A2608002

Intel® Desktop Board D850GB
Technical Product Specification
April 2001
Order Number A26080-002
The Intel® Desktop Board D850GB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized
errata are documented in the Intel Desktop Board D850GB Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel ® Desktop Board D850GB Technical Product September 2000
Specification.
-002 Second release of the Intel Desktop Board D850GB Technical Product April 2001
Specification. Changes include (but not limited to) the following:
• Added caution statement in processor section regarding the use of
ATX12V-compliant power supplies
• Changed Firmware Hub component to SST 49LF004A
• Added AD1885 analog codec as an option to audio subsystem
• Listed Diagnostic LEDs as a manufacturing option
• Updated fan connector section
• Updated BIOS Setup program chapter to reflect latest version of BIOS
• Included document changes from the most recent specification update
This product specification applies to only standard D850GB boards with BIOS identifier
GB85010A.86A.
Changes to this specification will be published in the Intel Desktop Board D850GB Specification
Update before being incorporated into a revision of this document.
Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and
Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied
warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The Intel® Desktop Board D850GB may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

Germany 44-0-1793-421-333, other Countries 708-296-9333.
† Third-party brands and names are the property of their respective owners.
Copyright  2000, 2001, Intel Corporation. All rights reserved.

Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the Intel Desktop Board D850GB. It
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the D850GB board and its
components to the vendors, system integrators, and other engineers and technicians who need this
level of information. It is specifically not intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on the D850GB board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, POST codes, and diagnostic
LEDs
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
✏ NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D850GB Technical Product Specification
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the D850GB board, and X is the instance of the particular part at
that general location. For example, J5J1 is a connector, located at 5J. It is the first connector
in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
† This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview ....................................................................................................................12
1.1.1 Feature Summary ........................................................................................12
1.1.2 Manufacturing Options .................................................................................13
1.1.3 D850GB Board Layout .................................................................................14
1.1.4 Block Diagram..............................................................................................15
1.2 Online Support ...........................................................................................................16
1.3 Design Specifications .................................................................................................16
1.4 Processor ...................................................................................................................19
1.5 System Memory .........................................................................................................20
1.5.1 Memory Features .........................................................................................20
1.5.2 Continuity RIMM Modules ............................................................................20
1.5.3 RDRAM Memory Configuration ....................................................................21
1.6 Intel® 850 Chipset.......................................................................................................22
1.6.1 AGP .............................................................................................................23
1.6.2 USB..............................................................................................................23
1.6.3 IDE Support .................................................................................................24
1.6.4 Real-Time Clock, CMOS SRAM, and Battery...............................................25
1.6.5 SST 49LF004A 4 Mbit Firmware Hub (FWH) ...............................................25
1.7 I/O Controller ..............................................................................................................26
1.7.1 Serial Port ....................................................................................................26
1.7.2 Parallel Port..................................................................................................26
1.7.3 Diskette Drive Controller ..............................................................................27
1.7.4 Keyboard and Mouse Interface ....................................................................27
1.8 Audio Subsystem (Optional) .......................................................................................28
1.8.1 Audio Connectors.........................................................................................29
1.8.2 Audio Subsystem Software ..........................................................................29
1.9 LAN Subsystem..........................................................................................................30
1.9.1 Intel® 82562EM Platform LAN Connect Device (Optional)............................30
1.9.2 RJ-45 LAN Connector with Integrated LEDs (Optional)................................30
1.9.3 LAN Subsystem Software ............................................................................31
1.10 CNR (Optional) ...........................................................................................................31
1.11 Hardware Management Subsystem............................................................................32
1.11.1 Hardware Monitor Component .....................................................................32
1.11.2 Fan Control and Monitoring ..........................................................................32
1.12 Power Management ...................................................................................................33
1.12.1 Software Support .........................................................................................33
1.12.2 Hardware Support ........................................................................................37
2 Technical Reference
2.1 Introduction.................................................................................................................43
2.2 Memory Map ..............................................................................................................43
2.3 I/O Map ......................................................................................................................44
v
2.4 DMA Channels ...........................................................................................................46

2.5 PCI Configuration Space Map ....................................................................................46
2.6 Interrupts ....................................................................................................................47
2.7 PCI Interrupt Routing Map ..........................................................................................47
2.8 Connectors .................................................................................................................49
2.8.1 Back Panel Connectors................................................................................50
2.8.2 Internal I/O Connectors ................................................................................53
2.8.3 External I/O Connectors ...............................................................................65
2.9 Jumper Blocks............................................................................................................68
2.9.1 BIOS Setup Configuration Jumper Block......................................................69
2.9.2 USB Port 2 Routing Jumper Block ...............................................................69
2.10 Mechanical Considerations.........................................................................................70
2.10.1 Form Factor .................................................................................................70
2.10.2 I/O Shield .....................................................................................................71
2.11 Electrical Considerations ............................................................................................72
2.11.1 Power Consumption .....................................................................................72
2.11.2 Add-in Board Considerations........................................................................72
2.11.3 Standby Current Requirements ....................................................................73
2.11.4 Fan Connector Current Capability ................................................................74
2.11.5 Power Supply Considerations ......................................................................74
2.12 Thermal Considerations..............................................................................................75
2.13 Reliability ....................................................................................................................76
2.14 Environmental ............................................................................................................77
2.15 Regulatory Compliance ..............................................................................................78
2.15.1 Safety Regulations .......................................................................................78
2.15.2 EMC Regulations .........................................................................................78
2.15.3 Certification Markings...................................................................................79
3 Overview of BIOS Features
3.1 Introduction.................................................................................................................81
3.2 BIOS Flash Memory Organization ..............................................................................82
3.3 Resource Configuration ..............................................................................................82
3.3.1 PCI Autoconfiguration ..................................................................................82
3.3.2 PCI IDE Support...........................................................................................82
3.4 System Management BIOS (SMBIOS) .......................................................................83
3.5 Legacy USB Support ..................................................................................................83
3.6 BIOS Updates ............................................................................................................84
3.6.1 Language Support........................................................................................84
3.6.2 Custom Splash Screen.................................................................................85
3.7 Recovering BIOS Data ...............................................................................................85
3.8 Boot Options...............................................................................................................86
3.8.1 CD-ROM and Network Boot .........................................................................86
3.8.2 Booting Without Attached Devices ...............................................................86
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot ....................................................86
3.9.1 Peripheral Selection and Configuration ........................................................86
3.9.2 Intel Rapid BIOS Boot ..................................................................................87
3.9.3 Operating System ........................................................................................87
3.10 BIOS Security Features..............................................................................................88
vi
Contents
4 BIOS Setup Program

4.1 Introduction.................................................................................................................89
4.2 Maintenance Menu .....................................................................................................90
4.2.1 Extended Configuration Submenu................................................................91
4.3 Main Menu..................................................................................................................92
4.4 Advanced Menu..........................................................................................................93
4.4.1 Boot Configuration Submenu .......................................................................94
4.4.2 Peripheral Configuration Submenu...............................................................95
4.4.3 IDE Configuration Submenu.........................................................................97
4.4.4 Diskette Configuration Submenu................................................................100
4.4.5 Event Log Configuration Submenu.............................................................101
4.4.6 Video Configuration Submenu....................................................................102
4.5 Security Menu ..........................................................................................................103
4.6 Power Menu .............................................................................................................104
4.7 Boot Menu ................................................................................................................105
4.8 Exit Menu .................................................................................................................107
5 Error Messages and Beep Codes
5.1 BIOS Error Messages...............................................................................................109
5.2 Port 80h POST Codes..............................................................................................111
5.3 Bus Initialization Checkpoints ...................................................................................115
5.4 Speaker ...................................................................................................................116
5.5 BIOS Beep Codes ....................................................................................................116
5.6 Diagnostic LEDs (Optional) ......................................................................................118
Figures
1. D850GB Board Components ......................................................................................14
2. Block Diagram ............................................................................................................15
3. Intel 850 Chipset Block Diagram.................................................................................22
4. Audio Subsystem Block Diagram................................................................................28
5. ICH2 and CNR Signal Interface ..................................................................................31
6. Using the Wake on LAN Technology Connector.........................................................39
7. Location of the Standby Power Indicator LED ............................................................40
8. Back Panel Connectors ..............................................................................................50
9. Audio Connectors .......................................................................................................54
10. Power and Hardware Control Connectors ..................................................................56
11. Add-in Board and Peripheral Interface Connectors.....................................................59
12. External I/O Connectors .............................................................................................65
13. Location of the Jumper Blocks....................................................................................68
14. D850GB Board Dimensions........................................................................................70
15. I/O Shield Dimensions ................................................................................................71
16. Localized High Temperature Zones............................................................................75
17. Diagnostic LEDs .......................................................................................................118
vii
Tables
1. Feature Summary.......................................................................................................12
2. Manufacturing Options ...............................................................................................13
3. Specifications .............................................................................................................16
4. Supported Processors ................................................................................................19
5. Supported Memory Configurations .............................................................................21
6. LAN Connector LED States ........................................................................................30
7. Effects of Pressing the Power Switch .........................................................................34
8. Power States and Targeted System Power ................................................................35
9. Wake Up Devices and Events ....................................................................................36
10. Fan Connector Descriptions .......................................................................................38
11. System Memory Map..................................................................................................43
12. I/O Map ......................................................................................................................44
13. DMA Channels ...........................................................................................................46
14. PCI Configuration Space Map ....................................................................................46
15. Interrupts ....................................................................................................................47
16. PCI Interrupt Routing Map ..........................................................................................48
17. PS/2 Mouse/Keyboard Connector ..............................................................................51
18. USB Connectors.........................................................................................................51
19. Parallel Port Connector...............................................................................................51
20. Serial Port Connector .................................................................................................52
21. LAN Connector (optional) ...........................................................................................52
22. Audio Line In Connector (optional) .............................................................................52
23. Audio Line Out Connector (optional)...........................................................................52
24. Mic In Connector (optional).........................................................................................52
25. Optional Auxiliary Line In Connector (J2C1) ...............................................................55
26. Optional ATAPI CD-ROM Connector (J2D1) ..............................................................55
27. Optional CD-ROM Legacy Style Connector (J2D2) ....................................................55
28. PC/PCI Connector (J6D1) ..........................................................................................55
29. ATX12V Power Connector (J3H1) ..............................................................................57
30. Processor Voltage Regulator Fan Connector (J3M1) .................................................57
31. RIMM Fan Connector (J7M2) .....................................................................................57
32. Processor Fan Connector (J6L1)................................................................................57
33. Main Power Connector (J10K1)..................................................................................58
34. Auxiliary Power (J9J1) ................................................................................................58
35. Wake on Ring Connector (J8C1) ................................................................................58
36. Wake on LAN Technology Connector (J7C1) .............................................................58
37. Chassis Fan Connector (J10A2).................................................................................58
38. CNR Connector (J3A1)...............................................................................................60
39. PCI Bus Connectors (J4A1, J4B1, J4C1, J4D1, J4E1) ...............................................61
40. AGP Connector (J5E1) ...............................................................................................62
41. PCI IDE Connectors (J9G2, Primary and J9G1, Secondary) ......................................63
42. Diskette Drive Connector (J10G1) ..............................................................................64
43. SCSI LED Connector (J7A2) ......................................................................................66
44. Front Panel USB Connector (J9C1)............................................................................66
45. Auxiliary Front Panel Power/Sleep/Message Waiting LED Connector (J8C3).............66
46. Front Panel Connector (J9D2) ....................................................................................66
viii
Contents
47. States for a One Color Power LED .............................................................................67

48. States for a Two Color Power LED .............................................................................67
49. BIOS Setup Configuration Jumper Settings (J8C2) ....................................................69
50. USB Port 2 Routing Jumper Settings (J8D1) ..............................................................69
51. Power Usage..............................................................................................................72
52. Standby Current Requirements ..................................................................................73
53. Thermal Considerations for Components ...................................................................76
54. D850GB Board Environmental Specifications.............................................................77
55. Safety Regulations .....................................................................................................78
56. EMC Regulations........................................................................................................78
57. Supervisor and User Password Functions ..................................................................88
58. BIOS Setup Program Menu Bar .................................................................................89
59. BIOS Setup Program Function Keys ..........................................................................90
60. Maintenance Menu .....................................................................................................90
61. Extended Configuration Submenu ..............................................................................91
62. Main Menu..................................................................................................................92
63. Advanced Menu..........................................................................................................93
64. Boot Configuration Submenu......................................................................................94
65. Peripheral Configuration Submenu.............................................................................95
66. IDE Configuration Submenu .......................................................................................97
67. Primary/Secondary IDE Master/Slave Submenus.......................................................98
68. Diskette Configuration Submenu ..............................................................................100
69. Event Log Configuration Submenu ...........................................................................101
70. Video Configuration Submenu ..................................................................................102
71. Security Menu ..........................................................................................................103
72. Power Menu .............................................................................................................104
73. Boot Menu ................................................................................................................105
74. Exit Menu .................................................................................................................107
75. BIOS Error Messages...............................................................................................109
76. Uncompressed INIT Code Checkpoints....................................................................111
77. Boot Block Recovery Code Checkpoints ..................................................................111
78. Runtime Code Uncompressed in F000 Shadow RAM ..............................................112
79. Bus Initialization Checkpoints ...................................................................................115
80. Upper Nibble High Byte Functions............................................................................115
81. Lower Nibble High Byte Functions............................................................................116
82. Beep Codes..............................................................................................................117
83. Diagnostic LED Codes..............................................................................................119
ix
x
1 Product Description
What This Chapter Contains

1.1 Overview ....................................................................................................................12
1.2 Online Support ...........................................................................................................16
1.3 Design Specifications .................................................................................................16
1.4 Processor ...................................................................................................................19
1.5 System Memory .........................................................................................................20
1.6 Intel® 850 Chipset.......................................................................................................22
1.7 I/O Controller ..............................................................................................................26
1.8 Audio Subsystem (Optional) .......................................................................................28
1.9 LAN Subsystem..........................................................................................................30
1.10 CNR (Optional) ...........................................................................................................31
1.11 Hardware Management Subsystem............................................................................32
1.12 Power Management ...................................................................................................33
11
1.1 Overview
1.1.1 Feature Summary

Table 1 summarizes the D850GB board’s major features.
Table 1. Feature Summary

Form Factor ATX (12.0 inches by 9.6 inches)
Processor • Support for an Intel® Pentium® 4 processor
• 400 MHz system data bus
Memory • Two Direct-RDRAM banks with two RIMM†s per bank (four RIMM sockets)
• Support for up to 2 GB of system memory using PC600 or PC800 RDRAM
Chipset Intel® 850 Chipset, consisting of:
• Intel® 82850 Memory Controller Hub (MCH)
• Intel® 82801BA I/O Controller Hub (ICH2)
• SST 49LF004A 4 Mbit Firmware Hub (FWH)
I/O Control SMSC LPC47M102 LPC bus I/O controller
Video • AGP connector supporting 1.5 V 4X AGP cards
Peripheral • Four Universal Serial Bus (USB) ports
Interfaces • One serial port
• One parallel port
• Two IDE interfaces with Ultra DMA, ATA-33/66/100 support
• One diskette drive interface
• PS/2† keyboard and mouse ports
Expansion • Five PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)
Capabilities
BIOS • Intel/AMI BIOS (resident in the SST 49LF004A 4 Mbit FWH)
• Support for Advanced Power Management (APM), Advanced Configuration and
Power Interface (ACPI), Plug and Play, and SMBIOS
Instantly Available • Support for PCI Local Bus Specification Revision 2.2
PC • Suspend to RAM support
• Wake on PCI, CNR, RS-232, front panel, PS/2 keyboard, and USB ports
Wake on LAN† Support for system wake up using an add-in network interface card with remote
Technology wake up capability
Connector
Hardware Two fan sense inputs used to monitor fan activity
Monitoring features
Enhanced thermal • Two additional fan sense inputs
monitor and fan • Two additional thermal sense inputs
control device
For information about Refer to

