Reliable SMT Design

All there is to know

1
 Discussion
n The Standards Customers Want
n The Variation in the Parts
n Solder Joint Strengths & Weaknesses
n The Land Pattern Platform
n The Mathematically Philosophy
n The International Tri-feature Scheme

2
Hierarchy of IPC Design Standards
(2220 Series)

IPC-2220

IPC-2221
GENERIC

IPC-2222 IPC-2223 IPC-2224 IPC-2225 IPC-2226

RIGID FLEX PCMCIA MCM-L HDI

3
 Hierarchy of Printed Board
Performance Standards
(6010 Series)
IPC-6010

IPC-6011
GENERIC

IPC-6012 IPC-6013 IPC-6014 IPC-6015 IPC-6016

RIGID FLEX PCMCIA MCM-L HDI

4
 Other Applicable IPC Standards
n IPC-SM-782; Land Pattern Considerations
n IPC-7095; BGA Process Implementation
n IPC-2315; HDI & Microvia Design Guide
n IPC-SM-785; SMT Reliability Testing
n IPC-D-279; Design for SMT Reliability
n J-STD-001; Soldering Requirements
n IPC-A-610; Assembly Acceptability
n IPC-6010; Printed Board Series
n J-STD-004/005; Solder Flux/Paste

5
 Standard Scope Example
(land patterns)
n This standard provides information on land
pattern geometries used for surface
attachment of electronic components.
n The information presented is to provide the
appropriate size, shape and tolerance of the
SMT mount land patterns to insure an area
sufficient for correct solder volume.
n Also to allow for inspection, testing, and
rework of those solder joints.
6
 Scope (continued)
n Land pattern geometry may be different
based on the type of soldering used to
attach the electronic part, however land
patterns are defined in such a manner that
they are transparent to the process.
n Standard configurations are for manual
designs & for computer-aided design.
n Parts are mounted on one or both sides,
subjected to wave, reflow, or other type of
soldering
7
 Scope (continued)
n Although patterns are dimensionally
defined and since they are a part of the printed
board circuitry geometry, they are subject to
the producibility levels and tolerances
associated with plating, etching, assembly or
other conditions.
n The producibility aspects also pertain to the
use of solder mask and the registration
required between the solder mask and the
conductor patterns.

8
 Performance Classes
n Three performance classes have been
established to reflect progressive increases in
sophistication, functional performance
requirements and testing/ inspection frequency.
n There may be an overlap of equipment
categories in different classes.
n The user is responsible to specify, in the
contract or purchase order, the product
performance class.
9
 Class 1 - General Electronic
Products

Includes consumer products, some

computer and computer peripherals
suitable for applications where cosmetic
imperfections are not important and the
major requirement is function of the
completed printed board.

10
 Class 2 - Dedicated Service
Electronic Products
Includes communications equipment,
sophisticated business machines,
instruments where high performance and
extended life is required and for which
uninterrupted service is desired but not
critical. Certain cosmetic imperfections
are allowed.

11
 Class 3 - High Reliability
Electronic Products
Includes the equipment and products where
continued performance or performance on
demand is critical. Equipment downtime
cannot be tolerated and must function when
required such as in life support items or flight
control systems. Applications where high
levels of assurance are required and service
is essential.
12
 Complexity Levels
n Land pattern determination methods:
F Exact details based on component
specifications, board manufacturing and
component placement accuracy. The land
patterns are restricted to a specific
component, and have an identifying land
pattern number
F Equations used for new components or to
alter the given information to achieve a
more robust solder connection, when used
in particular situations
13
 Level A: Maximum
n For low-density product applications, the
'maximum' land pattern condition have
been developed to accommodate wave or
flow solder of leadless chip devices and
leaded gull- wing devices.
n The geometry furnished for these
devices, as well as inward and “J”-formed
lead contact device families, may provide a
wider process window for reflow solder
processes as well.
14
 Level B: Median
n Products with a moderate level of
component density should consider
adapting the 'median' land patterns.
n The median land patterns furnished for
all device families will provide a robust
solder attachment condition for reflow solder
processes.
n The condition should suitable for wave or
reflow soldering of leadless chip and leaded
gull-wing type devices.
15
 Level C: Minimum

n High component density typical of

portable and hand-held product applications
may consider the 'minimum' land pattern
geometry variation.
n Selection of the minimum land pattern
geometry may not be suitable for all product
use categories.

