APPROVALS

STANDARD OPERATING PROCESS OWNER

PROCEDURE DARREN EVANS
PROPRIETARY NOTICE
PRINTED CIRCUIT BOARD
This material contains proprietary QUALITY REPRESENTATIVE
information. Any disclosure without prior, ACCEPTABILITY
written permission from Universal Avionics MIKE DRABEK
Systems Corporation is strictly prohibited. SOP-QA-08.12 REV 15

1. PURPOSE AND SCOPE

This document provides a reference and a standard for printed circuit board acceptability for
products manufactured by Universal Avionics Systems Corporation.
The acceptability criteria outlined in this document will be used to provide our board vendors
the level of quality expected by UASC. Furthermore, this document will be used as a quality
control tool to verify the level of quality being accepted into UASC stock.

2. RESPONSIBILITY
 The Area Supervisor or a designated individual will implement this procedure and
provide trained personnel.

3. DEFINITIONS
 None

4. PROCEDURE
This document is divided into the following subjects that are specific to UASC requirements:
 PANEL PLATING
 MARKING
 SOLDER MASK
 DIMENSIONAL CHARACTERISTICS
 CLEANLINESS
 TESTING
 X-OUTS
 FLAMMABILITY
 SOLDERABILITY
 SOLDER SAMPLES
 CERTIFICATE OF CONFORMANCE
 SERIALIZATION
 PACKAGING
 TEST COUPON

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 4.1. Panel Plating
 Copper plating on panel increases rigidity and reduces warpage.
ACCEPTANCE CRITERIA. Solid copper on all layers around perimeter and on webbing
shall not be removed except to meet .125 copper to edge distance requirements.
UASC’s panelized board drawings call for solid copper to be present on all layers. Many
times, the panel frame does not allow for the resins to flow during lamination causing the
frame to be much thicker than the board itself. Although the frame will be discarded
after the board is populated by UASC, the assembly process requires that the board and
panel thicknesses match as closely as possible. To achieve this, the outer layers should
be solid copper and all inner layers shall be cross hatched.

4.2. Marking
 Vendor Logo and Date Code. Vendor Logo or MIL Cage code and Date Code
identify the manufacturer of the PCB and the date of manufacture.

o ACCEPTANCE CRITERIA. Vendor Logo and Date Code shall be silkscreened

not plated and shall not be obscured by components. Date code shall not
exceed one year from date of delivery.
 Electrical Test Stamps. Electrical Test (ET) stamping on the PCB indicates that
testing operations are complete.

o ACCEPTANCE CRITERIA. Test stamp shall be placed on the PCB, not the
frame. If there is no room on the PCB for the marking, please notify UASC for a
deviation.

4.3. Solder Mask

 Mask Type. Mask type needs to be specified to control manufacturing processes.

o ACCEPTANCE CRITERIA. All circuit boards purchased by UASC shall be

manufactured as Solder Mask Over Bare Copper (SMOBC) with a green liquid
photoimageable solder mask with a matte or semi-gloss finish per IPC-SM-840
Class 3.

o Some fine pitch boards require the use of LDI soldermask. This is acceptable
and note that the material will be a higher gloss than the matte finish.
 Thickness. Thickness refers to the amount of solder mask that is covering the
circuit board.

o ACCEPTANCE CRITERIA. Minimum thickness of solder mask is 0.0007 and

Maximum thickness of solder mask is 0.001 inches over conductors.

4.4. Dimensional Characteristics and Tolerances

 Holes.

o ACCEPTANCE CRITERIA. All holes to be within .005 inches from their true
position.

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  Etching.

o ACCEPTANCE CRITERIA. Etch tolerance shall be +/- 20%. Etch tolerance

specified is measured deviation between etch board and UASC supplied master
Gerber data.
 Flatness.

o ACCEPTANCE CRITERIA. The board shall have no more than 0.70% bow or
twist when measured per IPC-TM-650, method 2.4.22.
 Co-planarity of pads. After HASL the surface of the pads need to be within a
certain level of variation.

o ACCEPTANCE CRITERIA. Average coplanarity of lands shall not deviate more

than .0006”.

