=CMPA (AQ)
CMPAHR (8)
16 8 HiRes PWM (HRPWM)
CMPA active (24)

EPWMA EPWMxAO
CMPA shadow (24)
CTR=CMPB Dead PWM Trip

band chopper zone
16 (DB) (PC) (TZ)
EPWMB EPWMxBO
CMPB active (16)
EPWMxTZINT
CMPB shadow (16) CTR = ZERO TZ1 to TZ6
Figure 4-5. ePWM Sub-Modules Showing Critical Internal Signal Interconnections
4.4 High-Resolution PWM (HRPWM)

The HRPWM module offers PWM resolution (time granularity) which is significantly better than what can
be achieved using conventionally derived digital PWM methods. The key points for the HRPWM module
are:
• Significantly extends the time resolution capabilities of conventionally derived digital PWM
• Typically used when effective PWM resolution falls below ~ 9-10 bits. This occurs at PWM frequencies
greater than ~200 KHz when using a CPU/System clock of 100 MHz.
• This capability can be utilized in both duty cycle and phase-shift control methods.
• Finer time granularity control or edge positioning is controlled via extensions to the Compare A and
Phase registers of the ePWM module.
• HRPWM capabilities are offered only on the A signal path of an ePWM module (i.e., on the EPWMxA
output). EPWMxB output has conventional PWM capabilities.

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4.5 Enhanced CAP Modules (eCAP1/2/3/4/5/6)

The 2833x device contains up to six enhanced capture (eCAP) modules. Figure 4-6 shows a functional
block diagram of a module. See the TMS320x280x Enhanced Capture (eCAP) Module Reference Guide
(literature number SPRU807) for more details.
CTRPHS
(phase register−32 bit) APWM mode
SYNC
SYNCIn
OVF CTR_OVF
TSCTR CTR [0−31]
SYNCOut PWM
(counter−32 bit) Delta−mode PRD [0−31] compare
RST
logic
CMP [0−31]
32
CTR [0−31] CTR=PRD
PRODUCT PREVIEW
CTR=CMP
32
PRD [0−31]
eCAPx
MODE SELECT
32 CAP1 LD1 Polarity
LD
(APRD active) select
APRD 32
shadow CMP [0−31]
32
32 CAP2 LD2 Polarity

LD
(ACMP active) select
Event Event
32 ACMP
qualifier
shadow Pre-scale
32 Polarity
CAP3 LD3 select
LD
(APRD shadow)
32 CAP4 LD4
LD Polarity
(ACMP shadow) select
4
Capture events 4
CEVT[1:4]
Interrupt Continuous /
to PIE Trigger Oneshot
and CTR_OVF Capture Control
Flag
CTR=PRD
control
CTR=CMP
Figure 4-6. eCAP Functional Block Diagram
The eCAP modules are clocked at the SYSCLKOUT rate.

TMS320F28335, TMS320F28334, TMS320F28332

The clock enable bits (ECAP1/2/3/4/5/6ENCLK) in the PCLKCR1 register are used to turn off the eCAP
modules individually (for low power operation). Upon reset, ECAP1ENCLK, ECAP2ENCLK,
ECAP3ENCLK, ECAP4ENCLK, ECAP5ENCLK, and ECAP6ENCLK are set to low, indicating that the
peripheral clock is off.
Table 4-3. eCAP Control and Status Registers
SIZE
NAME ECAP1 ECAP2 ECAP3 ECAP4 ECAP5 ECAP6 DESCRIPTION
(x16)
TSCTR 0x6A00 0x6A20 0x6A40 0x6A60 0x6A80 0x6AA0 2 Time-Stamp Counter
CTRPHS 0x6A02 0x6A22 0x6A42 0x6A62 0x6A82 0x6AA2 2 Counter Phase Offset Value
Register
CAP1 0x6A04 0x6A24 0x6A44 0x6A64 0x6A84 0x6AA4 2 Capture 1 Register
PRODUCT PREVIEW

CAP4 0x6A0A 0x6A2A 0x6A4A 0x6A6A 0x6A8A 0x6AAA 2 Capture 4 Register
Reserved 0x6A0C- 0x6A2C- 0x6A4C- 0x6A6C- 0x6A8C- 0x6AAC- 8 Reserved
0x6A12 0x6A32 0x6A52 0x6A72 0x6A92 0x6AB2
ECCTL1 0x6A14 0x6A34 0x6A54 0x6A74 0x6A94 0x6AB4 1 Capture Control Register 1
ECCTL2 0x6A15 0x6A35 0x6A55 0x6A75 0x6A95 0x6AB5 1 Capture Control Register 2
ECEINT 0x6A16 0x6A36 0x6A56 0x6A76 0x6A96 0x6AB6 1 Capture Interrupt Enable Register
ECFLG 0x6A17 0x6A37 0x6A57 0x6A77 0x6A97 0x6AB7 1 Capture Interrupt Flag Register
ECCLR 0x6A18 0x6A38 0x6A58 0x6A78 0x6A98 0x6AB8 1 Capture Interrupt Clear Register
ECFRC 0x6A19 0x6A39 0x6A59 0x6A79 0x6A99 0x6AB9 1 Capture Interrupt Force Register
Reserved 0x6A1A- 0x6A3A- 0x6A5A- 0x6A7A- 0x6A9A- 0x6ABA- 6 Reserved
0x6A1F 0x6A3F 0x6A5F 0x6A7F 0x6A9F 0x6ABC

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4.6 Enhanced QEP Modules (eQEP1/2)

The 2833x device contains up to two enhanced quadrature encoder (eQEP) modules. See the
TMS320x280x Enhanced Quadrature Encoder (eQEP) Module Reference Guide (literature number
SPRU790) for more details.
System
control registers
To CPU
EQEPxENCLK
SYSCLKOUT
Data bus
PRODUCT PREVIEW
QCPRD
QCAPCTL QCTMR
16 16
16
Quadrature
capture unit
QCTMRLAT (QCAP)
QCPRDLAT
Registers QUTMR QWDTMR

used by QUPRD QWDPRD
multiple units
32 16
QEPCTL
QEPSTS UTOUT
UTIME QWDOG QDECCTL
QFLG
16
WDTOUT
EQEPxAIN
EQEPxINT QCLK EQEPxA/XCLK
PIE EQEPxBIN
QDIR
16 EQEPxIIN
Position counter/ QI EQEPxB/XDIR
Quadrature EQEPxIOUT
control unit QS decoder GPIO
(PCCU) EQEPxIOE MUX
QPOSLAT PHE (QDU) EQEPxI
EQEPxSIN
QPOSSLAT PCSOUT
EQEPxSOUT
QPOSILAT EQEPxS
EQEPxSOE
32 32 16
QPOSCNT QPOSCMP QEINT

QPOSINIT QFRC
QPOSMAX QCLR
QPOSCTL
Enhanced QEP (eQEP) peripheral
Figure 4-7. eQEP Functional Block Diagram

TMS320F28335, TMS320F28334, TMS320F28332

Table 4-4. eQEP Control and Status Registers
EQEP1
EQEP1 EQEP2
NAME SIZE(x16)/ REGISTER DESCRIPTION
ADDRESS ADDRESS
#SHADOW
QPOSCNT 0x6B00 0x6B40 2/0 eQEP Position Counter
QPOSINIT 0x6B02 0x6B42 2/0 eQEP Initialization Position Count
QPOSMAX 0x6B04 0x6B44 2/0 eQEP Maximum Position Count
QPOSCMP 0x6B06 0x6B46 2/1 eQEP Position-compare
QPOSILAT 0x6B08 0x6B48 2/0 eQEP Index Position Latch
QPOSSLAT 0x6B0A 0x6B4A 2/0 eQEP Strobe Position Latch
QPOSLAT 0x6B0C 0x6B4C 2/0 eQEP Position Latch
QUTMR 0x6B0E 0x6B4E 2/0 eQEP Unit Timer
QUPRD 0x6B10 0x6B50 2/0 eQEP Unit Period Register
PRODUCT PREVIEW
QWDTMR 0x6B12 0x6B52 1/0 eQEP Watchdog Timer

QWDPRD 0x6B13 0x6B53 1/0 eQEP Watchdog Period Register
QDECCTL 0x6B14 0x6B54 1/0 eQEP Decoder Control Register
QEPCTL 0x6B15 0x6B55 1/0 eQEP Control Register
QCAPCTL 0x6B16 0x6B56 1/0 eQEP Capture Control Register
QPOSCTL 0x6B17 0x6B57 1/0 eQEP Position-compare Control Register
QEINT 0x6B18 0x6B58 1/0 eQEP Interrupt Enable Register
QFLG 0x6B19 0x6B59 1/0 eQEP Interrupt Flag Register
QCLR 0x6B1A 0x6B5A 1/0 eQEP Interrupt Clear Register
QFRC 0x6B1B 0x6B5B 1/0 eQEP Interrupt Force Register
QEPSTS 0x6B1C 0x6B5C 1/0 eQEP Status Register
QCTMR 0x6B1D 0x6B5D 1/0 eQEP Capture Timer
QCPRD 0x6B1E 0x6B5E 1/0 eQEP Capture Period Register
QCTMRLAT 0x6B1F 0x6B5F 1/0 eQEP Capture Timer Latch
QCPRDLAT 0x6B20 0x6B60 1/0 eQEP Capture Period Latch
Reserved 0x6B21- 0x6B61- 31/0
0x6B3F 0x6B7F

TMS320F28335, TMS320F28334, TMS320F28332
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4.7 Enhanced Analog-to-Digital Converter (ADC) Module

A simplified functional block diagram of the ADC module is shown in Figure 4-8. The ADC module
consists of a 12-bit ADC with a built-in sample-and-hold (S/H) circuit. Functions of the ADC module
include:
• 12-bit ADC core with built-in S/H
• Analog input: 0.0 V to 3.0 V (Voltages above 3.0 V produce full-scale conversion results.)
• Fast conversion rate: Up to 80 ns at 25-MHz ADC clock, 12.5 MSPS
• 16-channel, MUXed inputs
• Autosequencing capability provides up to 16 "autoconversions" in a single session. Each conversion
can be programmed to select any 1 of 16 input channels
• Sequencer can be operated as two independent 8-state sequencers or as one large 16-state
sequencer (i.e., two cascaded 8-state sequencers)
• Sixteen result registers (individually addressable) to store conversion values
PRODUCT PREVIEW
– The digital value of the input analog voltage is derived by:
Digital Value + 0, when input ≤ 0 V
Input Analog Voltage * ADCLO

