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IPC/industry Standard of PCB and PCBA?: PCB Fabrication Steps: (Presentation-How-To-Build-Pcb)

The document discusses industry standards for printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs). It outlines key IPC standards for PCB design, fabrication, and assembly acceptance criteria. It also provides details on common PCB materials, thicknesses, layer structures, and fabrication steps. Finally, it describes standards for stencil design, solder paste, placement, and reflow in the assembly process as well as various inspection techniques used in PCB manufacturing.

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Henry
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235 views

IPC/industry Standard of PCB and PCBA?: PCB Fabrication Steps: (Presentation-How-To-Build-Pcb)

The document discusses industry standards for printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs). It outlines key IPC standards for PCB design, fabrication, and assembly acceptance criteria. It also provides details on common PCB materials, thicknesses, layer structures, and fabrication steps. Finally, it describes standards for stencil design, solder paste, placement, and reflow in the assembly process as well as various inspection techniques used in PCB manufacturing.

Uploaded by

Henry
Copyright
© © All Rights Reserved
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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IPC\industry standard of PCB and PCBA?

IPC-A-600 Acceptability of Printed Boards


IPC-A-610E Acceptability requirements for electronic assemblies
IPC-7525A Stencil Design Guidelines
IPC-2221 Generic Standard on Printed Board Design
IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standards
IPC-7801 Reflow Oven Process Control Standard
1 mil = 0.001 inches

Solder Paste
FR-4 glass epoxy circuit board - eutectic Sn-Pb (63 percent tin, 37 percent lead) or SAC alloys
(tin/silver/copper)
high tensile and shear strength - tin-antimony (Sn/Sb) alloys

PCB Thickness & Gerber Layers


1oz copper cover per sq foot = thickness 0.00134” 1.34mil
PrePreg = FR4 fiberglass cloth preim-pregnated with epoxy resin (B-stage)
Normal PCB = 62mil =1.55cm = 0.061”
Ultra-thin PCB = 0.1mm~0.3mm (0.004"~0.012")

cmp Top Copper


sol Bottom Copper
stc Top Soldermask
sts Bottom Soldermask
plc Top Silkscreen
pls Bottom Silkscreen

PCB Fabrication Steps: (presentation-how-to-build-pcb)

Inner Layer (Core)


 Add light sensitive film\photo image-able resist coating to the copper layer of Inner layer
 Print Mask\Artwork from Gerber data
 UV expose to create image of the circuit
 Image Develop – chemical solution to remove the unwanted resist
 Etching – chemical solution to remove unwanted copper
 Remove Resist
 AOI – Automated Optical Inspection against design rules from Gerber files
 Oxide Coating – chemically treated to improve adhesion of the copper surface that leaves
the copper a dark brown color.

Add outer layer (Prepreg + Foil) on top and bottom of Inner layer to form multi-layer
Laminted Panels – Inner layer core, copper foil and prepreg are bonded together under heat and
pressure
Drill holes – 5 mils
Deburr the edges and holes
Desmear – chemical process that removes the thin coating of resin from the inner layer
connections that is produced by the heat and motion of the drill bits as they create the holes.
Electroless Copper Deposition – creates a metallic base for electroplating copper into the hole
Add resist coating to the copper layer of Outer layer
Outer Layer Expose and Develop (Same as Inner layer above)
Copper Pattern Plated be plated up to a thickness of approximately 1 mil (0.001”)
Plating tin onto all the exposed copper surfaces
Resist Strip – first step of strip-etch-strip or SESprocess – remove the resist of outer layer
Etching – second step of SES – remove unwanted copper
Tin Strip – last step of SES – remove the tin
Clean, apply, exporse and cure Green\Blue LPI Solder Mask
Silkscreen printing
CNC routing
Flying Probe test – Boards are tested for opens and shorts in the circuitry.

PCBA\SMT

Stencil Design
Pitch Pad Width Aperture Stencil Thickness Aspect Ratio
25mil 15mil 12mil 6mil 2
20mil 12mil 9-10mil 5-6mil 1.7
15mil 10mil 7-8mil 5mil 1.4
12mil 8mil 5-6mil 4-5mil 1.2

BGA Pad Aperture Thickness Area Ratio


60 mil 32mil 30mil 6-8mil 1.25 - 0.94
50 mil 25mil 22mil 6-8mil 0.92 - 0.69
20 mil 12mil 10mil 5-6mil 0.50 - 0.42

Solder paste – the volume, thickness and accuracy of paste 


Chip Shooter – Accuracy of placement, missed placements and scrap generated
Placement – Accuracy, location, alignment of placement
Reflow – Soldering defects (dry solder, no solder, missing /falled components etc.

Preheat 100-150 1-4/sec


Dryout/Soak 150-170 60-120secs
Reflow 220-260
Inspection

In-circuit test (ICT) is an example of white box testing where an electrical probe tests a
populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and
other basic quantities which will show whether the assembly was correctly fabricated.[1] It may
be performed with a bed of nails type test fixture and specialist test equipment, or with a
fixtureless in-circuit test setup.Flying probe test systems are often used for testing Low to Mid
volume production, NPI, prototypes and, boards that present accessibility problems. Flying
probe testing uses electro-mechanically controlled probes to access components on printed
circuit assemblies (PCAs). Commonly used for test of analog components, analog signature
analysis, and short/open circuits. They can be classified as in-circuit test (ICT) systems or as
Manufacturing Defects Analyzers (MDAs). They provide an alternative to the bed-of-nails
technique for contacting the components on printed circuit boards. The precision movement
can probe points on PLCCs, SOICs, PGAs, SSOPs, QFPs and others, without any expensive
fixturing or programming required.

Automated optical inspection (AOI) is an automated visual inspection of printed circuit board
(PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under
test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or
shape or component skew). It is commonly used in the manufacturing process because it is a
non-contact test method. It is implemented at many stages through the manufacturing process
including bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow as well
as other stages. AOI can be used in the following locations in the SMT lines: post paste, pre-
reflow, post-reflow, or wave areas.

5DX was an automated X-ray inspection robot, which belonged to the set of automated test
equipment robots and industrial robots utilizing machine vision. The 5DX was manufactured by
Agilent Technologies. The 5DX performed a non-destructive structural test using X-ray
laminography (tomography) to take 3D slices of an assembled printed circuit board. It was used
in the assembled printed circuit board (PCB) electronics manufacturing industry to provide
process feedback to a surface mount technology assembly line, as well as defect capture.

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