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IPC J-STD-001H
®

Requirements for
Soldered Electrical and
Electronic Assemblies
If a conflict occurs
between the English and
translated versions of this
document, the English
version will take
precedence.

Developed by the J-STD-001 Task Group (5-22A), J-STD-001 Task

Group – Europe (5-22A-EU), J-STD-001 Task Group – China (5-22ACN)
of the Assembly and Joining Committees (5-20) of IPC

Supersedes: Users of this publication are encouraged to participate in the

J-STD-001G - October 2017 development of future revisions.
J-STD-001F WAM1 -
February 2016 Contact:
J-STD-001F - July 2014
J-STD-001E - April 2010 IPC
J-STD-001D - February 2005
J-STD-001C - March 2000
J-STD-001B - October 1996
J-STD-001A - April 1992
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September 2020 IPC J-STD-001H

Table of Contents
1.0 GENERAL ................................................................ 1 1.12 Inspection Methodology ..................................... 6
1.1 Scope .................................................................... 1 1.12.1 Process Verification Inspection............................ 6
1.2 Purpose................................................................. 1 1.12.2 Visual Inspection.................................................. 6
1.3 Classification ........................................................ 1 1.13 Facilities ............................................................... 7
1.4 Measurement Units and Applications ................. 1 1.13.1 Environmental Controls....................................... 7
1.4.1 Verification of Dimensions .................................. 2 1.13.2 Field Assembly Operations.................................. 8
1.5 Definition of Requirements ................................. 2 1.13.3 Health and Safety ................................................ 8
1.5.1 Hardware Defects and Process Indicators .......... 2 1.14 Electrostatic Discharge (ESD)............................. 8
1.5.2 Material and Process Nonconformance .............. 2
2.0 APPLICABLE DOCUMENTS .......................................... 9
1.5.3 Procedures for Specialized Technologies............ 2 2.1 IPC ...................................................................... 9
1.6 Process Control Requirements ............................ 3 2.2 JEDEC ................................................................ 9
1.6.1 Opportunities Determination ............................... 3 2.3 Joint Industry Standards ................................... 10
1.6.2 Statistical Process Control................................... 3 2.4 ASTM ............................................................... 10
1.7 Order of Precedence ............................................ 4 2.5 EOS/ESD Association, Inc. .............................. 10
1.7.1 Appendices........................................................... 4 2.6 International Electrotechnical Commission ..... 10
1.8 Terms and Definitions.......................................... 4 2.7 SAE International ............................................. 10
1.8.1 Circumferential Solder Separation 2.8 Military Standards ............................................ 10
(Area Void of Solder) .......................................... 4
2.9 Aerospace Industries Association / National
1.8.2 Diameter .............................................................. 4 Aeronautics Standards ...................................... 10
1.8.3 Disposition ........................................................... 4
3.0 MATERIALS, COMPONENTS AND EQUIPMENT
1.8.4 Electrical Clearance ............................................. 4 REQUIREMENTS .................................................. 11
1.8.5 Engineering Documentation ................................ 4 3.1 Materials............................................................. 11
1.8.6 FOD (Foreign Object Debris) ............................. 4 3.2 Solder ................................................................. 11
1.8.7 High Voltage ........................................................ 4 3.2.1 Solder – Pb-Free ................................................ 11
1.8.8 Manufacturer ........................................................ 5 3.2.2 Solder Purity Maintenance ................................ 11
1.8.9 Objective Evidence .............................................. 5 3.3 Flux .................................................................... 12
1.8.10 Process Control .................................................... 5 3.3.1 Flux Application ................................................ 12
1.8.11 Proficiency............................................................ 5 3.4 Adhesives ........................................................... 12
1.8.12 Solder Destination Side ....................................... 5 3.5 Chemical Strippers............................................. 12
1.8.13 Solder Source Side .............................................. 5 3.6 Components........................................................ 13
1.8.14 Solder Void........................................................... 5 3.6.1 Component and Seal Damage ........................... 13
1.8.15 Supplier ................................................................ 5 3.6.2 Coating Meniscus .............................................. 13
1.8.16 Tempered Leads ................................................... 5 3.7 Tools and Equipment ......................................... 13
1.8.17 User ...................................................................... 5
4.0 GENERAL SOLDERING AND ASSEMBLY
1.8.18 Wire Overlap........................................................ 5 REQUIREMENTS .................................................. 15
1.8.19 Wire Overwrap..................................................... 5 4.1 Solderability ....................................................... 15
1.9 Requirements Flowdown ..................................... 6 4.2 Solderability Maintenance ................................. 15
1.10 Personnel Proficiency .......................................... 6 4.3 Removal of Component Surface Finishes ........ 15
1.10.1 X-Ray Specific Personnel Proficiency ................ 6 4.3.1 Gold Removal .................................................... 15
1.11 Acceptance Requirements.................................... 6 4.3.2 Other Metallic Surface Finishes Removal ........ 15