Digital Value + 4096 when 0 V < input < 3 V
3
Digital Value + 4095, when input ≥ 3 V
A. All fractional values are truncated.
• Multiple triggers as sources for the start-of-conversion (SOC) sequence
– S/W - software immediate start
– ePWM start of conversion
– XINT2 ADC start of conversion
• Flexible interrupt control allows interrupt request on every end-of-sequence (EOS) or every other EOS.
• Sequencer can operate in "start/stop" mode, allowing multiple "time-sequenced triggers" to
synchronize conversions.
• SOCA and SOCB triggers can operate independently in dual-sequencer mode.
• Sample-and-hold (S/H) acquisition time window has separate prescale control.
The ADC module in the 2833x has been enhanced to provide flexible interface to ePWM peripherals. The
ADC interface is built around a fast, 12-bit ADC module with a fast conversion rate of up to 80 ns at
25-MHz ADC clock. The ADC module has 16 channels, configurable as two independent 8-channel
modules. The two independent 8-channel modules can be cascaded to form a 16-channel module.
Although there are multiple input channels and two sequencers, there is only one converter in the ADC
module. Figure 4-8 shows the block diagram of the ADC module.
The two 8-channel modules have the capability to autosequence a series of conversions, each module
has the choice of selecting any one of the respective eight channels available through an analog MUX. In
the cascaded mode, the autosequencer functions as a single 16-channel sequencer. On each sequencer,
once the conversion is complete, the selected channel value is stored in its respective RESULT register.
Autosequencing allows the system to convert the same channel multiple times, allowing the user to
perform oversampling algorithms. This gives increased resolution over traditional single-sampled
conversion results.

TMS320F28335, TMS320F28334, TMS320F28332

System High-Speed SYSCLKOUT

DSP
Control Block Prescaler
HALT HSPCLK
ADCENCLK
Analog Result Registers

MUX
ADCINA0 Result Reg 0 70A8h

Result Reg 1
S/H
ADCINA7
12-Bit Result Reg 7 70AFh
ADC
PRODUCT PREVIEW
Result Reg 8 70B0h

Module
ADCINB0
S/H
ADCINB7 Result Reg 15 70B7h
ADC Control Registers

S/W
S/W
EPWMSOCA SOC Sequencer 1 Sequencer 2 SOC
GPIO/XINT2 EPWMSOCB
_ADCSOC
Figure 4-8. Block Diagram of the ADC Module
To obtain the specified accuracy of the ADC, proper board layout is very critical. To the best extent
possible, traces leading to the ADCIN pins should not run in close proximity to the digital signal paths.
This is to minimize switching noise on the digital lines from getting coupled to the ADC inputs.
Furthermore, proper isolation techniques must be used to isolate the ADC module power pins ( VDD1A18,
VDD2A18 , VDDA2, VDDAIO ) from the digital supply.Figure 4-9 shows the ADC pin connections for the 2833x
devices.
NOTE
1. The ADC registers are accessed at the SYSCLKOUT rate. The internal timing of the
ADC module is controlled by the high-speed peripheral clock (HSPCLK).
2. The behavior of the ADC module based on the state of the ADCENCLK and HALT
signals is as follows:
– ADCENCLK: On reset, this signal will be low. While reset is active-low (XRS) the
clock to the register will still function. This is necessary to make sure all registers
and modes go into their default reset state. The analog module, however, will be
in a low-power inactive state. As soon as reset goes high, then the clock to the
registers will be disabled. When the user sets the ADCENCLK signal high, then
the clocks to the registers will be enabled and the analog module will be enabled.
There will be a certain time delay (ms range) before the ADC is stable and can be
used.
– HALT: This mode only affects the analog module. It does not affect the registers.
In this mode, the ADC module goes into low-power mode. This mode also will stop
the clock to the CPU, which will stop the HSPCLK; therefore, the ADC register
logic will be turned off indirectly.

TMS320F28335, TMS320F28334, TMS320F28332
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Figure 4-9 shows the ADC pin-biasing for internal reference and Figure 4-10 shows the ADC pin-biasing
for external reference.
ADC 16-Channel Analog Inputs ADCINA[7:0] Analog input 0−3 V with respect to ADCLO
ADCINB[7:0]
ADCLO Connect to analog ground
ADCREFIN Float or ground if internal reference is used
22 kW
ADC External Current Bias Resistor ADCRESEXT
2.2 mF (A)
ADC Reference Positive Output ADCREFP
2.2 mF (A) ADCREFP and ADCREFM should not
ADC Reference Medium Output ADCREFM be loaded by external circuitry
VDD1A18 ADC Analog Power Pin (1.8 V)
ADC Power
VSS1AGND ADC Analog Ground Pin
PRODUCT PREVIEW
VDDA2 ADC Analog Power Pin (3.3 V)
VSSA2 ADC Analog Ground Pin
ADC Analog and Reference I/O Power
VDDAIO ADC Analog Power Pin (3.3 V)
VSSAIO ADC Analog I/O Ground Pin
A. TAIYO YUDEN LMK212BJ225MG-T or equivalent

B. External decoupling capacitors are recommended on all power pins.
C. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance.
Figure 4-9. ADC Pin Connections With Internal Reference
ADC 16-Channel Analog Inputs ADCINA[7:0] Analog input 0−3 V with respect to ADCLO
ADCINB[7:0]
ADCLO Connect to Analog Ground
ADCREFIN Connect to 1.500, 1.024, or 2.048-V precision source (D)
22 kW
ADC External Current Bias Resistor ADCRESEXT
2.2 mF (A)
ADC Reference Positive Output ADCREFP
2.2 mF (A) ADCREFP and ADCREFM should not
ADC Reference Medium Output ADCREFM be loaded by external circuitry
ADC Analog Power
VDDA2 ADC Analog Power Pin (3.3 V)

VSSA2 ADC Analog Ground Pin
VDDAIO ADC Analog Power Pin (3.3 V)

ADC Analog and Reference I/O Power
VSSAIO ADC Analog I/O Ground Pin
A. TAIYO YUDEN LMK212BJ225MG-T or equivalent

B. External decoupling capacitors are recommended on all power pins.
C. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance.
D. External voltage on ADCREFIN is enabled by changing bits 15:14 in the ADC Reference Select register depending on
the voltage used on this pin. TI recommends TI part REF3020 or equivalent for 2.048-V generation. Overall gain
accuracy will be determined by accuracy of this voltage source.
Figure 4-10. ADC Pin Connections With External Reference

TMS320F28335, TMS320F28334, TMS320F28332

NOTE
The temperature rating of any recommended component must match the rating of the end
product.
4.7.1 ADC Connections if the ADC Is Not Used

It is recommended to keep the connections for the analog power pins, even if the ADC is not used.
Following is a summary of how the ADC pins should be connected, if the ADC is not used in an
application:
• VDD1A18/VDD2A18 – Connect to VDD
• VDDA2, VDDAIO – Connect to VDDIO
• VSS1AGND/VSS2AGND, VSSA2, VSSAIO – Connect to VSS
• ADCLO – Connect to VSS
PRODUCT PREVIEW
• ADCREFIN – Connect to VSS

• ADCREFP/ADCREFM – Connect a 100-nF cap to VSS
• ADCRESEXT – Connect a 20-kΩ resistor (very loose tolerance) to VSS.
• ADCINAn, ADCINBn - Connect to VSS
When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power
savings.
When the ADC module is used in an application, unused ADC input pins should be connected to analog
ground (VSS1AGND/VSS2AGND)
4.7.2 ADC Registers
The ADC operation is configured, controlled, and monitored by the registers listed in Table 4-5.
Table 4-5. ADC Registers (1)
NAME ADDRESS (1) ADDRESS (2) SIZE (x16) DESCRIPTION

ADCTRL1 0x7100 1 ADC Control Register 1
ADCMAXCONV 0x7102 1 ADC Maximum Conversion Channels Register
ADCCHSELSEQ1 0x7103 1 ADC Channel Select Sequencing Control Register 1
ADCASEQSR 0x7107 1 ADC Auto-Sequence Status Register
ADCRESULT0 0x7108 0x0B00 1 ADC Conversion Result Buffer Register 0
ADCRESULT2 0x710A 0x0B02 1 ADC Conversion Result Buffer Register 2
ADCRESULT3 0x710B 0x0B03 1 ADC Conversion Result Buffer Register 3
ADCRESULT4 0x710C 0x0B04 1 ADC Conversion Result Buffer Register 4
ADCRESULT5 0x710D 0x0B05 1 ADC Conversion Result Buffer Register 5
ADCRESULT6 0x710E 0x0B06 1 ADC Conversion Result Buffer Register 6
ADCRESULT7 0x710F 0x0B07 1 ADC Conversion Result Buffer Register 7
(1) The registers in this column are Peripheral Frame 2 Registers.

(2) The ADC result registers are dual mapped in the 2833x DSC. Locations in Peripheral Frame 2 (0x7108-0x7117) are 2 wait-states and
left justified. Locations in Peripheral frame 0 space (0x0B00-0x0B0F) are 0 wait sates and right justified. During high speed/continuous
conversion use of the ADC, use the 0 wait-state locations for fast transfer of ADC results to user memory.

