PCB Hole Outgassing (2007)

Lead-Free Machine Soldering:
PCB Hole Outgassing

Nigel Burtt
Production Engineering Manager
Dolby Laboratories, Inc. – European HQ
Lead-Free Wave and

Selective Soldering
Workshop
SMART Group Lead-Free Wave & Selective Soldering Workshop Dec 5th 2007
PCB laminate selection for Lead-Free
• Laminate choice1
• The common “standard FR4 material” (used pre-RoHS) uses “dicy” cured
resins (epoxy cured with dicyandiamide)
• Most studies (e.g. NPL project) have found that extra performance needed
for lead-free soldering is best met by going to higher Tg laminates using
“phenolic” cured resin systems, also often with additional filler material
• Typical examples: Isola IS410, PCL-FR-370HR, FR408, Nelco N4000-11
• The improved thermal robustness has its drawbacks in terms of
associated mechanical properties
• Stiffer – multi-layer bonding force reduced which may lead to increased
incidence of local delamination after soldering, also copper traces adhere less
well which may give problems for rework
• More brittle – greater risk of delamination at breakout edges
• Harder to drill – can lead to outgassing problems as we shall see
1: see http://www.smartgroup.org/pcb2006/Amorgan.pdf
SMART Group Lead-Free Wave & Selective Soldering Workshop Dec 5th 2007 2
PCB finish selection for Lead-Free
• Main choices2
• HASL
• usually SnCu based alloy replacing SnPb – but flat enough for fine pitch SMT?
• OSP
• inexpensive, but short shelf-life
• ENIG
• Actually soldering to nickel – thin layer of gold just protects the nickel beneath it
• High visual contrast between gold pad and solder joint aids inspection
• Many possible hidden solderability problems (eg “black pad”)
• Immersion Tin
• problem with multiple hand solder rework?
• Immersion Silver
• Compatible metallurgy with SAC solder alloy family
• Some storage care needed – avoid sulphides but silver oxides still conductive
• Skin effect benefits for HF/RF designs?
2: see http://www.smartgroup.org/pcb2006/dprice.pdf
ENIG vs. Immersion Silver for Lead-Free at Dolby
• ENIG
• SMT and mixed technology
• Pressfit OK
• PCB keypad contacts
• Visual contrast aids inspection of SMT
• Problems with incomplete solder hole-fill with no-clean flux
• Occasional solderability problems (e.g. “black pad”) - always found too late!
• Immersion Ag
• SMT, mixed and THT only (use in place of HASL)
• Pressfit OK
• No hole-fill problems
• Careful storage needed
• Reduced solder bridging defects at wave solder?
• Hole outgassing!!
Drilling “tear-out”
• Section usually needs to be taken at
450 to direction of glass fibres in the
laminate in order to reveal this.
• It seems that when the glass bundle is
not aligned with the drill, it can be
gouged and pulled out in chunks. The
copper plating then has to try to fill the
gaps left in the hole walls.
• All laminates gouge this way but the
gouging appears to be deeper and more
severe with the phenolic-cured
laminates used for RoHS assembly.
• Lead-free is much less tolerant of
copper wall defects due to higher
temperatures and copper dissolution.
Wave and selective soldering “blow-holes”
Outgassing from trapped moisture in the laminate or flux activity as the

solder joint forms – large delta T as PCB contacts the wave, especially
with lead-free alloys and even more so with selective soldering (higher
processing temperatures mean increased vapour pressure.) Gases
expand rapidly to produce “blow-hole” before the molten solder
completely solidifies or remain trapped as a “void” after solidification.
Simple Check for Outgassing PCBs from Bob Willis
http://www.bobwillis.co.uk/videoclips/outgassing02.wmv
Solder joint micro-section example (1)
Drilling tear out leaving pinhole in

copper resulting in outgassing and
solder-joint void
Shattered glass bundles causing

copper wicking and leaving areas
behind the copper wall that can trap
moisture.
Tear-out
Pin-holes in
hole wall at
Tear-out
rear
PCB ENIG vs. Immersion Ag Finish and Outgassing
• ENIG
• Nickel layer under the gold appears to “seal” any pores/pin-holes in the copper wall
better than any immersion finish only, so blow-holes less common.
• Preliminary findings from NPL study into laminate reliability suggests the nickel may
add mechanical strength too. IST testing of PCB hole plating barrels shows that
cracks develop around the glass fibre bundles but the nickel appears to help hold
the underlying fractured copper together.
• Immersion Ag
• Thin silver layer does not seal the pin-holes (true also for Immersion Tin and OSP?)
• Possible exacerbating effect of copper dissolution by lead-free alloys on copper
hole plating after immersion finish dissolves? (Especially for selective soldering?)
• Blowholes reduced but found even after pre-bake of PCBs - need to be careful not
to cause tarnish (wrap in aluminium foil beforehand)
• Study with one of our PCB suppliers showed that the outgassing problem was
virtually eradicated if the PCB reverted to certain “lead-free capable” dicy-cured
laminate instead of preferred phenolic-cured type.
• Careful drill setups and even new drill bit designs may help cure “tear-out”
Weigh up the Pros and Cons
ENIG
ImmAg
 Strong visual contrast
 Reduced bridging?
 Nickel reliability
 Better hole-fill
benefits
 Compatible metallurgy
 Poor hole-fill
 Store with care
 Invisible solderability
problems ( “Black Pad”  Outgassing
etc.)
Any Questions?
SMART Group Technical Committee

info@smartgroup.org
+44(0) 1494 465217
Nigel Burtt - Production Engineering Manager

Dolby Laboratories, Inc. - European HQ (c) SMART Group 2007
We accept no liability for the
njb@dolby.co.uk consequence of any action taken on
the basis of information provided
from us.
+44(0) 1793 842132 The information is provided in good
faith. Any views or opinions
presented to you are solely those of
the author and reflect their
understanding of current good
practice and their interpretation of
guidance, regulation and standards.

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Lead-Free Machine Soldering:

PCB Hole Outgassing

Lead-Free Wave and

Outgassing from trapped moisture in the laminate or flux activity as the

Drilling tear out leaving pinhole in

Shattered glass bundles causing

SMART Group Technical Committee

Nigel Burtt - Production Engineering Manager

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