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4.4 Thermal Protection ............................................ 15 5.4.1 General Requirements ...................................... 23

4.5 Rework of Nonsolderable Parts ........................ 16 5.4.2 Turret and Straight Pin Terminals .................... 24
4.6 Preprocessing Cleanliness Requirements .......... 16 5.4.3 Bifurcated Terminals ........................................ 25
4.7 General Part Mounting Requirements............... 16 5.4.4 Slotted Terminals ............................................... 26
4.7.1 General Requirements........................................ 16 5.4.5 Hook Terminals.................................................. 27
4.7.2 Lead Deformation Limits .................................. 16 5.4.6 Pierced or Perforated Terminals ........................ 27
4.8 Hole Obstruction................................................ 16 5.4.7 Cup and Hollow Cylindrical Terminals –
4.9 Metal-Cased Component Isolation .................... 16 Placement ........................................................... 27
4.10 Adhesive Coverage Limits ................................ 16 5.4.8 Series Connected................................................ 28
4.11 Mounting of Parts on Parts (Stacking of 5.5 Soldering to Terminals....................................... 28
Components) ...................................................... 16 5.5.1 Bifurcated Terminals.......................................... 28
4.12 Connectors and Contact Areas .......................... 16 5.5.2 Slotted Terminal................................................. 28
4.13 Handling of Parts............................................... 16 5.5.3 Cup and Hollow Cylindrical Terminals –
Soldering ............................................................ 28
4.13.1 Preheating........................................................... 17
5.6 Jumper Wires ..................................................... 29
4.13.2 Controlled Cooling ............................................ 17
5.6.1 Insulation............................................................ 29
4.13.3 Drying/Degassing............................................... 17
5.6.2 Wire Routing...................................................... 29
4.13.4 Holding Devices and Materials ......................... 17
5.6.3 Wire Staking ...................................................... 29
4.14 Machine Soldering............................................. 17
5.6.4 Unpopulated Land or Via – Lap Soldered........ 29
4.14.1 Nonreflow Soldering ........................................ 17
5.6.5 Supported Holes ............................................... 29
4.14.2 Reflow Soldering ............................................... 17
5.6.6 SMT .................................................................. 29
4.15 Solder Connection.............................................. 17
4.15.1 Exposed Surfaces............................................... 18 6.0 THROUGH-HOLE MOUNTING AND
TERMINATIONS .................................................... 31
4.15.2 Solder Connection Anomalies ........................... 18
6.1 Through-Hole Terminations – General ............. 31
4.15.3 Partially Visible or Hidden Solder
Connections........................................................ 18 6.1.1 Lead Forming..................................................... 32
4.16 Heat Shrinkable Soldering Devices .................. 18 6.1.2 Termination Requirements................................. 32
4.17 Threaded Fasteners ............................................ 19 6.1.3 Lead Trimming .................................................. 33
4.18 Torque ................................................................ 20 6.1.4 Interfacial Connections ...................................... 33
6.2 Supported Holes ............................................... 33
5.0 WIRES AND TERMINAL CONNECTIONS ........... 21 6.2.1 Solder Application ............................................. 33
5.1 Wire and Cable Preparation ............................. 21 6.2.2 Through-Hole Component Lead Soldering....... 33
5.1.1 Insulation Damage ............................................. 21 6.2.3 Coating Meniscus in Solder .............................. 34
5.1.2 Strand Damage................................................... 21 6.3 Unsupported Holes ........................................... 34
5.1.3 Tinning of Stranded Wire – Forming ............... 21 6.3.1 Lead Termination Requirements for
5.2 Solder Terminals ................................................ 22 Unsupported Holes ............................................ 34
5.3 Bifurcated, Turret and Slotted Terminal 7.0 SURFACE MOUNTING OF COMPONENTS ......... 35
Installation ........................................................ 22
7.1 Surface Mount Device Lead ............................ 35
5.3.1 Shank Damage ................................................... 22 7.1.1 Plastic Components............................................ 35
5.3.2 Flange Damage .................................................. 22 7.1.2 Forming .............................................................. 35
5.3.3 Flared Flange Angles......................................... 22 7.1.3 Unintentional Bending....................................... 36
5.3.4 Terminal Mounting – Mechanical ..................... 22 7.1.4 Flat Pack Parallelism ......................................... 36
5.3.5 Terminal Mounting – Electrical ........................ 22 7.1.5 Surface Mount Device Lead Bends .................. 36
5.3.6 Terminal Mounting – Soldering ........................ 23 7.1.6 Flattened Leads .................................................. 36
5.4 Mounting to Terminals ..................................... 23 7.1.7 Parts Not Configured for Surface Mounting .... 36

