PCB

Requirements &
Specifications
Version 2016.1
 IMI Group
PCB – Requirements & Specifications

1. INTRODUCTION

1.1. Application
This document establishes the generic technical and qualitative requirements
necessary for the printed boards manufactured for the IMI group. It applies to all
the types of printed boards.
It will be supplemented, where necessary by a specific schedule of requirements,
according to particular IMI requests.
This document is to be read in conjunction with the IMI group SQA manual.

1.2. General Information

The manufacturer/supplier is to produce a uniform quality, free from any defect
and/or flaw which could affect the lifespan, the appearance or the performance of
the product.
Minimum IPC A 600 class 2 acceptance criteria is applied, IPC A 600 class3 will
also apply for incoming and outgoing inspection according IMI or IMI’s Customer
specification.
Specifications may be supplemented/replaced by IMI or IMI’s Customer
requirements.
If the manufacturer/supplier is uncertain of the application of the Printed Board,
the manufacturer/supplier must consult the IMI SQE representative without
hesitation so that the requirements can be determined.

2. Manufacturing process requirements

2.1. Generic Manufacturing Process Requirements

All the Printed Board manufactured must be according to the IMI or IMI’s
Customer Gerber files and specification requirements. Prior to
Change/Changes/deviation to original Gerber files and/or specification
requirements which will/may impact to part functionality must officially written
application/notification to IMI and officially receive written approval/acceptance
reply from IMI (see IMI SQA manual).
The Printed Board manufacturer/supplier is responsible for choosing the
manufacturing processes respectively process chemicals and machines and to
formally qualify them unless otherwise specified. Environmentally friendly
processes should be preferred. The choice has to be compliant to local legislation
and to regulations of countries where the product will be used so fare process
chemistry traces remain.
The Printed Board manufacturer/supplier is responsible for choosing the control
steps and control machines respectively tools unless otherwise specified and to
formally qualify them. Its choice has to be adapted to the required performance,
quality and reliability level of the product and in accordance to the process FMEA.
The manufacturer/supplier has the responsibility to identify all critical process,
machine and base material parameters which impact or risk impacting yield,
quality, reliability, functional performance and capacity. All critical parameters
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PCB – Requirements & Specifications
have to be monitored and used for active controlling of production and product
performance, using SPC.

2.2. Base Material Requirements

The manufacturer/supplier is responsible for the choice of all materials necessary
to produce the Printed Boards for a by IMI or IMI’s Customer defined working and
assembly profile unless otherwise specified hereafter or by the project team.
Manufacturer/Supplier has to qualify the used base materials and to demonstrate
that they are in accordance to required working and assembly profiles. All
materials have to be qualified using the volume production processes and
machines used for production of products intended to be used or be used directly
or indirectly on IMI or IMI’s Customer products as described in the present
specification. General requirements for used materials are listed below:

J-STD-609 Marking
IPC 1751, IPC 1752 Material declaration
Solder Mask / Cover
IPC SM 840 layer
IPC 4101, IPC 4103, IPC 4202, IPC-CF-152 Laminate, Prepreg
IPC 4562 Copper and Nickel foils
IPC 4552, IPC 4553, IPC 4554, IPC 4556 Surface Treatment
IPC-FC-234, IPC 4202, IPC 4203, IPC 4204 Flexible board materials
IPC-SG-141, IPC-A-142, IPC-QF-143, IPC 1731, IPC 4110, IPC 4121, IPC 4130, IPC 4411, IPC
4412 Reinforcements
IPC 2316, IPC 4811, IPC 4821 Embedding
UL94 V0 Flammability

Counterfeit material infiltration prevention requirements

To reduce the risk of counterfeit material infiltration following requirements has to

be fulfilled:
1. List of validated distributors and manufacturers must be available on site with
contract numbers.
2. A copy of initial sample packing label must be available on site
3. A photo of initial sample packing must be available on site
4. A reference analysis of initial sample must be available on site
5. Systematically for each supplied raw material shippment respectively
production batch a CoC check has to be done
6. Half yearly photos of label and packing have to be send to the original
manufacturer for confirmation
7. Half yearly a material samples has to be send to the original manufacturer for
confirmation

