DS18B20 Programmable Resolution 1-Wire Digital Thermometer: Features Pin Assignment
DS18B20 Programmable Resolution 1-Wire Digital Thermometer: Features Pin Assignment
DS18B20 Programmable Resolution 1-Wire Digital Thermometer: Features Pin Assignment
DS18B20
Programmable Resolution
1-Wire® Digital Thermometer
www.dalsemi.com
GND
VDD
Converts 12-bit temperature to digital word in
750 ms (max.) DQ 4 5 GND
User-definable, nonvolatile temperature alarm
settings DS18B20Z
Alarm search command identifies and 8-Pin SOIC (150 mil)
addresses devices whose temperature is
outside of programmed limits (temperature PIN DESCRIPTION
alarm condition) GND - Ground
Applications include thermostatic controls, DQ - Data In/Out
industrial systems, consumer products, VDD - Power Supply Voltage
thermometers, or any thermally sensitive NC - No Connect
system
DESCRIPTION
The DS18B20 Digital Thermometer provides 9 to 12-bit (configurable) temperature readings which
indicate the temperature of the device.
Information is sent to/from the DS18B20 over a 1-Wire interface, so that only one wire (and ground)
needs to be connected from a central microprocessor to a DS18B20. Power for reading, writing, and
performing temperature conversions can be derived from the data line itself with no need for an external
power source.
Because each DS18B20 contains a unique silicon serial number, multiple DS18B20s can exist on the
same 1-Wire bus. This allows for placing temperature sensors in many different places. Applications
where this feature is useful include HVAC environmental controls, sensing temperatures inside buildings,
equipment or machinery, and process monitoring and control.
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DS18B20
DETAILED PIN DESCRIPTION Table 1
PIN PIN
8PIN SOIC TO92 SYMBOL DESCRIPTION
5 1 GND Ground.
4 2 DQ Data Input/Output pin. For 1-Wire operation: Open
drain. (See “Parasite Power” section.)
3 3 VDD Optional VDD pin. See “Parasite Power” section for
details of connection. VDD must be grounded for
operation in parasite power mode.
DS18B20Z (8-pin SOIC): All pins not specified in this table are not to be connected.
OVERVIEW
The block diagram of Figure 1 shows the major components of the DS18B20. The DS18B20 has four
main data components: 1) 64-bit lasered ROM, 2) temperature sensor, 3) nonvolatile temperature alarm
triggers TH and TL, and 4) a configuration register. The device derives its power from the 1-Wire
communication line by storing energy on an internal capacitor during periods of time when the signal line
is high and continues to operate off this power source during the low times of the 1-Wire line until it
returns high to replenish the parasite (capacitor) supply. As an alternative, the DS18B20 may also be
powered from an external 3 volt - 5.5 volt supply.
Communication to the DS18B20 is via a 1-Wire port. With the 1-Wire port, the memory and control
functions will not be available before the ROM function protocol has been established. The master must
first provide one of five ROM function commands: 1) Read ROM, 2) Match ROM, 3) Search ROM, 4)
Skip ROM, or 5) Alarm Search. These commands operate on the 64-bit lasered ROM portion of each
device and can single out a specific device if many are present on the 1-Wire line as well as indicate to
the bus master how many and what types of devices are present. After a ROM function sequence has
been successfully executed, the memory and control functions are accessible and the master may then
provide any one of the six memory and control function commands.
One control function command instructs the DS18B20 to perform a temperature measurement. The result
of this measurement will be placed in the DS18B20’s scratch-pad memory, and may be read by issuing a
memory function command which reads the contents of the scratchpad memory. The temperature alarm
triggers TH and TL consist of 1 byte EEPROM each. If the alarm search command is not applied to the
DS18B20, these registers may be used as general purpose user memory. The scratchpad also contains a
configuration byte to set the desired resolution of the temperature to digital conversion. Writing TH, TL,
and the configuration byte is done using a memory function command. Read access to these registers is
through the scratchpad. All data is read and written least significant bit first.