16
 Combination of Issues
n Performance classes 1, 2, and 3 are combined
with that of complexity and density levels A, B,
and C in defining electronic assembly conditions.
n As an example, combining the description as
Levels 1A or 3B or 2C, would indicate the
different combinations of performance and
component density to understand fabrication and
assembly requirements for manufacturing and
end use environment.

17
Component Characteristics
 Ribbon Leads
greater than 0.625

Flat ribbon L and gull-wing leads

(greater than 0,625 mm pitch) (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3

Toe-land protrusion 0,8 0,5 0,2

Heel-land protrusion 0,5 0,35 0,2

Side-land protrusion 0,05 0,05 0,03

Courtyard excess 0,5 0,25 0,05

Round-up factor Nearest 0,5 Nearest 0,5 Nearest 0,05

19
 Ribbon Leads
less than 0.625

Flat ribbon L and gullwing leads

(less than or equal to 0,625 mm pitch) (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3

Toe-land protrusion 0,8 0,5 0,2

Heel-land protrusion 0,2 0,2 0,2

Side-land protrusion 0,0 0,0 0,0

Courtyard excess 0,5 0,25 0,05

Round-up factor Nearest 0,5 Nearest 0,05 Nearest 0,05

20
 Round or
Flattened
Leads

Round or flattened (coined) leads (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3
Toe-land protrusion 1,0 0,65 0,2
Heel-land protrusion 0,5 0,35 0,2
Side-land protrusion 0,1 0,1 0,1
Courtyard excess 0,5 0,25 0,05

Round-up factor Nearest 0.5 Nearest 0.5 nearest 0.05

21
 “J “
Leaded
Parts

J leads (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3
Toe-land protrusion 0,2 0,2 0,2

Heel-land protrusion 0,8 0,6 0,4

Side-land protrusion 0,1 0,05 0,0

Courtyard excess 1,5 0,8 0,2

Round-up factor Nearest 0,5 Nearest 0,5 Nearest 0,05

22
 Rectangular
Square end
Terminations
Rectangular or square-end components
(ceramic capacitors and resistors) (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3
Toe-land protrusion 0,6 0,4 0,2
Heel-land protrusion 0,0 0,0 0,0
Side-land protrusion 0,0 0,0 0,0

Courtyard excess 0,5 0,25 0,05

Round-up factor Nearest 0,5 Nearest 0,05 Nearest 0,05

23
 Metal Electrical
Face

Cylindrical end cap terminations (MELF) (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3
Toe-land protrusion 1,0 0,4 0,2

Heel-land protrusion 0,2 0,1 0,0

Side-land protrusion 0,2 0,1 0,0

Courtyard excess 0,5 0,25 0,05

Round-up factor Nearest 0,5 Nearest 0,5 Nearest 0,05

24
 Bottom
Only
Terminations

Bottom only terminations (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3

Toe-land protrusion 0,2 0,1 0

Heel-land protrusion 0,2 0,1 0

Side-land protrusion 0,2 0,1 0

Courtyard excess 0,25 0,1 0,05

Round-up factor Nearest 0,5 Nearest 0,05 Nearest 0,05

25
 Leadless
Chip Carriers

Leadless chip carrier with castellated terminations (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3

Toe-land protrusion 1,5 1,25 1,0

Heel-land protrusion 0,4 0,2 0,1

Side-land protrusion 0,0 0,0 0,0

Courtyard excess 1,5 0,8 0,2

Round-up factor Nearest 0,5 Nearest 0,5 Nearest 0,05

26
 Butt Joints

Butt joints (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3

Toe-land protrusion 1,0 0,8 0,6

Heel-land protrusion 1,0 0,8 0,6

Side-land protrusion 0,3 0,2 0,1

Courtyard excess 1,5 0,8 0,2

Round-up factor Nearest 0,5 Nearest 0,5 Nearest 0,05

27
 Inward L
shaped
Leads

Inward L shaped ribbon leads (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3

