EMC1063

1°C Triple Temperature

Sensor with Hotter of
Two Zones

PRODUCT FEATURES Datasheet

General Description Features

The EMC1063 is a family of System Management Bus „ Designed to Operate with AMD Processor Diodes
(SMBus) temperature sensors that monitors three „ Supports two External Temperature Diodes
temperature zones, one internal diode and two — ±1°C Accuracy (40°C to 80°C)
externally connected diodes. The EMC1063 is — 0.125°C Resolution
— Ideality Factor Configuration
specifically designed to operate with AMD processor
— Accepts 2200pF Cap Across External Diodes for Noise
diodes. Alternately, the External Diode 2 channel can be
Suppression
configured to measure a standard thermal diode (such — Optional Resistive Error Correction on External Diode 2
as a 2N3904) with Resistive Error Correction active.
„ Internal Temperature Diode
An added feature to the EMC1063 is a function that — ±3°C Accuracy (0°C to 85°C)
automatically compares the two external temperature — 0.125°C Resolution
zones and reports the hotter of the two temperatures. „ Low Power Operation
— 4uA Standby Current
Selectable conversion rates and standby mode support
low-power operation. The temperature measurement „ 3.0V to 3.6V Supply
ranges support two data ranges (and formats), -64°C to „ Programmable Conversion Rate
+127°C and -64°C to +191°C. „ SMBus 2.0 Compliant
— Four SMBus Address Available
Applications „ Reports Hotter of Two Diodes with Dual-core CPU
„ Desktop and Notebook Computers
„ Hardware Management
„ Servers
„ Embedded Applications
Simplified Block Diagram

Switching Configuration
Current Register
External Diode
DP1 1 Register
and Anti-Alias Filter

SMBus Interface

DN1
Analog Mux

11-bit Digital Mux

External Diode
delta-sigma and
ADC 2 Register
Byte Interlock
DP2
DN2
Internal Diode
Local Temp Register SMCLK
Diode
Status Register
SMDATA

SMSC EMC1063 DATASHEET Revision 1.44 (04-14-08)

 1°C Triple Temperature Sensor with Hotter of Two Zones

Datasheet

ORDERING INFORMATION

ORDERING NUMBER PACKAGE FEATURES SMBUS ADDRESS

EMC1063-1-ACZL-TR 1001_100x

EMC1063-2-ACZL-TR 8 pinMSOP package 1001_101x

Two External Diodes with
(Lead Free ROHS
Hottest Of Comparison
EMC1063-3-ACZL-TR compliant) 1001_000x

EMC1063-4-ACZL-TR 1001_001x

Reel size is 4,000 pieces.

Evaluation board available upon request (EVB-EMC1063)

80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123

Copyright © 2008 SMSC or its subsidiaries. All rights reserved.

Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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Table of Contents

Chapter 1 Pin Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Chapter 2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.1 Write Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.2 Read Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.3 Send Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.4 Receive Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.5 SMBus Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 SMBus Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 SMBus Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Chapter 3 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2 One Shot During Standby Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Operation During Run Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.1 Conversion Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3.2 Dynamic Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Temperature Monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 Temperature Measurement Results and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.6 Resistance Error Correction (REC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.7 Programmable Ideality Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.8 Diode Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Chapter 4 Register Set and Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1 Legacy Temperature Data Registers (00h, 23h, 01h, 10h, F8h, F9h) . . . . . . . . . . . . . . . . . . . . . . 18
4.2 Extended Format Temperature Registers (FAh-FDh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.3 Status Register - 02h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 Configuration Register (03h Read, 09h Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 Configuration 2 Register - (04h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6 One Shot Register - (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.7 Ideality Configuration Registers (27h - 28h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.8 Product ID Register (EDh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.9 Manufacturer ID Register (FEh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.10 Revision Register (FFh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Chapter 5 Typical Operating Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Chapter 6 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.1 Package Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

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List of Figures
Figure 1.1 EMC1063 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2.1 System Management Bus Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3.1 EMC1063 Diode System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3.2 Block Diagram of Temperature Monitoring Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3.3 External Diode Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6.1 8-Pin MSOP Package Outline - 3x3mm Body 0.65mm Pitch. . . . . . . . . . . . . . . . . . . . . . . . . 25

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List of Tables
Table 1.1 EMC1063 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2.2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2.3 Write Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2.4 Read Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2.5 Send Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 2.6 Receive Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3.1 Supply Current vs. Conversion Rate and ADC Averaging Factor . . . . . . . . . . . . . . . . . . . . . . 12
Table 3.2 EMC1063 Temperature Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4.1 EMC1063 Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 4.2 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 4.3 Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 4.4 Conversion Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 4.5 Configuration 2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 4.6 One Shot Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 4.7 Ideality Configuration Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 4.8 Ideality Factor Look Up Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 4.9 Substrate Diode Ideality Factor Look-Up Table (BJT Model) . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 4.10 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 4.11 Manufacturer ID Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 4.12 Revision Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 6.1 8-Pin MSOP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

