Unit 5
Unit 5
Unit 5
Unit V
References:
1. 1.Stephen Brown, ZvonkoVranesic, “Fundamentals of
Digital Logic with
Verilog Design,” 3/e, Tata McGraw Hill, 2008.
2. Michael John Sebastian Smith, Application Specific Integrated
Circuits, 3/e, Pearson Education Asia, 2001.
3. 3.Digital logic circuit analysis and design by Vector & Nelson
Syllabus
□ Introduction to ASIC’s: Full-
custom,standard-
cell and Gate array based ASICs.
□ SPLDs: PROM, PAL, GAL, PLA.
FPGA and CPLD simplified
architecture and applications.
□ ASIC/FPGA Design flow, CAD
tools. Combinational circuit Design
with Programmable logic
Devices (PLDs).
Introduction to ASIC
□ An ASIC (“a-sick”) is an application-specific
integrated circuit
□ A silicon chip or integrated circuit (IC) is
called a die
□ A gate equivalent is a NAND gate F = (AB)’
or four transistors
□ Flip flop contains 4 two input NAND gate
□ A 100 k gate IC contains 100,000 two
input NAND gate
□ (a) a pin grid array(PGA) package
□ made from ceramic or plastic
material
□ (b) The silicon die size varies few mm
to 1 inch
History of integration
□ SSI, ~10 gates per chip (60’s)- gates
□ MSI, ~100–1000 gates per chip
(70’s)- mux or decoder or comparator
□ LSI,~1000–10,000 gates per
chip(80’s)
□ VLSI, ~10,000–100,000 gates per
chip(90’s)
□ Ultralarge scale integration (ULSI,
~1M–10M gates per chip
History of technology
□ Bipolar technology
□ Transistor–transistor logic (TTL)
□ metal-oxide-silicon (MOS) technology
because it was difficult to make
metal-gate n-channel MOS
□ complementary MOS (CMOS) greatly
reduced power
□ Example : TSMC CMOS 180nm
Technology
Types of ASICs
Full-Custom ASICs: Possibly all logic cells and all mask layers
customized
Semi-Custom ASICs: all logic cells AND gate OR gate MUX or FF
are pre-designed and some (possibly all) mask layers customized
□ ICs are made on a wafer. Circuits are
built up with successive mask layers.
The number of masks used to define
the interconnect.
□ First half-dozen or so layers define
transistors and other half-dozen or so
define Interconnect
Types of ASICs – Cont’d
❑Full-Custom ASICs
❖ Include some (possibly all) customized logic cells
❖ Have all their mask layers customized
❖ Full-custom ASIC design makes sense only
✔ When no suitable existing libraries exist or
✔ Existing library cells are not fast enough or
✔ The available pre-designed/pre-tested cells consume too much
power that a design can not allow
✔ The available logic cells are not compact enough to fit
✔ ASIC technology is new or/and so special that no cell library
exits.
❖ Offer highest performance and lowest cost (smallest die
size) but at the expense of increased design time,
complexity, higher design cost and higher risk.
❖ Some Examples: Microprocessor, High-Voltage Automobile
Control Chips, Analog to Digital Communication Chips and Sensors
Types of ASICs – Cont’d
❑ Semi-Custom ASICs
❖ Standard-Cell based
ASICs (CBIC-
“sea-bick”)
✔ Use logic blocks from
standard cell libraries,
other mega-cells,
full-custom blocks,
system-level
macros(SLMs),
functional standard
blocks (FSBs), cores etc.
✔ Get all mask layers
customized- transistors
and interconnect
✔ Manufacturing lead time
is around 8 weeks
✔ Less efficient in size and
performance but lower in
design cost
Types of ASICs – Cont’d
❑ Semi-Custom ASICs –
Cont’d
❖ Standard-Cell based
ASICs (CBIC-
“sea-bick”) – Cont’d
Types of ASICs – Cont’d
❑ Semi-Custom ASICs –
Cont’d
❖ Gate Array based
ASICs
12
Types of ASICs – Cont’d
❑ Semi-Custom ASICs – Cont’d
❖ Gate Array based ASICs -
Cont’d
UNIT 5 13
Types of ASICs – Cont’d
❑ Semi-Custom ASICs –
Cont’d
❖ Programmable ASICs
✔ PLDs - PLDs are low-density
devices which contain 1k – 10 k
gates and are available both in
bipolar and CMOS technologies
[PLA, PAL or GAL]
✔ CPLDs or FPLDs or
FPGAs - FPGAs combine
architecture of gate arrays with
programmability of PLDs.
✔User Configurable
✔ Contain Regular Structures
- circuit elements such as
AND, OR, NAND/NOR gates,
FFs, Mux, RAMs,
✔Allow Different
Programming
Technologies
✔ Allow both Matrix and
Row-based Architectures
PLDs
□ No customized mask layers or logic cells
□ Fast design turnaround
□ A single large block of programmable
interconnect
□ A matrix of logic macrocells that usually consist
of programmable array logic followed by a
flip-flop or latch
Types of PLDs
□ Simple PLD
□ Complex PLDS
Simple PLD
□ OR gates can produce an output that is a
function of the two input variables, A and B.
□ Each output function is programmed with
the fuses located between the AND gates
and each of the OR gates.
Simplified PLD
□ Outputs are programmed as
Types - Simple PLDs
□ PROM(Programmable ROM)
□ PAL (Programmable Array Logic)
□ PLA (Programmable Logic Array)
□ GAL (Generic Array Logic)
Basic configuration
Example – Full adder
□ S=m(1,2,4,7)
□ C=m(3,5,6,7)
PROM Realization of FA
Example 2- Binary to Gray code
Code converter realization
PROM – Example 3
Realize BCD to Excess 3 code
converter
□ Using PLA
□ Truth Table relating BCD and Excess-3 codes
□ Boolean expression for □ K-Map solution
each Excess-3 code bits
PLA Realization
PLA Programming table
Logic equations
□ E3 =
□ E2=
□ E1=
□ E0=
PLA Example
PLA Programming Table
Comparison PROM and PLA
PROM PLA
AND array fixed and OR array AND and OR array are
programmable programmable