TMS320F28335, TMS320F28334, TMS320F28332
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Table 4-5. ADC Registers (continued)

NAME ADDRESS (1) ADDRESS (2) SIZE (x16) DESCRIPTION
ADCRESULT10 0x7112 0x0B0A 1 ADC Conversion Result Buffer Register 10
ADCRESULT11 0x7113 0x0B0B 1 ADC Conversion Result Buffer Register 11
ADCRESULT12 0x7114 0x0B0C 1 ADC Conversion Result Buffer Register 12
ADCRESULT13 0x7115 0x0B0D 1 ADC Conversion Result Buffer Register 13
ADCRESULT14 0x7116 0x0B0E 1 ADC Conversion Result Buffer Register 14
ADCRESULT15 0x7117 0x0B0F 1 ADC Conversion Result Buffer Register 15
ADCST 0x7119 1 ADC Status Register
0x711A
Reserved 2
0x711B
ADCREFSEL 0x711C 1 ADC Reference Select Register
PRODUCT PREVIEW
ADCOFFTRIM 0x711D 1 ADC Offset Trim Register
0x711E
Reserved 2 ADC Status Register
0x711F

TMS320F28335, TMS320F28334, TMS320F28332

4.8 Multichannel Buffered Serial Port (McBSP) Module

The McBSP module has the following features:
• Compatible to McBSP in TMS320C54x™ /TMS320C55x™ DSC devices, except the DMA features
• Full–duplex communication
• Double–buffered data registers that allow a continuous data stream
• Independent framing and clocking for receive and transmit
• External shift clock generation or an internal programmable frequency shift clock
• A wide selection of data sizes including 8–, 12–, 16–, 20–, 24–, or 32–bits
• 8–bit data transfers with LSB or MSB first
• Programmable polarity for both frame synchronization and data clocks
• HIghly programmable internal clock and frame generation
• Support A–bis mode
PRODUCT PREVIEW
• Direct interface to industry–standard CODECs, Analog Interface Chips (AICs), and other serially
connected A/D and D/A devices
• Works with SPI–compatible devices
The following application interfaces can be supported on the McBSP:
• T1/E1 framers
• MVIP switching–compatible and ST–BUS–compliant devices including:
– MVIP framers
– H.100 framers
– SCSA framers
– IOM–2 compliant devices
– AC97–compliant devices (the necessary multiphase frame synchronization capability is provided.)
– IIS–compliant devices
CLKSRG
CLKG =
• McBSP clock rate = (1 + CLKGDIV ) where CLKSRG source could be LSPCLK, CLKX, or CLKR.
Serial port performance is limited by I/O buffer switching speed. Internal prescalers must be adjusted
such that the peripheral speed is less than the I/O buffer speed limit—20–MHz maximum.
Figure 4-11 shows the block diagram of the McBSP module.

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TX
MXINT Interrupt
Peripheral Write Bus
To CPU TX Interrupt Logic
McBSP Transmit 16 16
Interrupt Select Logic
DXR2 Transmit Buffer DXR1 Transmit Buffer

LSPCLK
McBSP Registers 16 FSX
and Control Logic 16
Compand Logic CLKX
XSR2
PRODUCT PREVIEW
XSR1 DX
RSR2 RSR1 DR
16 CLKR
16
Expand Logic
FSR
RBR2 Register RBR1 Register
16 16
McBSP
DRR2 Receive Buffer DRR1 Receive Buffer
McBSP Receive
16 16
Interrupt Select Logic
RX
MRINT RX Interrupt Logic Interrupt
Peripheral Read Bus
To CPU
Figure 4-11. McBSP Module
Table 4-6 provides a summary of the McBSP registers.

TMS320F28335, TMS320F28334, TMS320F28332

Table 4-6. McBSP Register Summary
NAME McBSP-A McBSP-B TYPE RESET VALUE DESCRIPTION

ADDRESS ADDRESS
DATA REGISTERS, RECEIVE, TRANSMIT
DRR2 0x5000 0x5040 R 0x0000 McBSP Data Receive Register 2
DRR1 0x5001 0x5041 R 0x0000 McBSP Data Receive Register 1
DXR2 0x5002 0x5042 W 0x0000 McBSP Data Transmit Register 2
DXR1 0x5003 0x5043 W 0x0000 McBSP Data Transmit Register 1
McBSP CONTROL REGISTERS
SPCR2 0x5004 0x5044 R/W 0x0000 McBSP Serial Port Control Register 2
SPCR1 0x5005 0x5045 R/W 0x0000 McBSP Serial Port Control Register 1
RCR2 0x5006 0x5046 R/W 0x0000 McBSP Receive Control Register 2
PRODUCT PREVIEW
RCR1 0x5007 0x5047 R/W 0x0000 McBSP Receive Control Register 1

XCR2 0x5008 0x5048 R/W 0x0000 McBSP Transmit Control Register 2
XCR1 0x5009 0x5049 R/W 0x0000 McBSP Transmit Control Register 1
SRGR2 0x500A 0x504A R/W 0x0000 McBSP Sample Rate Generator Register 2
SRGR1 0x500B 0x504B R/W 0x0000 McBSP Sample Rate Generator Register 1
MULTICHANNEL CONTROL REGISTERS
MCR2 0x500C 0x504C R/W 0x0000 McBSP Multichannel Register 2
MCR1 0x500D 0x504D R/W 0x0000 McBSP Multichannel Register 1
RCERA 0x500E 0x504E R/W 0x0000 McBSP Receive Channel Enable Register Partition A
RCERB 0x500F 0x504F R/W 0x0000 McBSP Receive Channel Enable Register Partition B
XCERA 0x5010 0x5050 R/W 0x0000 McBSP Transmit Channel Enable Register Partition A
XCERB 0x5011 0x5051 R/W 0x0000 McBSP Transmit Channel Enable Register Partition B
PCR 0x5012 0x5052 R/W 0x0000 McBSP Pin Control Register
RCERC 0x5013 0x5053 R/W 0x0000 McBSP Receive Channel Enable Register Partition C
RCERD 0x5014 0x5054 R/W 0x0000 McBSP Receive Channel Enable Register Partition D
XCERC 0x5015 0x5055 R/W 0x0000 McBSP Transmit Channel Enable Register Partition C
XCERD 0x5016 0x5056 R/W 0x0000 McBSP Transmit Channel Enable Register Partition D
RCERE 0x5017 0x5057 R/W 0x0000 McBSP Receive Channel Enable Register Partition E
RCERF 0x5018 0x5058 R/W 0x0000 McBSP Receive Channel Enable Register Partition F
XCERE 0x5019 0x5059 R/W 0x0000 McBSP Transmit Channel Enable Register Partition E
XCERF 0x501A 0x505A R/W 0x0000 McBSP Transmit Channel Enable Register Partition F
RCERG 0x501B 0x505B R/W 0x0000 McBSP Receive Channel Enable Register Partition G
RCERH 0x501C 0x505C R/W 0x0000 McBSP Receive Channel Enable Register Partition H
XCERG 0x501D 0x505D R/W 0x0000 McBSP Transmit Channel Enable Register Partition G
XCERH 0x501E 0x505E R/W 0x0000 McBSP Transmit Channel Enable Register Partition H
MFFINT 0x5023 0x5063 R/W 0x0000 McBSP Interrupt Enable Register
MFFST 0x5024 0x5064 R/W 0x0000 McBSP Pin Status Register

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4.9 Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
The CAN module has the following features:
• Fully compliant with CAN protocol, version 2.0B
• Supports data rates up to 1 Mbps
• Thirty-two mailboxes, each with the following properties:
– Configurable as receive or transmit
– Configurable with standard or extended identifier
– Has a programmable receive mask
– Supports data and remote frame
– Composed of 0 to 8 bytes of data
– Uses a 32-bit time stamp on receive and transmit message
– Protects against reception of new message
PRODUCT PREVIEW
– Holds the dynamically programmable priority of transmit message
– Employs a programmable interrupt scheme with two interrupt levels
– Employs a programmable alarm on transmission or reception time-out
• Low-power mode
• Programmable wake-up on bus activity
• Automatic reply to a remote request message
• Automatic retransmission of a frame in case of loss of arbitration or error
• 32-bit local network time counter synchronized by a specific message (communication in conjunction
with mailbox 16)
• Self-test mode
– Operates in a loopback mode receiving its own message. A "dummy" acknowledge is provided,
thereby eliminating the need for another node to provide the acknowledge bit.
NOTE
For a SYSCLKOUT of 100 MHz, the smallest bit rate possible is 15.625 kbps.
For a SYSCLKOUT of 150 MHz, the smallest bit rate possible is 23.4 kbps.

TMS320F28335, TMS320F28334, TMS320F28332

eCAN0INT eCAN1INT Controls Address Data
Enhanced CAN Controller

32
Message Controller
Mailbox RAM Memory Management

(512 Bytes) Unit eCAN Memory
(512 Bytes)
CPU Interface, Registers and Message
32-Message Mailbox Receive Control Unit, Objects Control
of 4 × 32-Bit Words 32 32
Timer Management Unit
PRODUCT PREVIEW
32
eCAN Protocol Kernel Receive Buffer
Transmit Buffer
Control Buffer
Status Buffer
SN65HVD23x
3.3-V CAN Transceiver
CAN Bus
Figure 4-12. eCAN Block Diagram and Interface Circuit
Table 4-7. 3.3-V eCAN Transceivers
SUPPLY LOW-POWER SLOPE

PART NUMBER VREF OTHER TA
VOLTAGE MODE CONTROL
SN65HVD230 3.3 V Standby Adjustable Yes – -40°C to 85°C
SN65HVD230Q 3.3 V Standby Adjustable Yes – -40°C to 125°C
SN65HVD231 3.3 V Sleep Adjustable Yes – -40°C to 85°C
SN65HVD231Q 3.3 V Sleep Adjustable Yes – -40°C to 125°C
SN65HVD232 3.3 V None None None – -40°C to 85°C
SN65HVD232Q 3.3 V None None None – -40°C to 125°C
SN65HVD233 3.3 V Standby Adjustable None Diagnostic -40°C to 125°C
Loopback
SN65HVD234 3.3 V Standby and Sleep Adjustable None – -40°C to 125°C
SN65HVD235 3.3 V Standby Adjustable None Autobaud -40°C to 125°C
Loopback

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eCAN-A Control and Status Registers
Mailbox Enable − CANME

Mailbox Direction − CANMD
Transmission Request Set − CANTRS
Transmission Request Reset − CANTRR
Transmission Acknowledge − CANTA
eCAN-A Memory (512 Bytes) Abort Acknowledge − CANAA
6000h Received Message Pending − CANRMP
Control and Status Registers
603Fh Received Message Lost − CANRML
6040h Local Acceptance Masks (LAM) Remote Frame Pending − CANRFP
607Fh (32 × 32-Bit RAM) Global Acceptance Mask − CANGAM
6080h Message Object Time Stamps (MOTS) Master Control − CANMC
(32 × 32-Bit RAM) Bit-Timing Configuration − CANBTC
PRODUCT PREVIEW
60BFh
60C0h Message Object Time-Out (MOTO) Error and Status − CANES
60FFh (32 × 32-Bit RAM) Transmit Error Counter − CANTEC
Receive Error Counter − CANREC
Global Interrupt Flag 0 − CANGIF0
Global Interrupt Mask − CANGIM
eCAN-A Memory RAM (512 Bytes) Global Interrupt Flag 1 − CANGIF1