SMSC EMC1063 5 Revision 1.44 (04-14-08)

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Chapter 1 Pin Function

DP1 1 8 SMCLK

DN1 2 7 SMDATA
8-MSOP
DP2 3 6 VDD

DN2 4 5 GND

Figure 1.1 EMC1063 Pin Diagram

Table 1.1 EMC1063 Pin Description

PIN PIN NO. DESCRIPTION

DP1 1 External Diode 1 Positive (anode) Connection

DN1 2 External Diode 1 Negative (cathode) Connection

DP2 3 External Diode 2 Positive (anode) Connection

DN2 4 External Diode 2 Negative (cathode) Connection

GND 5 Ground

VDD 6 Supply Voltage

SMDATA 7 System Management Bus Data - bi-directional data, open drain output

SMCLK 8 System Management Bus Clock Input

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Chapter 2 Electrical Specifications

2.1 Absolute Maximum Ratings

Table 2.1 Absolute Maximum Ratings

DESCRIPTION RATING UNIT

Supply Voltage VDD -0.3 to 5.0 V

Voltage on SMDATA and SMCLK pins -0.3 to 5.5 V

Voltage on any other pin -0.3 to VDD+0.3 V

Operating Temperature Range -40 to 125 °C

Storage Temperature Range -55 to 150 °C

Lead Temperature Range Refer to JEDEC

Spec. J-STD-020

Package Thermal Characteristics for MSOP-8

Thermal Resistance TJA(at 0 air flow) 135.9 °C/W

ESD Rating, All Pins Human Body Model 2000 V

Note: Stresses above those listed could cause damage to the device. This is a stress rating only and
functional operation of the device at any other condition above those indicated in the operation
sections of this specification is not implied. When powering this device from laboratory or
system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or
device failure can result. Some power supplies exhibit voltage spikes on their outputs when the
AC power is switched on or off. In addition, voltage transients on the AC power line may appear
on the DC output. If this possibility exists, it is suggested that a clamp circuit be used.

2.2 Electrical Specifications

Table 2.2 Electrical Characteristics

VDD=3.0V to 3.6V, TA= -20°C to +85°C, Typical values at TA = 27°C unless otherwise noted

PARAMETER SYMBOL MIN TYP MAX UNITS CONDITIONS

DC Power

Supply Voltage VDD 3.0 3.3 3.6 V

Average Operating Current IDD 340 400 μA 4 conversions/s

See Table 4.4.

ISTBY 2 4 μA Standby mode

Internal Temperature Monitor

Temperature Accuracy ±1 ±3 °C -20°C≤ TA ≤85°C

± 1.5 °C 0°C < TA ≤ 85°C

Temperature Resolution 0.125 °C

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Table 2.2 Electrical Characteristics (continued)

VDD=3.0V to 3.6V, TA= -20°C to +85°C, Typical values at TA = 27°C unless otherwise noted

PARAMETER SYMBOL MIN TYP MAX UNITS CONDITIONS

External Temperature Monitor

Temperature Accuracy
Remote Diode 40°C to 80°C ±1 °C 15°C≤TA≤70°C
Remote Diode -20°C to 125°C ±3 °C -20°C≤TA≤85°C
Remote Diode -64°C to 192°C ±5 °C -20°C≤TA≤85°C

Temperature Resolution 0.125 °C

Filter Capacitor CFILTER 2.2 nF Connected across

external diode
Note 2.2

Voltage Tolerance

Voltage at pin ( SMDATA,SMCLK) VTOL -0.3 5.5 V

SMBus Interface (SMDATA,SMCLK)

Input High Level VIH 2.0 V

Input Low Level VIL 0.8 V

Input High/Low Current IIH/IIL -1 1 μA

Hysteresis 500 mV

Input Capacitance 5 pF

Output Low Sink Current 6 mA SMDATA = 0.6V

SMBus Timing

Clock Frequency FSMB 10 400 kHz

Spike Suppression 50 ns

Bus free time Start to Stop TBUF 1.3 μs

Hold time Start THD:STA 0.6 μs

Setup time Start TSU:STA 0.6 μs

Setup time Stop TSU:STO 0.6 μs

Data Hold Time THD:DAT 0.3 μs

Data Setup Time TSU:DAT 100 ns

Clock Low Period TLOW 1.3 μs

Clock High Period THIGH 0.6 μs

Clock/Data Fall Time TF * 300 ns *Min = 20+0.1Cb ns

Clock/Data Rise Time TR * 300 ns *Min = 20+0.1Cb ns

Note
2.1

Capacitive Load (each bus line) Cb 0.6 400 pF

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Note 2.1 300nS rise time max is required for 400kHz bus operation. For lower clock frequencies,
the maximum rise time is (0.1/FSMB)+50nS

Note 2.2 See SMSC Applications for Application Notes and Guidelines when measuring GPU
processor diodes and CPU processor diodes.