The board’s compliance level with APM, ACPI, Plug and Play, and SMBIOS. Section 1.3, page 16
12
Product Description
1.1.2 Manufacturing Options

Table 2 describes the D850GB board’s manufacturing options. Not every manufacturing option is
available in all marketing channels. Please contact your Intel representative to determine which
manufacturing options are available to you.
Table 2. Manufacturing Options

Audio (Integrated) Audio subsystem that uses the Analog Devices AD1881/AD1885 analog codec for
AC 97 processing
Video AGP Pro50 interface (50 W maximum); backward compatible with 1.5 V AGP video
cards.
This option uses an AGP Pro 1.5 V connector, also known as an AGP Pro50
connector.
LAN Intel® 82562EM 10/100 Mbit/sec Platform LAN Connect (PLC) device
Hardware Monitor Heceta 4 Hardware Monitor:
Subsystem • Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
CNR One Communication and Networking Riser (CNR) connector (slot shared with PCI
bus connector 5, J4A1)
Diagnostic LEDs Four dual-color LEDs on back panel
13
1.1.3 D850GB Board Layout

Figure 1 shows the location of the major components on the D850GB board.
A B C D
U
F
G
T
H
S
I
Q P ONM L K J
OM10441
A AD1881/AD1885 audio codec (optional) L Diskette drive connector

B AGP connector (AGP Pro 1.5V connector M IDE connectors
optional) N Intel 82801BA I/O Controller Hub (ICH2)
C Intel 82850 Memory Controller Hub (MCH) O SMSC LPC47M102 I/O Controller
D Back panel connectors P Front panel connector
E +12V power connector (ATX12V) Q Enhanced thermal monitor and fan control device
F Pentium 4 Processor socket R Battery
G Hardware monitor S SST 49LF004A 4 Mbit Firmware Hub (FWH)
H RAMBUS† Bank 0 (RIMM1 and RIMM2) T Speaker
I RAMBUS Bank 1 (RIMM3 and RIMM4) U PCI bus add-in card connectors
J Power connector V Communication and Networking Riser (CNR)
K Auxiliary Power connector connector (optional)
Figure 1. D850GB Board Components
14
Product Description
1.1.4 Block Diagram

Figure 2 is a block diagram of the major functional areas of the D850GB board.
Diagnostic
LEDs
Primary/ (Optional)
ATA-33/66/100
Secondary IDE
USB USB Ports 0 and 1

PGA423 System Bus
Processor Socket (400 MHz) USB Ports 2 and 3
850 Chipset
82850 Memory 82801BA SST 49LF004A

AGP AHA
Controller Hub I/O Controller Hub Firmware Hub
Interface Bus
(MCH) (ICH2) (FWH)
LPC
Dual RAMBUS Bus
4X AGP Channels
Connector CSMA/CD
Unit Diskette Drive
(1.5 V only)
Interface Connector
or RAMBUS Bank 0
AGP Pro50 (RIMM1 and RIMM2)
Serial Port
Connector RAMBUS Bank 1 LPC I/O Parallel Port
(optional) (RIMM3 and RIMM4) Controller PS/2 Mouse
PS/2 Keyboard
Hardware
Monitors SMBus
(optional) Physical LAN
Layer Connector
Interface (optional)
PCI Bus CNR

Connector
AC Link (optional)
PCI Slot 1
PCI Slot 2
AD1881/ CD-ROM
PCI Slot 3 AD1885 Line In
Audio Line Out
PCI Slot 4 Codec Mic In
(optional) Auxiliary Line In
PCI Slot 5
= connector or socket
OM11731
Figure 2. Block Diagram
15
1.2 Online Support

To find information about… Visit this World Wide Web site:
Intel’s D850GB board under “Product Info” or http://www.intel.com/design/motherbd
“Customer Support” http://support.intel.com/support/motherboards/desktop
Processor data sheets http://www.intel.com/design/litcentr
Proper date access in systems with Intel® http://support.intel.com/support/year2000
motherboards
ICH2 addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
1.3 Design Specifications

Table 3 lists the specifications applicable to the D850GB board.
Table 3. Specifications
Reference Specification Version, Revision Date, The information is
Name Title and Ownership available from…
AC ‘97 Audio Codec ‘97 Version 2.1, ftp://download.intel.com/ial/
May 1998, scalableplatforms/ac97r22.pdf
Intel Corporation
ACPI Advanced Configuration Version 2.0, http://www.teleport.com/~acpi/
and Power Interface July 27, 2000,
Specification Compaq Computer Corp.,
Intel Corporation,
Microsoft Corporation,
and Toshiba Corporation
AGP Accelerated Graphics Port Version 2.0, http://www.agpforum.org/
Interface Specification May 4, 1998,
Intel Corporation
AMI BIOS American Megatrends AMIBIOS 99, http://www.amij.com/amibios/
BIOS Specification 1999 bios.platforms.desktop.html
American Megatrends, Inc.
APM Advanced Power Version 1.2, http://www.microsoft.com/
Management BIOS February 1996, hwdev/busbios/amp_12.htm
Interface Specification Intel Corporation and
Microsoft Corporation
ATA/ Information Technology - Revision 3 http://www.t13.org
ATAPI-5 AT Attachment with Packet February 29, 2000,
Interface -5, Contact: T13 Chair,
(ATA/ATAPI-5) Seagate Technology
continued
16
Product Description
Table 3. Specifications (continued)

Reference Specification Version, Revision Date and The information is
Name Title Ownership available from…
ATX ATX Specification Version 2.03, http://www.formfactors.org/
December 1998, developer/specs/atx/
Intel Corporation. atxspecs.htm
ATX12V ATX / ATX12V Power Version 1.1, http://www.formfactors.org/
Supply Design Guide August 2000, developer/specs/atx/
Intel Corporation atxspecs.htm
BIS Boot Integrity Services Version 1.0 for WfM 2.0 http://developer.intel.com/
August 1999, design/security/bis/
Intel Corporation bisfaq.htm
CNR Communication and Version 1.1, http://developer.intel.com/
Network Riser (CNR) October 18, 2000, technology/cnr/index.htm
Specification Intel Corporation.
EPP IEEE std 1284.1-1997 Version 1.7, http://standards.ieee.org/
Enhanced Parallel Port 1997, reading/ieee/std_public/
Institute of Electrical and description/busarch/
Electronic Engineers 1284.1-1997_desc.html
El Torito Bootable CD-ROM Version 1.0, http://www.ptltd.com/
format specification January 25, 1995, techs/specs.html
Phoenix Technologies Ltd., and
IBM Corporation
LPC Low Pin Count Interface Version 1.0, http://www.intel.com/
Specification September 29, 1997, design/chipsets/industry/
Intel Corporation lpc.htm
PCI PCI Local Bus Version 2.2, http://www.pcisig.com/
Specification December 18, 1998,
PCI Special Interest Group
PCI Bus Power Version 1.1, http://www.pcisig.com/
Management Interface December 18, 1998,
Specification PCI Special Interest Group
Plug and Plug and Play BIOS Version 1.0a, http://www.microsoft.com/
Play Specification May 5, 1994, hwdev/respec/
Compaq Computer Corp., pnpspecs.htm
Phoenix Technologies Ltd.,
and Intel Corporation
PXE Preboot Execution Version 2.1, http://developer.intel.com/
Environment September 1999, ial/WfM/wfm20/design/
Intel Corporation mapxe/index.htm
RIMM Rambus Serial Presence Version 1.0, http://www.rambus.com/
Detect (SPD) March 1999, developer/
Specification Rambus Corp. support_rimm.html
Rambus RIMM Version 1.0, http://www.rambus.com/
Specification February 1999, developer/
Rambus Corp. development_support.html
continued
17
Table 3. Specifications (continued)

Reference Specification Version, Revision Date The information is
Name Title and Ownership available from…
SMBIOS System Management Version 2.3.1, http://developer.intel.com/
BIOS March 16, 1999, ial/wfm/design/smbios
American Megatrends Inc.,
Award Software International Inc.,
Compaq Computer Corporation
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
and SystemSoft Corporation.
UHCI Universal Host Controller Version 1.1, http://www.usb.org/
Interface Design Guide March 1996, developers
Intel Corporation
USB Universal Serial Bus Version 1.1, http://www.usb.org/
Specification September 23, 1998, developers
Compaq Computer Corporation,
Intel Corporation,
Microsoft Corporation, and
NEC Corporation
WfM Wired for Management Version 2.0, http://developer.intel.com/
Baseline December 18, 1998, ial/WfM/wfmspecs.htm
Intel Corporation
18
Product Description
1.4 Processor
CAUTION
Use only the processors listed below. Use of unsupported processors can damage the D850GB
board, the processor, and the power supply. See the Intel® Desktop Board 850GB Specification
Update for the most up-to-date list of supported processors for the D850GB board.
The D850GB board supports a single Pentium 4 processor with a system bus of 400 MHz. The
D850GB board supports the processors listed in Table 4. All supported onboard memory can be
cached, up to the cachability limit of the processor. See the processor’s data sheet for cachability
limits.
Table 4. Supported Processors

Type Designation System Bus L2 Cache Size
Pentium 4 processor 1.3, 1.4, and 1.5 GHz 400 MHz 256 KB
CAUTION
Use only an ATX12V-compliant power suppIy with this board. ATX12V power supplies have two
additional power leads that provide required supplemental power for the Intel Pentium 4
processor and the Intel 850 chipset. Always connect both additional power supply leads of the
ATX12V power supply, otherwise the board and the processor could be damaged.
Do not use a standard ATX power supply. Doing so could damage the board and the processor.
Processor support Section 1.2, page 16
Processor usage Section 1.2, page 16
Power supply connectors Section 2.8.2.3, page 56
19
1.5 System Memory

CAUTION
Turn off the power and unplug the power cord before installing or removing RIMM modules.
Failure to do so could damage the memory and the D850GB board. (After removing AC power the
standby power indicator LED should not be lit. See Figure 7 on page 40 for the location of the
standby power indicator LED.)
✏ NOTE
The board supports combinations of no more than 32 RDRAM components per RDRAM bank. If
the total number of RDRAM components installed in all RIMM sockets exceeds 64, the computer
will not boot.
1.5.1 Memory Features

The 82850 Memory Controller Hub integrates two lock-stepped Direct Rambus banks, providing a
processor-to-memory bandwidth up to 3.2 GB/sec. The D850GB board has four RIMM sockets
(two sockets for each bank) and supports the following memory features:
• Single- or double-sided RIMM configurations
• Maximum of 32 Direct Rambus devices per bank
• Memory configurations from 128 MB (minimum) to 2 GB (maximum) utilizing 128 Mbit or
256 Mbit technology PC600 or PC800 compliant RDRAM
• Serial Presence Detect (SPD) based configuration for optimal memory operation
• Suspend to RAM support
• ECC and non-ECC support
1.5.2 Continuity RIMM Modules

All RIMM sockets must be populated to achieve continuity for termination at the Rambus
interface. Continuity RIMMs (or “pass-through” modules) must be installed in the second
RDRAM bank if memory is not installed. If any of the RIMM sockets are not populated, the
computer will not complete the Power-On Self-Test (POST) and the BIOS beep codes will not be
heard.
20
Product Description
1.5.3 RDRAM Memory Configuration

When installing memory, note the following:
• The four RIMM sockets are grouped into two banks:
 Bank 0 (labeled on the board as RIMM1 and RIMM2)
 Bank 1 (labeled on the board as RIMM3 and RIMM4)
• Bank 0 must be populated first ensuring that the RDRAM installed in RIMM1 and RIMM2 is
identical in speed, size, and density. For example, the minimum system configuration would
use two 64 MB RIMM modules of PC600 or PC800 RDRAM.
• If the desired memory configuration has been achieved by populating Bank 0, then Bank 1
should be filled with two Continuity RIMMs.
• If memory is to be installed in Bank 1, the RIMM modules installed in RIMM3 and RIMM4
must be identical in size and density to each other, and match the speed of the RIMM modules
in Bank 0. The RIMM modules do not, however, need to match those in Bank 0 in size and
density. For example, if Bank 0 has two 128 MB RIMMs of PC800 RDRAM, Bank 1 would
require PC800 RDRAM also, however, any other supported RIMM modules such as 64 MB or
192 MB could be used.
• If ECC functionality is required, all installed RIMM modules must be ECC-compliant
Table 5 gives examples of RDRAM component density for various RIMM modules. Component
density (counts) can be identified on the RIMM label.
Table 5. Supported Memory Configurations

Capacity with Capacity with Capacity with Capacity with Capacity with
4 DRAM 6 DRAM 8 DRAM 12 DRAM 16 DRAM
Rambus Components Components Components Components Components
Technology per RIMM per RIMM per RIMM per RIMM per RIMM
128/144 Mbit 64 MB 96 MB 128 MB 192 MB 256 MB
256/288 Mbit 128 MB 192 MB 256 MB 384 MB 512 MB
21
1.6 Intel® 850 Chipset

The Intel 850 chipset consists of the following devices:
• 82850 Memory Controller Hub (MCH) with Accelerated Hub Architecture (AHA) bus
• 82801BA I/O Controller Hub (ICH2) with AHA bus
• SST 49LF004A Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the
Accelerated Hub Architecture interface. The ICH2 is a centralized controller for the board’s I/O
paths. The FWH provides the nonvolatile storage of the BIOS. The component combination
provides the chipset interfaces as shown in Figure 3.
ATA-33/66/100 Network
System Bus USB
850 Chipset
82850 82801BA SST 49LF004A

AHA
Memory Controller I/O Controller Hub Firmware Hub
Bus
Hub (MCH) (ICH2) (FWH)
LPC Bus
Dual RAMBUS AGP
SMBus PCI Bus AC Link
Channels Interface
OM11732
Figure 3. Intel 850 Chipset Block Diagram

The Intel 850 chipset http://developer.intel.com
The SST 49LF004A Firmware Hub http://www.ssti.com
Chipset resources Section 1.3, page 16
22
Product Description
1.6.1 AGP
✏ NOTE
The AGP connector is keyed for 1.5 V AGP cards only. Do not attempt to install a legacy 3.3 V
AGP card. The AGP connector is not mechanically compatible with legacy 3.3 V AGP cards.
The AGP connector supports AGP add-in cards with 1.5 V Switching Voltage Level (SVL). An
AGP Pro50 interface is available (for a 50 W maximum power draw) as a manufacturing option.
Legacy 3.3 V AGP cards are not supported and will prevent the system from booting if installed.
The location of the AGP connector Figure 1, page 14
The signal names of the AGP connector Table 40, page 62
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications.

