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    Solder Paste SC 170: Physical Properties

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    luismcmc
    SC 170 is a no-clean solder paste developed to meet industry standards for SMT applications. It has excellent printing and soldering properties like slump resistance and minimal transparent residue. The paste contains corrosion inhibitors and can be left on boards after reflow as it meets RE L0 requirements. It is suitable for fine pitch components and all common reflow systems.

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    © All Rights Reserved
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    Solder Paste SC 170: Physical Properties

    Uploaded by

    luismcmc
    27 views2 pages
    SC 170 is a no-clean solder paste developed to meet industry standards for SMT applications. It has excellent printing and soldering properties like slump resistance and minimal transparent residue. The paste contains corrosion inhibitors and can be left on boards after reflow as it meets RE L0 requirements. It is suitable for fine pitch components and all common reflow systems.

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    ixSC170_data_en

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    SC 170 is a no-clean solder paste developed to meet industry standards for SMT applications. It has excellent printing and soldering properties like slump resistance and minimal transparent residue. The paste contains corrosion inhibitors and can be left on boards after reflow as it meets RE L0 requirements. It is suitable for fine pitch components and all common reflow systems.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    27 views2 pages

    Solder Paste SC 170: Physical Properties

    Uploaded by

    luismcmc
    SC 170 is a no-clean solder paste developed to meet industry standards for SMT applications. It has excellent printing and soldering properties like slump resistance and minimal transparent residue. The paste contains corrosion inhibitors and can be left on boards after reflow as it meets RE L0 requirements. It is suitable for fine pitch components and all common reflow systems.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    S OL D ER PAS T E S C 170

    Type ISO 1.2.3.C

    The solder paste SOLDER CHEMISTRY SC 170 is a high tech product specifically
    suitable for all SMT applications. Not only many years of experience in the SMT field,
    but also the careful and strict consideration of DIN-, SC-, IPC- and MIL- standards were
    part of a complete development for the future.
    SC 170 is a homogeneous mixture of solder powder, in all required alloys and grain
    sizes, and an organic flux based on synthetic rosin, corresponding to the RE L0
    according to J-STD-004 or RMA-qualification being thus one of the latest ”no clean”
    solder pastes.
    Besides excellent slump resistance, no solder balling, a long stencil and tack life and
    high temperature stability, this paste has following advantages:

    *SC 170* minimal (4.3%), highly transparent residue, simplifying the in circuit test
    *SC 170* a true ”no clean” paste
    *SC 170* contains corrosion inhibitors
    *SC 170* an outstanding printing quality - for hours
    *SC 170* excellent even for fine pitch applications
    *SC 170* superior soldering results with all soldering profiles and ovens
    *SC 170* the modified synthetic rosin composition prevents the development of tar
    residues in the reflow oven

    PHYSICAL PROPERTIES:
    Preferred alloys of solder powder: 62Sn/36Pb/2Ag and 63Sn/37Pb

    Grain size definition:


    SC 170 DIN 32 513 Diameter Mesh size
    Fine (F) class 3 20-45 µm 325-500
    Superfine (SF) class 4 15-30 µm 400-700

    VISCOSITY (Pa.s) +/-10% measured with Brookfield RVT-DV-II viscometer at 90% metal content

    Grain size Viscosity


    Fine (F) 800 - 1000

    S.I.R. AND ELECTROMIGRATION comparable to DIN 32513

    Day measured 4th 21st

    4.4·1013 6.8·1012
    QUALIFICATIONS

    SC 170 is an RMA paste, which fulfils the demands of MIL-QQ-S571e. The corrosion-,
    solderballing-, wetting- and slump (SN 59650) tests have been passed. Laboratory tests
    certify non-corrosive residues, which can be left on the board, even under the protective
    coating, as the flux corresponds to RE L0 (no clean).

    STORAGE

    Unopened at room temperature (20°C/68°F): 6 months


    Open or on the printer squeegee the maximal processing time depends, of course, on
    the environmental influences on the paste. A storage in the refrigerator is not necessary,
    but a storage temperature of <22°C is recommended.

    APPLICATION INFORMATION

    After using the paste close the container tightly.


    Do not mix used and fresh paste, only to freshen up paste and only at work in progress.
    Do not mix pastes of different kind.
    Recommended squeegee speed: 15-100 mm/s.
    For stencil printing, paste with 90% metal content is recommended.
    Note: the printer is always faster than the fastest assembler in the production line.
    The printer squeegee must be set to ensure that the paste performs a rolling action in
    front of the squeegee and does not slide!
    The stencil can be washed with an alcohol mixture but the alcohol must not contaminate
    fresh paste. We recommend the SC Stencil Cleaner.
    The paste is suitable for all common reflow systems.

    Solder Chemistry order example

    Paste Grain size Alloy Flux content Jar capacity


    SC 170 F 62/36/2Ag 10% 500 g
    SC 170 F 63/37 10% 500 g

    Order example after DIN:

    Solder paste (SC...) L-Sn62Pb2Ag / F-SW32 / 90-3 500 g (packing)

    Solder Chemistry ; Fragnerstraße 4 ; D-84034 Landshut


    Tel. ++49/871/4309500 ; Fax. ++49/871/43095020
    e-mail: info@SolderChemistry.com ; www.solderchemistry.com

    The engineering data shown here has been compiled by Solder Chemistry using commonly accepted procedures. Although the data
    is considered accurate, we cannot guarantee its accuracy, the results obtained from its use, or any patent infringement resulting from
    its use. The data is supplied on the condition that the user shall conduct tests to determine material suitability for a particular
    application.

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