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DS18B20
DS18B20 BLOCK DIAGRAM Figure 1
MEMORY AND
CONTROL LOGIC
64-BIT ROM
DQ AND
1-WIRE PORT
TEMPERATURE SENSOR
LOW TEMPERATURE
TRIGGER, TL
POWER
VDD SUPPLY 8-BIT CRC
SENSE GENERATOR CONFIGURATION
REGISTER
PARASITE POWER
The block diagram (Figure 1) shows the parasite-powered circuitry. This circuitry “steals” power
whenever the DQ or VDD pins are high. DQ will provide sufficient power as long as the specified timing
and voltage requirements are met (see the section titled “1-Wire Bus System”). The advantages of
parasite power are twofold: 1) by parasiting off this pin, no local power source is needed for remote
sensing of temperature, and 2) the ROM may be read in absence of normal power.
In order for the DS18B20 to be able to perform accurate temperature conversions, sufficient power must
be provided over the DQ line when a temperature conversion is taking place. Since the operating current
of the DS18B20 is up to 1.5 mA, the DQ line will not have sufficient drive due to the 5k pullup resistor.
This problem is particularly acute if several DS18B20s are on the same DQ and attempting to convert
simultaneously.
There are two ways to assure that the DS18B20 has sufficient supply current during its active conversion
cycle. The first is to provide a strong pullup on the DQ line whenever temperature conversions or copies
to the E2 memory are taking place. This may be accomplished by using a MOSFET to pull the DQ line
directly to the power supply as shown in Figure 2. The DQ line must be switched over to the strong pull-
up within 10 µs maximum after issuing any protocol that involves copying to the E2 memory or initiates
temperature conversions. When using the parasite power mode, the VDD pin must be tied to ground.
Another method of supplying current to the DS18B20 is through the use of an external power supply tied
to the VDD pin, as shown in Figure 3. The advantage to this is that the strong pullup is not required on the
DQ line, and the bus master need not be tied up holding that line high during temperature conversions.
This allows other data traffic on the 1-Wire bus during the conversion time. In addition, any number of
DS18B20s may be placed on the 1-Wire bus, and if they all use external power, they may all
simultaneously perform temperature conversions by issuing the Skip ROM command and then issuing the
Convert T command. Note that as long as the external power supply is active, the GND pin may not be
floating.
The use of parasite power is not recommended above 100°C, since it may not be able to sustain
communications given the higher leakage currents the DS18B20 exhibits at these temperatures. For
applications in which such temperatures are likely, it is strongly recommended that VDD be applied to the
DS18B20.
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DS18B20
For situations where the bus master does not know whether the DS18B20s on the bus are parasite
powered or supplied with external VDD, a provision is made in the DS18B20 to signal the power supply
scheme used. The bus master can determine if any DS18B20s are on the bus which require the strong
pullup by sending a Skip ROM protocol, then issuing the read power supply command. After this
command is issued, the master then issues read time slots. The DS18B20 will send back “0” on the
1-Wire bus if it is parasite powered; it will send back a “1” if it is powered from the VDD pin. If the
master receives a “0,” it knows that it must supply the strong pullup on the DQ line during temperature
conversions. See “Memory Command Functions” section for more detail on this command protocol.
+3V - +5.5V
GND VDD
4.7k
µP
I/O
+3V - +5.5V
4.7k VDD
EXTERNAL
I/O +3V - +5.5V
µP
SUPPLY
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DS18B20
OPERATION - MEASURING TEMPERATURE
The core functionality of the DS18B20 is its direct-to-digital temperature sensor. The resolution of the
DS18B20 is configurable (9, 10, 11, or 12 bits), with 12-bit readings the factory default state. This
equates to a temperature resolution of 0.5°C, 0.25°C, 0.125°C, or 0.0625°C. Following the issuance of
the Convert T [44h] command, a temperature conversion is performed and the thermal data is stored in
the scratchpad memory in a 16-bit, sign-extended two’s complement format. The temperature
information can be retrieved over the 1-Wire interface by issuing a Read Scratchpad [BEh] command
once the conversion has been performed. The data is transferred over the 1-Wire bus, LSB first. The
MSB of the temperature register contains the “sign” (S) bit, denoting whether the temperature is positive
or negative.
Table 2 describes the exact relationship of output data to measured temperature. The table assumes 12-bit
resolution. If the DS18B20 is configured for a lower resolution, insignificant bits will contain zeros. For
Fahrenheit usage, a lookup table or conversion routine must be used.