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7.2 Leaded Component Body Clearance................. 36 8.3.2 Level 2 – Minor Changes with Supporting
7.2.1 Axial-Leaded Components ................................ 36 Objective Evidence ............................................ 64
7.3 Parts Configured for Butt/I Lead Mounting ..... 36 8.4 Foreign Object Debris (FOD) ........................... 64
7.4 Installation of Surface Mount Components ...... 36 8.5 Visible Residues................................................. 65
7.5 Soldering Requirements..................................... 36 8.6 Non-ionic Residues............................................ 65
7.5.1 Misaligned Components .................................... 37 8.7 Ultrasonic Cleaning Processes .......................... 65
7.5.2 Unspecified and Special Requirements ............. 37 8.8 Guidance Documents......................................... 65
7.5.3 Bottom Only Chip Component Terminations ... 38 9.0 PRINTED BOARD REQUIREMENTS .................... 67
7.5.4 Rectangular or Square End Chip 9.1 Printed Board Damage ..................................... 67
Components – 1, 2, 3 or 5 Side
Termination(s) .................................................... 39 9.1.1 Blistering/Delamination ..................................... 67
7.5.5 Cylindrical End Cap Terminations .................... 41 9.1.2 Weave Exposure/Cut Fibers .............................. 67
7.5.6 Castellated Terminations.................................... 43 9.1.3 Haloing............................................................... 67
7.5.7 Flat Gull Wing Leads ........................................ 44 9.1.4 Edge Delamination ............................................ 67
7.5.8 Round or Flattened (Coined) Gull 9.1.5 Land/Conductor Separation ............................... 67
Wing Leads ........................................................ 45 9.1.6 Land/Conductor Reduction in Size ................... 67
7.5.9 J Lead Terminations........................................... 46 9.1.7 Flexible Circuitry Delamination........................ 67
7.5.10 Butt/I Terminations ........................................... 47 9.1.8 Flexible Circuitry Damage ................................ 67
7.5.11 Flat Lug Leads................................................... 49 9.1.9 Burns .................................................................. 67
7.5.12 Tall Profile Components Having Bottom 9.1.10 Non-Soldered Edge Contacts ............................ 67
Only Terminations ............................................. 50
9.1.11 Measles............................................................... 67
7.5.13 Inward Formed L-Shaped Ribbon Leads.......... 51
9.1.12 Crazing ............................................................... 68
7.5.14 Surface Mount Area Array Packages ................ 52
7.5.15 Bottom Termination Components (BTC).......... 55 9.2 Marking .............................................................. 68
7.5.16 Components with Bottom Thermal Plane 9.3 Bow and Twist (Warpage) ................................. 68
Terminations (D-Pak)......................................... 56 9.4 Depanelization.................................................... 68
7.5.17 Flattened Post Terminations .............................. 57
10.0 COATING, ENCAPSULATION AND STAKING
7.5.18 P-Style Terminations.......................................... 58 (ADHESIVE).......................................................... 69
7.5.19 Vertical Cylindrical Cans with Outward 10.1 Conformal Coating ........................................... 69
L-Shaped Lead Terminations............................. 59
10.1.1 Materials............................................................. 69
7.5.20 Wrapped Terminals ............................................ 61
10.1.2 Masking.............................................................. 69
7.5.21 Flexible and Rigid-Flex Printed Circuitry
with Flat Unformed Leads ................................ 62 10.1.3 Application......................................................... 69
7.6 Specialized SMT Terminations.......................... 62 10.1.4 Thickness............................................................ 69
10.1.5 Uniformity.......................................................... 69
8.0 CLEANING AND RESIDUE REQUIREMENTS .... 63
10.1.6 Bubbles and Voids ............................................. 69
8.1 Qualified Manufacturing Process ...................... 63
10.1.7 Delamination ...................................................... 70
8.1.1 Cleaning Designator .......................................... 63
10.1.8 Foreign Objects Debris...................................... 70
8.2 Ionic Process Monitoring .................................. 63
10.1.9 Other Visual Conditions .................................... 70
8.2.1 Sampling Plan .................................................... 63
10.1.10 Inspection ........................................................... 70
8.2.2 Control Limits.................................................... 63
10.1.11 Rework or Touchup ........................................... 70
8.2.3 Exceeding the Control Limits ........................... 64
10.2 Encapsulation .................................................... 70
8.3 Re-qualification Requirements .......................... 64
8.3.1 Level 1 – Major Changes Requiring 10.2.1 Application......................................................... 70
Validation ........................................................... 64 10.2.2 Performance Requirements................................ 70