While based on the PCI Local Bus Specification, Rev. 2.1, AGP is independent of the PCI bus and
is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of
the PCI bus related to handling large amounts of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent efficiency
Obtaining the Accelerated Graphics Port Interface Specification Section 1.3, page 16
1.6.2 USB
The ICH2 contains two separate USB controllers supporting four USB ports. One USB peripheral
can be connected to each port. For more than four USB devices, an external hub can be connected
to any of the ports. Two of the USB ports are implemented with stacked back panel connectors.
The other two are accessible via the front panel USB connector at location J9C1. One of the front
panel USB connectors can be routed to the optional CNR connector. The D850GB board fully
supports UHCI and uses UHCI-compatible software drivers.
✏ NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
The location of the USB connectors on the back panel Figure 8, page 50
The signal names of the back panel USB connectors Table 18, page 51
The location of the front panel USB connector Figure 12, page 65
The signal names of the front panel USB connector Table 44, page 66
The USB specification and UHCI Section 1.3, page 16
23
1.6.3 IDE Support

1.6.3.1 IDE Interfaces
The ICH2’s IDE controller has two independent bus-mastering IDE interfaces that can be
independently enabled. The IDE interfaces support the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH2’s ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
✏ NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using
the transfer modes listed in Section 4.4.3.1 on page 98.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The D850GB board supports Laser Servo (LS-120) diskette technology through its IDE interfaces.
An LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot
menu to one of the following:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
The location of the IDE connectors Figure 11, page 59
The signal names of the IDE connectors Table 41, page 63
BIOS Setup program’s Boot menu Table 73, page 105
24
Product Description
1.6.3.2 SCSI Hard Drive Activity LED Connector

The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in
SCSI controller to use the same LED as the onboard IDE controller. For proper operation, this
connector should be wired to the LED output of the add-in SCSI controller. The LED indicates
when data is being read from, or written to, both the add-in SCSI controller and the IDE controller.
The location of the SCSI hard drive activity LED connector Figure 12, page 65
The signal names of the SCSI hard drive activity LED connector Table 43, page 66
1.6.4 Real-Time Clock, CMOS SRAM, and Battery

The real-time clock provides a time-of-day clock and a multicentury calendar with alarm features.
The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are
reserved for BIOS use.
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values
can be returned to their defaults by using the BIOS Setup program.
✏ NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
Proper date access in systems with D850GB boards Section 1.2, page 16
1.6.5 SST 49LF004A 4 Mbit Firmware Hub (FWH)

The FWH provides the following:
• System BIOS program
• System security and manageability logic that enables protection for storing and updating of
platform information
25
1.7 I/O Controller

The SMSC LPC47M102 I/O controller provides the following features:
• 3.3 V operation
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.2 MB or 1.44 MB diskette drive
• Intelligent power management, including a programmable wake up event interface
• PCI power management support
• One fan tachometer input
The BIOS Setup program provides configuration options for the I/O controller.
SMSC LPC47M102 I/O controller http://www.smsc.com
1.7.1 Serial Port

The D850GB board has one serial port connector on the back panel. The serial port’s NS16C550-
compatible UART supports data transfers at speeds up to 115.2 kbits/sec with BIOS support. The
serial port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).
The location of the serial port connector Figure 8, page 50
The signal names of the serial port connector Table 20, page 52
1.7.2 Parallel Port

The 25-pin D-Sub parallel port connector located on the back panel. In the BIOS Setup program,
the parallel port can be set to the following modes:
• Output only (PC AT†-compatible mode)
• Bi-directional (PS/2 compatible)
• EPP
• ECP
The location of the parallel port connector Figure 8, page 50
The signal names of the parallel port connector Table 19, page 51
Setting the parallel port’s mode Table 65, page 95
26
Product Description
1.7.3 Diskette Drive Controller

The I/O controller supports one diskette drive that is compatible with the 82077 diskette drive
controller and supports both PC-AT and PS/2 modes.
The location of the diskette drive connector Figure 11, page 59
The signal names of the diskette drive connector Table 42, page 64
The supported diskette drive capacities and sizes Table 68, page 100
1.7.4 Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these
connectors are protected with a PolySwitch† circuit that, like a self-healing fuse, reestablishes the
connection after an overcurrent condition is removed.
✏ NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top
PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
The keyboard controller contains the AMI keyboard and mouse controller code, provides the
keyboard and mouse control functions, and supports password protection for power-on/reset. A
power-on/reset password can be specified in the BIOS Setup program.
The location of the keyboard and mouse connectors Figure 8, page 50
The signal names of the keyboard and mouse connectors Table 17, page 51
27
1.8 Audio Subsystem (Optional)
CAUTION
The pins on both the legacy-style 2-mm and the ATAPI CD-ROM connectors are wired to the same
inputs on the audio mixer. Do not attach CD-ROM drives to both connectors, otherwise, the board
or drives could be damaged.
The audio subsystem includes these features:
• Split digital/analog architecture for improved S/N (signal-to-noise) ratio: ≥ 85 dB
• Power management support for APM 1.2 and ACPI 1.0 (driver dependant)
• 3-D stereo enhancement
Even though all connectors may not appear on all boards, the audio subsystem supports the
following audio interfaces:
• CD-ROM (legacy-style 2-mm connector)
• ATAPI-style connectors:
 CD-ROM
 Auxiliary line in
• Back panel audio connectors:
 Line out
 Line in
 Mic in
The audio subsystem consists of the following devices:
• Intel 82801BA I/O Controller Hub (ICH2)
• Analog Devices AD1881/AD1885 analog codec
Figure 4 is a block diagram of the audio subsystem.
CD-ROM
82801BA Analog Devices Line In
AC ’97
I/O Controller Hub AD1881/AD1885 Audio In
Link
(ICH2) Analog Codec Mic In
Line Out
OM11733
Figure 4. Audio Subsystem Block Diagram

The back panel audio connectors Section 2.8.1, page 50
28
Product Description
1.8.1 Audio Connectors

1.8.1.1 CD-ROM (Legacy-style 2-mm) Audio Connector (Optional)
A 1 x 4-pin legacy-style 2-mm connector connects an internal CD-ROM drive to the audio mixer.
The location of the legacy-style 2-mm connector Figure 9, page 54
The signal names of the legacy-style 2-mm connector Table 38, page 57
1.8.1.2 ATAPI CD-ROM Audio Connector (Optional)

A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the audio
mixer.
The location of the ATAPI CD-ROM connector Figure 9, page 54
The signal names of the ATAPI CD-ROM connector Table 26, page 55
1.8.1.3 Auxiliary Line In Connector (Optional)

A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an internal audio
device to the audio subsystem.
The location of the auxiliary line in connector Figure 9, page 54
The signal names of the auxiliary line in connector Table 25, page 55
1.8.2 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.
Obtaining audio software and drivers Section 1.2, page 16
29
1.9 LAN Subsystem

The Network Interface Controller subsystem consists of the ICH2 (with integrated LAN Media
Access Controller) and a physical layer interface device. Features of the LAN subsystem include:
• PCI Bus Master interface
• CSMA/CD Protocol Engine
• Serial CSMA/CD unit interface that supports the following physical layer interface devices:
 82562EM onboard LAN
 82562ET/EM (10/100 Mbit/sec Ethernet) on CNR bus
 82562EH (1 Mbit/sec HomePNA†) on CNR bus
• PCI Power Management
 Supports APM
 Supports ACPI technology
 Supports Wake up from suspend state (Wake on LAN† technology)
1.9.1 Intel® 82562EM Platform LAN Connect Device (Optional)

The Intel 82562EM component provides an interface to the back panel RJ-45 connector with
integrated LEDs. This physical interface may alternately be provided through the CNR connector.
The Intel 82562EM provides the following functions:
• Basic 10/100 Ethernet LAN connectivity
• Supports RJ-45 connector with status indicator LEDs on the back panel
• Full device driver compatibility
• Advanced Power Management and ACPI support
• Programmable transit threshold
• Configuration EEPROM that contains the MAC address
• Remote monitoring (alerting)
1.9.2 RJ-45 LAN Connector with Integrated LEDs (Optional)

Two LEDs are built into the RJ-45 LAN connector. Table 6 describes the LED states when the
board is powered up and the LAN subsystem is operating.
Table 6. LAN Connector LED States

LED Color LED State Condition
Green Off 10 Mbit/sec data rate is selected.
On 100 Mbit/sec data rate is selected.
Yellow Off LAN link is not established.
On (steady state) LAN link is established.
On (brighter and pulsing) The computer is communicating with another computer on
the LAN.
30
Product Description
1.9.3 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.
Obtaining LAN software and drivers Section 1.2, page 16
1.10 CNR (Optional)

The CNR connector provides an interface that supports the audio, modem, USB, and LAN
interfaces of the Intel 850 chipset. Figure 5 shows the signal interface between the riser and the
ICH2.
CNR Connector
AC ’97 Interface
Communication and
Intel 82801BA LAN Interfaces Networking Riser
I/O Controller Hub SMBus
(ICH2) (Up to two AC ’97 codecs
USB and one LAN device)
Power
OM10412
Figure 5. ICH2 and CNR Signal Interface
The interfaces supported by the CNR include the following:

• AC ’97 interface: supports audio and/or modem functions on the CNR board.
• LAN interfaces: provides one of two LAN interfaces for networking functions. Interfaces
include an eight-pin interface for use with Platform LAN Connection (PLC) based devices, and
a 17-pin interface for Media Independent Interface (MII) based devices (commonly referred to
as a PHY).
• SMBus interface: provides Plug-and-Play functionality for the CNR board.
• USB interface: provides a USB interface for the CNR board.
The CNR connector includes power signals required for power management and for CNR board
operation. To learn more about the CNR, refer to the CNR specification.
✏ NOTE
If you install a CNR card with an audio codec that cannot support a mutilchannel audio upgrade,
the D850GB board’s integrated audio codec will be disabled. This only applies to D850GB
boards that have both the onboard audio subystem and a CNR.
Obtaining the CNR specification Section 1.3, page 16
31
1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The board has several hardware management features,
including the following:
• Fan control and monitoring
• Thermal and voltage monitoring
The WfM specification Table 3, page 16
1.11.1 Hardware Monitor Component

The hardware monitor component provides low-cost instrumentation capabilities. The features of
the component include:
• Internal ambient temperature sensing
• Remote thermal diode sensing for direct monitoring of processor temperature
• Power supply monitoring (+5 V, +3.3 V, +2.5 V, 3.3 VSB, Vccp) to detect levels above or
below acceptable values
• SMBus interface
1.11.2 Fan Control and Monitoring

The SMSC LPC47M102 I/O controller provides one fan tachometer input. The enhanced thermal
monitor and fan control device provides two fan sense inputs and two fan control outputs.
Monitoring and control can be implemented using third-party software.
The functions of the fan connectors Section 1.12.2.2, page 38
The location of the fan connectors Figure 10, page 56
The signal names of the fan connectors Section 2.8.2.2, page 54
32
Product Description
1.12 Power Management

Power management is implemented at several levels, including:
• Software support:
 Advanced Power Management (APM)
 Advanced Configuration and Power Interface (ACPI)
• Hardware support:
 Power connector
 Fan connectors
 Wake on LAN technology
 Instantly Available technology
 Resume on Ring
 Wake from USB
 Wake from PS/2 keyboard
 PME# wakeup support
1.12.1 Software Support

The software support for power management includes:
• APM
• ACPI
If an ACPI-aware operating system is used, the BIOS can provide ACPI support. Otherwise, it
defaults to APM support.
1.12.1.1 APM
APM makes it possible for the computer to enter an energy-saving standby mode. The standby
mode can be initiated in the following ways:
• Time-out period specified in the BIOS Setup program
• From the operating system, such as the Standby menu item in Windows† 98
In standby mode, the D850GB board can reduce power consumption by spinning down hard
drives, and reducing power to, or turning off of, VESA† DPMS-compliant monitors. Power
management mode can be enabled or disabled in the BIOS Setup program.
While in standby mode, the system retains the ability to respond to external interrupts and service
requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the
system out of standby mode and immediately restores power to the monitor.
33
The BIOS enables APM by default, but the operating system must support an APM driver for the
power management features to work. For example, Windows 98 supports the power management
features upon detecting that APM is enabled in the BIOS.
Enabling or disabling power management in the BIOS Setup program Table 72, page 104
The D850GB board’s compliance level with APM Table 3, page 16
1.12.1.2 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with the D850GB board requires an operating system
that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration) and APM support (normally contained
in the BIOS)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping
state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake up events (see Table 9 on page 36)
• Support for a front panel power and sleep mode switch. Table 7 lists the system states based
on how long the power switch is pressed, depending on how ACPI is configured with an
ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch

…and the power switch is
If the system is in this state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than four seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than four seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)

The D850GB board’s compliance level with ACPI Section 1.3, page 16
34
Product Description
1.12.1.2.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 8 lists the power states supported by the D850GB board along with the associated system
power targets. See the ACPI specification for a complete description of the various system and
power states.
Table 8. Power States and Targeted System Power

Processor Targeted System
Global States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W
state stopped grant device
specification
specific.
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state RAM. Context except for wake
saved to RAM. up logic.
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state disk. Context except for wake
saved to disk. up logic.
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W (Note 2)
Context not saved. except for wake
Cold boot is up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system so
mechanical off system. wake up logic, that service can be
AC power is except when performed.
disconnected provided by
from the battery or external
computer. source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
35
1.12.1.2.2 Wake Up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.
Table 9. Wake Up Devices and Events

These devices/events can wake up the computer… …from this state
Power switch S1, S3, S4, S5
RTC alarm S1, S3, S4, S5
LAN S1, S3, S4, S5 (Note)
CNR S1, S3, S4, S5
PME# S1, S3, S4, S5
Modem (back panel Serial Port A) S1, S3
IR command S1, S3
USB S1, S3
PS/2 keyboard S1, S3
Note: For LAN and PME#, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will
enable a wake-up event from LAN in the S5 state.
✏ NOTE
The use of these wake up events from an ACPI state requires a properly configured operating
system that provides full ACPI support. In addition, software, drivers, and peripherals must fully
support ACPI wake events.
1.12.1.2.3 Plug and Play
In addition to power management, ACPI provides control information so that operating systems
can facilitate Plug and Play. ACPI is used only to configure devices that do not use other hardware
configuration standards. PCI devices for example, are not configured by ACPI.
36
Product Description
1.12.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if the Wake on LAN and
Instantly Available technology features are used. Failure to do so can damage the power supply.
The total amount of standby current required depends on the wake devices supported and
manufacturing options. Refer to Section 2.11.3 on page 73 for additional information.
The D850GB board provides several power management hardware features, including:
• Power connector
• Fan connectors
• Wake on LAN technology
• Instantly Available technology
• Resume on Ring
• Wake from USB
• Wake from PS/2 keyboard
• PME# wakeup support
Wake on LAN technology and Instantly Available technology require power from the +5 V
standby line. The sections discussing these features describe the incremental standby power
requirements for each.
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal) and the
power management mode being used (APM or ACPI).
✏ NOTE
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
1.12.2.1 Power Connector

When used with an ATX12V-compliant power supply that supports remote power on/off, the
D850GB board can turn off the system power through software control. To enable soft-off control
in software, advanced power management must be enabled in the BIOS Setup program and in the
operating system. When the system BIOS receives the correct APM command from the operating
system, the BIOS turns off power to the computer.
With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected
power cord, when power resumes, the computer returns to the power state it was in before power
was interrupted (on or off). The computer’s response can be set using the After Power Failure
feature in the BIOS Setup program’s Boot menu.
37

The location of the power connector Figure 10, page 56
The signal names of the power connector Table 33, page 58
The BIOS Setup program’s Boot menu Table 73, page 105
The ATX specification Section 1.3, page 16
1.12.2.2 Fan Connectors