Mailbox Interrupt Mask − CANMIM
6100h−6107h Mailbox 0
Mailbox Interrupt Level − CANMIL
6108h−610Fh Mailbox 1
Overwrite Protection Control − CANOPC
TX I/O Control − CANTIOC
RX I/O Control − CANRIOC
Time Stamp Counter − CANTSC
Time-Out Control − CANTOC
Time-Out Status − CANTOS
61E0h−61E7h Mailbox 28 Reserved

61E8h−61EFh Mailbox 29
61F0h−61F7h Mailbox 30
61F8h−61FFh Mailbox 31
Message Mailbox (16 Bytes)
61E8h−61E9h Message Identifier − MSGID

61EAh−61EBh Message Control − MSGCTRL
61ECh−61EDh Message Data Low − MDL
61EEh−61EFh Message Data High − MDH
Figure 4-13. eCAN-A Memory Map

TMS320F28335, TMS320F28334, TMS320F28332

eCAN-B Control and Status Registers
Mailbox Enable − CANME

Mailbox Direction − CANMD
Transmission Request Set − CANTRS
Transmission Request Reset − CANTRR
Transmission Acknowledge − CANTA
eCAN-B Memory (512 Bytes) Abort Acknowledge − CANAA
6200h Received Message Pending − CANRMP
Control and Status Registers
623Fh Received Message Lost − CANRML
6240h Local Acceptance Masks (LAM) Remote Frame Pending − CANRFP
627Fh (32 × 32-Bit RAM) Global Acceptance Mask − CANGAM
6280h Message Object Time Stamps (MOTS) Master Control − CANMC
(32 × 32-Bit RAM)
PRODUCT PREVIEW
62BFh Bit-Timing Configuration − CANBTC

62C0h Message Object Time-Out (MOTO) Error and Status − CANES
62FFh (32 × 32-Bit RAM) Transmit Error Counter − CANTEC
Receive Error Counter − CANREC
Global Interrupt Flag 0 − CANGIF0
Global Interrupt Mask − CANGIM
eCAN-B Memory RAM (512 Bytes) Global Interrupt Flag 1 − CANGIF1

Mailbox Interrupt Mask − CANMIM
Mailbox Interrupt Level − CANMIL
Overwrite Protection Control − CANOPC
TX I/O Control − CANTIOC
RX I/O Control − CANRIOC
Time Stamp Counter − CANTSC
Time-Out Control − CANTOC
Time-Out Status − CANTOS
63E0h−63E7h Mailbox 28 Reserved

63E8h−63EFh Mailbox 29
63F0h−63F7h Mailbox 30
63F8h−63FFh Mailbox 31
Message Mailbox (16 Bytes)
63E8h−63E9h Message Identifier − MSGID

63EAh−63EBh Message Control − MSGCTRL
63ECh−63EDh Message Data Low − MDL
63EEh−63EFh Message Data High − MDH
Figure 4-14. eCAN-B Memory Map
The CAN registers listed in Table 4-8 are used by the CPU to configure and control the CAN controller
and the message objects. eCAN control registers only support 32-bit read/write operations. Mailbox RAM
can be accessed as 16 bits or 32 bits. 32-bit accesses are aligned to an even boundary.

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Table 4-8. CAN Register Map (1)
ECAN-A ECAN-B SIZE

REGISTER NAME DESCRIPTION
ADDRESS ADDRESS (x32)
CANME 0x6000 0x6200 1 Mailbox enable
CANMD 0x6002 0x6202 1 Mailbox direction
CANTRS 0x6004 0x6204 1 Transmit request set
CANTRR 0x6006 0x6206 1 Transmit request reset
CANTA 0x6008 0x6208 1 Transmission acknowledge
CANAA 0x600A 0x620A 1 Abort acknowledge
CANRMP 0x600C 0x620C 1 Receive message pending
CANRML 0x600E 0x620E 1 Receive message lost
CANRFP 0x6010 0x6210 1 Remote frame pending
PRODUCT PREVIEW
CANGAM 0x6012 0x6212 1 Global acceptance mask
CANMC 0x6014 0x6214 1 Master control
CANBTC 0x6016 0x6216 1 Bit-timing configuration
CANES 0x6018 0x6218 1 Error and status
CANTEC 0x601A 0x621A 1 Transmit error counter
CANREC 0x601C 0x621C 1 Receive error counter
CANGIF0 0x601E 0x621E 1 Global interrupt flag 0
CANGIM 0x6020 0x6220 1 Global interrupt mask
CANGIF1 0x6022 0x6222 1 Global interrupt flag 1
CANMIM 0x6024 0x6224 1 Mailbox interrupt mask
CANMIL 0x6026 0x6226 1 Mailbox interrupt level
CANOPC 0x6028 0x6228 1 Overwrite protection control
CANTIOC 0x602A 0x622A 1 TX I/O control
CANRIOC 0x602C 0x622C 1 RX I/O control
CANTSC 0x602E 0x622E 1 Time stamp counter (Reserved in SCC mode)
CANTOC 0x6030 0x6230 1 Time-out control (Reserved in SCC mode)
CANTOS 0x6032 0x6232 1 Time-out status (Reserved in SCC mode)
(1) These registers are mapped to Peripheral Frame 1.

TMS320F28335, TMS320F28334, TMS320F28332

4.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)

The 2833x devices include three serial communications interface (SCI) modules. The SCI modules
support digital communications between the CPU and other asynchronous peripherals that use the
standard non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each
has its own separate enable and interrupt bits. Both can be operated independently or simultaneously in
the full-duplex mode. To ensure data integrity, the SCI checks received data for break detection, parity,
overrun, and framing errors. The bit rate is programmable to over 65000 different speeds through a 16-bit
baud-select register.
Features of each SCI module include:
• Two external pins:
– SCITXD: SCI transmit-output pin
– SCIRXD: SCI receive-input pin
PRODUCT PREVIEW
NOTE: Both pins can be used as GPIO if not used for SCI.
– Baud rate programmable to 64K different rates:
Baud rate = LSPCLK

(BRR ) 1) * 8 when BRR ≠ 0
Baud rate = LSPCLK when BRR = 0

16
• Data-word format
– One start bit
– Data-word length programmable from one to eight bits
– Optional even/odd/no parity bit
– One or two stop bits
• Four error-detection flags: parity, overrun, framing, and break detection
• Two wake-up multiprocessor modes: idle-line and address bit
• Half- or full-duplex operation
• Double-buffered receive and transmit functions
• Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms
with status flags.
– Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX
EMPTY flag (transmitter-shift register is empty)
– Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag
(break condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
• Separate enable bits for transmitter and receiver interrupts (except BRKDT)
Max bit rate + 150 MHz + 9.375 106 bńs
• 16 (for 150-MHz devices)
Max bit rate + 100 MHz + 6.25 10 bńs 6
• 16 (for 100-MHz devices)
• NRZ (non-return-to-zero) format
• Ten SCI module control registers located in the control register frame beginning at address 7050h
NOTE
All registers in this module are 8-bit registers that are connected to Peripheral Frame 2.
When a register is accessed, the register data is in the lower byte (7-0), and the upper
byte (15-8) is read as zeros. Writing to the upper byte has no effect.
Enhanced features:
• Auto baud-detect hardware logic

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• 16-level transmit/receive FIFO

The SCI port operation is configured and controlled by the registers listed in Table 4-9, Table 4-10, and
Table 4-11.
Table 4-9. SCI-A Registers (1)

SCICCRA 0x7050 1 SCI-A Communications Control Register
SCICTL1A 0x7051 1 SCI-A Control Register 1
SCIHBAUDA 0x7052 1 SCI-A Baud Register, High Bits
SCILBAUDA 0x7053 1 SCI-A Baud Register, Low Bits
SCICTL2A 0x7054 1 SCI-A Control Register 2
SCIRXSTA 0x7055 1 SCI-A Receive Status Register
PRODUCT PREVIEW
SCIRXEMUA 0x7056 1 SCI-A Receive Emulation Data Buffer Register
SCIRXBUFA 0x7057 1 SCI-A Receive Data Buffer Register
SCITXBUFA 0x7059 1 SCI-A Transmit Data Buffer Register
SCIFFTXA (2) 0x705A 1 SCI-A FIFO Transmit Register
SCIFFRXA (2) 0x705B 1 SCI-A FIFO Receive Register
SCIFFCTA (2) 0x705C 1 SCI-A FIFO Control Register
SCIPRIA 0x705F 1 SCI-A Priority Control Register
(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.
(2) These registers are new registers for the FIFO mode.
Table 4-10. SCI-B Registers (1) (2)

SCICCRB 0x7750 1 SCI-B Communications Control Register
SCICTL1B 0x7751 1 SCI-B Control Register 1
SCIHBAUDB 0x7752 1 SCI-B Baud Register, High Bits
SCILBAUDB 0x7753 1 SCI-B Baud Register, Low Bits
SCICTL2B 0x7754 1 SCI-B Control Register 2
SCIRXSTB 0x7755 1 SCI-B Receive Status Register
SCIRXEMUB 0x7756 1 SCI-B Receive Emulation Data Buffer Register
SCIRXBUFB 0x7757 1 SCI-B Receive Data Buffer Register
SCITXBUFB 0x7759 1 SCI-B Transmit Data Buffer Register
SCIFFTXB (2) 0x775A 1 SCI-B FIFO Transmit Register
SCIFFRXB (2) 0x775B 1 SCI-B FIFO Receive Register
SCIFFCTB (2) 0x775C 1 SCI-B FIFO Control Register
SCIPRIB 0x775F 1 SCI-B Priority Control Register
(1) Registers in this table are mapped to peripheral bus 16 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.

TMS320F28335, TMS320F28334, TMS320F28332

Table 4-11. SCI-C Registers (1) (2)

SCICCRC 0x7770 1 SCI-C Communications Control Register
SCICTL1C 0x7771 1 SCI-C Control Register 1
SCIHBAUDC 0x7772 1 SCI-C Baud Register, High Bits
SCILBAUDC 0x7773 1 SCI-C Baud Register, Low Bits
SCICTL2C 0x7774 1 SCI-C Control Register 2
SCIRXSTC 0x7775 1 SCI-C Receive Status Register
SCIRXEMUC 0x7776 1 SCI-C Receive Emulation Data Buffer Register
SCIRXBUFC 0x7777 1 SCI-C Receive Data Buffer Register
SCITXBUFC 0x7779 1 SCI-C Transmit Data Buffer Register
SCIFFTXC (2) 0x777A 1 SCI-C FIFO Transmit Register
PRODUCT PREVIEW
SCIFFRXC (2) 0x777B 1 SCI-C FIFO Receive Register

SCIFFCTC (2) 0x777C 1 SCI-C FIFO Control Register
SCIPRC 0x777F 1 SCI-C Priority Control Register
(1) Registers in this table are mapped to peripheral bus 16 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.