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10.2.3 Rework of Encapsulant Material....................... 70 Figure 5-15 Hook Terminal Wire Placement...................... 27
10.2.4 Encapsulant Inspection ...................................... 70 Figure 5-16 Acceptable Pierced or Perforated
Terminal Wire Placement ............................... 27
10.3 Staking................................................................ 70
Figure 5-17 Wires on Intermediate Turret, Bifurcated,
10.3.1 Staking – Application ........................................ 71 and Pierced Terminals.................................... 28
10.3.2 Staking – Adhesive ............................................ 73 Figure 5-18 Solder Depression .......................................... 28
10.3.3 Staking (Inspection)........................................... 73 Figure 5-19 Cup and Hollow Cylindrical Terminals –
Vertical Fill of Solder ...................................... 29
11.0 WITNESS (TORQUE/ANTI-TAMPERING)
Figure 6-1 Component Lead Stress Relief Examples ..... 31
STRIPE.................................................................. 75
Figure 6-2 Lead Bends .................................................... 32
12.0 REWORK AND REPAIR....................................... 77 Figure 6-3 Lead Trimming................................................ 33
12.1 Rework ............................................................... 77 Figure 6-4 Vertical Fill Example ....................................... 34
12.2 Repair ................................................................. 77 Figure 7-1 Surface Mount Device Lead Forming ............ 35
12.3 Post Rework/Repair Cleaning ........................... 77 Figure 7-2 Surface Mount Device Lead Forming ............ 35