The D850GB board has two fan connectors with thermal control signals (fan 1 at location J10A2
and fan 2 at location J7M2) that are used to switch the fans on and off or adjust the fan speed as
determined by the thermal sensors.
The ambient temperature of a D850GB-based system is thermally monitored by separate
temperature sensors that control voltage to the fan 1 and fan 2 connectors. If the fans attached to
these connectors provide a tachometer signal, the sensor reports the fan speed to the hardware
monitor component.
The temperature sensors that control the fans are initialized by the BIOS at power-up to turn on
o o
only when the sensor reaches 36 C (96.8 F). The fans switch off when their respective sensors
o o
cool down to 31 C (87.8 F). This prevents the fans from turning off and on when the ambient air
o
around the sensor fluctuates around 35-36 C. When the fans switch on, they may appear to rotate
o
slowly because the fan’s duty cycle starts at 70% and rises to 100% when the sensor reaches 46 C
o
(114.8 F).
All fans (fan 1, fan 2, fan 3, and fan 4) and the thermal control circuits are off during ACPI S3, S4,
and S5 states. Fan 3 and fan 4 (and the associated thermal control fan circuits) are enabled during
ACPI S0 and S1 states. Table 10 summarizes the functions of the four fan connectors.
Table 10. Fan Connector Descriptions

Connector Function
Chassis fan (fan 1) Provides +12 V DC for the system or chassis fan. A tachometer feedback
connection is also provided. A fan attached to this connector can be monitored
and controlled by the enhanced thermal monitor and fan control device.
RIMM fan (fan 2) Provides +12 V DC for the fan to cool the RIMM modules. A tachometer feedback
connection is also provided. A fan attached to this connector can be monitored
and controlled by the enhanced thermal monitor and fan control device.
Processor fan (fan 3) Provides +12 V DC for the processor fan or active fan heatsink. This fan is on in
the S0 or S1 state and is off only when the system is off or in the S3 or S5 state.
There are no user controls, however, this fan connector is wired to the fan
tachometer input of the SMSC LPC47M102 I/O controller.
Processor voltage Provides +12 V DC for the fan to cool the processor voltage regulator area. This
regulator fan (fan 4) fan is on in the S0 or S1 state and is off only when the system is off or in the S3 or
S5 state. There are no user controls.
38
Product Description

The location of the fan connectors Figure 10, page 56
The signal names of the fan connectors Section 2.8.2.2, page 54
1.12.2.3 Wake on LAN Technology
CAUTION
For Wake on LAN technology, the 5-V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Wake on LAN technology can damage the power supply. Refer to Section 2.11.3 on
page 73 for additional information.
Wake on LAN technology enables remote wakeup of the computer through a network. The LAN
subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface.
Upon detecting a Magic Packet† frame, the LAN subsystem asserts a wakeup signal that powers up
the computer. Depending on the LAN implementation, the D850GB board supports Wake on LAN
technology in the following ways:
• With APM, through the Wake on LAN technology connector
• With ACPI,
 through the PCI bus PME# signal for PCI 2.2 compliant LAN designs
 through the onboard LAN subsystem
 through a CNR-based LAN subsystem
The Wake on LAN technology connector can be used with PCI bus network interface cards that
have a remote wake up connector, as shown in Figure 6. Network interface cards that are PCI 2.2
compliant assert the wakeup signal through the PCI bus signal PME# (pin A19 on the PCI bus
connectors).
Network
Interface Remote
Card Wake Up Wake on
Connector LAN
Technology
PCI Slot Connector
Desktop Board
OM10731
Figure 6. Using the Wake on LAN Technology Connector

The location of the Wake on LAN technology connector Figure 10, page 56
The signal names of the Wake on LAN technology connector Table 36, page 58
39
1.12.2.4 Instantly Available Technology
CAUTION
For Instantly Available technology, the 5-V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available technology can damage the power supply. Refer to
Section 2.11.3 on page 73 for additional information.
Instantly Available technology enables the D850GB board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power
supply is off, and the front panel LED is amber if dual-color, or off if single-color.) When
signaled by a wake-up device or event, the system quickly returns to its last known wake state.
Table 9 on page 36 lists the devices and events that can wake the computer from the S3 state.
The D850GB board supports the PCI Bus Power Management Interface Specification. For
information on the versions of this specification, see Section 1.3. Add-in boards that also support
this specification can participate in power management and can be used to wake the computer.
The use of Instantly Available technology requires operating system support and PCI 2.2
compliant add-in cards and drivers.
The standby power indicator LED shows that power is still present at the RIMM, PCI bus, AGP,
and CNR connectors, even when the computer appears to be off. Figure 7 shows the location of
the standby power indicator LED.
CR6F1
OM10442
Figure 7. Location of the Standby Power Indicator LED
40
Product Description
1.12.2.5 Resume on Ring

The operation of Resume on Ring can be summarized as follows:
• Resumes operation from either the APM sleep mode or the ACPI S1 or S3 states
• Requires only one call to access the computer
• Detects incoming call similarly for external and internal modems
• Requires modem interrupt be unmasked for correct operation
1.12.2.6 Wake from USB

USB bus activity wakes the computer from an ACPI S1 or S3 state.
✏ NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.12.2.7 Wake from PS/2 Keyboard

PS/2 keyboard activity wakes the computer from an ACPI S1 or S3 state.
1.12.2.8 PME# Wakeup Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4,
or S5 state (with BIOS support).
1.12.2.9 Wake on LAN (Legacy)

This provision allows legacy internal LAN cards that require separate internal board connection to
support Wake on LAN technology. (More recent PCI LAN cards use the PME# signal available at
the PCI connector for this purpose.)
When a Wake on LAN technology supporting LAN card is connected to the Wake on LAN
connector, LAN activity wakes the computer from the APM sleep mode, or the ACPI S1, S3, S4,
or S5 states.
41
42
2 Technical Reference

2.1 Introduction.................................................................................................................43
2.2 Memory Map ..............................................................................................................43
2.3 I/O Map ......................................................................................................................44
2.4 DMA Channels ...........................................................................................................46
2.5 PCI Configuration Space Map ....................................................................................46
2.6 Interrupts ....................................................................................................................47
2.7 PCI Interrupt Routing Map ..........................................................................................47
2.8 Connectors .................................................................................................................49
2.9 Jumper Blocks............................................................................................................68
2.10 Mechanical Considerations.........................................................................................70
2.11 Electrical Considerations ............................................................................................72
2.12 Thermal Considerations..............................................................................................75
2.13 Reliability ....................................................................................................................76
2.14 Environmental ............................................................................................................77
2.15 Regulatory Compliance ..............................................................................................78
2.1 Introduction
Sections 2.2 - 2.6 contain several standalone tables. Table 11 describes the system memory map,
Table 12 shows the I/O map, Table 13 lists the DMA channels, Table 14 defines the PCI
configuration space map, and Table 15 describes the interrupts. The remaining sections in this
chapter are introduced by text found with their respective section headings.
2.2 Memory Map

Table 11. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 2097152 K 100000 - 7FFFFFFF 2047 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Available high DOS memory (open
to the PCI bus)
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
43
2.3 I/O Map

Table 12. I/O Map
Address (hex) Size Description
0000 - 000F 16 bytes DMA controller
0020 - 0021 2 bytes Programmable Interrupt Control (PIC)
0040 - 0043 4 bytes System timer
0060 1 byte Keyboard controller byte—reset IRQ
0061 1 byte System speaker
0064 1 byte Keyboard controller, CMD / STAT byte
0070 - 0071 2 bytes System CMOS / Real Time Clock
0072 - 0073 2 bytes System CMOS
0080 - 008F 16 bytes DMA controller
0092 1 byte Fast A20 and PIC
00A0 - 00A1 2 bytes PIC
00B2 - 00B3 2 bytes APM control
00C0 - 00DF 32 bytes DMA
00F0 1 byte Numeric data processor
0170 - 0177 8 bytes Secondary IDE channel
01F0 - 01F7 8 bytes Primary IDE channel
One of these ranges: 16 bytes Audio (Sound Blaster Pro†-compatible)
0220 - 022F
0240 - 024F
0228 - 022F* 8 bytes LPT3
0278 - 027F* 8 bytes LPT2
02E8 - 02EF* 8 bytes COM4 / video (8514A)
02F8 - 02FF* 8 bytes COM2
0376 1 byte Secondary IDE channel command port
0377, bits 6:0 7 bits Secondary IDE channel status port
0378 - 037F 8 bytes LPT1
03B0 - 03BB 12 bytes Intel 82850 MCH
03C0 - 03DF 32 bytes Intel 82850 MCH
03E8 - 03EF 8 bytes COM3
03F0 - 03F5 6 bytes Diskette channel 1
03F6 1 byte Primary IDE channel command port
03F8 - 03FF 8 bytes COM1
04D0 - 04D1 2 bytes Edge / level triggered PIC
LPTn + 400 8 bytes ECP port, LPTn base address + 400h
0CF8 - 0CFB** 4 bytes PCI configuration address register
0CF9*** 1 byte Turbo and reset control register
0CFC - 0CFF 4 bytes PCI configuration data register
FFA0 - FFA7 8 bytes Primary bus master IDE registers
FFA8 - FFAF 8 bytes Secondary bus master IDE registers
continued
44
Technical Reference
Table 12. I/O Map (continued)

Address (hex) Description
96 contiguous bytes starting on a 128-byte ICH2 (ACPI + TCO)
divisible boundary
64 contiguous bytes starting on a 64-byte D850GB board resource
divisible boundary
64 contiguous bytes starting on a 64-byte Onboard audio controller
divisible boundary
32 contiguous bytes starting on a 32-byte ICH2 (USB controller #1)
divisible boundary
16 contiguous bytes starting on a 16-byte ICH2 (SMBus)
divisible boundary
4096 contiguous bytes starting on a 4096-byte Intel 82801BA PCI bridge
divisible boundary
256 contiguous bytes starting on a 256-byte ICH2 audio mixer
divisible boundary
64 contiguous bytes starting on a 64-byte ICH2 audio bus mixer
divisible boundary
256 contiguous bytes starting on a 256-byte ICH2 modem mixer
divisible boundary
32 contiguous bytes starting on a 32-byte ICH2 (USB controller #2)
divisible boundary
96 contiguous bytes starting on a 128-byte LPC47M102
divisible boundary
* Default, but can be changed to another address range.
** Dword access only.
*** Byte access only.
✏ NOTE
Some additional I/O addresses are not available due to ICH2 address aliassing.
ICH2 addressing Section 1.2 on page 16
45
2.4 DMA Channels

Table 13. DMA Channels
DMA Channel Number Data Width System Resource
0 8 or 16 bits Audio
1 8 or 16 bits Audio / parallel port
2 8 or 16 bits Diskette drive
3 8 or 16-bits Parallel port (for ECP or EPP) / audio
4 8 or 16 bits DMA controller
5 16 bits Open
6 16 bits Open
7 16 bits Open
2.5 PCI Configuration Space Map

Table 14. PCI Configuration Space Map
Bus Device Function
Number (hex) Number (hex) Number (hex) Description
00 00 00 Memory controller of Intel 82850 component
00 01 00 PCI to AGP bridge
00 1E 00 Hub link to PCI bridge
00 1F 00 Intel 82801BA ICH2 PCI to LPC bridge
00 1F 01 IDE controller
00 1F 02 USB
00 1F 03 SMBus controller
00 1F 04 USB
00 1F 05 AC ’97 audio controller (optional)
00 1F 06 AC ’97 modem controller (optional)
01 00 00 Add-in AGP adapter card
02 08 00 LAN controller (optional)
02 09 00 PCI bus connector 1 (J4E1)
02 0A 00 PCI bus connector 2 (J4D1)
02 0B 00 PCI bus connector 3 (J4C1)
02 0C 00 PCI bus connector 4 (J4B1)
02 0D 00 PCI bus connector 5 (J4A1)
46
Technical Reference
2.6 Interrupts
Table 15. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
3 COM2 (Note)
4 COM1 (Note)
5 LPT2 (Plug and Play option) / Audio / User available
6 Diskette drive
7 LPT1 (Note)
8 Real-time clock
9 Reserved for ICH2 system management bus
10 User available
11 User available
12 Onboard mouse port (if present, else user available)
13 Reserved, math coprocessor
14 Primary IDE (if present, else user available)
15 Secondary IDE (if present, else user available)
Note: Default, but can be changed to another IRQ.
2.7 PCI Interrupt Routing Map

This section describes interrupt sharing and how the interrupt signals are connected between the
PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can
be shared between devices attached to the PCI bus. In most cases, the small amount of latency
added by interrupt sharing does not affect the operation or throughput of the devices. In some
special cases where maximum performance is needed from a device, a PCI device should not share
an interrupt with other PCI devices. Use the following information to avoid sharing an interrupt
with a PCI add-in card.
PCI devices are categorized as follows to specify their interrupt grouping:
• INTA: By default, all add-in cards that require only one interrupt are in this category. For
almost all cards that require more than one interrupt, the first interrupt on the card is also
classified as INTA.
• INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
• INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a
fourth interrupt is classified as INTD.
47
The ICH2 has eight programmable interrupt request (PIRQ) input signals. All PCI interrupt
sources either onboard or from a PCI add-in card connect to one of these PIRQ signals. Some PCI
interrupt sources are electrically tied together on the D850GB board and therefore share the same
interrupt. Table 16 shows an example of how the PIRQ signals are routed on the D850GB board.
For example, using Table 16 as a reference, assume an add-in card using INTA is plugged into PCI
bus connector 4. In PCI bus connector 4, INTA is connected to PIRQB, which is already
connected to the SMBus. The add-in card in PCI bus connector 4 now shares interrupts with these
onboard interrupt sources.
Table 16. PCI Interrupt Routing Map

ICH2 PIRQ Signal Name
PCI Interrupt Source PIRQF PIRQG PIRQH PIRQB Other
AGP connector INTB INTA to PIRQA
ICH2 USB controller INTD to PIRQD
SMBus controller INTB
ICH2 USB controller INTC to PIRQC
ICH2 Audio / Modem INTB
ICH2 LAN INTA to PIRQE
PCI Bus Connector 1 (J4E1) INTA INTB INTC INTD
PCI Bus Connector 2 (J4D1) INTD INTA INTB INTC
PCI Bus Connector 3 (J4C1) INTC INTD INTA INTB
PCI Bus Connector 4 (J4B1) INTB INTC INTD INTA
PCI Bus Connector 5 (J4A1) INTA INTB INTC INTD
✏ NOTE
The ICH2 can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6, 7, 9, 10, 11,
12, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt.
However, in certain interrupt-constrained situations, it is possible for two or more of the PIRQ
lines to be connected to the same IRQ signal.
48
Technical Reference
2.8 Connectors
CAUTION
Only the back panel connectors of the D850GB board have overcurrent protection. The D850GB
board’s internal connectors are not overcurrent protected and should connect only to devices
inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors
to power devices external to the computer’s chassis. A fault in the load presented by the external
devices could cause damage to the computer, the interconnecting cable, and the external devices
themselves.
This section describes the board’s connectors. The connectors can be divided into the following
groups:
• Back panel I/O connectors (see page 50)
 PS/2 keyboard and mouse
 USB (two)
 Parallel port
 Serial port
 LAN
 Audio (Line out, Line in, and Mic in)
• Internal I/O connectors (see page 53)
 Audio (ATAPI CD-ROM, legacy-style CD-ROM, and auxiliary line input)
 Fans (four)
 Power (three)
 Wake on Ring
 Add-in boards (one CNR connector, one AGP connector, and five PCI bus connectors)
 IDE (two)
 Diskette drive
 SCSI LED
• External I/O connectors (see page 65)
 Front panel USB
 Front panel (power/sleep/message-waiting LED, power switch, hard drive activity LED,
reset switch, infrared port, and auxiliary front panel power LED)
49
2.8.1 Back Panel Connectors