S S S S S 26 25 24 MSB
CRC GENERATION
The DS18B20 has an 8-bit CRC stored in the most significant byte of the 64-bit ROM. The bus master
can compute a CRC value from the first 56-bits of the 64-bit ROM and compare it to the value stored
within the DS18B20 to determine if the ROM data has been received error-free by the bus master. The
equivalent polynomial function of this CRC is:
CRC = X8 + X5 + X4 + 1
The DS18B20 also generates an 8-bit CRC value using the same polynomial function shown above and
provides this value to the bus master to validate the transfer of data bytes. In each case where a CRC is
used for data transfer validation, the bus master must calculate a CRC value using the polynomial
function given above and compare the calculated value to either the 8-bit CRC value stored in the 64-bit
ROM portion of the DS18B20 (for ROM reads) or the 8-bit CRC value computed within the DS18B20
(which is read as a ninth byte when the scratchpad is read). The comparison of CRC values and decision
to continue with an operation are determined entirely by the bus master. There is no circuitry inside the
DS18B20 that prevents a command sequence from proceeding if the CRC stored in or calculated by the
DS18B20 does not match the value generated by the bus master.
The 1-Wire CRC can be generated using a polynomial generator consisting of a shift register and XOR
gates as shown in Figure 6. Additional information about the Dallas 1-Wire Cyclic Redundancy Check is
available in Application Note 27 entitled “Understanding and Using Cyclic Redundancy Checks with
Dallas Semiconductor Touch Memory Products.”
The shift register bits are initialized to 0. Then starting with the least significant bit of the family code,
1 bit at a time is shifted in. After the 8th bit of the family code has been entered, then the serial number is
entered. After the 48th bit of the serial number has been entered, the shift register contains the CRC
value. Shifting in the 8 bits of CRC should return the shift register to all 0s.
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DS18B20
ROM FUNCTIONS FLOW CHART Figure 5
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DS18B20
1-WIRE CRC CODE Figure 6
INPUT
(MSB) (LSB)
MEMORY
The DS18B20’s memory is organized as shown in Figure 8. The memory consists of a scratchpad RAM
and a nonvolatile, electrically erasable (E2) RAM, which stores the high and low temperature triggers TH
and TL, and the configuration register. The scratchpad helps insure data integrity when communicating
over the 1-Wire bus. Data is first written to the scratchpad using the Write Scratchpad [4Eh] command.
It can then be verified by using the Read Scratchpad [BEh] command. After the data has been verified, a
Copy Scratchpad [48h] command will transfer the data to the nonvolatile (E2) RAM. This process insures
data integrity when modifying memory. The DS18B20 EEPROM is rated for a minimum of 50,000
writes and 10 years data retention at T = +55°C.
The scratchpad is organized as eight bytes of memory. The first 2 bytes contain the LSB and the MSB of
the measured temperature information, respectively. The third and fourth bytes are volatile copies of TH
and TL and are refreshed with every power-on reset. The fifth byte is a volatile copy of the configuration
register and is refreshed with every power-on reset. The configuration register will be explained in more
detail later in this section of the datasheet. The sixth, seventh, and eighth bytes are used for internal
computations, and thus will not read out any predictable pattern.
It is imperative that one writes TH, TL, and config in succession; i.e. a write is not valid if one writes
only to TH and TL, for example, and then issues a reset. If any of these bytes must be written, all three
must be written before a reset is issued.
There is a ninth byte which may be read with a Read Scratchpad [BEh] command. This byte contains a
cyclic redundancy check (CRC) byte which is the CRC over all of the eight previous bytes. This CRC is
implemented in the fashion described in the section titled “CRC Generation”.
Configuration Register
The fifth byte of the scratchpad memory is the configuration register.
It contains information which will be used by the device to determine the resolution of the temperature to
digital conversion. The bits are organized as shown in Figure 7.
0 R1 R0 1 1 1 1 1
MSb LSb
Bits 0-4 are don’t cares on a write but will always read out “1”.
Bit 7 is a don’t care on a write but will always read out “0”.
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DS18B20
R0, R1: Thermometer resolution bits. Table 3 below defines the resolution of the digital thermometer,
based on the settings of these 2 bits. There is a direct tradeoff between resolution and conversion time, as
depicted in the AC Electrical Characteristics. The factory default of these EEPROM bits is R0=1 and
R1=1 (12-bit conversions).