APPENDIX A Guidelines for Soldering Tools and Figure 7-3 Bottom Only Terminations .............................. 38
Equipment ............................................ 79 Figure 7-4 Rectangular or Square End Chip
Components ................................................... 39
APPENDIX B Minimum Electrical Clearance –
Electrical Conductor Spacing ......... 81 Figure 7-4A Rectangular or Square End Chip
Components – 1, 2, 3 or 5 Side
APPENDIX C J-STD-001 Guidance on Objective Termination(s) Center Termination
Evidence of Material Compatibility .. 83 (When Present) .............................................. 40
Figure 7-5 Cylindrical End Cap Terminations .................. 41
APPENDIX D X-Ray Guidelines .............................. 87
Figure 7-5A Cylindrical End Cap Terminations Center
Termination (When Present)........................... 42
Figures
Figure 7-6 Castellated Terminations ................................ 43
Figure 1-1 Wire Overlap..................................................... 5 Figure 7-7 Flat Gull Wing Leads...................................... 44
Figure 1-1 Wire Overwrap.................................................. 5
Figure 7-8 Round or Flattened (Coined) Gull
Figure 4-1 Hole Obstruction............................................. 16 Wing Leads..................................................... 45
Figure 4-2 Acceptable Wetting Angles............................. 18 Figure 7-9 J Leads ........................................................... 46
Figure 4-3 Hardware Sequence and Orientation............. 19 Figure 7-10 Butt/I Terminations for Modified
Figure 4-4 Example of Hardware Sequence and Through-Hole Leads....................................... 47
Orientation ...................................................... 19 Figure 7-11 Butt/I Terminations for Solder Charged
Figure 5-1 Insulation Thickness ....................................... 21 Leads .............................................................. 48
Figure 5-2 Flange Damage .............................................. 22 Figure 7-12 Flat Lug Leads................................................ 49
Figure 5-3 Flared Flange Angles ..................................... 22 Figure 7-12A SMD-4 LED .................................................... 49
Figure 5-4 Terminal Mounting – Mechanical.................... 22 Figure 7-13 Tall Profile Components Having Bottom
Only Terminations........................................... 50
Figure 5-5 Terminal Mounting – Electrical ....................... 23
Figure 5-6 Insulation Clearance Measurement................ 23 Figure 7-14 Inward Formed L-Shaped Ribbon Lead......... 51

Figure 5-7 Service Loop for Lead Wiring......................... 23 Figure 7-15 BGA Solder Ball Clearance ............................ 53

Figure 5-8 Stress Relief Examples .................................. 24 Figure 7-16 Bottom Termination Component..................... 55
Figure 5-9 Insulation Sleeving ......................................... 24 Figure 7-17 Bottom Thermal Plane Termination ................ 56
Figure 5-10 Wire and Lead Placement.............................. 24 Figure 7-18 Flattened Post Termination............................. 57
Figure 5-11 Bifurcated Terminal Side Route Figure 7-19 P-Style Termination ........................................ 58
Placement with Wrap ..................................... 25 Figure 7-20 Examples of Vertical Cylindrical Cans with
Figure 5-12 Bifurcated Terminal Side Route Outward L-Shaped Lead Terminations........... 60
Placement – Straight Though Figure 7-21 Vertical Cylindrical Cans with Outward
and Staked ..................................................... 25 L-Shaped Lead Terminations ......................... 60
Figure 5-13 Bifurcated Terminal Top and Bottom Figure 7-22 Wrapped Terminal – SMT Inductor –
Route Connection........................................... 26 Bottom View ................................................... 61
Figure 5-14 Slotted Terminal.............................................. 26