Figure 8 shows the location of the back panel connectors. The back panel connectors are color-
coded in compliance with PC 99 recommendations. The figure legend below lists the colors used.
A E
C H
I
J
B D F G
OM10443
Item Description Color For more information see:

A PS/2 mouse port Green Table 17
B PS/2 keyboard port Purple Table 17
C USB port 0 Black Table 18
D USB port 1 Black Table 18
E Parallel port Burgundy Table 19
F Serial port Teal Table 20
G LAN (optional) Black Table 21
H Audio line in (optional) Light blue Table 22
I Audio line out (optional) Lime green Table 23
J Mic in (optional) Pink Table 24
Figure 8. Back Panel Connectors
✏ NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
50
Technical Reference
Table 17. PS/2 Mouse/Keyboard Connector

Pin Signal Name
1 Data
2 Not connected
3 Ground
4 +5 V
5 Clock
6 Not connected
Table 18. USB Connectors

Pin Signal Name
1 +5 V
2 USBP0# [USBP1#]
3 USBP0 [USBP1]
4 Ground
Signal names in brackets ([ ]) are for USB port 1.
Table 19. Parallel Port Connector

Pin Standard Signal Name ECP Signal Name EPP Signal Name
1 STROBE# STROBE# WRITE#
2 PD0 PD0 PD0
3 PD1 PD1 PD1
4 PD2 PD2 PD2
5 PD3 PD3 PD3
6 PD4 PD4 PD4
7 PD5 PD5 PD5
8 PD6 PD6 PD6
9 PD7 PD7 PD7
10 ACK# ACK# INTR
11 BUSY BUSY#, PERIPHACK WAIT#
12 PERROR PE, ACKREVERSE# PE
13 SELECT SELECT SELECT
14 AUDOFD# AUDOFD#, HOSTACK DATASTB#
15 FAULT# FAULT#, PERIPHREQST# FAULT#
16 INIT# INIT#, REVERSERQST# RESET#
17 SLCTIN# SLCTIN# ADDRSTB#
18 – 25 Ground Ground Ground
51
Table 20. Serial Port Connector

Pin Signal Name
1 DCD (Data Carrier Detect)
2 RXD# (Receive Data)
3 TXD# (Transmit Data)
4 DTR (Data Terminal Ready)
5 Ground
6 DSR (Data Set Ready)
7 RTS (Request to Send)
8 CTS (Clear to Send)
9 RI (Ring Indicator)
Table 21. LAN Connector (optional)

Pin Signal Name
1 TX+
2 TX-
3 RX+
4 Ground
5 Ground
6 RX-
7 Ground
8 Ground
Table 22. Audio Line In Connector (optional)

Pin Signal Name
Tip Audio left in
Ring Audio right in
Sleeve Ground
Table 23. Audio Line Out Connector (optional)

Pin Signal Name
Tip Audio left out
Ring Audio right out
Sleeve Ground
Table 24. Mic In Connector (optional)

Pin Signal Name
Tip Mono in
Ring Mic bias voltage
Sleeve Ground
52
Technical Reference
2.8.2 Internal I/O Connectors

The internal I/O connectors are divided into the following functional groups:
• Audio (see page 54)
 Auxiliary line in (optional)
 ATAPI CD-ROM (optional)
 Legacy style (2-mm) CD-ROM (optional)
 PC/PCI
• Power and hardware control (see page 56)
 Fans (four)
 ATX12V
 Main power
 Auxiliary power
 Wake on ring connector
• Add-in boards and peripheral interfaces (see page 59)
 CNR (communication and networking riser)
 PCI bus (five)
 AGP
 IDE (two)
 SCSI LED
 Diskette drive
2.8.2.1 Expansion Slots

The board has the following expansion slots:
• One AGP connector or an optional AGP Pro50 connector at location J5E1 (ATX expansion
slot 6). The AGP connector is keyed for 1.5 V AGP cards only. Do not attempt to install a
legacy 3.3 V AGP card. The AGP connector is not mechanically compatible with legacy 3.3 V
AGP cards.
• Five PCI local bus slots (compliant with PCI rev 2.2 specification). The SMBus is routed to
PCI bus connector 2 only at location J4D1 (ATX expansion slot 4). PCI add-in cards with
SMBus support can access sensor data and other information residing on the desktop board.
• One CNR (optional), shared with PCI bus connector 5 at location J4A1 (ATX expansion
slot 1).
✏ NOTE
This document references back-panel slot numbering with respect to processor location on the
board. The AGP slot is not numbered. PCI slots are identified as PCI slot #x, starting with the
slot closest to the processor. The CNR slot shares PCI slot 5. The ATX/MicroATX specifications
identify expansion slot locations with respect to the far edge of a full-sized ATX chassis. The ATX
specification and the board’s silkscreen are opposite and could cause confusion. The ATX
numbering convention is made without respect to slot type (PCI vs. AGP), but refers to an actual
slot location on a chassis. Figure 11 on page 59 illustrates the board’s PCI slot numbering.
53
2.8.2.2 Audio Connectors

Figure 9 shows the location of the audio connectors.
A B C D
1
1 1
1
5 6
OM10444
Item Description Color Reference Designator For more information see:

A Auxiliary line in, ATAPI style White J2C1 Table 25
(Optional)
B ATAPI CD-ROM (Optional) Black J2D1 Table 26
C CD-ROM, Legacy style, 2 mm White J2D2 Table 27
(Optional)
D PC/PCI N/A J6D1 Table 28
Figure 9. Audio Connectors
54
Technical Reference
Table 25. Optional Auxiliary Line In Connector (J2C1)

Pin Signal Name
1 Left auxiliary line in
2 Ground
3 Ground
4 Right auxiliary line in
Table 26. Optional ATAPI CD-ROM Connector (J2D1)

Pin Signal Name
1 Left audio input from CD-ROM
2 CD audio differential ground
3 CD audio differential ground
4 Right audio input from CD-ROM
Table 27. Optional CD-ROM Legacy Style

Connector (J2D2)
Pin Signal Name
1 CD_Ground
2 CD_IN-Left
3 CD_Ground
4 CD_IN-Right
Table 28. PC/PCI Connector (J6D1)

Pin Signal Name Pin Signal Name
1 P_PCIGNTA# 2 Ground
3 Key (no pin) 4 P_PCIREQA#
5 Ground 6 SER_IRQ
55
2.8.2.3 Power and Hardware Control Connectors

Figure 10 shows the location of the power and hardware control connectors.
A B
2 1 1
3 4
1 1
1
20 11
10 1
I H G F E D C
OM10445
Item Description Reference Designator For more information see:

A ATX12V power connector J3H1 Table 29
B Processor voltage regulator fan (Fan 4) J3M1 Table 30
C RIMM fan (Fan 2) J7M2 Table 31
D Processor fan (Fan 3) J6L1 Table 32
E Main power J10K1 Table 33
F Auxiliary power J9J1 Table 34
G Wake on Ring J8C1 Table 35
H Wake on LAN technology J7C1 Table 36
I Chassis fan (Fan 1) J10A2 Table 37
Figure 10. Power and Hardware Control Connectors
56
Technical Reference

The power connector Section 1.12.2.1, page 37
The functions of the fan connectors Section 1.12.2.2, page 38
Wake on LAN technology Section 1.12.2.3, page 39
CAUTION
Use only an ATX12V-compliant power suppIy with this board. ATX12V power supplies have two
additional power leads that provide required supplemental power for the Intel Pentium 4
processor and the Intel 850 chipset. Always connect both additional power supply leads of the
ATX12V power supply, otherwise the board and the processor could be damaged.
Do not use a standard ATX power supply. Doing so could damage the board and the processor.
Table 29. ATX12V Power Connector (J3H1)

1 Ground 3 +12 V
2 Ground 4 +12 V
Table 30. Processor Voltage Regulator Fan Connector (J3M1)

Pin Signal Name
1 Ground
2 +12 V
3 Ground
Table 31. RIMM Fan Connector (J7M2)

Pin Signal Name
1 FAN_CNTRL
2 +12 V
3 Tachometer (FAN_2)
Table 32. Processor Fan Connector (J6L1)

Pin Signal Name
1 FAN_CNTRL
2 +12 V
57
Table 33. Main Power Connector (J10K1)

1 +3.3 V 11 +3.3 V
2 +3.3 V 12 -12 V
3 Ground 13 Ground
4 +5 V 14 PS-ON# (power supply remote on/off)
5 Ground 15 Ground
6 +5 V 16 Ground
7 Ground 17 Ground
8 PWRGD (Power Good) 18 TP_PWRCONN_18
9 +5 V (Standby) 19 +5 V
10 +12 V 20 +5 V
Table 34. Auxiliary Power (J9J1)

Pin Signal Name
1 Ground
2 Ground
3 Ground
4 +3.3 V
5 +3.3 V
6 +5 V
Table 35. Wake on Ring Connector (J8C1)

Pin Signal Name
1 Ground
2 Ring Indicate
Table 36. Wake on LAN Technology Connector (J7C1)

Pin Signal Name
1 +5 VSB
2 Ground
3 WOL
Table 37. Chassis Fan Connector (J10A2)

Pin Signal Name
1 FAN_CNTRL
2 +12 V
58
Technical Reference
2.8.2.4 Add-in Board and Peripheral Interface Connectors

Figure 11 shows the location of the add-in board connector and peripheral connectors. Note the
following considerations for the PCI bus connectors:
• All of the PCI bus connectors are bus master capable.
• PCI bus connector 2 has SMBus signals routed to it. This enables PCI bus add-in boards with
SMBus support to access sensor data on the board. The specific SMBus signals are as follows:
 The SMBus clock line is connected to pin A40
 The SMBus data line is connected to pin A41
A B C D E F G
2 40
1 39
2 40
1 39
2 34
1 33
J I H
OM10446

A Communication and networking riser (CNR) J3A1 Table 38
B PCI bus connector 5 J4A1 Table 39
C PCI bus connector 4 J4B1 Table 39
D PCI bus connector 3 J4C1 Table 39
E PCI bus connector 2 J4D1 Table 39
F PCI bus connector 1 J4E1 Table 39
G AGP connector J5E1 Table 40
H Diskette drive J10G1 Table 42
I Primary IDE J9G2 Table 41
J Secondary IDE J9G1 Table 41
Figure 11. Add-in Board and Peripheral Interface Connectors
59
Table 38. CNR Connector (J3A1)

A1 Reserved B1 Reserved
A3 Ground B3 Reserved
A4 Reserved B4 Ground
A7 LAN_TXD2 B7 Ground
A8 LAN_TXD0 B8 LAN_TXD1
A9 Ground B9 LAN_RSTSYNC
A10 LAN_CLK B10 Ground
A11 LAN_RXD1 B11 LAN_RXD2
A12 Reserved B12 LAN_RXD0
A13 USB+ B13 Ground
A15 USB- B15 +5V (dual)
A16 +12V B16 USB_OC
A17 Ground B17 Ground
A18 +3.3 V (dual) B18 -12V
A19 +5 V B19 +3.3 V
A20 Ground B20 Ground
A21 EEDI B21 EED0
A22 EECS B22 EECK
A23 SMB_A1 B23 Ground
A24 SMB_A2 B24 SMB_A0
A25 SMB_SDA B25 SMB_SCL
A26 AC97_RESET B26 CDC_DWN_ENAB
A27 Reserved B27 Ground
A28 AC97_SDATA_IN1 B28 AC97_SYNC
A29 AC97_SDATA_IN0 B29 AC97_SDATA_OUT
A30 Ground B30 AC97_BITCLK

The CNR Section 1.10, page 31
60
Technical Reference
Table 39. PCI Bus Connectors (J4A1, J4B1, J4C1, J4D1, J4E1)
Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name
A1 Ground (TRST#)* B1 -12 V A32 AD16 B32 AD17
A2 +12 V B2 Ground (TCK)* A33 +3.3 V B33 C/BE2#
A3 +5 V (TMS)* B3 Ground A34 FRAME# B34 Ground
A4 +5 V (TDI)* B4 Not connected (TDO)* A35 Ground B35 IRDY#
A5 +5 V B5 +5 V A36 TRDY# B36 +3.3 V
A6 INTA# B6 +5 V A37 Ground B37 DEVSEL#
A7 INTC# B7 INTB# A38 STOP# B38 Ground
A8 +5 V B8 INTD# A39 +3.3 V B39 LOCK#
A9 Reserved B9 Not connected A40 Reserved ** B40 PERR#
(PRSNT1#)*
A10 +5 V (I/O) B10 Reserved A41 Reserved *** B41 +3.3 V
A11 Reserved B11 Not connected A42 Ground B42 SERR#
(PRSNT2#)*
A12 Ground B12 Ground A43 PAR B43 +3.3 V
A13 Ground B13 Ground A44 AD15 B44 C/BE1#
A14 +3.3 V aux B14 Reserved A45 +3.3 V B45 AD14
A15 RST# B15 Ground A46 AD13 B46 Ground
A16 +5 V (I/O) B16 CLK A47 AD11 B47 AD12
A17 GNT# B17 Ground A48 Ground B48 AD10
A18 Ground B18 REQ# A49 AD09 B49 Ground
A19 PME# B19 +5 V (I/O) A50 Key B50 Key
A20 AD30 B20 AD31 A51 Key B51 Key
A21 +3.3 V B21 AD29 A52 C/BE0# B52 AD08
A22 AD28 B22 Ground A53 +3.3 V B53 AD07
A23 AD26 B23 AD27 A54 AD06 B54 +3.3 V
A24 Ground B24 AD25 A55 AD04 B55 AD05
A25 AD24 B25 +3.3 V A56 Ground B56 AD03
A26 IDSEL B26 C/BE3# A57 AD02 B57 Ground
A27 +3.3 V B27 AD23 A58 AD00 B58 AD01
A28 AD22 B28 Ground A59 +5 V (I/O) B59 +5 V (I/O)
A29 AD20 B29 AD21 A60 REQ64C# B60 ACK64C#
A30 Ground B30 AD19 A61 +5 V B61 +5 V
A31 AD18 B31 +3.3 V A62 +5 V B62 +5 V
* These signals (in parentheses) are optional in the PCI specification and are not currently implemented.
** On PCI bus connector 2 (J4D1), this pin is connected to the SMBus clock line.
*** On PCI bus connector 2 (J4D1), this pin is connected to the SMBus data line.
61
Table 40. AGP Connector (J5E1)

Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name
A1 +12 V B1 Not connected A34 Vddq B34 Vddq
A2 TYPEDET# B2 +5 V A35 AD22 B35 AD21
A3 Reserved B3 +5 V A36 AD20 B36 AD19
A4 Not connected B4 Not connected A37 Ground B37 Ground
A5 Ground B5 Ground A38 AD18 B38 AD17
A6 INTA# B6 INTB# A39 AD16 B39 C/BE2#
A7 RST# B7 CLK A40 Vddq B40 Vddq
A8 GNT1# B8 REQ# A41 FRAME# B41 IRDY#
A9 Vcc3.3 B9 Vcc3.3 A42 Reserved B42 +3.3 V (aux)
A10 ST1 B10 ST0 A43 Ground B43 Ground
A11 Reserved B11 ST2 A44 Reserved B44 Reserved
A12 PIPE# B12 RBF# A45 Vcc3.3 B45 Vcc3.3
A13 Ground B13 Ground A46 TRDY# B46 DEVSEL#
A14 WBF# B14 Not connected A47 STOP# B47 Vddq
A15 SBA1 B15 SBA0 A48 PME# B48 PERR#
A16 Vcc3.3 B16 Vcc3.3 A49 Ground B49 Ground
A17 SBA3 B17 SBA2 A50 PAR B50 SERR#
A18 SBSTB# B18 SB_STB A51 AD15 B51 C/BE1#
A19 Ground B19 Ground A52 Vddq B52 Vddq
A20 SBA5 B20 SBA4 A53 AD13 B53 AD14
A21 SBA7 B21 SBA6 A54 AD11 B54 AD12
A22 Reserved B22 Reserved A55 Ground B55 Ground
A23 Ground B23 Ground A56 AD9 B56 AD10
A24 Reserved B24 +3.3 V (aux) A57 C/BE0# B57 AD8
A25 Vcc3.3 B25 Vcc3.3 A58 Vddq B58 Vddq
A26 AD30 B26 AD31 A59 AD_STB0# B59 AD_STB0
A27 AD28 B27 AD29 A60 AD6 B60 AD7
A28 Vcc3.3 B28 Vcc3.3 A61 Ground B61 Ground
A29 AD26 B29 AD27 A62 AD4 B62 AD5
A30 AD24 B30 AD25 A63 AD2 B63 AD3
A31 Ground B31 Ground A64 Vddq B64 Vddq
A32 AD_STB1# B32 AD_STB1 A65 AD0 B65 AD1
A33 C/BE3# B33 AD23 A66 VRREFG_C B66 VREFC_G
✏ NOTE
The AGP connector is keyed for 1.5 V AGP cards only. Do not attempt to install a legacy 3.3 V
AGP card. The AGP connector is not mechanically compatible with legacy 3.3 V AGP cards.
62
Technical Reference
Table 41. PCI IDE Connectors (J9G2, Primary and J9G1, Secondary)
1 Reset IDE 2 Ground
3 Data 7 4 Data 8
5 Data 6 6 Data 9
7 Data 5 8 Data 10
9 Data 4 10 Data 11
11 Data 3 12 Data 12
19 Ground 20 Key
21 DDRQ0 [DDRQ1] 22 Ground
23 I/O Write# 24 Ground
25 I/O Read# 26 Ground
27 IOCHRDY 28 P_ALE (Cable Select pull-up)
29 DDACK0# [DDACK1#] 30 Ground
31 IRQ 14 [IRQ 15] 32 Reserved
33 DAG1 (Address 1) 34 GPIO_DMA66_Detect_Pri (GPIO_DMA66_Detect_Sec)
35 DAG0 (Address 0) 36 DAG2 (Address 2)
37 Chip Select 1P# [Chip Select 1S#] 38 Chip Select 3P# [Chip Select 3S#]
39 Activity# 40 Ground
Signal names in brackets ([ ]) are for the secondary IDE connector.
63
Table 42. Diskette Drive Connector (J10G1)

1 Ground 2 DENSEL
3 Ground 4 Reserved
5 Key 6 FDEDIN
7 Ground 8 FDINDX# (Index)
9 Ground 10 FDM00# (Motor Enable A)
11 Ground 12 Not connected
13 Ground 14 FDDS0# (Drive Select A)
15 Ground 16 Not connected
17 Not connected 18 FDDIR# (Stepper Motor Direction)
19 Ground 20 FDSTEP# (Step Pulse)
21 Ground 22 FDWD# (Write Data)
23 Ground 24 FDWE# (Write Enable)
25 Ground 26 FDTRK0# (Track 0)
27 Not connected 28 FDWPD# (Write Protect)
29 Ground 30 FDRDATA# (Read Data)
31 Ground 32 FDHEAD# (Side 1 Select)
33 Ground 34 DSKCHG# (Diskette Change)
64
Technical Reference
2.8.3 External I/O Connectors

Figure 12 shows the locations of the external I/O connectors.
1 2
1 2
7
10
15 16
A B C D
OM10447

A SCSI LED J7A2 Table 43
B Front panel USB J9C1 Table 44
C Auxiliary front panel power LED J8C3 Table 45
D Front panel J9D2 Table 46
Figure 12. External I/O Connectors
65
Table 43. SCSI LED Connector (J7A2)

Pin Signal Name
1 SCSI activity
2 Not connected
Table 44. Front Panel USB Connector (J9C1)

1 VREG_FP_USB_PWR 2 VREG_FP_USB_PWR
3 ICH_U_P2# 4 ICH_U_P3#
5 ICH_U_P2 6 ICH_U_P3
7 Ground 8 Ground
9 Key (no pin) 10 ICU_U_OC1_2#
2.8.3.1 Auxiliary Front Panel Power/Sleep/Message Waiting LED Connector

This connector duplicates on pins 1 and 3, the signals on pins 2 and 4 of the front panel connector.
Table 45. Auxiliary Front Panel Power/Sleep/Message Waiting LED Connector (J8C3)
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
2.8.3.2 Front Panel Connector

This section describes the functions of the front panel connector. Table 46 lists the signal names
of the front panel connector.
Table 46. Front Panel Connector (J9D2)

Pin Signal In/Out Description Pin Signal In/Out Description
1 HD_PWR Out Hard disk LED pull- 2 HDR_BLNK_ Out Front panel green
up (330 Ω) to +5 V GRN LED
3 HAD# Out Hard disk active LED 4 HDR_BLNK_ Out Front panel yellow
YEL LED
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
9 +5 V Out IR Power 10 N/C
11 Reserved In Reserved 12 Ground Ground
13 Ground Ground 14 (pin removed) Not connected
15 Reserved Out Reserved 16 +5 V Out Power
66
Technical Reference
2.8.3.2.1 Reset Switch Connector

Pins 5 and 7 can be connected to a momentary SPST type switch that is normally open. When the
switch is closed, the D850GB board resets and runs the POST.
2.8.3.2.2 Hard Drive Activity LED Connector

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from
or written to a hard drive. For the LED to function properly, an IDE drive must be connected to
the onboard IDE interface. The LED will also show activity for devices connected to the SCSI
hard drive activity LED connector.
The SCSI hard drive activity LED connector Section 1.6.3.2, page 25
2.8.3.2.3 Power/Sleep/Message Waiting LED Connector

Pins 2 and 4 can be connected to a one- or two-colored LED. Table 47 shows the possible states
for a one-colored LED. Table 48 shows the possible states for a two-colored LED.
Table 47. States for a One Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running
Blinking Green Running/message waiting
Table 48. States for a Two Color Power LED

LED State Description
Off Power off
Steady Green Running
Blinking Green Running/message waiting
Steady Yellow Sleeping
Blinking Yellow Sleeping/message waiting
✏ NOTE
To use the message waiting function, ACPI must be enabled in the operating system and a
message-capturing application must be invoked.
2.8.3.2.4 Power Switch Connector
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must
pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off.
(The time requirement is due to internal debounce circuitry on the D850GB board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
67
2.9 Jumper Blocks
CAUTION
Do not move any jumpers with the power on. Always turn off the power and unplug the power
cord from the computer before changing a jumper setting. Otherwise, the board could be
damaged.
The board has two jumper blocks. Figure 13 shows the location of the jumper blocks.
3 1 4
1 3 6
J8C2 J8D1
OM10448
Reference Designator Description

J8C2 BIOS configuration jumper block
J8D1 USB front panel / CNR jumper block
Figure 13. Location of the Jumper Blocks
68
Technical Reference
2.9.1 BIOS Setup Configuration Jumper Block

This 3-pin jumper block determines the BIOS Setup program’s mode. Table 49 describes the
jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to
configuration mode and the computer is powered-up, the BIOS compares the processor version and
the microcode version in the BIOS and reports if the two match.
Table 49. BIOS Setup Configuration Jumper Settings (J8C2)

Function/Mode Jumper Setting Configuration
Normal 3
The BIOS uses current configuration information and
1-2 passwords for booting.
1
Configure 3
After the POST runs, Setup runs automatically. The
2-3 maintenance menu is displayed.
1
Recovery 3
The BIOS attempts to recover the BIOS configuration. A
None recovery diskette is required.
1

How to access the BIOS Setup program Section 4.1, page 89
The maintenance menu of the BIOS Setup program Section 4.2, page 90
BIOS recovery Section 3.7, page 85
2.9.2 USB Port 2 Routing Jumper Block

This 6-pin jumper block routes the signals of USB port 2. Table 50 describes the jumper settings
for USB port 2. Figure 13 shows the location of the Front Panel USB connector.
Table 50. USB Port 2 Routing Jumper Settings (J8D1)

Jumper Setting Configuration
1 4 USB port 2 signals are routed to the Front Panel USB connector.
2-3 and 5-6

3 6
1 4 USB port 2 signals are routed to the CNR connector.
1-2 and 4-5

3 6

The location of the Front Panel USB connector Figure 12, page 65
The location of the CNR connector Figure 11, page 59
69
2.10 Mechanical Considerations
2.10.1 Form Factor

The D850GB board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the
mechanical form factor for the D850GB board. Dimensions are given in inches [millimeters]. The
outer dimensions are 9.60 inches by 12.00 inches [243.84 millimeters by 304.80 millimeters].
Location of the I/O connectors and mounting holes are in compliance with the ATX specification
(see Section 1.3).
6.50[165.10]
6.10[154.94]
5.20[132.08]
0.00
2.850[72.39]
3.10[78.74]
11.35[288.29]
0.65[16.51]
3.10 4.90
0.00 [78.74] [124.46] 11.10[281.94]
OM10449
Figure 14. D850GB Board Dimensions
✏ NOTE
There may be mechanical interference with installed RDRAM modules in some combinations of
ATX chassis and peripherals, such as CD-ROM drives.
70
Technical Reference
2.10.2 I/O Shield

The back panel I/O shield for the D850GB board must meet specific dimension and material
requirements. Systems based on this board need the back panel I/O shield to pass certification
testing. Figure 15 shows the critical dimensions of the chassis-dependent I/O shield. Dimensions
are given in inches to a tolerance of ±0.02 inches.
The figure also indicates the position of each cutout. Additional design considerations for I/O
shields relative to chassis requirements are described in the ATX specification. See Section 1.3 for
information about the ATX specification.
✏ NOTE
An I/O shield compliant with the ATX chassis specification 2.01 is available from Intel.
6.390 Ref [162.30]
0.787 ± .010 Typ.[20±0.254]
0.61[15.494] 6.268[159.20]
Ref
0.00[0]
3x Dia 0.366[9.30]
0.94 Ref
0.884[22.45]
0.280[7.10] 0.519
[13.19]
0.039[0.99] Dia
1.890
0.00[0] 0.027 [48.00]
[0.69] Ref
0.465
0.450[11.43] [11.81]
0.568[14.427] 0.718
[18.24]
8x R 0.5 Min 0.171[4.33]

0.442[11.218]
1.189[30.197]
1.799[45.684]
2.071[52.60]
4.404[111.854]
5.546[140.860]
4.572[116.116]
0.321[8.14]
0.471[11.95]
0.621[15.76]
Pictorial
View
OM10451A
Figure 15. I/O Shield Dimensions
71
2.11 Electrical Considerations
2.11.1 Power Consumption

Table 51 lists voltage and current measurements for a computer that contains the D850GB board
and the following:
• 1.4 GHz Intel Pentium 4 processor with a 256 KB cache
• 128 MB RDRAM
• 3.5-inch diskette drive
• 6.4 GB IDE hard disk drive
• 40X IDE CD-ROM drive
This information is provided only as a guide for calculating approximate power usage with
additional resources added.
Values for the Windows 98 desktop mode are measured at 640 x 480 x 256 colors and 60 Hz
refresh rate. AC watts are measured with the computer is connected to a typical 250 W power
supply, at nominal input voltage and frequency, with a true RMS wattmeter at the line input.
✏ NOTE
Actual system power consumption depends upon system configuration. The power supply should
comply with the recommendations found in the ATX / ATX12V Power Supply Design Guide,
Version 1.1 (see Table 3 on page 16 for specification information).
Table 51. Power Usage

DC Current at:
Mode AC Power +3.3 V +5 V +12 V -12 V +5 VSB
Windows 98 APM full on 88.6 W 3.95 A 1.0 A 0.68 A -0.27 A 0.18 A
Windows 98 APM Suspend 54.3 W 3.96 A 0.99 A 0.30 A -0.24 A 0.14 A
Windows 98 ACPI S0 57.6 W 3.91 A 0.99 A 0.30 A -0.26 A 0.21 A
Windows 98 ACPI S1 54.1 W 3.88 A 0.89 A 0.31 A -0.27 A 0.21 A
Windows 98 ACPI S3 4.1 W 0.0 A 0.0 A 0.0 A 0.0 A 0.37 A
2.11.2 Add-in Board Considerations

The D850GB board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards in a fully-loaded D850GB board (all six expansion
slots filled) must not exceed 12 A.
72
Technical Reference
2.11.3 Standby Current Requirements
CAUTION
If the standby current necessary to support multiple wake events from the PCI and/or USB buses
exceeds power supply capacity, the D850GB board may lose register settings stored in memory,
etc. Calculate the standby current requirements using the steps described below.
Power supplies used with the D850GB board must be able to provide enough standby current to
support the Instantly Available (ACPI S3 sleep state) configuration as outlined in
Table 52 below.
Values are determined by specifications such as PCI 2.2. Actual measured values may vary.
To estimate the amount of standby current required for a particular system configuration, standby
current requirements of all installed components must be added to determine the total standby
current requirement. Refer to the descriptions in Table 52 and review the following steps.
1. Note the total D850GB board standby current requirement.
2. Add to that the total PS/2 port standby current requirement if a wake-enabled device is
connected.
3. Add, from the PCI 2.2 slots (wake enabled) row, the total number of wake-enabled devices
installed (PCI and AGP) and multiply by the standby current requirement.
4. Add, from the PCI 2.2 slots (nonwake enabled) row, the total number of wake-enabled devices
installed (PCI and AGP) and multiply by the standby current requirement.
5. Add all additional wake-enabled devices’ and nonwake-enabled devices’ standby current
requirements as applicable.
6. Add all the required current totals from steps 1 through 5 to determine the total estimated
standby current power supply requirement.
Table 52. Standby Current Requirements

Instantly Available Current Standby Current
Support (Estimated for Description Requirements (mA)
Integrated Board Components) Total for D850GB board 300
Instantly Available Stand-by PS/2 ports (Note) 345
Current Support PCI 2.2 slots (wake enabled) 375
• Estimated for add-on PCI 2.2 slots (nonwake enabled) 20
components
WOL header 525
• Add to Instantly Available
CNR (Note) 375
total current requirement
USB ports (Note) 500
(See instructions above)
Note: Dependent upon system configuration
73
✏ NOTE
IBM PS/2 Port Specification (Sept 1991) states:
• 275 mA for keyboard
• 70 mA for the mouse (nonwake-enable device)
PCI/AGP requirements are calculated by totaling the following:
• One wake-enabled device @ 375 mA, plus
• Five nonwake-enabled devices @ 20 mA each, plus
USB requirements are calculated as:
• One wake-enabled device @ 500 mA
• USB hub @ 100 mA
• Three USB nonwake-enabled devices connected @ 2.5 mA each
✏ NOTE
Both USB ports are capable of providing up to 500 mA during normal G0/S0 operation. Only one
USB port will support up to 500 mA of stand-by-current (wake-enabled device) during G1/S3
suspended operation. The other port may provide up to 7.5 mA (three nonwake-enabled devices.)
during G1/S3 suspended operation.
2.11.4 Fan Connector Current Capability