2.3 System Management Bus Interface Protocol

A host controller, such as an SMSC I/O controller, communicates with the EMC1063 via the two wire
serial interface named SMBus. The SMBus interface is used to read and write registers in the
EMC1063, which is a slave-only device. A detailed timing diagram is shown in Figure 2.1.

TLOW THIGH
THD:STA TSU:STO

TR TF
SMCLK

THD:STA THD:DAT TSU:DAT TSU:STA

SMDATA
TBUF

P S S - Start Condition S P - Stop Condition P

Figure 2.1 System Management Bus Timing Diagram

The EMC1063 implements a subset of the SMBus specification and supports Write Byte, Read Byte,
Send Byte, and Receive Byte protocols as shown. In the tables that describe the protocol, the “gray”
columns indicate that the slave is driving the bus.

All of the below protocols use the following convention:

DATA SENT DATA SENT TO

TO DEVICE THE HOST

# of bits sent # of bits sent

2.3.1 Write Byte

The Write Byte is used to write one byte of data to the registers as shown in Table 2.3.

Table 2.3 Write Byte Protocol

START SLAVE ADDRESS WR ACK COMMAND ACK DATA ACK STOP

1 7 1 1 8 1 8 1 1

2.3.2 Read Byte

The Read Byte protocol is used to read one byte of data from the registers as shown in Table 2.4.

Table 2.4 Read Byte Protocol

SLAVE SLAVE
START ADDRESS WR ACK COMMAND ACK START ADDRESS RD ACK DATA NACK STOP

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Table 2.4 Read Byte Protocol

1 7 1 1 8 1 1 7 1 1 8 1 1

2.3.3 Send Byte

The Send Byte protocol is used to set the Internal Address Register to the correct Address as shown
in Table 2.5. The Send Byte can be followed by the Receive Byte protocol described in Table 2.6 to
read data from the register. The send byte protocol cannot be used to write data - if data is to be
written to a register then the write byte protocol must be used as described in Section 2.3.1.

Table 2.5 Send Byte Protocol

START SLAVE ADDR WR ACK REG. ADDR ACK STOP

1 7 1 1 8 1 1

2.3.4 Receive Byte

The Receive Byte protocol is used to read data from a register when the internal register address
pointer is known to be at the right location (e.g. set via Send Byte). This can be used for consecutive
reads of the same register as shown in Table 2.6.

Table 2.6 Receive Byte Protocol

START SLAVE ADDR RD ACK REG. DATA NACK STOP

1 7 1 1 8 1 1

2.3.5 SMBus Timing Diagram

The Timing for the SMBus is shown in Figure 2.1.

2.4 SMBus Addresses

The EMC1063 may be ordered with one of four slave addresses as shown in Ordering Information.
Attempting to communicate with the EMC1063 SMBus interface with an invalid slave address or invalid
protocol results in no response from the device and does not affect its register contents. The EMC1063
supports stretching of the SMCLK signal by other devices on the SMBus but will not perform this
operation itself.

2.5 SMBus Timeout

The EMC1063 includes an SMBus time-out feature. Following a 25 ms period of inactivity on the
SMBus, the device will time-out and reset the SMBus interface.

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Chapter 3 Product Description

The EMC1063 is an SMBus sensor that monitors three temperature zones for use in a personal
computer or embedded environment. The part may be used as a companion to one of SMSC’s broad
line of SIO host devices to perform fan control and thermal management.

The EMC1063 is designed to operate with two AMD thermal diodes. The External diode 2 channel can
be configured with the Resistance Error Correction feature enabled to measure a discrete 2N3904
diode. A typical system is shown in Figure 3.1.

CPU EMC1063 Host

Thermal DP1
diode DN1
SMBus
SMBus Interface
DP2
Thermal
diode DN2
Internal
CPU Diode

Figure 3.1 EMC1063 Diode System

3.1 Power Modes

The EMC1063 has two power modes.
„ Run Mode - In this mode, the temperature monitors are active and converting at the programmed
conversion rate. The average power dissipation will depend on the conversion rate. When the
EMC1063 is not actively converting a channel, it goes into a lower power wait state.
„ Standby Mode (power-up default) - in this mode, the EMC1063 is put into a low power state. In the
standby mode, temperature monitoring is disabled. The device will still respond to SMBus
commands.