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Figure 4-15 shows the SCI module block diagram.
SCICTL1.1
Frame Format and Mode SCITXD
SCITXD
TXSHF
Parity Register TXENA
TX EMPTY
Even/Odd Enable
8 SCICTL2.6
SCICCR.6 SCICCR.5
TXRDY TX INT ENA
Transmitter-Data
Buffer Register SCICTL2.7
TXWAKE SCICTL2.0
SCICTL1.3 8 TX FIFO
TX FIFO _0 Interrupts TXINT
1 TX Interrupt
TX FIFO _1
Logic
----- To CPU
TX FIFO _15
WUT SCITXBUF.7-0 SCI TX Interrupt select logic
TX FIFO registers
PRODUCT PREVIEW
SCIFFENA AutoBaud Detect logic
SCIFFTX.14
SCIHBAUD. 15 - 8
SCIRXD
Baud Rate RXSHF
Register SCIRXD
MSbyte
Register RXWAKE
LSPCLK SCIRXST.1
SCILBAUD. 7 - 0 RXENA
Baud Rate 8 SCICTL1.0

LSbyte SCICTL2.1
Register Receive Data
Buffer register
RXRDY RX/BK INT ENA
SCIRXBUF.7-0
SCIRXST.6
8
RX FIFO _15 BRKDT
----- SCIRXST.5
RX FIFO_1 RX FIFO
Interrupts
RX FIFO _0 RXINT
RX Interrupt
SCIRXBUF.7-0 Logic
RX FIFO registers To CPU
RXFFOVF
SCIRXST.7 SCIRXST.4 - 2
SCIFFRX.15
RX Error FE OE PE
RX Error
RX ERR INT ENA
SCI RX Interrupt select logic
SCICTL1.6
Figure 4-15. Serial Communications Interface (SCI) Module Block Diagram

TMS320F28335, TMS320F28334, TMS320F28332

4.11 Serial Peripheral Interface (SPI) Module (SPI-A)

The 2833x devices include the four-pin serial peripheral interface (SPI) module. One SPI module (SPI-A)
is available. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of
programmed length (one to sixteen bits) to be shifted into and out of the device at a programmable
bit-transfer rate. Normally, the SPI is used for communications between the DSC controller and external
peripherals or another processor. Typical applications include external I/O or peripheral expansion through
devices such as shift registers, display drivers, and ADCs. Multidevice communications are supported by
the master/slave operation of the SPI.
The SPI module features include:
• Four external pins:
– SPISOMI: SPI slave-output/master-input pin
– SPISIMO: SPI slave-input/master-output pin
PRODUCT PREVIEW
– SPISTE: SPI slave transmit-enable pin

– SPICLK: SPI serial-clock pin
NOTE: All four pins can be used as GPIO, if the SPI module is not used.
• Two operational modes: master and slave
Baud rate: 125 different programmable rates.
LSPCLK
Baud rate = when SPIBRR = 3 to 127
(SPIBRR ) 1)
Baud rate = LSPCLK when SPIBRR = 0,1, 2
4
• Data word length: one to sixteen data bits
• Four clocking schemes (controlled by clock polarity and clock phase bits) include:
– Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
– Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
• Simultaneous receive and transmit operation (transmit function can be disabled in software)
• Transmitter and receiver operations are accomplished through either interrupt-driven or polled
algorithms.
• Nine SPI module control registers: Located in control register frame beginning at address 7040h.
NOTE
All registers in this module are 16-bit registers that are connected to Peripheral Frame 2.
When a register is accessed, the register data is in the lower byte (7-0), and the upper
byte (15-8) is read as zeros. Writing to the upper byte has no effect.
Enhanced feature:
• 16-level transmit/receive FIFO
• Delayed transmit control
The SPI port operation is configured and controlled by the registers listed in Table 4-12.

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Table 4-12. SPI-A Registers
NAME ADDRESS SIZE (X16) DESCRIPTION (1)

SPICCR 0x7040 1 SPI-A Configuration Control Register
SPICTL 0x7041 1 SPI-A Operation Control Register
SPISTS 0x7042 1 SPI-A Status Register
SPIBRR 0x7044 1 SPI-A Baud Rate Register
SPIRXEMU 0x7046 1 SPI-A Receive Emulation Buffer Register
SPIRXBUF 0x7047 1 SPI-A Serial Input Buffer Register
SPITXBUF 0x7048 1 SPI-A Serial Output Buffer Register
SPIDAT 0x7049 1 SPI-A Serial Data Register
SPIFFTX 0x704A 1 SPI-A FIFO Transmit Register
SPIFFRX 0x704B 1 SPI-A FIFO Receive Register
PRODUCT PREVIEW
SPIFFCT 0x704C 1 SPI-A FIFO Control Register
SPIPRI 0x704F 1 SPI-A Priority Control Register
(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined
results.

TMS320F28335, TMS320F28334, TMS320F28332

Figure 4-16 is a block diagram of the SPI in slave mode.
SPIFFENA
Receiver Overrun
SPIFFTX.14 Overrun Flag INT ENA
RX FIFO registers SPISTS.7

SPICTL.4
SPIRXBUF
RX FIFO _0
RX FIFO _1
SPIINT/SPIRXINT
−−−−−
RX FIFO _15
RX FIFO Interrupt
RX Interrupt
Logic
16
SPIRXBUF SPIFFOVF FLAG

Buffer Register
SPIFFRX.15
PRODUCT PREVIEW
To CPU
TX FIFO registers
SPITXBUF
TX FIFO _15 TX Interrupt
−−−−− TX FIFO Interrupt Logic
TX FIFO _1
SPITXINT
TX FIFO _0
16 SPI INT
SPI INT FLAG ENA
SPITXBUF SPISTS.6
16 Buffer Register
SPICTL.0
16
M M
SPIDAT S
Data Register S SW1 SPISIMO
M M
SPIDAT.15 − 0
S
S SW2 SPISOMI
Talk
SPICTL.1
SPISTE(A)
State Control
Master/Slave
SPI Char SPICCR.3 − 0 SPICTL.2
S
3 2 1 0 SW3
Clock Clock
SPI Bit Rate M S Polarity Phase
LSPCLK SPIBRR.6 − 0 SPICCR.6 SPICTL.3 SPICLK
M
6 5 4 3 2 1 0
A. SPISTE is driven low by the master for a slave device.
Figure 4-16. SPI Module Block Diagram (Slave Mode)

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4.12 Inter-Integrated Circuit (I2C)

The 2833x device contains one I2C Serial Port. Figure 4-15 shows how the I2C peripheral module
interfaces within the 2833x device.
The I2C module has the following features:
• Compliance with the Philips Semiconductors I2C-bus specification (version 2.1):
– Support for 1-bit to 8-bit format transfers
– 7-bit and 10-bit addressing modes
– General call
– START byte mode
– Support for multiple master-transmitters and slave-receivers
– Support for multiple slave-transmitters and master-receivers
– Combined master transmit/receive and receive/transmit mode
PRODUCT PREVIEW
– Data transfer rate of from 10 kbps up to 400 kbps (Philips Fast-mode rate)
• One 16-bit receive FIFO and one 16-bit transmit FIFO
• One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the
following conditions:
– Transmit-data ready
– Receive-data ready
– Register-access ready
– No-acknowledgment received
– Arbitration lost
– Stop condition detected
– Addressed as slave
• An additional interrupt that can be used by the CPU when in FIFO mode
• Module enable/disable capability
• Free data format mode

TMS320F28335, TMS320F28334, TMS320F28332

System Control
Block C28X CPU
I2CAENCLK
SYSCLKOUT
Peripheral Bus
SYSRS
Control
Data[16]
SDAA Data[16]
PRODUCT PREVIEW
GPIO
I2C−A
MUX Addr[16]
SCLA
I2CINT1A
PIE
Block
I2CINT2A
A. The I2C registers are accessed at the SYSCLKOUT rate. The internal timing and signal waveforms of the I2C port are
also at the SYSCLKOUT rate.
B. The clock enable bit (I2CAENCLK) in the PCLKCRO register turns off the clock to the I2C port for low power
operation. Upon reset, I2CAENCLK is clear, which indicates the peripheral internal clocks are off.
Figure 4-17. I2C Peripheral Module Interfaces
The registers in Table 4-13 configure and control the I2C port operation.
Table 4-13. I2C-A Registers
NAME ADDRESS DESCRIPTION

I2COAR 0x7900 I2C own address register
I2CIER 0x7901 I2C interrupt enable register
I2CSTR 0x7902 I2C status register
I2CCLKL 0x7903 I2C clock low-time divider register
I2CCLKH 0x7904 I2C clock high-time divider register
I2CCNT 0x7905 I2C data count register
I2CDRR 0x7906 I2C data receive register
I2CSAR 0x7907 I2C slave address register
I2CDXR 0x7908 I2C data transmit register
I2CMDR 0x7909 I2C mode register
I2CISRC 0x790A I2C interrupt source register
I2CPSC 0x790C I2C prescaler register
I2CFFTX 0x7920 I2C FIFO transmit register
I2CFFRX 0x7921 I2C FIFO receive register
I2CRSR - I2C receive shift register (not accessible to the CPU)
I2CXSR - I2C transmit shift register (not accessible to the CPU)

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4.13 GPIO MUX

On the 2833x devices, the GPIO MUX can multiplex up to three independent peripheral signals on a
single GPIO pin in addition to providing individual pin bit-banging IO capability. The GPIO MUX block
diagram per pin is shown in Figure 4-18. Because of the open drain capabilities of the I2C pins, the GPIO
MUX block diagram for these pins differ. See the TMS320x280x, 2801x, 2804x System Control and
Interrupts Reference Guide (literature number SPRU712) for details.
GPIOXINT1SEL
GPIOLMPSEL GPIOXINT2SEL
LPMCR0 GPIOXNMISEL
Low Power External Interrupt PIE
PRODUCT PREVIEW
Modes Block MUX
Asynchronous
path GPxDAT (read)
GPxQSEL1/2
GPxCTRL
N/C
GPxPUD 00
01 Peripheral 1 Input
Input
Internal
Qualification
Pullup 10 Peripheral 2 Input
11 Peripheral 3 Input
Asynchronous path GPxTOGGLE
GPIOx pin GPxCLEAR
GPxSET
00 GPxDAT (latch)
01 Peripheral 1 Output
High Impedance
Output Control
00 GPxDIR (latch)
0 = Input, 1 = Output 01 Peripheral 1 Output Enable
10 Peripheral 2 Output Enable
XRS
11 Peripheral 3 Output Enable
= Default at Reset
GPxMUX1/2
A. x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register
depending on the particular GPIO pin selected.
B. GPxDAT latch/read are accessed at the same memory location.
Figure 4-18. GPIO MUX Block Diagram