The D850GB board is designed to supply a maximum of 225 mA per fan connector.
2.11.5 Power Supply Considerations

CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options. Refer to
Section 2.11.3 on page 73 for additional information.
System integrators should refer to the power usage values listed in Table 51 when selecting a
power supply for use with the D850GB board.
Measurements account only for current sourced by the D850GB board while running in idle modes
of the started operating systems.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
The ATX form factor specification Section 1.3, page 16
74
Technical Reference
2.12 Thermal Considerations
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating temperature
o
by more than 10 C. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 2.14.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
o
(item A in Figure 16) can reach a temperature of up to 85 C in an open chassis.
Figure 16 shows the locations of the localized high temperature zones.
D
OM10450
A Processor voltage regulator area

B Processor
C Intel 82850 MCH
D Intel 82801BA ICH2
Figure 16. Localized High Temperature Zones
75
Table 53 provides maximum case temperatures for D850GB board components that are sensitive
to thermal changes. Case temperatures could be affected by the operating temperature, current
load, or operating frequency. Maximum case temperatures are important when considering proper
airflow to cool the D850GB board.
Table 53. Thermal Considerations for Components

Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor datasheets and
processor specification updates
o
Intel 82850 MCH 105 C (under bias)
o
Intel 82801BA ICH2 109 C (under bias)

Intel Pentium 4 processor datasheets and specification updates Section 1.2, page 16
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 55 ºC.
D850GB board MTBF: 104769.75 hours
76
Technical Reference
2.14 Environmental
Table 54 lists the environmental specifications for the D850GB board.
Table 54. D850GB Board Environmental Specifications

Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock
Unpackaged 30 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
77
2.15 Regulatory Compliance

This section describes the D850GB board’s compliance with safety and EMC regulations.
2.15.1 Safety Regulations

Table 55 lists the safety regulations the D850GB board complies with when it is correctly installed
in a compatible host system.
Table 55. Safety Regulations

Regulation Title
rd
UL 1950/CSA950, 3 edition, Bi-National Standard for Safety of Information Technology Equipment
Dated 07-28-95 including Electrical Business Equipment. (USA and Canada)
nd
EN 60950, 2 Edition, 1992 (with The Standard for Safety of Information Technology Equipment including
Amendments 1, 2, 3, and 4) Electrical Business Equipment. (European Community)
nd
IEC 950, 2 edition, 1991 (with The Standard for Safety of Information Technology Equipment including
Amendments 1, 2, 3, and 4) Electrical Business Equipment. (International)
EMKO-TSE (74-SEC) 207/94 Summary of Nordic deviations to EN 60950. (Norway, Sweden,
Denmark, and Finland)
2.15.2 EMC Regulations

Table 56 lists the EMC regulations with which the D850GB board complies when it is correctly
installed in a compatible host system.
Table 56. EMC Regulations

Regulation Title
FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
pertaining to unintentional radiators. (USA)
nd
CISPR 22, 2 Edition, 1993 Limits and methods of measurement of Radio Interference
(Class B) Characteristics of Information Technology Equipment. (International)
VCCI Class B (ITE) Implementation Regulations for Voluntary Control of Radio Interference
by Data Processing Equipment and Electronic Office Machines.
(Japan)
EN55022 (1994) (Class B) Limits and methods of measurement of Radio Interference
Characteristics of Information Technology Equipment. (Europe)
EN50082-1 (1992) Generic Immunity Standard; currently compliance is determined via
testing to IEC 801-2, -3, and -4. (Europe)
ICES-003 (1997) Interference-Causing Equipment Standard, Digital Apparatus, Class B
(Including CRC c.1374). (Canada)
AS/NZ 3548 Australian Communications Authority (ACA), Standard for
Electromagnetic Compatibility.
78
Technical Reference
2.15.3 Certification Markings

This printed circuit assembly has the following markings related to product certification:
• UL Joint Recognition Mark: Consists of small c followed by a stylized backward UR and
followed by a small US (Component side)
• Manufacturer’s recognition mark: Consists of a unique UL recognized manufacturer’s logo,
along with a flammability rating (94V-0) (Solder side)
• UL File Number for D850GB boards: E139761 (Component side)
• PB Part Number: Intel bare circuit board part number (Solder side) PB A22167-003
• Battery “+ Side Up” marking: located on the component side of the D850GB board in close
proximity to the battery holder
• FCC Logo/Declaration: (Solder side)
• ACA (C-Tick) mark: Consists of a unique letter C, with a tick mark; followed by N-232.
Located on the component side of the D850GB board and on the shipping container
• CE Mark: (Component side) The CE mark should also be on the shipping container
79
80
3 Overview of BIOS Features

3.1 Introduction.................................................................................................................81
3.2 BIOS Flash Memory Organization ..............................................................................82
3.3 Resource Configuration ..............................................................................................82
3.4 System Management BIOS (SMBIOS) .......................................................................83
3.5 Legacy USB Support ..................................................................................................83
3.6 BIOS Updates ............................................................................................................84
3.7 Recovering BIOS Data ...............................................................................................85
3.8 Boot Options...............................................................................................................86
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot ....................................................86
3.10 BIOS Security Features..............................................................................................88
3.1 Introduction
The D850GB board uses an Intel/AMI BIOS, which is stored in flash memory and can be updated
using a disk-based program. In addition to the BIOS, the flash memory contains the BIOS Setup
program, POST, APM, the PCI auto-configuration utility, and Plug and Play support.
The D850GB board supports system BIOS shadowing, allowing the BIOS to execute from 64-bit
onboard write-protected system memory.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOS is identified as GB85010A.86A.

The D850GB board’s compliance level with APM and Plug and Play Section 1.3, page 16
81
3.2 BIOS Flash Memory Organization

The SST 49LF004A Firmware Hub (FWH) includes a 4 Mbit (512 KB) symmetrical flash memory
device. Internally, the device is grouped into eight 64-KB blocks that are individually erasable,
lockable, and unlockable.
3.3 Resource Configuration

3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card. Autoconfiguration information is stored in
ESCD format.
For information about the versions of PCI and Plug and Play supported by the BIOS, see
Section 1.3.
3.3.2 PCI IDE Support

If you select Auto in the BIOS Setup program, the BIOS automatically sets up the two
PCI IDE connectors with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape
drives, and Ultra DMA drives (see Section 1.3 for the supported version of ATAPI). The BIOS
determines the capabilities of each drive and configures them to optimize capacity and
performance. To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending
on the capability of the drive. You can override the auto-configuration options by specifying
manual configuration in the BIOS Setup program.
To use ATA-66/100 features the following items are required:
• An ATA-66/100 peripheral device
• An ATA-66/100 compatible cable
• ATA-66/100 operating system device drivers
✏ NOTE
ATA-66/100 compatible cables are backward compatible with drives using slower IDE transfer
protocols. If an ATA-66/100 disk drive and a disk drive using any other IDE transfer protocol are
attached to the same cable, the maximum transfer rate between the drives is reduced to that of the
slowest device.
✏ NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
82
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the management information format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT†, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information.

The D850GB board’s compliance level with SMBIOS Section 1.3, page 16
3.5 Legacy USB Support

Legacy USB support enables USB devices such as keyboards, mice, and hubs to be used even
when the operating system’s USB drivers are not yet available. Legacy USB support is used to
access the BIOS Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system. (Keyboards and mice are
not recognized during this period if Legacy USB support was set to Disabled in the BIOS
Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no longer
used.
To install an operating system that supports USB, verify that Legacy USB support in the BIOS
Setup program is set to Enabled and follow the operating system’s installation instructions.
83
✏ NOTE
Legacy USB support is for keyboards, mice, and hubs only. Other USB devices are not supported
in legacy mode.
3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB
diskette, or a CD-ROM, or from the file location on the Web.
• Intel® Flash Memory Update Utility, which requires creation of a boot diskette and manual
rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB
diskette (from a legacy diskette drive or an LS-120 diskette drive) or a CD-ROM.
Both utilities support the following BIOS maintenance functions:
• Verifying that the updated BIOS matches the target system to prevent accidentally installing
an incompatible BIOS.
• Updating both the BIOS boot block and the main BIOS. This process is fault tolerant to
prevent boot block corruption.
• Updating the BIOS boot block separately.
• Changing the language section of the BIOS.
• Updating replaceable BIOS modules, such as the video BIOS module.
• Inserting a custom splash screen.
✏ NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.

The Intel World Wide Web site Section 1.2, page 16
3.6.1 Language Support

The BIOS Setup program and help messages are supported in five languages: US English,
German, Italian, French, and Spanish. The default language is US English, which is present unless
another language is selected in the BIOS Setup program.
84
3.6.2 Custom Splash Screen

During POST, an Intel splash screen is displayed by default. This splash screen can be replaced
with a custom splash screen. A utility is available from Intel to assist with creating a custom
splash screen. The custom splash screen can be programmed into the flash memory using the
BIOS upgrade utility. Information about this capability is available on the Intel Support World
Wide Web site.

The Intel World Wide Web site Section 1.2, page 16
3.7 Recovering BIOS Data

Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage
occurs while the BIOS is being updated in flash memory. The BIOS can be recovered from a
diskette using the BIOS recovery mode. When recovering the BIOS, be aware of the following:
• Because of the small amount of code available in the non-erasable boot block area, there is no
video support. You can only monitor this procedure by listening to the speaker or looking at
the diskette drive LED.
• The recovery process may take several minutes; larger BIOS flash memory devices require
more time.
• Two beeps and the end of activity in the diskette drive indicate successful BIOS recovery.
• A series of continuous beeps indicates a failed BIOS recovery.
To create a BIOS recovery diskette, a bootable diskette must be created and the BIOS update files
copied to it. BIOS upgrades and the Intel Flash Memory Update Utility are available from Intel
Customer Support through the Intel World Wide Web site.
✏ NOTE
Even if the computer is configured to boot from an LS-120 diskette (in the Setup program’s
Removable Devices submenu), the BIOS recovery diskette must be a standard 1.44 MB diskette not
a 120 MB diskette.

The BIOS recovery mode jumper settings Section 2.9.1, page 69
The Boot menu in the BIOS Setup program Section 4.7, page 105
Contacting Intel customer support Section 1.2, page 16
85
3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.8.1 CD-ROM and Network Boot

Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system will attempt to boot from the next defined drive.
The network can be selected as a boot device. This selection allows booting from the onboard
LAN or a network add-in card with a remote boot ROM installed.

The El Torito specification Section 1.3, page 16
3.8.2 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
• Video adapter
• Keyboard
• Mouse
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot

Three factors affect system boot speed:
• Selecting and configuring peripherals properly
• Using an optimized BIOS, such as the Intel® Rapid BIOS
• Selecting a compatible operating system
3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds,
that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST execution
time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode
changes in POST. These features may add time to the boot process.
• Try different monitors. Some monitors initialize and communicate with the BIOS more
quickly, which enables the system to boot more quickly.
86
3.9.2 Intel Rapid BIOS Boot

Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu:
• Set the hard disk drive as the first boot device. As a result, the POST does not first seek a
diskette drive, which saves about one second from the POST execution time.
• Disable Quiet Boot, which eliminates display of the logo splash screen. This could save
several seconds of painting complex graphic images and changing video modes.
• Enabled Intel Rapid BIOS Boot. This feature bypasses memory count and the search for a
diskette drive.
In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can
reduce up to four seconds of option ROM boot time.
✏ NOTE
It is possible to optimize the boot process to the point where the system boots so quickly that the
Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives
with minimum initialization times can also contribute to a boot time that might be so fast that
necessary logo screens and POST messages cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If this condition
should occur, it is possible to introduce a programmable delay ranging from 3 to 30 seconds
(using the Hard Disk Pre-Delay feature of the Advanced Menu in the IDE Configuration Submenu
of the BIOS Setup program).

IDE Configuration Submenu in the BIOS Setup program Section 4.4.3, page 97
3.9.3 Operating System

The Microsoft Windows Millennium Edition (Windows Me) operating system has built-in
capabilities for making PCs boot more quickly. To speed operating system availability at boot
time, limit the number of applications that load into the system tray or the task bar.
87
3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the computer, with the following restrictions:
• The supervisor password gives unrestricted access to view and change all the Setup options in
the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the BIOS Setup
program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the
BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the supervisor
password or the user password to access Setup. Users have access to Setup respective to
which password is entered.
• Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, the user can enter either
password to boot the computer.
Table 57 shows the effects of setting the supervisor password and user password. This table is for
reference only and is not displayed on the screen.
Table 57. Supervisor and User Password Functions

Supervisor Password to Password
Password Set Mode User Mode Setup Options Enter Setup During Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited number
of options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited number Enter Password user user
of options
Note: If no password is set, any user can change all Setup options.

Setting user and supervisor passwords Section 4.5, page 103
88
4 BIOS Setup Program

4.1 Introduction.................................................................................................................89
4.2 Maintenance Menu .....................................................................................................90
4.3 Main Menu..................................................................................................................92
4.4 Advanced Menu..........................................................................................................93
4.5 Security Menu ..........................................................................................................103
4.6 Power Menu .............................................................................................................104
4.7 Boot Menu ................................................................................................................105
4.8 Exit Menu .................................................................................................................107
4.1 Introduction
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
Table 58 lists the BIOS Setup program menu features.
Table 58. BIOS Setup Program Menu Bar

Clears Allocates Configures Sets Configures Selects boot Saves or
passwords and resources for advanced passwords power options and discards
BIS credentials hardware features and security management power supply changes to
and enables components available features features controls Setup
extended through the program
configuration chipset options
mode

Boot Integrity Services (BIS) Section 1.3, page 16
✏ NOTE
In this chapter, all examples of the BIOS Setup program menu bar include the maintenance menu;
however, the maintenance menu is displayed only when the board is in configuration mode.
Section 2.9 on page 68 tells how to put the board in configuration mode.
89
Table 59 lists the function keys available for menu screens.
Table 59. BIOS Setup Program Function Keys

BIOS Setup Program Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
4.2 Maintenance Menu

To access this menu, select Maintenance on the menu bar at the top of the screen.

Extended Configuration
The menu shown in Table 60 is for clearing Setup passwords and enabling extended configuration
mode. Setup only displays this menu in configuration mode. See Section 2.9 on page 68 for
configuration mode setting information.
Table 60. Maintenance Menu

Feature Options Description
Clear All Passwords • Yes (default) Clears the user and supervisor passwords.
• No
Clear BIS Credentials • Yes (default) Clears the Wired for Management Boot Integrity Service (BIS)
• No credentials.
Extended • Default (default) Invokes the Extended Configuration submenu.
Configuration • User-Defined
Scan User Flash • Disabled Enables the BIOS to scan the flash memory for user binary
Area (default) files that are executed at boot time.
• Enabled
Fixed Disk Boot • Normal (default) Write Protect prevents write operations to the IDE boot sector.
Sector • Write Protect Normal has no write protection and is used when formatting.
CPU Information No options Displays CPU Information.
CPU Stepping No options Displays CPU’s Stepping Signature.
Signature
CPU Microcode No options Displays CPU’s Microcode Update Revision.
Update Revision
90
BIOS Setup Program
4.2.1 Extended Configuration Submenu

To access this submenu, select Maintenance on the menu bar, then Extended Configuration.