SCRATCHPAD E2 RAM
BYTE
TEMPERATURE LSB 0
TEMPERATURE MSB 1
CONFIG 4 CONFIG
RESERVED 5
RESERVED 6
RESERVED 7
CRC 8
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DS18B20
1-WIRE BUS SYSTEM
The 1-Wire bus is a system which has a single bus master and one or more slaves. The DS18B20
behaves as a slave. The discussion of this bus system is broken down into three topics: hardware
configuration, transaction sequence, and 1-Wire signaling (signal types and timing).
HARDWARE CONFIGURATION
The 1-Wire bus has only a single line by definition; it is important that each device on the bus be able to
drive it at the appropriate time. To facilitate this, each device attached to the 1-Wire bus must have open
drain or 3-state outputs. The 1-Wire port of the DS18B20 (DQ pin) is open drain with an internal circuit
equivalent to that shown in Figure 9. A multidrop bus consists of a 1-Wire bus with multiple slaves
attached. The 1-Wire bus requires a pullup resistor of approximately 5 kΩ.
RX RX
5 µA
Typ. TX
TX
100 OHM
MOSFET
RX = RECEIVE
TX = TRANSMIT
The idle state for the 1-Wire bus is high. If for any reason a transaction needs to be suspended, the bus
MUST be left in the idle state if the transaction is to resume. Infinite recovery time can occur between
bits so long as the 1-Wire bus is in the inactive (high) state during the recovery period. If this does not
occur and the bus is left low for more than 480 µs, all components on the bus will be reset.
TRANSACTION SEQUENCE
The protocol for accessing the DS18B20 via the 1-Wire port is as follows:
Initialization
Transaction/Data
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DS18B20
INITIALIZATION
All transactions on the 1-Wire bus begin with an initialization sequence. The initialization sequence
consists of a reset pulse transmitted by the bus master followed by presence pulse(s) transmitted by the
slave(s).
The presence pulse lets the bus master know that the DS18B20 is on the bus and is ready to operate. For
more details, see the “1-Wire Signaling” section.
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DS18B20
Example of a ROM Search
The ROM search process is the repetition of a simple three-step routine: read a bit, read the complement
of the bit, then write the desired value of that bit. The bus master performs this simple, three-step routine
on each bit of the ROM. After one complete pass, the bus master knows the contents of the ROM in one
device. The remaining number of devices and their ROM codes may be identified by additional passes.
The following example of the ROM search process assumes four different devices are connected to the
same 1-Wire bus. The ROM data of the four devices is as shown:
ROM1 00110101...
ROM2 10101010...
ROM3 11110101...
ROM4 00010001...
1. The bus master begins the initialization sequence by issuing a reset pulse. The slave devices respond
by issuing simultaneous presence pulses.
2. The bus master will then issue the Search ROM command on the 1-Wire bus.
3. The bus master reads a bit from the 1-Wire bus. Each device will respond by placing the value of the
first bit of their respective ROM data onto the 1-Wire bus. ROM1 and ROM4 will place a 0 onto the
1-Wire bus, i.e., pull it low. ROM2 and ROM3 will place a 1 onto the 1-Wire bus by allowing the
line to stay high. The result is the logical AND of all devices on the line, therefore the bus master
sees a 0. The bus master reads another bit. Since the Search ROM data command is being executed,
all of the devices on the 1-Wire bus respond to this second read by placing the complement of the first
bit of their respective ROM data onto the 1-Wire bus. ROM1 and ROM4 will place a 1 onto the
1-Wire, allowing the line to stay high. ROM2 and ROM3 will place a 0 onto the 1-Wire, thus it will
be pulled low. The bus master again observes a 0 for the complement of the first ROM data bit. The
bus master has determined that there are some devices on the 1-Wire bus that have a 0 in the first
position and others that have a 1.
The data obtained from the two reads of the three-step routine have the following interpretations:
00 There are still devices attached which have conflicting bits in this position.
01 All devices still coupled have a 0-bit in this bit position.
10 All devices still coupled have a 1-bit in this bit position.
11 There are no devices attached to the 1-Wire bus.
4. The bus master writes a 0. This deselects ROM2 and ROM3 for the remainder of this search pass,
leaving only ROM1 and ROM4 connected to the 1-Wire bus.