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Figure 7-23 Wrapped Terminal – SMT Inductor – Table 6-2 Components with Spacers ............................. 31
Top View ......................................................... 61 Table 6-3 Lead Bend Radius.......................................... 32
Figure 7-24 Wrapped Terminal – SMT Component........... 61 Table 6-4 Protrusion of Leads in Supported Holes ........ 33
Figure 7-25 Wrapped Terminals......................................... 61 Table 6-5 Protrusion of Leads in Unsupported Holes .... 33
Figure 7-26 Flexible and Rigid-Flex Circuitry with Flat Table 6-6 Supported Holes with Component Leads,
Unformed Leads ............................................. 62 Minimum Acceptable Conditions, Note 1 ....... 34
Figure 10-1 Radial Leaded Components Whose Height Table 6-7 Unsupported Holes with Component
Is Greater Than or Equal to Their Length or Leads, Minimum Acceptable Conditions,
Diameter – Individual Rectangular Shaped Notes 1, 4 ....................................................... 34
Component ..................................................... 71
Table 7-1 SMT Lead Forming Minimum Lead
Figure 10-2 Radial Leaded Components Whose Height Length (L) ....................................................... 35
Is Greater Than or Equal to Their Length or
Diameter – Individual Cylindrically Shaped Table 7-2 Surface Mount Components Soldering
Component ..................................................... 72 Requirements ................................................. 37
Figure 10-3 Radial Leaded Components Whose Table 7-3 Dimensional Criteria – Bottom Only Chip
Longest Dimension Is Their Diameter or Component Terminations................................ 38
Length, e.g., TO5 Semiconductors................. 72 Table 7-4 Dimensional Criteria – Rectangular or
Figure 10-4 Radial Leaded Components Whose Height Square End Chip Components – 1, 2, 3 or
Is Greater Than or Equal to Their Length 5 Side Termination(s) ..................................... 39
or Diameter – Closely Spaced Arrays ........... 72 Table 7-4A Dimensional Criteria – Center Termination
Figure 11-1 Torque Stripe on Fastener – Acceptable........ 75 (When Present) – Rectangular or Square
End Chip Components – 1, 2, 3 or 5 Side
Figure 11-2 Torque Stripe on Fastener – Defect............... 75
Termination(s) ................................................. 40
Figure D-1 Circumferential Solder Separation ................. 87
Table 7-5 Dimensional Criteria – Cylindrical End Cap
Figure D-2 Solder Voids ................................................... 87 Terminations ................................................... 41
Table 7-5A Dimensional Criteria – Center Termination
Tables (When Present) – Cylindrical End Cap
Terminations ................................................... 42
Table 1-1 Design, Fabrication and Acceptability
Table 7-6 Dimensional Criteria – Castellated
Specifications.................................................... 1
Terminations ................................................... 43
Table 1-2 Magnification Aid Applications for Solder
Connections...................................................... 7 Table 7-7 Dimensional Criteria – Flat Gull Wing
Leads .............................................................. 44
Table 1-3 Magnification Aid Applications for Wires and
Wire Connections, Note 1 ................................ 7 Table 7-8 Dimensional Criteria – Round or Flattened
(Coined) Gull Wing Leads .............................. 45
Table 1-4 Magnification Aid Applications – Other............. 7
Table 7-9 Dimensional Criteria – J Leads ...................... 46
Table 3-1 Maximum Limits of Solder Bath
Contaminant ................................................... 12 Table 7-10 Dimensional Criteria – Butt/I Connections ..... 47
Table 4-1 Solder Connection Anomalies ........................ 18 Table 7-11 Dimensional Criteria – Butt/I Terminations –
Solder Charged Terminations......................... 48
Table 5-1 Allowable Strand Damage, Notes 1, 2, 3....... 21
Table 7-12 Dimensional Criteria – Flat Lug Leads,
Table 5-2 Terminal Mounting Minimum Soldering
Note 5 ............................................................. 49
Requirements ................................................. 23
Table 7-13 Dimensional Criteria – Tall Profile
Table 5-3 Turret and Straight Pin Wire Wrap................. 24
Components Having Bottom Only
Table 5-4 AWG 30 and Smaller Wire Wrap ................... 25 Terminations ................................................... 50
Table 5-5 Bifurcated Terminal Wire Placement – Table 7-14 Dimensional Criteria – Inward Formed
Side Route with Wrap .................................... 25 L-Shaped Ribbon Leads, Note 5.................... 51
Table 5-6 Bifurcated Terminal Side Table 7-15 Dimensional Criteria – Ball Grid Array
Route Straight-Through Staking..................... 25 Components with Collapsing Balls................. 53
Table 5-7 Bifurcated Terminal Wire Placement – Table 7-16 Ball Grid Array Components with
Bottom Route.................................................. 26 Noncollapsing Balls ........................................ 54
Table 5-8 Hook Terminal Wire Placement...................... 27 Table 7-17 Column Grid Array.......................................... 54
Table 5-9 Pierced or Perforated Terminal Wire Table 7-18 Dimensional Criteria – BTC............................ 55
Placement....................................................... 27
Table 7-19 Dimensional Criteria – Bottom Thermal
Table 5-10 Solder Requirements Lead/Wire to Post........ 28 Plane Terminations ......................................... 56
Table 6-1 Component to Land Clearance ...................... 31