TMS320F28335, TMS320F28334, TMS320F28332

The 2833x supports 88 GPIO pins. The GPIO control and data registers are mapped to Peripheral Frame
1 to enable 32-bit operations on the registers (along with 16-bit operations). Table 4-14 shows the GPIO
register mapping.
Table 4-14. GPIO Registers

GPIO CONTROL REGISTERS (EALLOW PROTECTED)
GPACTRL 0x6F80 2 GPIO A Control Register (GPIO0 to 31)
GPAQSEL1 0x6F82 2 GPIO A Qualifier Select 1 Register (GPIO0 to 15)
GPAQSEL2 0x6F84 2 GPIO A Qualifier Select 2 Register (GPIO16 to 31)
GPAMUX1 0x6F86 2 GPIO A MUX 1 Register (GPIO0 to 15)
GPAMUX2 0x6F88 2 GPIO A MUX 2 Register (GPIO16 to 31)
PRODUCT PREVIEW
GPADIR 0x6F8A 2 GPIO A Direction Register (GPIO0 to 31)

GPAPUD 0x6F8C 2 GPIO A Pull Up Disable Register (GPIO0 to 31)
0x6F8E
reserved 2
0x6F8F
GPBCTRL 0x6F90 2 GPIO B Control Register (GPIO32 to 35)
GPBQSEL1 0x6F92 2 GPIO B Qualifier Select 1 Register (GPIO32 to 35)
GPBQSEL2 0x6F94 2 reserved
GPBMUX1 0x6F96 2 GPIO B MUX 1 Register (GPIO32 to 35)
GPBMUX2 0x6F98 2 reserved
GPBDIR 0x6F9A 2 GPIO B Direction Register (GPIO32 to 35)
GPBPUD 0x6F9C 2 GPIO B Pull Up Disable Register (GPIO32 to 35)
0x6F9E
reserved 2 reserved
0x6F9F
0x6FA0
reserved 32
0x6FBF
GPIO DATA REGISTERS (NOT EALLOW PROTECTED)
GPADAT 0x6FC0 2 GPIO Data Register (GPIO0 to 31)
GPASET 0x6FC2 2 GPIO Data Set Register (GPIO0 to 31)
GPACLEAR 0x6FC4 2 GPIO Data Clear Register (GPIO0 to 31)
GPATOGGLE 0x6FC6 2 GPIO Data Toggle Register (GPIO0 to 31)
GPBDAT 0x6FC8 2 GPIO Data Register (GPIO32 to 35)
GPBSET 0x6FCA 2 GPIO Data Set Register (GPIO32 to 35)
GPBCLEAR 0x6FCC 2 GPIO Data Clear Register (GPIO32 to 35)
GPBTOGGLE 0x6FCE 2 GPIO Data Toggle Register (GPIO32 to 35)
0x6FD0
reserved 16
0x6FDF
GPIO INTERRUPT AND LOW POWER MODES SELECT REGISTERS (EALLOW PROTECTED)
GPIOXINT1SEL 0x6FE0 1 XINT1 GPIO Input Select Register (GPIO0 to 31)
GPIOXINT2SEL 0x6FE1 1 XINT2 GPIO Input Select Register (GPIO0 to 31)
GPIOXNMISEL 0x6FE2 1 XNMI GPIO Input Select Register (GPIO0 to 31)
0x6FE3
reserved 5
0x6FE7
GPIOLPMSEL 0x6FE8 2 LPM GPIO Select Register (GPIO0 to 31)
0x6FEA
reserved 22
0x6FFF

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Table 4-15. GPIO-A Mux Peripheral Selection Matrix
REGISTER BITS PERIPHERAL SELECTION

GPADIR GPAMUX1 GPIOx PER1 PER2 PER3
GPADAT GPAQSEL1 GPAMUX1=0,0 GPAMUX1 = 0, 1 GPAMUX1 = 1, 0 GPAMUX1 = 1, 1
GPASET
GPACLR
GPATOGGLE
Q 0 1, 0 GPIO0 (I/O) EPWM1A (O)
U 1 3, 2 GPIO1 (I/O) EPWM1B (O) ECAP6 (I/O) MFSRB (I/O)
A 2 5, 4 GPIO2 (I/O) EPWM2A (O)
L 3 7, 6 GPIO3 (I/O) EPWM2B (O) ECAP5 (I/O) MCLKRB (I/O)
P 4 9, 8 GPIO4 (I/O) EPWM3A (O)
R 5 11, 10 GPIO5 (I/O) EPWM3B (O) MFSRA (I/O) ECAP1 (I/O)
PRODUCT PREVIEW
D 6 13, 12 GPIO6 (I/O) EPWM4A (O) EPWMSYNCI (I) EPWMSYNCO (O)
0 7 15, 14 GPIO7 (I/O) EPWM4B (O) MCLKRA (I/O) ECAP2 (I/O)
Q 8 17, 16 GPIO8 (I/O) EPWM5A (O) CANTXB (O) ADCSOCAO (O)
U 9 19, 18 GPIO9 (I/O) EPWM5B (O) SCITXDB (O) ECAP3 (I/O)
A 10 21, 20 GPIO10 (I/O) EPWM6A (O) CANRXB (I) ADCSOCBO (O)
L 11 23, 22 GPIO11 (I/O) EPWM6B (O) SCIRXDB (I) ECAP4 (I/O)
P 12 25, 24 GPIO12 (I/O) TZ1 (I) CANTXB (O) MDXB (O)
R 13 27, 26 GPIO13 (I/O) TZ2 (I) CANRXB (I) MDRB (I)
D 14 29, 28 GPIO14 (I/O) TZ3 (I)/XHOLD (I) SCITXDB (O) MCLKXB (I/O)
1 15 31, 30 GPIO15 (I/O) TZ4 (I)/XHOLDA (O) SCIRXDB (I) MFSXB (I/O)
GPAMUX2
GPAQSEL2 GPAMUX2 =0, 0 GPAMUX2 = 0, 1 GPAMUX2 = 1, 0 GPAMUX2 = 1, 1
Q 16 1, 0 GPIO16 (I/O) SPISIMOA (I/O) CANTXB (O) TZ5 (I)
U 17 3, 2 GPIO17 (I/O) SPISOMIA (I/O) CANRXB (I) TZ6 (I)
A 18 5, 4 GPIO18 (I/O) SPICLKA (I/O) SCITXDB (O) CANRXA (I)
L 19 7, 6 GPIO19 (I/O) SPISTEA (I/O) SCIRXDB (I) CANTXA (O)
P 20 9, 8 GPIO20 (I/O) EQEP1A (I) MDXA (O) CANTXB (O)
R 21 11, 10 GPIO21 (I/O) EQEP1B (I) MDRA (I) CANRXB (I)
D 22 13, 12 GPIO22 (I/O) EQEP1S (I/O) MCLKXA (I/O) SCITXDB (O)
2 23 15, 14 GPIO23 (I/O) EQEP1I (I/O) MFSXA (I/O) SCIRXDB (I)
Q 24 17, 16 GPIO24 (I/O) ECAP1 (I/O) EQEP2A (I) MDXB (O)
U 25 19, 18 GPIO25 (I/O) ECAP2 (I/O) EQEP2B (I) MDRB (I)
A 26 21, 20 GPIO26 (I/O) ECAP3 (I/O) EQEP2I (I/O) MCLKXB (I/O)
L 27 23, 22 GPIO27 (I/O) ECAP4 (I/O) EQEP2S (I/O) MFSXB (I/O)
P 28 25, 24 GPIO28 (I/O) SCIRXDA (I) XZCS6 (O)
R 29 27, 26 GPIO29 (I/O) SCITXDA (O) XA19 (O)
D 30 29, 28 GPIO30 (I/O) CANRXA (I) XA18 (O)
3 31 31, 30 GPIO31 (I/O) CANTXA (O) XA17 (O)

TMS320F28335, TMS320F28334, TMS320F28332

Table 4-16. GPIO-B Mux Peripheral Selection Matrix

GPBDIR GPBMUX1 GPIOx PER1 PER2 PER3
GPBDAT GPBQSEL1 GPBMUX1=0, 0 GPBMUX1 = 0, 1 GPBMUX1 = 1, 0 GPBMUX1 = 1, 1
GPBSET
GPBCLR
GPBTOGGLE
Q 0 1, 0 GPIO32 (I/O) SDAA (I/OC) (1) EPWMSYNCI (I) ADCSOCAO (O)
U 1 3, 2 GPIO33 (I/O) SCLA (I/OC) (1) EPWMSYNCO (O) ADCSOCBO (O)
A 2 5, 4 GPIO34 (I/O) ECAP1 (I/O) XREADY (I)
L 3 7, 6 GPIO35 (I/O) SCITXDA (O) XR/W (O)
P 4 9, 8 GPIO36 (I/O) SCIRXDA (I) XZCS0 (O)
R 5 11, 10 GPIO37 (I/O) ECAP2 (I/O) XZCS7 (O)
PRODUCT PREVIEW
D 6 13, 12 GPIO38 (I/O) XWE0 (O)