Toe-land protrusion 0,1 0,1 0,0

Heel-land protrusion 1,0 0,5 0,2

Side-land protrusion 0,1 0,1 0,1

Courtyard excess 0,5 0,25 0,05

Round-up factor Nearest 0,5 Nearest 0,5 nearest 0,05

28
 Flat Lug
Leads

Flat lug leads (unit: mm)

Land pattern Maximum Median Minimum

characteristics Level 1 Level 2 Level 3
Toe-land protrusion 1,0 0,8 0,5
Heel-land protrusion 0 0 0
Side-land protrusion 1,0 0,5 0,3
Courtyard excess* 2,0 1,5 1,0
Round-up factor Nearest 0,5 Nearest 0,5 Nearest 0,05
* Depends on thermal requirements

29
 Plastic
BGA

Nominal Ball Diameter (mm) Tolerance Variation (mm) Pitch (mm)

0.75 0.90 - 0.65 1.5, 1.27
0.60 0.70 - 0.50 1.0
0.50 0.55 - 0.45 1.0, 0.8
0.45 0.50 - 0.40 1.0, 0.8, 0.75
0.40 0.45 - 0.35 0.80, 0.75, 0.65
0.30 0.35 - 0.25 0.8, 0.75, 0.65, 0.50
0.25 0.28 - 0.22 0.40
0.20 0.22 - 0.18 0.30
0.15 0.17 - 0.13 0.25

30
 Design Considerations
n Land pattern concepts
n Component selection
n Mounting substrate design
n Assembly methods
n Method of test
n Phototool generation
n Meeting solder joint requirements
n Stencil fixture requirements
n Providing access for inspection
n Access for rework and repair
31
 Manufacturing Allowance
n Manufacturing allowance must be
considered in the design process
n The courtyard represents the starting point
of the minimum area needed for the
component and the land pattern
n Manufacturing, assembly and testing
representatives should assist in
determining the additional room needed
to accommodate placement, testing,
modification and repair

32
Land Pattern Courtyard
Determination
Component / pattern
(maximum boundary)
Courtyard
excess
Courtyard
(minimum area)

Manufacturing
allowance

Courtyard
manufacturing
zone

33
 Solder Joint Strength

Solder ball exhibits a uniform solder

joint interface and is aligned
symmetrically about the circuit
board land pattern.

34
Solder Lands for
BGA Components

35
Acceptability through
Visual Assessment

36
Target Condition

37
 Acceptable for Class 1 & 2

End joint width (C)

is minimum 50% of
component
termination
width (W) or 50%
land width (P),
whichever is less.

38
 Defect Class 1, 2, and 3

Less than minimum

acceptable end
joint width.

39
Bottom Only Terminations

1. Side overhang 2.
End overhang 3.
End joint width
4. Side joint length,
end overlap

40
Dimensional Criteria
Bottom Only Terminations

41
Rectangular/Square End Components

1. Side overhang 4. See Note 4, Table 9-5 7. Three face termination

2. End overhang 5. Side joint length, end overlap 8. Five face termination
3. End joint width 6. One or two face termination 9. Termination configurations

42
 Dimensional Criteria
Rectangular/Square End Components

43
MELF Terminations

1. Side overhang
2. End overhang
3. End joint width
4. See Note 4, Table 9-6
5. Side joint length and end
overlap

44
Dimensional Criteria
MELF Terminations

45
 Castellated Terminations

1. Side overhang 3. Side joint length

2. Corner (termination) fillet required 4. Side overhang/end joint width
if metallization is present

46
Dimensional Criteria
Castellated Terminations

47
 Flat Ribbon L and Gull Wings

1. Side overhang 5. Lead 9. Line bisecting lower bend

2. Toe overhang 6. Other lead configurations 10. Toe down heel fillet height
3. End joint width 7. See Note 4, Table 9-8 11. Side joint length
4. Land 8. Center line of (T)