5. The bus master performs two more reads and receives a 0-bit followed by a 1-bit. This indicates that
all devices still coupled to the bus have 0s as their second ROM data bit.
6. The bus master then writes a 0 to keep both ROM1 and ROM4 coupled.
7. The bus master executes two reads and receives two 0-bits. This indicates that both 1-bits and 0-bits
exist as the 3rd bit of the ROM data of the attached devices.
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DS18B20
8. The bus master writes a 0-bit. This deselects ROM1, leaving ROM4 as the only device still
connected.
9. The bus master reads the remainder of the ROM bits for ROM4 and continues to access the part if
desired. This completes the first pass and uniquely identifies one part on the 1-Wire bus.
10. The bus master starts a new ROM search sequence by repeating steps 1 through 7.
11. The bus master writes a 1-bit. This decouples ROM4, leaving only ROM1 still coupled.
12. The bus master reads the remainder of the ROM bits for ROM1 and communicates to the underlying
logic if desired. This completes the second ROM search pass, in which another of the ROMs was
found.
13. The bus master starts a new ROM search by repeating steps 1 through 3.
14. The bus master writes a 1-bit. This deselects ROM1 and ROM4 for the remainder of this search pass,
leaving only ROM2 and ROM3 coupled to the system.
15. The bus master executes two Read time slots and receives two 0s.
16. The bus master writes a 0-bit. This decouples ROM3 leaving only ROM2.
17. The bus master reads the remainder of the ROM bits for ROM2 and communicates to the underlying
logic if desired. This completes the third ROM search pass, in which another of the ROMs was
found.
18. The bus master starts a new ROM search by repeating steps 13 through 15.
19. The bus master writes a 1-bit. This decouples ROM2, leaving only ROM3.
20. The bus master reads the remainder of the ROM bits for ROM3 and communicates to the underlying
logic if desired. This completes the fourth ROM search pass, in which another of the ROMs was
found.
NOTE:
The bus master learns the unique ID number (ROM data pattern) of one 1-Wire device on each ROM
Search operation. The time required to derive the part’s unique ROM code is:
The bus master is therefore capable of identifying 75 different 1-Wire devices per second.
I/O SIGNALING
The DS18B20 requires strict protocols to insure data integrity. The protocol consists of several types of
signaling on one line: reset pulse, presence pulse, write 0, write 1, read 0, and read 1. All of these signals,
with the exception of the presence pulse, are initiated by the bus master.
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DS18B20
The initialization sequence required to begin any communication with the DS18B20 is shown in
Figure 11. A reset pulse followed by a presence pulse indicates the DS18B20 is ready to send or receive
data given the correct ROM command and memory function command.
The bus master transmits (TX) a reset pulse (a low signal for a minimum of 480 µs). The bus master then
releases the line and goes into a receive mode (RX). The 1-Wire bus is pulled to a high state via the 5k
pullup resistor. After detecting the rising edge on the DQ pin, the DS18B20 waits 15-60 µs and then
transmits the presence pulse (a low signal for 60-240 µs).
Convert T [44h]
This command begins a temperature conversion. No further data is required. The temperature
conversion will be performed and then the DS18B20 will remain idle. If the bus master issues read time
slots following this command, the DS18B20 will output 0 on the bus as long as it is busy making a
temperature conversion; it will return a 1 when the temperature conversion is complete. If parasite-
powered, the bus master has to enable a strong pullup for a period greater than tconv immediately after
issuing this command.
Recall E2 [B8h]
This command recalls the temperature trigger values and configuration register stored in E2 to the
scratchpad. This recall operation happens automatically upon power-up to the DS18B20 as well, so valid
data is available in the scratchpad as soon as the device has power applied. With every read data time slot
issued after this command has been sent, the device will output its temperature converter busy flag:
0=busy, 1=ready.