4.5. Cleanliness
 ACCEPTANCE CRITERIA. When tested in accordance with IPC-TM-650, method
2.3.26, bare boards must measure 2.0 micrograms per square inch or less of sodium
chloride (NaCl) equivalent.

4.6. Testing and Inspection

Electrical test required using ASCII file to create netlist when supplied. If ASCII file is not
provided, use extracted Gerber data to create netlist. 100% Automatic Optical
Inspection (AOI) required on all layers.

4.7. X-Outs
 X-outs must be present on both sides on the non-conforming PCB.
 X-outs in PCB Panels are acceptable per the following:
 Boards per panel Max X-outs per panel
2 to 4 1
5 to 8 2
9 and more 3
Number of panels in each lot delivered with X-outs must be ≤ 10%.
 Package X-out panels separately by lot and identify packaging as containing X-out
panels.

4.8. Flammability
PCB raw materials must meet their respective UL flammability requirements (94V-0).

4.9. Solder Samples

Solder samples are used for engineering process development and solderability
evaluation. One solder sample PCB shall be supplied with each lot date code delivered

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4.10. Certificate of Compliance
A certificate of compliance certifies that the PCBs were manufactured in compliance with
this document and all applicable drawings and specifications.
 ACCEPTANCE CRITERIA. A Certificate of Compliance shall accompany each lot of
PCBs. A Certificate of Conformance must have the PCB part number, date code,
revision, manufacturer’s name and address and signature. If an IPC document is
specified, it must match the document specified on the board drawing. Reference
section 4.13 for details on the structural integrity certification requirements.

4.11. Serialization
PCB serialization is used to track cross-section reports from vendors.
 ACCEPTANCE CRITERIA. PCBs shall be serialized. Etching or stamping is
acceptable. Serialization should be made on PCB surface, not PCB frame unless
space does not permit. Serial numbers must be unique per panel, not per board.

4.12. Packaging
PCBs shall be individually packaged or vacuum sealed in bundles in ESD safe
packaging to avoid chaffing. Slip sheets can be used if boards are sealed in groups, not
individual. X-outs shall be packaged per paragraph 4.7.

4.13. Test Coupons

 Structural Integrity cross-section analysis reports are required to be delivered with
each shipment. Serial number information needs to be indicated on the paperwork
to ensure that all boards received have been examined per IPC-6012 or IPC-6013
class III acceptability standards.
 The potted cross-section samples shall be maintained at the supplier.

5. ASSOCIATED DOCUMENTS

Document Type Document Number Title

External IPC-TM-650 IPC Test Methods
External ANSI/J-STD-003 Solderability Tests for Printed Circuits
External IPC-SM-840 Qualification and Performance of Permanent Solder
Mask
External IPC-600 Acceptability of Printed Boards
External IPC-6011 Generic Performance Specification for Printed Boards
External IPC-6012 Qualification and Performance Specification for Rigid
Printed Boards
External IPC-6013 Qualification and Performance Specification for Flexible
Printed Boards
Form FRM-ADM-08.12 Supplier Deviation Request Form

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6. REVISION HISTORY

Date Revision Changes

5/26/2009 10 Convert MD-0001 to BMS format with NO Changes other than the format.
12/3/2009 11 Major update. Remove all IPC-600 Class III duplication.
2/24/2010 12 Clean-up errors from rev 11 release and add LDI mask note section 4.3.
7/23/2012 13 Changed Author / Owner
Clarified acceptance criteria in section 4.11.
Added Supplier Deviation Request form to section 5.
9/21/2015 14 Changes Author / Owner
Updated Section 4.2 (Test Stamp Requirements).
7/11/2018 15 Updated Section 4.3 to add “semi-gloss” soldermask to the acceptance
criteria.

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Document Control System. Printed copies are uncontrolled and for reference only.