3.2 One Shot During Standby Mode

The EMC1063 supports a One-Shot command when it is in Standby Mode. Writing to the One-Shot
register will cause the device to power up, perform 1 full set of temperature conversions, then return
to Standby Mode.

3.3 Operation During Run Mode

When the device is active, there are two modes of operation available.
„ Normal Mode (power-up default) - In this mode of operation, the EMC1063 continuously samples
and updates all of its temperature channels.
„ Hotter of Two Mode - In this mode, the EMC1063 continuously samples and then compares the
two remote zones. The hotter of the two remote zones is loaded into the External Diode 2 Data
Registers. In addition, the HOTTER bit in the Status register is set or cleared to indicate which
external diode zone is hotter. If the two remote zones are exactly equal to each other, then the

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HOTTER bit is cleared (set to ‘0’), and the results of the two remote zones are stored in their
respective registers.

3.3.1 Conversion Rates

The EMC1063 may be configured for different conversion rates based on the system requirements.
The available rates are 1 full set of conversions per second to 16 full sets of conversions per second.
The conversion rate is configured as described in Section 4.4. The available conversion rates are
shown in Table 4.4.

3.3.2 Dynamic Averaging

The EMC1063 temperature channels support a new feature that measures the external diode channels
for an extended time based on the selected conversion rate. This functionality can be disabled as
described in Section 4.5 for increased power savings at the lower conversion rates. When Dynamic
Averaging is enabled, the device will automatically adjust the sampling and measurement time for both
external diode channels. This allows the device to average 2x or 4x longer than the normal 11 bit
operation while still maintaining the selected conversion rate. The benefits of Dynamic Averaging are
improved noise rejection due to the longer integration time as well as less random variation on the
temperature measurement.

The Dynamic Averaging applies when a One-Shot command is issued. The device will perform the
desired averaging during the one-shot operation according to the selected conversion rate.

The Dynamic Averaging will affect the average supply current based on the chosen conversion rate
as shown in Table 3.1.

Table 3.1 Supply Current vs. Conversion Rate and ADC Averaging Factor

ADC AVERAGING FACTOR

4X 2X
(MAX_RES = 1) (MAX_RES = 0) 1X
CONVERSION RATE (DA_N = 0) (DA_N = 0) (DA_N = 1)

1 / sec 190uA 132uA 105uA

2 / sec 315uA 205uA 150uA

4 / sec 580uA 350uA 235uA

8 / sec N/A 640uA 405uA

16 / sec N/A N/A 750uA

3.4 Temperature Monitors

In general, thermal diode temperature measurements are based on the change in forward bias voltage
of a diode when operated at two different currents. This ΔVBE is then proportional to absolute
temperature as shown in the following equation:

where:
k = Boltzmann’s constant
ηkT ⎛ I HIGH ⎞
ΔVBE = VBE _ HIGH − VBE _ LOW = ln⎜⎜ ⎟⎟ T = absolute temperature in Kelvin [1]
q ⎝ LOW ⎠
I q = electron charge
η = diode ideality factor

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ILOW IHIGH

DP

Anti-
Aliasing ΔΣ
Filter ADC

DN

Figure 3.2 Block Diagram of Temperature Monitoring Circuit

Figure 3.2 shows a block diagram of the temperature measurement circuit. The negative terminal for
the remote temperature diode, DN, is internally biased with a forward diode voltage referenced to
ground.

The External Diode 2 channel in the EMC1063 is compatible with a broad range of thermal diode,
including those found in AMD processors, that may be connected as shown in Figure 3.3.

to to to
DP DP DP

to to to
DN DN DN

Typical remote Typical remote Typical remote

PN Junction diode discrete PNP transistor discrete NPN transistor
i.e. AMD temperature diode
i.e. 2N3906 i.e. 2N3904

Figure 3.3 External Diode Configurations

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3.5 Temperature Measurement Results and Data

Each temperature result for each zone is available in two byte wide data registers. As shown in
Section 4.1, the 11-bit format has the 8 most significant bits stored in the high byte register and the 3
least significant bits stored in the three MSB positions of the low byte register. The delta-sigma ADC
may be operated with more than 11 bits of resolution for improved averaging as described in
Section 4.5, but the temperature result is reported at 11-bit resolution.

The temperature results for the two remote zones are also stored in extended format with a range from
-64°C to +191°C. The data format is a 2’s complement number offset by 64°C as shown in Section 4.2.
The data for each of the remote zones in both legacy and extended format is stored in separate data
registers so that both data formats are always available. Table 3.2 shows the default and extended
range formats.