0 7 15, 14 GPIO39 (I/O) XA16 (O)
Q 8 17, 16 GPIO40 (I/O) XA0/XWE1 (O)
U 9 19, 18 GPIO41 (I/O) XA1 (O)
A 10 21, 20 GPIO42 (I/O) XA2 (O)
L 11 23, 22 GPIO43 (I/O) XA3 (O)
P 12 25, 24 GPIO44 (I/O) XA4 (O)
R 13 27, 26 GPIO45 (I/O) XA5 (O)
D 14 29, 28 GPIO46 (I/O) XA6 (O)
1 15 31, 30 GPIO47 (I/O) XA7 (O)
GPBMUX2 GPBMUX2 =0, 0 GPBMUX2 = 0, 1 GPBMUX2 = 1, 0 GPBMUX2 = 1, 1
GPBQSEL2
Q 16 1, 0 GPIO48 (I/O) ECAP5 (I/O) XD31 (I/O)
U 17 3, 2 GPIO49 (I/O) ECAP6 (I/O) XD30 (I/O)
A 18 5, 4 GPIO50 (I/O) EQEP1A (I) XD29 (I/O)
L 19 7, 6 GPIO51 (I/O) EQEP1B (I) XD28 (I/O)
P 20 9, 8 GPIO52 (I/O) EQEP1S (I/O) XD27 (I/O)
R 21 11, 10 GPIO53 (I/O) EQEP1I (I/O) XD26 (I/O)
D 22 13, 12 GPIO54 (I/O) SPISIMOA (I/O) XD25 (I/O)
2 23 15, 14 GPIO55 (I/O) SPISOMIA (I/O) XD24 (I/O)
Q 24 17, 16 GPIO56 (I/O) SPICLKA (I/O) XD23 (I/O)
U 25 19, 18 GPIO57 (I/O) SPISTEA (I/O) XD22 (I/O)
A 26 21, 20 GPIO58 (I/O) MCLKRA (I/O) XD21 (I/O)
L 27 23, 22 GPIO59 (I/O) MFSRA (I/O) XD20 (I/O)
P 28 25, 24 GPIO60 (I/O) MCLKRB (I/O) XD19 (I/O)
R 29 27, 26 GPIO61 (I/O) MFSRB (I/O) XD18 (I/O)
D 30 29, 28 GPIO62 (I/O) SCIRXDC (I) XD17 (I/O)
3 31 31, 30 GPIO63 (I/O) SCITXDC (O) XD16 (I/O)
(1) Open drain

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Table 4-17. GPIO-C Mux Peripheral Selection Matrix

GPCDIR GPCMUX1 GPIOx or PER1 PER2 or PER3
GPCDAT GPCMUX1 = 0, 0 or 0, 1 GPCMUX1 = 1, 0 or 1, 1
GPCSET
GPCCLR
GPCTOGGLE
no 0 1, 0 GPIO64 (I/O) XD15 (I/O)
1 3, 2 GPIO65 (I/O) XD14 (I/O)
qu 2 5, 4 GPIO66 (I/O) XD13 (I/O)
a 3 7, 6 GPIO67 (I/O) XD12 (I/O)
l 4 9, 8 GPIO68 (I/O) XD11 (I/O)
5 11, 10 GPIO69 (I/O) XD10 (I/O)
PRODUCT PREVIEW
6 13, 12 GPIO70 (I/O) XD9 (I/O)
7 15, 14 GPIO71 (I/O) XD8 (I/O)
no 8 17, 16 GPIO72 (I/O) XD7 (I/O)
9 19, 18 GPIO73 (I/O) XD6 (I/O)
qu 10 21, 20 GPIO74 (I/O) XD5 (I/O)
a 11 23, 22 GPIO75 (I/O) XD4 (I/O)
l 12 25, 24 GPIO76 (I/O) XD3 (I/O)
13 27, 26 GPIO77 (I/O) XD2 (I/O)
14 29, 28 GPIO78 (I/O) XD1 (I/O)
15 31, 30 GPIO79 (I/O) XD0 (I/O)
GPCMUX2 GPCMUX2 = 0, 0 or 0, 1 GPCMUX2 = 1, 0 or 1, 1
no 16 1, 0 GPIO80 (I/O) XA8 (O)
17 3, 2 GPIO81 (I/O) XA9 (O)
qu 18 5, 4 GPIO82 (I/O) XA10 (O)
a 19 7, 6 GPIO83 (I/O) XA11 (O)
l 20 9, 8 GPIO84 (I/O) XA12 (O)
21 11, 10 GPIO85 (I/O) XA13 (O)
22 13, 12 GPIO86 (I/O) XA14 (O)
23 15, 14 GPIO87 (I/O) XA15 (O)
The user can select the type of input qualification for each GPIO pin via the GPxQSEL1/2 registers from
four choices:
• Synchronization To SYSCLKOUT Only (GPxQSEL1/2=0, 0): This is the default mode of all GPIO pins
at reset and it simply synchronizes the input signal to the system clock (SYSCLKOUT).
• Qualification Using Sampling Window (GPxQSEL1/2=0, 1 and 1, 0): In this mode the input signal, after
synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles before
the input is allowed to change.

TMS320F28335, TMS320F28334, TMS320F28332

Time between samples
GPyCTRL Reg
GPIOx SYNC Qualification Input Signal

Qualified By 3
or 6 Samples
GPxQSEL
SYSCLKOUT
PRODUCT PREVIEW
Number of Samples
Figure 4-19. Qualification Using Sampling Window

• The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in
groups of 8 signals. It specifies a multiple of SYSCLKOUT cycles for sampling the input signal. The
sampling window is either 3-samples or 6-samples wide and the output is only changed when ALL
samples are the same (all 0s or all 1s) as shown in Figure 4-18 (for 6 sample mode).
• No Synchronization (GPxQSEL1/2=1,1): This mode is used for peripherals where synchronization is
not required (synchronization is performed within the peripheral).
Due to the multi-level multiplexing that is required on the 2833x device, there may be cases where a
peripheral input signal can be mapped to more then one GPIO pin. Also, when an input signal is not
selected, the input signal will default to either a 0 or 1 state, depending on the peripheral.

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5 Device Support
Texas Instruments (TI) offers an extensive line of development tools for the C28x™ generation of DSCs,
including tools to evaluate the performance of the processors, generate code, develop algorithm
implementations, and fully integrate and debug software and hardware modules.
The following products support development of 2833x-based applications:
Software Development Tools
• Code Composer Studio™ Integrated Development Environment (IDE)
– C/C++ Compiler
– Code generation tools
– Assembler/Linker
– Cycle Accurate Simulator
• Application algorithms
PRODUCT PREVIEW
• Sample applications code
Hardware Development Tools
• 2833x development board
• Evaluation modules
• JTAG-based emulators - SPI515, XDS510PP, XDS510PP Plus, XDS510USB
• Universal 5-V dc power supply
• Documentation and cables
5.1 Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320™ DSC devices and support tools. Each TMS320™ DSP commercial family member has one of
three prefixes: TMX, TMP, or TMS (e.g., TMS320F28335). Texas Instruments recommends two of three
possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary
stages of product development from engineering prototypes (TMX/TMDX) through fully qualified
production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device's electrical
specifications
TMP Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification
TMS Fully qualified production device
Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Submit Documentation Feedback Device Support 91

TMS320F28335, TMS320F28334, TMS320F28332

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PBK) and temperature range (for example, A). Figure 5-1 provides a legend
for reading the complete device name for any family member.
TMS 320 F 28335 PGF A
PREFIX TEMPERATURE RANGE

TMX = experimental device A = −40°C to 85°C
TMP = prototype device
TMS = qualified device
PRODUCT PREVIEW
PACKAGE TYPE
DEVICE FAMILY ZHH = 179-ball MicroStar BGA (lead-free)
320 = TMS320 DSP Family PGF = 176-pin LQFP
DEVICE
TECHNOLOGY 28335
28334
F = Flash EEPROM (1.8-V/1.9-V Core/3.3-V I/O) 28332
BGA = Ball Grid Array

LQFP = Low-Profile Quad Flatpack
.ti.com/leadfree
Figure 5-1. Example of 2833x Device Nomenclature
92 Device Support Submit Documentation Feedback

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5.2 Documentation Support

Extensive documentation supports all of the TMS320™ DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
sheets and data manuals, with design specifications; and hardware and software applications. Useful
reference documentation includes:
CPU User's Guides
SPRU430 TMS320C28x DSP CPU and Instruction Set Reference Guide describes the central
processing unit (CPU) and the assembly language instructions of the TMS320C28x
fixed-point digital signal processors (DSPs). It also describes emulation features available on
these DSPs.
SPRUEO2 TMS320C28x Floating Point Unit and Instruction Set Reference Guide describes the
floating-point unit and includes the instructions for the FPU.
PRODUCT PREVIEW
Peripheral Guides
SPRU566 TMS320x28xx, 28xxx Peripheral Reference Guide describes the peripheral reference guides
of the 28x digital signal processors (DSPs).
SPRU716 TMS320x280x, 2801x, 2804x Analog-to-Digital Converter (ADC) Reference Guide describes
how to configure and use the on-chip ADC module, which is a 12-bit pipelined ADC.
SPRU791 TMS320x28xx, 28xxx Enhanced Pulse Width Modulator (ePWM) Module Reference Guide
describes the main areas of the enhanced pulse width modulator that include digital motor
control, switch mode power supply control, UPS (uninterruptible power supplies), and other
forms of power conversion
SPRU924 TMS320x28xx, 28xxx High-Resolution Pulse Width Modulator (HRPWM) describes the
operation of the high-resolution extension to the pulse width modulator (HRPWM)
SPRU807 TMS320x28xx, 28xxx Enhanced Capture (eCAP) Module Reference Guide describes the
enhanced capture module. It includes the module description and registers.
SPRU790 TMS320x28xx, 28xxx Enhanced Quadrature Encoder Pulse (eQEP) Reference Guide
describes the eQEP module, which is used for interfacing with a linear or rotary incremental
encoder to get position, direction, and speed information from a rotating machine in high
performance motion and position control systems. It includes the module description and
registers
SPRU074 TMS320x28xx, 28xxx Enhanced Controller Area Network (eCAN) Reference Guide
describes the eCAN that uses established protocol to communicate serially with other
controllers in electrically noisy environments.
SPRU051 TMS320x28xx, 28xxx Serial Communication Interface (SCI) Reference Guide describes the
SCI, which is a two-wire asynchronous serial port, commonly known as a UART. The SCI
modules support digital communications between the CPU and other asynchronous
peripherals that use the standard non-return-to-zero (NRZ) format.
SPRU059 TMS320x28xx, 28xxx Serial Peripheral Interface (SPI) Reference Guide describes the SPI -
a high-speed synchronous serial input/output (I/O) port - that allows a serial bit stream of
programmed length (one to sixteen bits) to be shifted into and out of the device at a
programmed bit-transfer rate.
SPRU721 TMS320x28xx, 28xxx Inter-Integrated Circuit (I2C) Reference Guide describes the features
and operation of the inter-integrated circuit (I2C) module that is available on the
TMS320x280x digital signal processor (DSP).
Tools Guides
SPRU513 TMS320C28x Assembly Language Tools User's Guide describes the assembly language
tools (assembler and other tools used to develop assembly language code), assembler

