INTEGRATED CIRCUITS

DATA SHEET

TDA1515BQ
24 W BTL or 2 x 12 W stereo
car radio power amplifier
Product specification July 1994
File under Integrated Circuits, IC01
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

The TDA1515BQ is a monolithic integrated class-B output amplifier in a 13-lead single in-line (SIL) plastic power
package. The device is primarily developed for car radio applications, and also to drive low-impedance loads (down to
1,6 Ω). At a supply voltage VP = 14,4 V, an output power of 24 W can be delivered into a 4 Ω BTL (Bridge Tied Load),
or, when used as stereo amplifier, it delivers 2 × 12 W into 2 Ω or 2 × 7 W into 4 Ω.
Special features are:
• flexibility in use − mono BTL as well as stereo
• high output power
• low offset voltage at the output (important for BTL)
• large usable gain variation
• very good ripple rejection
• internal limited bandwidth for high frequencies
• low stand-by current possibility (typ. 1 µA), to simplify required switches; TTL drive possible
• low number and small sized external components
• high reliability.
The following currently required protections are incorporated in the circuit. These protections also have positive influence
on reliability in the applications.
• load dump protection
• a.c. and d.c. short-circuit safe to ground up to VP = 18 V
• thermal protection
• speaker protection in bridge configuration
• SOAR protection
• outputs short-circuit safe to ground in BTL
• reverse polarity safe.

July 1994 2
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

QUICK REFERENCE DATA

Supply voltage range (operating) VP 6 to 18 V
Supply voltage (non-operating) VP max. 28 V
Supply voltage (non-operating; load dump protection) VP max. 45 V
Repetitive peak output current IORM max. 4 A
Total quiescent current Itot typ. 75 mA
Stand-by current Isb typ. 1 µA
Switch-on current Iso < 100 µA
Input impedance |Zi| > 1 MΩ
Bridge tied load application (BTL) VP = 14,4 13,2 V
Output power at RL = 4 Ω (with bootstrap)
dtot = 0,5% Po typ. 18 15 W
dtot = 10% Po typ. 24 20 W
Supply voltage ripple rejection; RS = 0 Ω; f = 100 Hz RR typ. 50 50 dB
D.C. output offset voltage between the outputs |∆V5-9| < 50 50 mV

Stereo application
Output power at dtot = 10% (with bootstrap)
RL = 4 Ω Po typ. 7 6 W
RL = 2 Ω Po typ. 12 10 W
Output power at dtot = 0,5% (with bootstrap)
RL = 4 Ω Po typ. 5,5 4,5 W
RL = 2 Ω Po typ. 9 7,5 W
Channel separation α > 40 40 dB
Noise output voltage; RS = 10 kΩ; according to IEC curve-A Vn typ. 0,2 0,2 mV

PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141C); SOT141-6; 1996 July 19.

July 1994 3
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

Fig.1 Internal block diagram; the heavy lines indicate the signal paths.

RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage; operating (pin 10) VP max. 18 V
Supply voltage; non-operating VP max. 28 V
Supply voltage; during 50 ms (load dump protection) VP max. 45 V
Peak output current IOM max. 6A
Total power dissipation see derating curve Fig.2
Storage temperature range Tstg −55 to + 150 °C
Crystal temperature Tc max. 150 °C
A.C. and d.c. short-circuit safe voltage max. 18 V
Reverse polarity max. 10 V

July 1994 4
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

Fig.2 Power derating curves.

HEATSINK DESIGN EXAMPLE

The derating of 3 K/W of the encapsulation requires the following external heatsink (for sine-wave drive):
24 W BTL (4 Ω) or 2 × 12 W stereo (2 Ω)
maximum sine-wave dissipation: 12 W
Tamb = 65 °C maximum
150 – 65
R th h-a = ---------------------- = – 3 = 4 K/W
12

2 × 7 W stereo (4 Ω)
maximum sine-wave dissipation: 6 W
Tamb = 65 °C maximum
150 – 65
R th h-a = ---------------------- = – 3 = 11 K/W
6

July 1994 5
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

D.C. CHARACTERISTICS
Supply voltage range (pin 10) VP 6 to 18 V
Repetitive peak output current IORM < 4A
Total quiescent current Itot typ. 75 mA
Switching level 11: OFF V11 < 1,8 V
ON V11 > 3V
Impedance between pins 10 and 6; 10 and 8 (stand-by position V11 < 1,8 V) |ZOFF| > 100 kΩ
typ. 1 µA
Stand-by current at V11 = 0 to 0,8 V Isb
< 100 µA
typ. 10 µA
Switch-on current (pin 11) at V11 ≤ V10 (note 1) Iso
< 100 µA

A.C. CHARACTERISTICS
Tamb = 25 °C; VP = 14,4 V; f = 1 kHz; unless otherwise specified