Table 3.2 EMC1063 Temperature Data Format

RANGE -64°C TO 127°C RANGE -64°C TO 191°C

TEMPERATURE (°C) BINARY OFFSET BINARY

Diode Fault 100 0000 0000 100 0000 0000

<= -64 110 0000 0000 100 0000 0000

-63.875 110 0000 0001 100 0000 0001

-63 110 0000 1000 100 0000 1000

-1 111 1111 1000 101 1111 1000

0 000 0000 0000 110 0000 0000

0.125 000 0000 0001 110 0000 0001

1 000 0000 1000 110 0000 1000

64 010 0000 0000 000 0000 0000

65 010 0000 1000 000 0000 1000

127 011 1111 1000 001 1111 1000

127.875 011 1111 1111 001 1111 1111

128 011 1111 1111 010 0000 0000

191 011 1111 1111 011 1111 1000

>= 191.875 011 1111 1111 011 1111 1111

3.6 Resistance Error Correction (REC)

Resistance error correction is an optional feature in the EMC1063 that eliminates the need to
characterize and compensate for series resistance in the External Diode 2 lines. The EMC1063
corrects for as much as 100 ohms of series resistance.

When using a temperature sensor that does not include resistance error correction, voltage developed
across the parasitic resistance in the external diode path produces an error in the reported
temperature. The error introduced by this resistance is approximately +0.7°C per ohm. Sources of
series resistance are PCB trace resistance, on die (i.e. on the processor) metal resistance, bulk
resistance in the base and emitter of the temperature transistor.

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The External Diode 1 channel has the REC functionality disabled for use in monitoring an AMD K8
processor. The External Diode 2 channel defaults to REC functionality disabled but can be enabled by
writing to the Configuration 2 Register (see Section 4.5). If the External Diode 2 channel is connected
as a diode-connected transistor as shown in Figure 3.3, resistance error correction should be enabled
to minimize series resistance and improve accuracy

3.7 Programmable Ideality Factor

The EMC1063 default is for a diode ideality factor of 1.008 which is common for a 2N3904 diode and
for many processor transistors. When a diode or transistor is used that has a different ideality factor
value than 1.008 a temperature error is induced that is a linear function of temperature. Previous
solutions for this mismatch in ideality factor has been to supply a programmable offset to the
temperature reading which corrects the error at a single temperature but causes a residual error at all
other temperatures. The EMC1063 ideality factor register corrects this mismatch error at all
temperatures (see Section 4.7).

APPLICATION NOTE: When monitoring a substrate transistor or CPU diode and beta compensation is enabled, the
Ideality Factor should not be adjusted. Beta Compensation automatically corrects for most
ideality errors.

3.8 Diode Faults

The EMC1063 detects a fault if the DP pin is left floating or is shorted to VDD. In the case of a diode
fault, the corresponding status bit will be set and the output data will be set at 400h.

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Chapter 4 Register Set and Description

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The following registers are accessible through the SMBus Interface.

Table 4.1 EMC1063 Register Set

REGISTER
ADDRESS
DEFAULT
READ WRITE R/W REGISTER NAME SYMBOL B7 B6 B5 B4 B3 B2 B1 B0 VALUE

00h N/A R Internal Temperature INTHBL Sign 64 32 16 8 4 2 1 00h

High Byte - Legacy
Format

23h N/A R Internal Temperature INTLBL 0.5 0.25 0.125 00h

DATASHEET
Low Byte - Legacy
Format

16
01h N/A R External Diode 1 High ET1HBL Sign 64 32 16 8 4 2 1 00h
Byte - Legacy Format

10h N/A R External Diode 1 Low ET1LBL 0.5 0.25 0.125 00h
Byte - Legacy Format

F8h N/A R External Diode 2 High ET2HBL Sign 64 32 16 8 4 2 1 00h

Byte - Legacy Format

F9h N/A R External Diode 2 Low ET2LBL 0.5 0.25 0.125 00h
Byte - Legacy Format

FAh N/A R External Diode 1 High ET1HBE 128 64 32 16 8 4 2 1 00h

Byte - Extended
Format

FBh N/A R External Diode 1 Low ET1LBE 0.5 0.25 0.125 00h
Byte - Extended

SMSC EMC1063
Format

FCh N/A R External Diode 2 HIgh ET2HBE 128 64 32 16 8 4 2 1 00h

Byte - Extended
Format
 Table 4.1 EMC1063 Register Set (continued)
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1°C Triple Temperature Sensor with Hotter of Two Zones