2.2.1. Foil
Foil must qualify to corresponding IPC-4562 specification

2.2.2. Solder Mask

Thickness: Min 10 m *; Max 30 m
* Thickness 10 m min, measurement to be taken at center of trace surface.
Minimum thickness of 5 m is acceptable at trace edges.
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 IMI Group
PCB – Requirements & Specifications
 Solder mask must according to IPC-SM-840 and IPC-6012, section 3.8
 Visual Acceptability guidelines per IPC-A-600 section 2-9 (minimum class
2)
 Masked board must meet 500VDC withstanding voltage test done to IPC
TM-650, TM 2.5.6.1

2.2.3. Copper Thickness

Inner layer copper thickness after process:
Must exceed min. value in IPC-6012 Table 3-7
Outer layer copper thickness after process:
Must exceed min. value in IPC-6012 Table 3-8
 As per IPC-6012, section 3.6

2.2.4. Surface Treatment/Finish

Type: Minimum Thickness: Maximum Thickness:

Silver 0.2 m 0.64 m
Immersion
HASL / LF- 2 m 25 m
HASL
ENIG Ni 3.5m; Au 0.05 m Ni 7m; Au 0.15 m
Immersion 1.0 m 1.3 m
Tin
 As per IPC-6012, section 3.2.6

2.3. Board Dimensional Requirements

Unless specified on the drawing/specification, Printed Boards must meet the
minimum dimensional requirements listed in IPC-6012B Section 3.4 or the
following, whichever is less:

2.3.1. Hole and Pattern Accuracy

 Insertion, interconnection (via), holes for mechanical assembly,
locating holes, and tooling holes shall be located within 0.1 mm of
specified location at maximum material condition.
 Pattern shall be located within 0.05 mm of specified location at
maximum material condition.
2.3.2. Inner and Outer Annular Ring
 Must meet all requirements under IPC-A-600 (minimum class 2),
section 2.10 for annular rings. [Supported and unsupported hole ring
values can be found in IPC-6012, Table 3-5] (Ring and hole design
shall be such that ring is 0.3mm greater in diameter than nominal
hole)
 Must meet all requirements under IPC-A-600 (minimum class 2),
section 3.3 for internal annular rings

2.3.3. Bow and Twist

 The Printed Board must meet 0.75% as defined in IPC-TM-650, TM
2.4.22
 IPC-2615 to be adopted for any measurements taken. Minimum
Dielectric Thickness shall meet IPC-6012, section 3.6.2.14.

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2.4. Protocol for Delivery of the Printed Boards to IMI

It is the responsibility of the manufacturer/supplier to guarantee the conformity of
the parts delivered to IMI with the contractual requirements previously formalized.
The manufacturer/supplier is not allowed to deliver non-conforming parts to IMI.

2.4.1 Electrical Test

The electrical test has to be performed in accordance to IPC 9252
specification guidelines testing processes, 100% of the networks on the
board have to be tested for continuity and isolation.

Specific Test Requirement Non-Auto & Non-Safety Safety Automotive

Resistive Continuity Testing (definition of continuity
threshold) ≤50 Ω (IPC9252 level B) ≤30 Ω
Resistive Isolation Testing (definition of short
threshold) ≥2 MΩ (IPC9252 level B) ≥10 MΩ (IPC9252 level C)
Adjacency (for isolation testing) Yes (IPC9252 level B) Yes (IPC9252 level B)
Required Testing of accessible Midpoints Yes (IPC9252 level B) Yes (IPC9252 level C)
≥150VDC for operating Voltage
Test Voltage <50V* ≥250VDC for operating Voltage >50V*
Golden board for production release Yes Yes
* for pattern spacing ≥ 100μm, in case of < 100μm spacing choice of test
voltage has to prevent electrical break down, in case of PCBs containing
Comment
embedded active or passive components , the test voltage and polarity has to
be in accordance to the component requirements

2.4.2 Automatic Optical/Visual Inspection

IPC A-600 class 3 criteria have to be applied for Automotive Parts unless
otherwise specified.