48
 Dimensional Criteria
Flat Ribbon/Gull Wing leads

49
 Round or Flattened Leads

1. Side overhang 4. See Note 4, Table 9-9 7. Toe down heel fillet height
2. Toe overhang 5. Side joint length 8. Other land configurations
3. End joint width 6. Line bisecting lower bend

50
Dimensional Criteria
Round/Flattened Leads

51
J Leaded Components

1. Side overhang
2. Toe overhang
3. Side joint length
4. Land
5. End joint width
6. See Note 4, Table 9-10
7. Side joint width

52
Dimensional Criteria
J leads

53
Butt Joint Attachment

1. Side overhang
2. Toe overhang
3. Lead
4. Land
5. End joint width
6. See Note 4, Table 9-11
7. Side joint length

54
Dimensional Criteria
Butt Leads

55
Flat Lug Leads

56
Dimensional Criteria
Flat Lug Leads

57
Tall Profile Components
with Bottom Only Terminations

58
 Dimensional Criteria
Bottom Only Tall components

59
Inward Formed L-Shaped
Ribbon Leads

60
 Dimensional Criteria
Inward Formed Ribbon Leads

61
 Land Pattern
Development

Mathematical Model

62
 Dimensioning Concepts
n Concepts used for this analysis consider the
assembly and /attachment requirements as
their major goal
n Data sheets for components or dimensions for
land patterns on boards may use other
dimensioning concepts, however, the goal
is to combine all concepts into a single
system
n The system allows for tailoring of these
concepts for robust process performance

63
 Dimensioning Requirements

• All dimensions are basic (nominal)

• Limits of size control form as well as size
• Perfect form is required at maximum
dimensions
• Datum reference and position tolerances
apply at maximum dimensions and
are dependent on feature size

64
 Dimensioning Requirements

• Position dimensions originate from

maximum dimensions
• Tolerances and their datum
references other than size and
position apply regardless of
feature size (rfs)
• Interpretations are per ASME Y14.5
(IPC-2615)

65
Profile Tolerancing Example

66
 Component Tolerancing
n Component manufacturers are
responsible for the dimensioning and
tolerancing of electronic components
n Their concepts have been converted to a
functional equivalent using the profile
tolerancing method
n All components are shown with their basic
dimensions as limit dimensions
(maximum or minimum size)

67
 Component Tolerancing
n Profile tolerances are unilateral, and are
described to reflect the best condition
for solder joint formation
n Component dimensions are evaluated
using the surfaces of the termination
or component lead involved in the
formation of an acceptable solder joint
n Component manufactures provide
nominal dimensions which are
converted to maximum and minimum
requirements

68
C1206 Capacitor example

69
 Heel to Heel Dimensions
n The outer dimensions of leaded or even
leadless components are usually easy to
determine, these are readily available from
the component manufacturer
n The inner (heel-to-heel) dimensions are not
provided and are more difficult to
determine
n Inner dimensions must be derived by
subtracting the sum of the dimensions of
the leads (with their inherent tolerances)
from the overall dimensions of the part.
70
Gull Wing Leaded SOIC

71
 Dimension “S” Determination
n The inner dimensions between heel
fillets on opposing sides are the most
important
n Inner dimensions are derived by:
F establishingthe maximum width of the
component as measured from lead
termination to lead termination. (This
dimension is shown as "L," and is provided
by the manufacturer).
72
 Root Mean Square (RMS)

n Recommended method to determine the

statistical impact is to summarise the
squares of the tolerances and take
the square-root of their sum (RMS)
n RMS tolerance accumulation =
where

(L tol ) 2
+ 2(Ttol ) 2 Ltol = Lmax – Lmin

Ttol = Tmax – Tmin

73
 Total Tolerances

FC is the the unilateral profile tolerance(s)

for the component
FF is the the unilateral profile tolerance(s)
for the board land pattern
FP is the the diameter of true position
placement accuracy to the centre of the
land pattern

74
 Land Pattern Equations

n Zmax = Lmin + 2JT + CL2 + F2 + P2

n Gmin = Smax – 2JH – CL2 + F2 + P2

n Xmax = Wmin + 2JS + CL2 + F2 + P2

n where
F Z is the overall length of land pattern;
F G is the distance between lands of the pattern;
F X is the width of land pattern;