REGISTER
ADDRESS
DEFAULT
READ WRITE R/W REGISTER NAME SYMBOL B7 B6 B5 B4 B3 B2 B1 B0 VALUE

FDh N/A R External Diode 2 Low ET2LBE 0.5 0.25 0.125 00h
Byte - Extended
Format

Status and Control

02h N/A R Status STS Busy - - HOTT - - D2 D1 00h
ER

03h 09h R/W Configuration CFG - ADC_ST - - - CR<2:0> 45h

OP

04h 04h R/W Configuration 2 CFG2 - - - - MAX_ DA_n COMP REC 08h
RES
DATASHEET

One Shot
17

N/A 0Fh W One Shot Conversion Shot The data written to this register is irrelevant and will not be stored 00h

Ideality
27h 27h R/W External Diode 1 IDCF1 - - B5 B4 B3 B2 B1 B0 12h
Ideality Correction (1.008)
Factor

28h 28h R/W External Diode 2 IDCF2 - - B5 B4 B3 B2 B1 B0 12h

Ideality Correction (1.008)
Factor

EDh EDh R Product ID PID 0 0 1 1 0 0 0 0 30h (-1)

0 0 1 1 0 0 0 1 31h (-2)

0 0 1 1 0 0 1 0 32h (-3)

0 0 1 1 0 0 1 1 33h (-4)
SMSC EMC1063

FEh FEh R Manufacturer ID SMSC 0 1 0 1 1 1 0 1 5Dh

FFh FFh R Revision Register REV - - - - 0 0 0 1 01h

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During Power on Reset (POR), the default values are stored in the registers. A POR is initiated when
power is first applied to the part and the voltage on the VDD supply surpasses the POR level as
specified in the electrical characteristics. Any reads to undefined registers will return 00h. Writes to
undefined registers will not have an effect.

The EMC1063 uses an interlock mechanism that will update the Low byte of a particular monitor when
the High Byte is read. This prevents changes in register content when the ADC updates between
successive reads.

4.1 Legacy Temperature Data Registers (00h, 23h, 01h, 10h, F8h,
F9h)
As shown in Table 4.1, each temperature monitor has two data registers. The 11 bit temperature data
is stored aligned to the left resulting in the High Byte containing temperature in 1°C steps and the Low
Byte containing fractions of a degree.

4.2 Extended Format Temperature Registers (FAh-FDh)

The Extended Format Temperature Registers store only the external diode temperatures in the
extended data format. This is because, due to the operating range limitations of the EMC1063, the
internal temperature could not benefit from the extended temperature range. Like the Legacy data
formatting, the data is stored in two registers per temperature channel.

4.3 Status Register - 02h

Table 4.2 Status Register

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

02h Status Busy - - HOTTER - - D2 D1 00h

The Status Register is a read only register and returns the operational status of the part. External diode
faults are indicated by bits 1 and 0. If either bit is set to ‘1’, then a diode fault has occurred. When a
diode fault occurs, the D1 or D2 status bit is set, but otherwise the data remains unchanged.

Bit 7 - Busy - indicates that the ADC is currently converting a temperature.

Bit 4 - HOTTER - during Hotter of Two mode, this bit indicates which of the external diode channels
is hotter. If this bit is ‘0’, then External Diode 1 is hotter or equal to External Diode 2. If this bit is ‘1’,
then External Diode 2 is hotter than External Diode 1. During normal operation, this bit will always read
a ‘0’.

Bit 1 - D2 - indicates that a diode fault has occurred on External Diode 2.

Bit 0 - D1 - indicates that a diode fault has occurred on External Diode 1.

4.4 Configuration Register (03h Read, 09h Write)

Table 4.3 Configuration Register

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

03h Read, Config - STANDBY - - - CR<2:0> 45h

09h Write

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The Configuration Register controls the basic functionality of the EMC1063. The bits are described
below:

Bit 6 - STANDBY- controls the ADC conversions and power modes of the part.
„ '0' - The device is in the run operating mode. The ADC is converting at the user-programmed
conversion rate.
„ '1' - (default) The device is in the standby operating mode (see Section 3.1).

Bit 2-0 - CR<2:0> - determines the conversion rate for the temperature monitoring per Table 4.4.

Table 4.4 Conversion Rate

CR<2:0>
CONVERSIONS / SECOND
2 1 0 (CONVERSION TIME)

0 0 0 Reserved

0 0 1 Reserved

0 1 0 Reserved

0 1 1 1 Conversion / sec

1 0 0 2 Conversions / sec

1 0 1 4 Conversions / sec (default)

1 1 0 8 Conversions / sec

1 1 1 16 Conversions / sec

4.5 Configuration 2 Register - (04h)

Table 4.5 Configuration 2 Register

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

04h CFG2 - - - - MAX_RES DA_n COMP REC 08h

The Configuration 2 Register controls the basic functionality of the EMC1063 that is NOT compatible
with the EMC1023.