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DS18B20
MEMORY FUNCTIONS FLOW CHART Figure 10
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DS18B20
MEMORY FUNCTIONS FLOW CHART Figure 10 (cont’d)
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DS18B20
MEMORY FUNCTIONS FLOW CHART Figure 10 (cont’d)
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DS18B20
INITIALIZATION PROCEDURE “RESET AND PRESENCE PULSES” Figure 11
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DS18B20
NOTES:
1. Temperature conversion takes up to 750 ms. After receiving the Convert T protocol, if the part does
not receive power from the VDD pin, the DQ line for the DS18B20 must be held high for at least a
period greater than tconv to provide power during the conversion process. As such, no other activity
may take place on the 1-Wire bus for at least this period after a Convert T command has been issued.
2. After receiving the Copy Scratchpad protocol, if the part does not receive power from the VDD pin, the
DQ line for the DS18B20 must be held high for at least 10 ms to provide power during the copy
process. As such, no other activity may take place on the 1-Wire bus for at least this period after a
Copy Scratchpad command has been issued.
The DS18B20 samples the DQ line in a window of 15 µs to 60 µs after the DQ line falls. If the line is
high, a Write 1 occurs. If the line is low, a Write 0 occurs (see Figure 12).
For the host to generate a Write 1 time slot, the data line must be pulled to a logic low level and then
released, allowing the data line to pull up to a high level within 15 µs after the start of the write time slot.
For the host to generate a Write 0 time slot, the data line must be pulled to a logic low level and remain
low for 60 µs.
Figure 12 shows that the sum of TINIT, TRC, and TSAMPLE must be less than 15 µs. Figure 14 shows that
system timing margin is maximized by keeping TINIT and TRC as small as possible and by locating the
master sample time towards the end of the 15-µs period.
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DS18B20
READ/WRITE TIMING DIAGRAM Figure 12
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DS18B20
DETAILED MASTER READ 1 TIMING Figure 13
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DS18B20
Related Application Notes
The following Application Notes can be applied to the DS18B20. These notes can be obtained from the
Dallas Semiconductor “Application Note Book,” via our website at http://www.dalsemi.com/.
Application Note 27: “Understanding and Using Cyclic Redundancy Checks with Dallas Semiconductor
Touch Memory Product”
Application Note 74: “Reading and Writing Touch Memories via Serial Interfaces”
Sample 1-Wire subroutines that can be used in conjunction with AN74 can be downloaded from the
website or our Anonymous FTP Site.
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DS18B20
MEMORY FUNCTION EXAMPLE Table 6
Example: Bus Master writes memory (parasite power and only one DS18B20 assumed).
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DS18B20
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground -0.5V to +6.0V
Operating Temperature -55°C to +125°C
Storage Temperature -55°C to +125°C
Soldering Temperature See J-STD-020A specification
* This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
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DS18B20
AC ELECTRICAL CHARACTERISTICS: (-55°C to +125°C; VDD=3.0V to 5.5V)
PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS NOTES
Temperature tCONV
9 bit 93.75 ms
Conversion
Time 10 bit 187.5
11 bit 375
12 bit 750
Time Slot tSLOT 60 120 µs
Recovery Time tREC 1 µs
Write 0 Low Time rLOW0 60 120 µs
Write 1 Low Time tLOW1 1 15 µs
Read Data Valid tRDV 15 µs
Reset Time High tRSTH 480 µs
Reset Time Low tRSTL 480 µs 9
Presence Detect High tPDHIGH 15 60 µs
Presence Detect Low tPDLOW 60 240 µs
Capacitance CIN/OUT 25 pF
NOTES:
1. All voltages are referenced to ground.
4. Active current refers to either temperature conversion or writing to the E2 memory. Writing to E2
memory consumes approximately 200 µA for up to 10 ms.
7. To always guarantee a presence pulse under low voltage parasite power conditions, VILMAX may have
to be reduced to as much as 0.5V.
8. To minimize IDDS, DQ should be: GND ≤ DQ ≤ GND +0.3V or VDD – 0.3V ≤ DQ ≤ VDD.
9. Under parasite power, the max tRSTL before a power on reset occurs is 960 µS.
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DS18B20
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DS18B20
TYPICAL PERFORMANCE CURVE
0.5
0.4
0.3
+3σ Error
0.2
0.1
0
0 10 20 30 40 50 60 70
-0.1
-0.2
Mean Error
-0.3
-0.4
-3σ Error
-0.5
Reference Temp (C)
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