75
 Component Characteristics
n L is the overall
length of component;
n S is the distance
between component
terminations;
n W is the width of

the lead or
termination;

76
 Solder Joint/Land Protrusion

n J is the desired dimension of solder fillet or

land protrusion;
F Jt is the solder fillet or
land protrusion at toe;
F Jh is the solder fillet or
land protrusion at heel;
F Js is the solder fillet or
land protrusion at side;

77
78
 BGA Land Approximation
n Component manufacturers and board
designers are encouraged to reduce
the land size by some percentage of
the nominal ball diameter
n Reduction is based on the original ball size
Used to determine the average land
n Manufacturing allowance for land size has
been determined to be 0.1 mm between
MMC and LMC

79
 Big Vs. Small Land and Impact
on Routing
n Diameter of the solder land can affect
reliability of solder joints and also the
routing of conductors
n Land diameter is usually smaller than the
ball diameter of the BGA
n Land size reduction of 20 to 25% provides
reliable attachment criteria
n Larger the lands, the less room for routing
between lands.

80
 Land Pattern Approximation

Nominal Ball Nominal Land

Diameter (mm) Reduction Diameter (mm) Land Variation (mm)
0.75 25% 0.55 0.60 - 0.50
0.60 25% 0.45 0.50 - 0.40
0.50 20% 0.40 0.45 - 0.35
0.45 20% 0.35 0.40 - 0.30
0.40 20% 0.30 0.35 - 0.25
0.30 20% 0.25 0.25 - 0.20

81
High Lead and Eutectic Solder
Ball and Joint Comparison

82
Solder Mask Relief Around the
BGA Lands of the Board
Soldermask Relief Around Land ~0 mm 0.75 mm

Top view of land

illustrating increase of
effective land diameter
due to trace connections

Cross-sectional view of
land with solder ball
joint illustrating the
solder wetting down the
edge of the land when
there is solder mask
relief away from the land
edge

83
 International Participation

• IPC submits 782 to International

Electrotechnical Commission (IEC)
• National Committees from Japan, UK,
Germany, Finland, contribute
• Japan recommends patterns for high
tech and low tech density
• IEC documentation started as
IEC 61188 – 5 – 1, 2, 3, 4, 5, 6, 7, 8

84
 Land Pattern Variations
for
Rectangular Two Terminal Devices

Level A Level B Level C

Very Robust General Purpose Minimal Solder Joint
Solder Joint Solder Joint for
High Density Applications

85
 Land Pattern Variations
for
Flat Ribbon ‘L’ and Gull Wing Leads

Level A Level B Level C

Very Robust General Purpose Minimal Solder Joint
Solder Joint Solder Joint for
High Density Applications

86
87
88
89
90
 Conclusion
n Many issues are considered in SMT
design for reliability
n As the industry moves to lead free solder
new evaluations must be made
n Process control is becoming a must

n Automatic X-ray inspection will be a way

of life
n We’ve discussed the tip of the solutions; to
get more join the designers at EXPO
91
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 IPC Designers Summit Mission
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93
 IPC Designers Summit
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94
 IPC Designers Summit
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 IPC Designers Summit Highlights
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International Designers Forum with a Special Keynote Address

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96
 IPC Designers Summit Highlights
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Workshops, Tutorials, and Technical Paper Sessions
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n The How and Why of Obtaining Accurate Impedance Calculations,
Lee Ritchey
n Hand Routing and Designing with BGAs, Wayne Pulliam
n Transmission Lines - Plain and Simple, Eric Bogatin
n Current Carrying Capability of Silver Filled Epoxies, Jerry White
n SMD Land Pattern Design for Manufacturing via Wave Soldering, Gabriel
Briceno
n Embedded Capacitance Materials and their Application in High Speed
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97
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98
 About IPC Printed Circuits Expo®
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IPC Printed Circuits Expo ® is THE most comprehensive tradeshow
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This year, we bring together the best of both worlds by welcoming the
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99
IPC Designers Council Summit
http://ipc.dc.org/summit

100