Bridge tied load application (BTL); see Fig.3

Output power at RL = 4 Ω (with bootstrap)
> 15,5 W
VP = 14,4 V; dtot = 0,5% Po
typ. 18 W
> 20 W
VP = 14,4 V; dtot = 10% Po
typ. 24 W
VP = 13,2 V; dtot = 0,5% Po typ. 15 W
VP = 13,2 V; dtot = 10% Po typ. 20 W
Open loop voltage gain Go typ. 75 dB
Closed loop voltage gain (note 2) Gc typ. 40 (± 0,5) dB
Output power without bootstrap (note 9)
VP = 14,4 V; dtot = 10% Po typ. 15 W
VP = 14,4 V; dtot = 0,5% Po typ. 12 W
VP = 13,2 V; dtot = 10% Po typ. 12 W
VP = 13,2 V; dtot = 0,5% Po typ. 9 W
Frequency response at −3 dB (note 3) B 20 Hz to min. 20 kHz
Input impedance (note 4) |Zi| > 1 MΩ
Noise input voltage (r.m.s. value) at f = 20 Hz to 20 kHz
RS = 0 Ω Vn(rms) typ. 0,2 mV
typ. 0,35 mV
RS = 10 kΩ Vn(rms)
< 0,8 mV
RS = 10 kΩ; according to IEC 179 curve A Vn typ. 0,25 mV
Supply voltage ripple rejection (note 5)
> 42 dB
f = 100 Hz RR
typ. 50 dB

July 1994 6
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

< 50 mV
D.C. output offset voltage between the outputs |∆V5-9|
typ. 2 mV
Loudspeaker protection (all conditions)
maximum d.c. voltage (across the load) |∆V5-9| < 1 V
Power bandwidth; −1 dB; dtot = 0,5% B 30 Hz to 40 kHz
Stereo application; see Fig.4
Output power at dtot = 10%; with bootstrap (note 6)
> 6 W
VP = 14,4 V; RL = 4 Ω Po
typ. 7 W
> 10 W
VP = 14,4 V; RL = 2 Ω Po
typ. 12 W
VP = 13,2 V; RL = 4 Ω Po typ. 6 W
VP = 13,2 V; RL = 2 Ω Po typ. 10 W
Output power at dtot = 0,5%; with bootstrap (note 6)
VP = 14,4 V; RL = 4 Ω Po typ. 5,5 W
VP = 14,4 V; RL = 2 Ω Po typ. 9 W
VP = 13,2 V; RL = 4 Ω Po typ. 4,5 W
VP = 13,2 V; RL = 2 Ω Po typ. 7,5 W
Output power at dtot = 10%; without bootstrap
VP = 14,4 V; RL = 4 Ω (notes 6, 8 and 9) Po typ. 6 W
Frequency response at −3 dB (note 3) B 40 Hz to min. 20 kHz
Supply voltage ripple rejection (note 5) RR typ. 50 dB
> 40 dB
Channel separation; RS = 10 kΩ; f = 1 kHz α
typ. 50 dB
Closed loop voltage gain (note 7) Gc typ. 40 dB
Noise output voltage (r.m.s. value) at f = 20 Hz to 20 kHz
RS = 0 Ω Vn(rms) typ. 0,15 mV
RS = 10 kΩ Vn(rms) typ. 0,25 mV
RS = 10 kΩ; according to IEC 179 curve A Vn typ. 0,2 mV
Notes
1. The internal circuit impedance at pin 11 is > 5 kΩ if V11 > V10.
2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components.
For further gain reduction see Application Report.
3. Frequency response externally fixed.
4. The input impedance in the test circuit (Fig.3) is typ. 100 kΩ.
5. Supply voltage ripple rejection measured with a source impedance of 0 Ω (maximum ripple amplitude: 2 V).
6. Output power is measured directly at the output pins of the IC.
7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components.
8. A resistor of 56 kΩ between pins 3 and 7 to reach symmetrical clipping.
9. Without bootstrap the 100 µF capacitor between pins 5 and 6 (8 and 9) can be omitted. Pins 6, 8 and 10 have to be
interconnected.

July 1994 7
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

(1) Belongs to power supply.

Fig.3 Test/application circuit bridge tied load (BTL).

handbook, full pagewidth 100 kΩ 100 kΩ

47 stand-by switch
µF
VP

0.1 µF (1)
4 3 11 10
2 12

0.1 µF 1 TDA1515BQ 13 0.1 µF

6 5 9 8 7

100 kΩ 100 µF 100 µF 100 kΩ

0.1
1 kΩ 0.1 µF 1 mF 1 mF
µF 1 kΩ

4.7
10 µF 4.7 Ω RL RL 10 µF
Ω

MLA320 - 1

(1) Belongs to power supply.

Fig.4 Test/application circuit stereo.

July 1994 8
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

PACKAGE OUTLINE

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6

non-concave
Dh
x

Eh

view B: mounting base side

d A2

j E

L3

L Q

c v M

1 13

Z e1 w M m e2
bp
e

0 5 10 mm
scale

DIMENSIONS (mm are the original dimensions)

UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1)

17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 12.4 2.4 2.1 2.00
mm 10 3.4 1.7 5.08 4.3 0.8 0.25 0.03
15.5 4.2 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

95-03-11
SOT141-6
97-12-16

July 1994 9
Philips Semiconductors Product specification

24 W BTL or 2 x 12 W stereo
TDA1515BQ
car radio power amplifier

SOLDERING The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the
Introduction
specified maximum storage temperature (Tstg max). If the
There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling
packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the
through-hole and surface mounted components are mixed temperature within the permissible limit.
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for Repairing soldered joints
printed-circuits with high population densities. In these
Apply a low voltage soldering iron (less than 24 V) to the
situations reflow soldering is often used.
lead(s) of the package, below the seating plane or not
This text gives a very brief insight to a complex technology. more than 2 mm above it. If the temperature of the
A more in-depth account of soldering ICs can be found in soldering iron bit is less than 300 °C it may remain in
our “IC Package Databook” (order code 9398 652 90011). contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

July 1994 10
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