TMS320F28335, TMS320F28334, TMS320F28332

directives, macros, common object file format, and symbolic debugging directives for the
TMS320C28x device.
SPRU514 TMS320C28x Optimizing C Compiler User's Guide describes the TMS320C28x™ C/C++
compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320
DSP assembly language source code for the TMS320C28x device.
SPRU608 The TMS320C28x Instruction Set Simulator Technical Overview describes the simulator,
available within the Code Composer Studio for TMS320C2000 IDE, that simulates the
instruction set of the C28x™ core.
SPRU625 TMS320C28x DSP/BIOS Application Programming Interface (API) Reference Guide
describes development using DSP/BIOS.
Application Reports
SPRAAM0 Getting Started With TMS320C28x™ Digital Signal Controllers is organized by development
PRODUCT PREVIEW
flow and functional areas to make your design effort as seamless as possible. Tips on
getting started with C28x™ DSP software and hardware development are provided to aid in
your initial design and debug efforts. Each section includes pointers to valuable information
including technical documentation, software, and tools for use in each phase of design.
SPRAAD5 Power Line Communication for Lighting Apps using BPSK w/ a Single DSP Controller
presents a complete implementation of a power line modem following CEA-709 protocol
using a single DSP.
SPRAA85 Programming TMS320x28xx and 28xxx Peripherals in C/C++ explores a hardware
abstraction layer implementation to make C/C++ coding easier on 28x DSPs. This method is
compared to traditional #define macros and topics of code efficiency and special case
registers are also addressed.
SPRA958 Running an Application from Internal Flash Memory on the TMS320F28xx DSP covers the
requirements needed to properly configure application software for execution from on-chip
flash memory. Requirements for both DSP/BIOS™ and non-DSP/BIOS projects are
presented. Example code projects are included.
SPRAA91 TMS320F280x DSC USB Connectivity Using TUSB3410 USB-to-UART Bridge Chip presents
hardware connections as well as software preparation and operation of the development
system using a simple communication echo program.
SPRAA58 TMS320x281x to TMS320x280x Migration Overview describes differences between the
Texas Instruments TMS320x281x and TMS320x280x DSPs to assist in application migration
from the 281x to the 280x. While the main focus of this document is migration from 281x to
280x, users considering migrating in the reverse direction (280x to 281x) will also find this
document useful.
SPRAAD8 TMS320280x and TMS320F2801x ADC Calibration describes a method for improving the
absolute accuracy of the 12-bit ADC found on the TMS320280x and TMS3202801x devices.
Inherent gain and offset errors affect the absolute accuracy of the ADC. The methods
described in this report can improve the absolute accuracy of the ADC to levels better than
0.5%. This application report has an option to download an example program that executes
from RAM on the F2808 EzDSP.
SPRAAI1 Using Enhanced Pulse Width Modulator (ePWM) Module for 0-100% Duty Cycle Control
provides a guide for the use of the ePWM module to provide 0% to 100% duty cycle control
and is applicable to the TMS320x280x family of processors.
SPRAA88 Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x presents a method
for utilizing the on-chip pulse width modulated (PWM) signal generators on the
TMS320F280x family of digital signal controllers as a digital-to-analog converter (DAC).
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SPRAAH1 Using the Enhanced Quadrature Encoder Pulse (eQEP) Module provides a guide for the use
of the eQEP module as a dedicated capture unit and is applicable to the TMS320x280x,
28xxx family of processors.
SPRA820 Online Stack Overflow Detection on the TMS320C28x DSP presents the methodology for
online stack overflow detection on the TMS320C28x™ DSP. C-source code is provided that
contains functions for implementing the overflow detection on both DSP/BIOS™ and
non-DSP/BIOS applications.
SPRA806 An Easy Way of Creating a C-callable Assembly Function for the TMS320C28x DSP
provides instructions and suggestions to configure the C compiler to assist with
understanding of parameter-passing conventions and environments expected by the C
compiler.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is
PRODUCT PREVIEW
published quarterly and distributed to update TMS320 DSP customers on product information.
Updated information on the TMS320 DSP controllers can be found on the worldwide web at:
http://www.ti.com.
To send comments regarding this data manual (literature number SPRS230), use the
comments@books.sc.ti.com email address, which is a repository for feedback. For questions and support,
contact the Product Information Center listed at the http://www.ti.com/sc/docs/pic/home.htm site.

TMS320F28335, TMS320F28334, TMS320F28332

6 Electrical Specifications
This section provides the absolute maximum ratings and the recommended operating conditions.
6.1 Absolute Maximum Ratings (1) (2)

Unless otherwise noted, the list of absolute maximum ratings are specified over operating temperature ranges.
Supply voltage range, VDDIO, VDD3VFL with respect to VSS - 0.3 V to 4.6 V
Supply voltage range, VDDA2, VDDAIO with respect to VSSA - 0.3 V to 4.6 V
Supply voltage range, VDD with respect to VSS - 0.3 V to 2.5 V
Supply voltage range, VDD1A18, VDD2A18 with respect to VSSA - 0.3 V to 2.5 V
Supply voltage range, VSSA2, VSSAIO, VSS1AGND, VSS2AGND with respect to VSS - 0.3 V to 0.3 V
Input voltage range, VIN - 0.3 V to 4.6 V
PRODUCT PREVIEW
Output voltage range, VO - 0.3 V to 4.6 V

Input clamp current, IIK (VIN < 0 or VIN > VDDIO) (3) ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDDIO) ± 20 mA
Operating ambient temperature ranges, TA: A version (4) - 40°C to 85°C
Junction temperature range, Tj (4) - 40°C to 150°C
Storage temperature range, Tstg (4) - 65°C to 150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.2 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) Continuous clamp current per pin is ± 2 mA. This includes the analog inputs which have an internal clamping circuit that clamps the
voltage to a diode drop above VDDA2 or below VSSA2.
(4) Long-term high-temperature storage and/or extended use at maximum temperature conditions may result in a reduction of overall device
life. For additional information, see IC Package Thermal Metrics Application Report (literature number SPRA953) and Reliability Data for
TMS320LF24x and TMS320F281x Devices Application Report (literature number SPRA963)
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6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Device supply voltage, I/O, VDDIO 3.2 3.3 3.4 V
Device supply voltage CPU, VDD 1.84 1.9 1.96 V
Supply ground, VSS, VSSIO 0 V
ADC supply voltage (3.3 V), VDDA2, VDDAIO 3.2 3.3 3.4 V
ADC supply voltage (1.8 V), VDD1A18, VDD2A18 1.84 1.9 1.96 V
Flash supply voltage, VDD3VFL 3.2 3.3 3.4 V
Device clock frequency (system clock), fSYSCLKOUT 150-MHz devices 2 150 MHz
100-MHz devices 2 100 MHz
High-level input voltage, VIH 2 VDDIO V
Low-level input voltage, VIL 0.8
PRODUCT PREVIEW
All I/Os except Group 2 -4 mA
High-level output source current, VOH = 2.4 V, IOH
Group 2 (1) -8
All I/Os except Group 2 4 mA
Low-level output sink current, VOL = VOL MAX, IOL
Group 2 (1) 8
Ambient temperature, TA A version -40 85
(1) Group 2 pins are as follows: GPIO28, GPIO29, GPIO30, GPIO31, TDO, XCLKOUT, EMU0, EMU1, XINTF pins, GPIO35-87, XRD.
6.3 Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOH = IOHMAX 2.4
VOH High-level output voltage V
IOH = 50 µA VDDIO - 0.2
VOL Low-level output voltage IOL = IOLMAX 0.4 V
Pin with pullup
VDDIO = 3.3 V, VIN = 0 V All I/Os (including XRS) -80 -140 -190
Input current enabled
IIL µA
(low level) Pin with pulldown
VDDIO = 3.3 V, VIN = 0 V ±2
enabled
Pin with pullup
VDDIO = 3.3 V, VIN = VDDIO ±2
enabled
Input current Pin with pulldown
IIH VDDIO = 3.3 V, VIN = VDDIO 28 50 80 µA
(high level) enabled
Pin with pulldown
VDDIO = 3.3 V, VIN = VDDIO 80 140 190
enabled
Output current, pullup or
IOZ VO = VDDIO or 0 V ±2 µA
pulldown disabled
CI Input capacitance 2 pF
Submit Documentation Feedback Electrical Specifications 97


OCTOBER 1994
PGF (S-PQFP-G176) PLASTIC QUAD FLATPACK
132 89
133 88
0,27
0,17 0,08 M
0,50
0,13 NOM
176 45
1 44
Gage Plane
21,50 SQ
24,20
SQ
23,80 0,25
26,20 0,05 MIN 0°−ā 7°
SQ
25,80
1,45 0,75
1,35 0,45
Seating Plane
1,60 MAX 0,08
4040134 / B 03/95
NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-136
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Digital Signal Controllers (DSCs)

Literature Number: SPRS439

PRODUCT PREVIEW information concerns products in the

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2 Contents Submit Documentation Feedback

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1 TMS320F28335, TMS320F28334, TMS320F28332 DSCs

(1) IEEE Standard 1149.1-1990 Standard Test Access Port and

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1.2 Getting Started

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Table 2-1. Hardware Features

2.1 Pin Assignments

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GPIO37/ECAP2/XZCS7 150 71 VDDIO

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GPIO14/ GPIO13/ GPIO15/ GPIO16/

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J VSS X2 VSS X1 XCLKIN J

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GPIO11/ GPIO12/ GPIO10/ GPIO9/

GPIO6/ GPIO5/ GPIO3/

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GPIO63/ GPIO61/ GPIO62/ GPIO60/

GPIO69/ GPIO66/ VSS VDD GPIO65/

GPIO40/ GPIO37/ GPIO34/

GPIO42/ VDDIO VDD GPIO78/ GPIO76/ GPIO72/

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2.2 Signal Descriptions

Table 2-2. Signal Descriptions

(1) I = Input, O = Output, Z = High impedance, OD = Open drain, ↑ = Pullup, ↓ = Pulldown

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Table 2-2. Signal Descriptions (continued)

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Table 2-2. Signal Descriptions (continued)