SDT400 B
SDT400 B
SDT400 B
DC Input
60V / 70V / 80V
Photo-Transistor Optocoupler
Description Features
The SDT400 consists of a phototransistor optically coupled VCEO = 60V / 70V / 80V
to a light emitting diode. Optical coupling between the Small 4 pin DIP/SMD package
input IR LED and output phototransistor allows for high Low input power consumption
isolation levels while maintaining low-level DC signal High stability
control capability. The SDT400 provides an optically CTR Range 50 – 600%
isolated method of controlling many interface applications High Isolation Voltage (5000VRMS)
such as telecommunications, industrial control and Long Life / High Reliability
instrumentation circuitry. RoHS / Pb-Free / REACH Compliant
The SDT400 comes standard in a miniature 4 pin DIP
package. Agency Approvals
Output Specifications
Collector-Emitter Voltage VCEO 60 - - V IC=100A
-7 VCEO Option VCEO 70 - - V IC=100A
-8 VCEO Option VCEO 80 - - V IC=100A
Emitter-Collector Voltage VECO 6 - - V IE=10A
Collector Dark Current ICEO - - 100 nA VCE=20V
Collector Current IC 2.5 - 30 mA IF=5mA, VCE=5V
Floating Capacitance Cf - 0.6 1.0 pF VCE=0, f=1MHz
Cut-Off Frequency fC - 80 - kHz VCE=5V, IC=2mA, RL=100-3dB
Saturation Voltage VCE(sat) - 0.1 0.2 V IF=20mA, IC=1mA
Coupled Specifications
Rise Time TR - 4 - S IC=2mA, VCC=2V, RL=100
Fall Time TF - 3 - S IC=2mA, VCC=2V, RL=100
Current Transfer Ratio CTR 50 - 600 % IF=5mA, VCE=5V
CTR Classification (BINNING)
-A 80 - 160 % IF=5mA, VCE=5V
-B 130 - 260 % IF=5mA, VCE=5V
-C 200 - 400 % IF=5mA, VCE=5V
-D 300 - 600 % IF=5mA, VCE=5V
-E 50 - 600 % IF=5mA, VCE=5V
Isolation Specifications
Isolation Voltage VISO 5000 - - VRMS RH ≤ 50%, t=1min
12
Input-Output Resistance RI-O - 10 - VI-O = 500VDC
Figure 1: Forward Current (IF) vs. Temperature (°C) Figure 2: Collector Power Dissipation (PC) vs. Temperature (°C)
Figure 3: Collector-Emitter Saturation Voltage (VCE(SAT)) vs. Figure 4: Forward Current (IF) vs. Forward Voltage (VF)
Forward Current (IF)
Figure 5: Collector Current (IC) vs. Collector-Emitter Figure 6: Current Transfer Ratio (CTR) vs. Forward Current (IF)
Voltage (VCE)
Figure 7: Relative CTR (%) vs. Temperature (°C) Figure 8: Collector-Emitter Saturation Voltage (VCE(SAT)) vs.
Temperature (°C)
Figure 9: Collector Dark Current (ICEO) vs. Temperature (°C) Figure 10: Response Times vs. Load Resistance (RL)
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
D
E
H
B
Process
Description Parameter
Step
A Preheat Start Temperature (ºC) 150ºC
B Preheat Finish Temperature (ºC) 180ºC
C Preheat Time (s) 90 - 120s
D Melting Temperature (ºC) 230ºC
E Time above Melting Temperature (s) 30s
F Peak Temperature, at Terminal (ºC) 260ºC
G Dwell Time at Peak Temperature (s) 10s
H Cool-down (ºC/s) <6ºC/s
4 PIN DIP Package Note: All dimensions in millimeters [mm] with inches in parenthesis ()
4 PIN WIDE Lead Space Package (-H) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
4 PIN SMD Surface Mount Package (-S) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
Tape & Reel Specifications (T&R) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
D E F P P1 P2 W T
1.55±0.05 1.75±0.1 7.5±0.1 12.0±0.1 4.0±0.1 2.0±0.1 16.0±0.3 0.3±0.05
L M N O Q R S
330±2 101.6±1 16.4+0.2 2.0±0.2 R13±0.5 1.50±0.5 R10±1
SDT400 – W X Y Z
VCEO Voltage
- Blank 60V Packaging / Lead Form
- “7” 70V - Blank Standard DIP
- “8” 80V -S SMD Form
- STR SMD +
Tape & Reel
CTR Binning
-A 80-160%
-B 130-260% VDE Lead Spacing
-C 200-400%
-D 300-600% - Blank Standard DIP
- E or Blank 50-600% - “H” 0.40” Lead Spacing
DISCLAIMER
Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO
reserves the right to make changes to product description, specifications at any time without further notices.
SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent
licenses nor indemnity are expressed or implied.
Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other
warranty, expressed or implied, including merchantability and fitness for particular use.