Bit 3 - MAX_RES - controls the external diode conversion time during dynamic averaging. Although
the dynamic averaging may be used to increase the ADC resolution, only 11 bits of data are available
in the temperature registers.
„ ‘0’ - the dynamic averaging will set the ADC averaging factor at 1x when the conversion rate is set
at 16 conversions per second and 2x at conversion rates lower than 16 per second.
„ ‘1’ (default) - the dynamic averaging will set the ADC averaging factor at 1x when the conversion
rate is set at 16 conversions per second, 2x at 8 conversions / second and 4x at conversion rates
lower than 8 per second.

Bit 2 - DA_n - controls the dynamic digital averaging circuitry. See Section 3.3.2.
„ ‘0’ (default) - dynamic averaging is enabled. Depending on the selected conversion rate, the ADC
averaging factor is increased for the external diodes.

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„ ‘1’ - dynamic averaging is disabled. The ADC averaging factor will remain fixed at 1x for all
conversion rates and will allow increased power savings at the slower conversion rates.

Bit 1 - COMP - configures the device to perform a comparison for the Hotter of Two mode (see Section
3.3, "Operation During Run Mode," on page 11.)
„ ‘0’ (default) - the device is in normal mode
„ ‘1’ - the device is in Hotter of Two mode. In this mode, the two external diode channels are
measured and compared against each other. The hotter of the two channels has its data loaded
into the External Diode 2 Data Registers. The Internal Diode and External Diode 1 Data Registers
remain unaffected.

Bit 0 - REC - controls the Resistance Error Correction circuitry

„ '0' (default)- The Resistance Error Correction circuitry is disabled.
„ '1' - The Resistance Error Correction circuitry is active and will automatically correct for up to 100
ohms of series resistance in the diode lines for the External Diode 2channel.

4.6 One Shot Register - (0Fh)

Table 4.6 One Shot Registers

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

0Fh One Shot Writing to this register address initiates the one-shot. The data is not 00h
Conversion important and is not stored

The One Shot Register is an address place holder for the one-shot command. Writing to the address
initiates the command. The data written is not important and is not stored. Reading from the one-shot
registers will always return 00h.

4.7 Ideality Configuration Registers (27h - 28h)

Table 4.7 Ideality Configuration Registers

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

27h Diode 1 Ideality - - B5 B4 B3 B2 B1 B0 12h

Correction Factor (1.008)

28h Diode 2 Ideality - - B5 B4 B3 B2 B1 B0 12h

Correction Factor (1.008)

The Ideality Configuration Registers store the ideality correction factor that is applied to each external
diode.

The table below shows the ideality factor settings for the Ideality Configuration registers. Shading
indicates power-up default. All codes that are not listed are reserved and should not be used.

Beta Compensation and Resistance Error Correction automatically correct for most diode ideality
errors, therefore it is not recommended that these settings be updated without consulting SMSC.

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Table 4.8 Ideality Factor Look Up Table

SETTING FACTOR SETTING FACTOR SETTING FACTOR

001000 0.9951 011000 1.0159 101000 1.0377

001001 0.9964 011001 1.0173 101001 1.0391

001010 0.9976 011010 1.0186 101010 1.0404

001011 0.9989 011011 1.0199 101011 1.0418

001100 1.0002 011100 1.0213 101100 1.0432

001101 1.0015 011101 1.0226 101101 1.0446

001110 1.0028 011110 1.0240 101110 1.0460

001111 1.0041 011111 1.0253 101111 1.0475

010000 1.0054 100000 1.0267 110000 1.0489

010001 1.0067 100001 1.0280 110001 1.0503

010010 1.0080 100010 1.0294

010011 1.0093 100011 1.0308

010100 1.0106 100100 1.0321

010101 1.0119 100101 1.0335

010110 1.0133 100110 1.0349

010111 1.0146 100111 1.0363

For CPU substrate transistors that require the BJT transistor model, the ideality factor behaves slightly
differently than for discrete diode-connected transistors. Refer to Table 4.9 when using a CPU
substrate transistor.