Specific test requirements Requirement

Inner Layers AOI 100%
Outer Layers AOI 100%
Automatic hole inspection 100%
Automatic Visual inspection 100%
Final Visual Inspection / Final Quality Check (FQC) 100%
Golden board conditioning inspection tool release for production Yes

2.4.3 X-Out/Repair/Rework
 Defect PCB’s (X-out’s) -- Not allowed
 Repair – Not allowed**
 Rework – Not allowed**

**Repair/Rework proposal to be provided to IMI for review if supplier

cannot meet this requirement. Repair/Rework proposal can be placed
under Other Requirements section of the PPAP submission. IMI will review
proposal and will grant approval at this point only, not in advance.

2.4.4 Shelf-Life/Expiry Date

The manufacturer/supplier must clearly state the shelf-life/expiry date of all
types of surface treatment/surface finish in an official document.
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The Printed Board must preserve its solder-ability features for minimum 6
months
(the duration will be extended to 12 months for ENIG, ENEPIG, HASL and
LF-HASL).
The Printed Boards must be subjected to 3 consecutive soldering operations
as per J-STD-003.
2.4.5 Documents Traceability Requirements
Document traceability (raw materials, CoC, production data, test/inspection
results, test coupons, solder-ability test results, etc.) must be kept by the
Printed Board manufacturer/supplier for a minimum of 15 years for
Automotive & Medical application products, and a minimum of 5 years for
Non-Automotive application products, after delivery of the conforming
Printed Boards, and must be readily available upon requested by IMI.

3 Functional Requirements of Printed Board

3.1. Solder-ability
All the batches of the Printed Boards delivered to IMI must be subjected to solder-
ability testing, as per IPC-TM-650 requirements.
Test records for solder-ability must be able to be presented to IMI covering a
period of 6 months, when upon requested by IMI.
IMI has the right to carry out the solder-ability test for verification/justification
purpose.
Poor Solder-ability (angle of meniscus > 55˚) is regarded as a MAJOR defect.

3.2. Ionic Contamination

The measurement method must be accordance with IPC-TM-650. All the batches
of the Printed Boards delivered to IMI must be subjected to ionic contamination
testing.
Test records for ionic contamination must be able to be presented to IMI covering
a period of 6 months, when upon requested by IMI.
The maximum allowed residual pollution is 0.5 µg/cm² (NaCl equivalent) for all
surface treatment/surface finish except HASL where the maximum shall be 0.8
µg/cm² (NaCl equivalent).

4. Ship To Stock (STS) Reception of the Printed Boards

4.1. Initialization of STS for Printed Boards

From the time that IMI deems that the Printed Boards delivered by the
manufacturer/supplier can be put directly into store without receiving inspection
(depending on satisfactory historical delivery quality data), the
manufacturer/supplier will be informed officially of this decision (mail, fax, E-
mail). The manufacturer/supplier will from then on, starting with the next delivery
following this information, to identify all packaging of the printed circuits by a label
“STS”.
This label will be clearly visible (on the outside of the packaging), in black Arial
font (ref. Microsoft Word), height of font to be minimum 50 (ref. Microsoft Word).
Important: The application of STS relates only to the products mentioned in the
official information sent by IMI. It does not apply to all Printed Boards delivered by
the manufacturer/supplier to IMI.
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4.2. Withdrawal of the Application of STS

As with the initialization of STS, the possible withdrawal of STS for one or more
products will be notified to the supplier in an official way (mail, fax, E-mail). From
then on, and from the first delivery following the official information from IMI
regarding withdrawal of STS, the manufacturer/supplier will have to withdraw all
reference to STS from the packaging of the products concerned.

5. Packaging

5.1. Packaging Quality

The Printed Boards delivered to IMI must be packed in a way in which they cannot
be damaged, and must be protected against humidity. There must, however, be a
protective layer between the circuits and the outside package (bubble wrap etc).
All packing must remain intact and preserve its original shape until its point of
use, whatever the climatic conditions.
The principal conditioning and packaging of the printed circuits must be sufficiently
robust so that they can be transported on pallets. The panels must be wrapped in
thermoplastic film (except flexible circuits), and the Printed Boards be vacuum
packed. Packaging must ensure that the Printed Boards are held in place and are
kept flat throughout transportation. Packaging must be free of grease and/or
marks of acid.