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Table 7-20 Dimensional Criteria – Flattened Post

Terminations ................................................... 57
Table 7-21 Dimensional Criteria – P-Style
Terminations ................................................... 58
Table 7-22 Dimensional Criteria – Vertical
Cylindrical Cans with Outward
L-Shaped Lead Terminations ......................... 59
Table 7-23 Dimensional Criteria – Wrapped Terminals.... 61
Table 7-24 Dimensional Criteria – Flexible and
Rigid-Flex Circuitry with Flat Unformed
Leads .............................................................. 62
Table 8-1 Designation of Surfaces to be Cleaned ......... 63
Table 8-2 Residue Testing For Process Control ............ 63
Table 8-3 Maximum Acceptable Rosin, Note 1 .............. 65
Table 10-1 Coating Thickness .......................................... 69

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Requirements for Soldered Electrical

and Electronic Assemblies

1.0 GENERAL

1.1 Scope This standard describes materials, methods and acceptance criteria for producing soldered electrical and elec-
tronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels
during the manufacture of products. It is not the intent of this standard to exclude any procedure, such as for component
placement or for applying flux and solder used to make the electrical connection.
The soldering operations, equipment, and conditions described in this document are based on electrical/electronic circuits
designed and fabricated in accordance with the specifications listed in Table 1-1.
Table 1-1 Design, Fabrication and Acceptability Specifications
Board Type Design Fabrication/Acceptability Specification
Generic Requirements IPC-2221 IPC-6011
IPC-6012
Rigid Printed Boards IPC-2222
IPC-A-600
Flexible Circuits IPC-2223 IPC-6013
IPC-2222
Rigid Flex Board IPC-6013
IPC-2223

1.2 Purpose This standard prescribes material requirements, process requirements, and acceptability requirements for the
manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document’s
recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and
IPC-A-610. Standards may be updated at any time, including with the addition of amendments. The use of an amendment
or a newer revision is not automatically required.

1.3 Classification This standard recognizes that electrical and electronic assemblies are subject to classifications by
intended end-item use. Three general end-product classes have been established to reflect differences in manufacturability,
complexity, functional performance requirements, and verification (inspection/test) frequency.
Use of this standard requires agreement on the class to which the product belongs. The User has the responsibility for iden-
tifying the class to which the assembly is produced. The product class should be stated in the procurement documentation
package. If the User does not establish and document the acceptance class, the Manufacturer may do so.

CLASS 1 General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.

CLASS 2 Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired
but not critical. Typically the end-use environment would not cause failures.

CLASS 3 High Performance/Harsh Environment Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be
tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life
support or other critical systems.

1.4 Measurement Units and Applications This standard uses International System of Units (SI) units per ASTM SI10,
IEEE/ASTM SI 10, Section 3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in this
standard are millimeters (mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and tem-
perature tolerances, grams (g) [oz] for weight, and lux for illuminance.

Note: This standard uses other SI prefixes (ASTM SI10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm
becomes 1.2 µm) or as alternative to powers-of-ten (3.6 x 103 mm becomes 3.6 m).