Table 4.9 Substrate Diode Ideality Factor Look-Up Table (BJT Model)

SETTING FACTOR SETTING FACTOR SETTING FACTOR

001000 0.9869 011000 1.0079 101000 1.0291

001001 0.9882 011001 1.0092 101001 1.0304

001010 0.9895 011010 1.0105 101010 1.0317

001011 0.9908 011011 1.0120 101011 1.0330

001100 0.9921 011100 1.0132 101100 1.0343

001101 0.9934 011101 1.0146 101101 1.0356

001110 0.9947 011110 1.0159 101110 1.0369

001111 0.9960 011111 1.0173 101111 1.0382

010000 0.9973 100000 1.0187 110000 1.0395

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Table 4.9 Substrate Diode Ideality Factor Look-Up Table (BJT Model) (continued)

SETTING FACTOR SETTING FACTOR SETTING FACTOR

010001 0.9986 100001 1.0200 110001 1.0408

010010 1.0000 100010 1.0213

010011 1.0013 100011 1.0226

010100 1.0026 100100 1.0239

010101 1.0039 100101 1.0252

010110 1.0053 100110 1.0265

010111 1.0066 100111 1.0278

APPLICATION NOTE: When measuring a 65nm Intel CPUs, the Ideality Setting should be the default 12h. When
measuring 45nm Intel CPUs, the Ideality Setting should be 15h.

4.8 Product ID Register (EDh)

Table 4.10 Product ID Register

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

EDh PID 0 0 1 1 0 0 X X 30h (-1)

31h (-2)
32h (-3)
33h (-4)

The Product ID Register holds the unique product ID for identifying SMSC EMC products. See
Table 4.1 for a list of the product ID number for each version of the EMC1063.

4.9 Manufacturer ID Register (FEh)

Table 4.11 Manufacturer ID Register

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

FEh SMSC 0 1 0 1 1 1 0 1 5Dh

The Manufacturer ID register contains an 8 bit word that identifies the manufacturer of the EMC1063
(SMSC = 5Dh).

4.10 Revision Register (FFh)

Table 4.12 Revision Register

ADDR REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

FFh REV - - - - 0 0 0 1 01h

The Revision register contains a 4 bit word that identifies the die revision.

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Chapter 5 Typical Operating Curves

Supply Curre nt vs . Conve rs ion Rate Tem perature Error vs. Filter Capacitor
(TA = 27°C, V DD = 3.3V ) (2N3904, TA = 27°C, TDIODE = 27°C, VDD = 3.3V)
800
0.5
700

Temperature Error (°C)

0.3
Supply Current (uA)

600
0.0
500

400 -0.3

300 -0.5
200 -0.8
100
-1.0
0 0 1000 2000 3000 4000
1 2 4 8 16
Filter Capacitor (pF)
Conve rs ion Rate (conv / s e c)

Tem perature Error vs. Am bient Tem perature Tem perature Error vs. External Diode Tem perature
(2N3904, TDIODE = 27°C, VDD = 3.3V) (2N3904, TA=42.5°C, VDD = 3.3V)
2.0 2.0

1.5 1.5
Temperature Error (°C)

Temperature Error (°C)

1.0 1.0

0.5 0.5

0.0 0.0

-0.5 -0.5

-1.0 -1.0

-1.5 -1.5

-2.0 -2.0
0 15 30 45 60 75 90 0 25 50 75 100 125
Am bient Tem perature (°C) External Diode Tem perature (°C)

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Te m pe r ature Err or vs . Le ak age Re s is tance

Standby Current vs. Supply Voltage
(2N3904, TA = T DIODE = 27°C, V DD = 3.3V )
(TA = 27°C)
30.0 3.0
DP to GND
20.0
2.5

Standby Current (uA)

Temperature Error(°C)

10.0
2.0
0.0
1.5
-10.0
1.0
-20.0
0.5
-30.0
DP to VDD
-40.0 0.0
1 10 100 2.9 3.1 3.3 3.5 3.7
Le ak age Re s is tance (M Ω ) Supply Voltage (V)

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Chapter 6 Package Outline

Figure 6.1 8-Pin MSOP Package Outline - 3x3mm Body 0.65mm Pitch

Table 6.1 8-Pin MSOP Package Parameters

MIN NOMINAL MAX REMARKS

A 0.80 ~ 1.10 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 0.75 0.85 0.95 Body Thickness
D 2.80 3.00 3.20 X Body Size
E 4.65 4.90 5.15 Y Span
E1 2.80 ~ 3.20 Y body Size
H 0.08 ~ 0.23 Lead Foot Thickness
L 0.40 ~ 0.80 Lead Foot Length
L1 0.95 REF Lead Length
e 0.65 BSC Lead Pitch
θ 0o ~ 8o Lead Foot Angle
W 0.22 ~ 0.38 Lead Width
ccc ~ ~ 0.10 Coplanarity
Notes:
1. Controlling Unit: millimeters.
2. Tolerance on the true position of the leads is ± 0.065 mm maximum.
3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and
E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)
per end, and 0.15mm (0.006 inches) per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.

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6.1 Package Markings

All devices will be marked on the first line of the top side with ”1063”. On the second line, they will be
marked with the appropriate -X number (-1, -2, etc), the Functional Revision “B” and Country Code
(CC) .

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