5.2. Loading
The weight of principal package should not exceed 10 kg. All packaging must be
manageable and be able to be handled manually. Any palletized load should not
exceed 800 kg, unless previously agreed with IMI. The height of the palletized
loads should not exceed 1m.

5.3. Storage of Printed Boards

The storage of the Printed Board with the manufacturer/supplier must be carried
out using thermoplastic film, in a temperature controlled room (20°c+/-5°c) with
the level of humidity not exceeding 60%. The date codes of manufacture of the
printed circuits which will be delivered to IMI should not be greater than 6 months
old.
The manufacturer/supplier is requested to provide to IMI their expiry date
commitment for the shelf-life expectancy for each surface finish type provided by
the manufacturer/supplier. This document is required at the same time as the
approval submission.

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PCB – Requirements & Specifications
Applicable Documents

Reference ID Document Name

IPC-A-600 Acceptability of printed circuit boards
IPC-4761
Design Guide for protection of Printed Board Via Structures
J-STD-0201
Environmental Acceptance Requirements for tin whisker susceptibility of tin
and tin alloy surface finishes
AEC Q 100
Failure mechanism based stress test qualification for integrated circuits
JEP122
Failure Mechanisms and Models for Semiconductor Devices
FMVSS 302
Federal Motor Vehicle Safety Standards and Regulations
IPC 6011
Generic Performance Specification of Printed Board
IPC-2221 Generic Standard on Printed Board Design
IPC-9252 Guidelines and requirements for Electrical Testing of unpopulated Printed
Boards
JESD22-A110-B
Highly-Accelerated Temperature and Humidity Stress Test (HAST)
IMDS International Material Data System
SMD J-STD-020
Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State
IPC 6013
Qualification and Performance Specification for Flexible Printed Boards
IPC-6016
Qualification & Performance Specification for High Density Interconnect
IPC-6018
Qualification & Performance Specification for High Frequency Printed Boards
IPC 6015
Qualification & Performance Specification for Organic Multichip Module
Mounting and Interconnecting Structures
IPC-6017
Qualification and Performance Specification for Printed Boards containing
Embedded Passive Devices
IPC 6012
Qualification and Performance Specification for Rigid Printed Boards
IPC-SM-840
Qualification and Performance of Permanent Solder Mask
IPC 4556
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold
(ENEPIG) Plating for Printed Circuit Boards
IPC 4552 Specification for Electroless Nickel/Immersion Gold (ENIG)Plating for Printed
Circuit Boards
IPC 4553
Specification for Immersion Silver Plating for Printed Circuit Boards

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IPC 4554
Specification for Immersion Tin Plating for Printed Circuit Boards
IPC-4101
Specification for Base Materials for Rigid and Multilayer Printed Boards
J-STD-003 Solder-ability Tests for Printed Boards
JS-001-2010
Standard for Electrostatic Discharge Sensitive Testing
JSTD033
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
UL 796 Standard for Printed-Wiring Boards
ISO 9455-17
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance
comb test and electrochemical migration test of flux residues
IPC-TM-650 Test manual
IEC 61189-5
Test methods for electrical materials, interconnection structures and
assemblies - Part 5: Test methods for printed board assemblies
JESD22-A121A Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface
Finishes
IPC-5701 User Guide for Cleanliness

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APPROVAL

(BLOCK CAPITALS)

Company name:________________________________________________

Job Title:______________________________________________________

Your name:____________________________________________________

Document read and approved

Or

Document read and approved with addendum

Signed:______________________________________________________

Date:________________________________________________________

The name of your SQE contact at IMI:______________________________

Within one month of receiving this document, please complete the above
form, sign it and return a scanned copy by email or a hard copy by post
to your SQE contact at IMI.

Any other comments should be sent to IMI in a separate Vendor Addendum.

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