Extended Configuration
The submenu represented by Table 61 is for setting video memory cache mode. This submenu
becomes available when User Defined is selected under Extended Configuration.
Table 61. Extended Configuration Submenu

Extended Configuration • Default User Defined allows setting memory control and video
(default) memory cache mode. If selected here, will also display in
• User Defined the Advanced Menu as: “Extended Menu: Used.”
Video Memory Cache Mode • USWC Selects Uncacheable Speculative Write-Combining
(USWC) video memory cache mode. Full 32 byte contents
of the Write Combining buffer are written to memory as
required. Cache lookups are not performed. Both the
video driver and the application must support Write
Combining.
• UC (default) Selects UnCacheable (UC) video memory cache mode.
This setting identifies the video memory range as
uncacheable by the processor. Memory writes are
performed in program order. Cache lookups are not
performed. Well suited for applications not supporting
Write Combining.
91
4.3 Main Menu

To access this menu, select Main on the menu bar at the top of the screen.
Table 62 describes the Main menu. This menu reports processor and memory information and is
for configuring the system date and system time.
Table 62. Main Menu

BIOS Version No options Displays the version of the BIOS.
Processor Type No options Displays processor type.
Processor Speed No options Displays processor speed.
System Bus Speed No options Displays the system bus speed.
Cache RAM No options Displays the size of second-level cache and whether it is
ECC-capable.
Total Memory No options Displays the total amount of RAM.
RIMM 1 No options Displays the amount and type of RAM in the memory
RIMM 2 banks.
RIMM 3
RIMM 4
Language • English (default) Selects the current default language used by the BIOS.
• Deutsch
• Français
• Español
• Portugues
Memory • Non-ECC Allows the user to enable error reporting if the system and
Configuration • ECC (default) all installed memory support ECC. If non-ECC memory is
installed, BIOS will detect and change the setting to
Non-ECC.
System Time Hour, minute, and Specifies the current time.
second
System Date Day of week Specifies the current date.
Month/day/year
92
BIOS Setup Program
4.4 Advanced Menu

To access this menu, select Advanced on the menu bar at the top of the screen.

Boot Configuration
Peripheral Configuration
IDE Configuration
Diskette Configuration
Event Log Configuration
Video Configuration
Table 63 describes the Advanced Menu. This menu is used for setting advanced features that are
available through the chipset.
Table 63. Advanced Menu

Extended Configuration No options If Used is displayed, User-Defined has been selected in
Extended Configuration under the Maintenance Menu.
Boot Configuration Select to display Configures Plug and Play and the Numlock key, and resets
submenu configuration data. When selected, displays the Boot
Configuration submenu.
Peripheral Configuration Select to display Configures peripheral ports and devices. When selected,
submenu displays the Peripheral Configuration submenu.
IDE Configuration Select to display Specifies type of connected IDE devices.
submenu
Diskette Configuration Select to display When selected, displays the Diskette Configuration
submenu submenu.
Event Log Configuration Select to display Configures Event Logging. When selected, displays the
submenu Event Log Configuration submenu.
Video Configuration Select to display Configures video features. When selected, displays the
submenu Video Configuration submenu.
93
4.4.1 Boot Configuration Submenu

To access this submenu, select Advanced on the menu bar, then Boot Configuration.

Boot Configuration
IDE Configuration
Video Configuration
The submenu represented by Table 64 is for setting Plug and Play options, resetting configuration
data, and the power-on state of the Numlock key.
Table 64. Boot Configuration Submenu

Reset Config Data • No (default) No does not clear the PCI/PnP configuration data stored in
• Yes flash memory on the next boot.
Yes clears the PCI/PnP configuration data stored in flash
memory on the next boot.
Numlock • Off Specifies the power-on state of the Numlock feature on the
• On (default) numeric keypad of the keyboard.
94
BIOS Setup Program
4.4.2 Peripheral Configuration Submenu

To access this submenu, select Advanced on the menu bar, then Peripheral Configuration.

Boot Configuration
IDE Configuration
Video Configuration
The submenu represented in Table 65 is used for configuring computer peripherals.
Table 65. Peripheral Configuration Submenu

Serial port A • Disabled Configures serial port A.
• Enabled Auto assigns the first free COM port, normally COM1, the
• Auto (default) address 3F8h, and the interrupt IRQ4.
An * (asterisk) displayed next to an address indicates a
conflict with another device.
Base I/O address • 3F8 (default) Specifies the base I/O address for serial port A, if serial port A
(This feature is present • 2F8 is Enabled.
only when Serial Port A
• 3E8
is set to Enabled)
• 2E8
Interrupt • IRQ 3 Specifies the interrupt for serial port A, if serial port A is
(This feature is present • IRQ 4 Enabled.
only when Serial Port A (default)
is set to Enabled)
Parallel port • Disabled Configures the parallel port.
• Enabled Auto assigns LPT1 the address 378h and the interrupt IRQ7.
• Auto (default) An * (asterisk) displayed next to an address indicates a
conflict with another device.
Mode • Output Only Selects the mode for the parallel port. Not available if the
• Bi-directional parallel port is disabled.
• EPP Output Only operates in AT†-compatible mode.
• ECP (default) Bi-directional operates in PS/2-compatible mode.
EPP is Extended Parallel Port mode, a high-speed
bi-directional mode.
ECP is Enhanced Capabilities Port mode, a high-speed bi-
directional mode.
continued
95
Table 65. Peripheral Configuration Submenu (continued)

Base I/O address • 378 (default) Specifies the base I/O address for the parallel port.
(This feature is present • 278
only when Parallel Port
is set to Enabled)
Interrupt • IRQ 5 Specifies the interrupt for the parallel port.
(This feature is present • IRQ 7
only when Parallel Port (default)
is set to Enabled)
DMA • 1 Specifies the DMA channel.
(This feature is present • 3 (default)
only when Parallel Port
Mode is set to ECP)
Audio Device • Disabled Enables or disables the onboard audio subsystem.
• Enabled For boards with no onboard audio subsystem, this option
(default) does not appear; however, this option does appear if a CNR
card with an audio subsystem is installed.
LAN Device • Disabled Enables or disables the onboard LAN device.
• Enabled For boards with no onboard LAN audio subsystem, this option
(default) will not appear; however, this option does appear if a CNR
card with a LAN subsystem is installed.
Modem Device • Disabled Enables or disables a modem device on a CNR card.
• Enabled This option appears only when a CNR card with a modem is
(default) installed.
Legacy USB Support • Disabled Enables or disables Legacy USB support.
• Enabled
(default)
96
BIOS Setup Program
4.4.3 IDE Configuration Submenu

To access this submenu, select Advanced on the menu bar, then IDE Configuration.

Boot Configuration
IDE Configuration
Video Configuration
The menu represented in Table 66 is used to configure IDE device options.
Table 66. IDE Configuration Submenu

IDE Controller • Disabled Specifies the integrated IDE controller.
• Primary Primary enables only the primary IDE controller.
Secondary enables only the secondary IDE controller.
• Secondary
Both enables both IDE controllers.
• Both (default)
Hard Disk Pre-Delay • Disabled (default) Specifies the hard disk drive pre-delay.
• 3 Seconds
• 6 Seconds
• 9 Seconds
• 12 Seconds
• 15 Seconds
• 21 Seconds
• 30 Seconds
Primary IDE Master Select to display sub- Reports type of connected IDE device. When selected,
menu displays the Primary IDE Master submenu.
Primary IDE Slave Select to display sub- Reports type of connected IDE device. When selected,
menu displays the Primary IDE Slave submenu.
Secondary IDE Master Select to display sub- Reports type of connected IDE device. When selected,
menu displays the Secondary IDE Master submenu.
Secondary IDE Slave Select to display sub- Reports type of connected IDE device. When selected,
menu displays the Secondary IDE Slave submenu.
97
4.4.3.1 Primary/Secondary IDE Master/Slave Submenus

To access these submenus, select Advanced on the menu bar, then IDE Configuration and then the
master or slave to be configured.

Boot Configuration
IDE Configuration
Primary IDE Master
Primary IDE Slave
Secondary IDE Master
Secondary IDE Slave
Video Configuration
There are four IDE submenus: primary master, primary slave, secondary master, and secondary
slave. Table 67 shows the format of the IDE submenus. For brevity, only one example is shown.
Table 67. Primary/Secondary IDE Master/Slave Submenus

Drive Installed No options Displays the type of drive installed.
Type • None Specifies the IDE configuration mode for IDE devices.
• User User allows capabilities to be changed.
• Auto (default) Auto fills-in capabilities from ATA/ATAPI device.
• CD-ROM
• ATAPI Removable
• Other ATAPI
• IDE Removable
Maximum Capacity No options Displays the capacity of the drive.
LBA Mode Control • Disabled Enables or disables LBA mode control.
• Enabled (default)
Multi-Sector Transfers • Disabled (default) Specifies number of sectors per block for transfers from
• 2 Sectors the hard disk drive to memory.
• 4 Sectors Check the hard disk drive’s specifications for optimum
setting.
• 8 Sectors
• 16 Sectors
continued
98
BIOS Setup Program
Table 67. Primary/Secondary IDE Master/Slave Submenus (continued)

PIO Mode • Auto (default) Specifies the PIO mode.
• 0
• 1
• 2
• 3
• 4
Ultra DMA • Disabled (default) Specifies the Ultra DMA mode for the drive.
• Mode 0
• Mode 1
• Mode 2
• Mode 3
• Mode 4
Cable Detected No options Displays the type of cable connected to the IDE
interface: 40-conductor or 80-conductor (for ATA-100
peripherals).
99
4.4.4 Diskette Configuration Submenu

To access this menu, select Advanced on the menu bar, then Diskette Configuration.

Boot Configuration
IDE Configuration
Video Configuration
The submenu represented by Table 68 is used for configuring the diskette drive.
Table 68. Diskette Configuration Submenu

Diskette Controller • Disabled Disables or enables the integrated diskette
• Enabled (default) controller.
Floppy A • Not Installed Specifies the capacity and physical size of
• 360 KB 5¼" diskette drive A.
• 1.2 MB 5¼"
• 720 KB 3½"
• 1.44/1.25 MB 3½" (default)
• 2.88 MB 3½"
Diskette Write-Protect • Disabled (default) Disables or enables write-protect for the
• Enabled diskette drive.
100
BIOS Setup Program
4.4.5 Event Log Configuration Submenu

To access this menu, select Advanced on the menu bar, then Event Log Configuration.

Boot Configuration
IDE Configuration
Video Configuration
The submenu represented by Table 69 is used to configure the event logging features.
Table 69. Event Log Configuration Submenu

Event log No options Indicates if there is space available in the event log.
Event log validity No options Indicates if the contents of the event log are valid.
View event log [Enter] Displays the event log.
Clear all event logs • No (default) Clears the event log after rebooting.
• Yes
Event Logging • Disabled Enables logging of events.
ECC Event Logging • Disabled Enables logging of ECC events.
Mark events as read [Enter] Marks all events as read.
101
4.4.6 Video Configuration Submenu

To access this menu, select Advanced on the menu bar, then Video Configuration.

Boot Configuration
IDE Configuration
Video Configuration
The submenu represented in Table 70 is for configuring the video features.
Table 70. Video Configuration Submenu

AGP Aperture Size • 64 MB (default) Sets the aperture size for the AGP video controller.
• 256 MB
Primary Video Adapter • AGP (default) Selects primary video adapter to be used during
• PCI boot.
Video Repost • Disabled (default) Enables the video BIOS coming out of the S3 state.
• Enabled Set to Enabled if the drivers for the video card are
not installed or if the computer is set to standard
VGA mode.
102
BIOS Setup Program
4.5 Security Menu

To access this menu, select Security from the menu bar at the top of the screen.
The menu represented by Table 71 is for setting passwords and security features.
Table 71. Security Menu

If no password entered previously:
Supervisor Password Is No options Reports if there is a supervisor password set.
User Password Is No options Reports if there is a user password set.
Set Supervisor Password Password can be up to seven Specifies the supervisor password.
alphanumeric characters.
Set User Password Password can be up to seven Specifies the user password.
alphanumeric characters.
Clear User Password • Yes (default) Clears the user password.
(Note 1) • No
User Access Level • Limited Sets BIOS Setup Utility access rights for user
(Note 2) • No Access level.
• View Only
• Full (default)
Notes:
1. This feature appears only if a user password has been set.
2. This feature appears only if a supervisor password has been set.
103
4.6 Power Menu

To access this menu, select Power from the menu bar at the top of the screen.
The menu represented in Table 72 is for setting the power management features.
Table 72. Power Menu

ACPI Suspend State • S1 State (default) Specifies the ACPI suspend state.
• S3 State
Power Management • Disabled (default) Enables or disables the BIOS power management
• Enabled feature.
Hard Drive • Disabled Enables power management for hard disks during
• Enabled (default) standby modes.
After Power Failure • Stay Off (default) Specifies the mode of operation if an AC power loss
• Last State occurs.
• Power On Stay Off keeps the power off until the power button is
pressed.
Last State restores the previous power state before
power loss occurred.
Power On restores power to the computer.
Wake On Modem Ring • Stay Off (default) In APM mode only, specifies how the computer
• Power On responds to an incoming call on an installed modem
when the power is off.
Wake On PME • Stay Off (default) In APM mode only, determines how the system
• Power On responds to a PCI power management event.
104
BIOS Setup Program
4.7 Boot Menu

To access this menu, select Boot from the menu bar at the top of the screen.

IDE Drive Configuration
The menu represented in Table 73 is used to set the boot features and the boot sequence.
Table 73. Boot Menu

Quiet Boot • Disabled Disabled displays normal POST messages.
• Enabled Enabled displays OEM graphic instead of POST
(default) messages.
Intel Rapid BIOS Boot • Disabled Enables the computer to boot without running certain
• Enabled POST tests.
(default)
• Floppy
st
1 Boot Device Specifies the boot sequence according to the device
nd
2 Boot Device • ARMD-FDD type. The computer will attempt to boot from up to five
rd
(Note 1) devices as specified here. Only one of the devices can
3 Boot Device
th • ARMD-HDD be an IDE hard disk drive. To specify boot sequence:
4 Boot Device (Note 2)
1. Select the boot device with <↑> or <↓>.
• IDE-HDD 2. Press <Enter> to set the selection as the intended
(Note 3)
boot device.
• ATAPI CDROM The default settings for the first through fourth boot
• Disabled devices are, respectively:
• ATAPI CDROM
• Floppy
• IDE-HDD
• Disabled
NOTE: To configure the computer to boot from an IDE
hard disk drive, set a boot device in the Setup feature to
IDE-HDD. Determine the IDE channel, and master or
slave mode of the drive. Then, in the next Setup
feature, IDE Drive Configuration, set that channel and
mode to 1st IDE.
IDE Drive Configuration • 1 IDE (default) 1st IDE specifies the IDE hard disk drive to boot from.
st
nd th
Primary Master IDE • 2 IDE
nd The 2 through 4 IDE settings are ignored. See the
note above for more information.
• 3 IDE
rd
Primary Slave IDE
To specify the drive to boot from:
• 4 IDE
th
Secondary Master IDE
1. Use <↑> or <↓> to select the channel, and master or
Secondary Slave IDE
slave mode of the drive to boot from.
2. Press <Enter>.
st
3. Use <↑> or <↓> to select 1 IDE.
4. Press <Enter> to set the selection.
continued
105
Table 73. Boot Menu (continued)

Keyboard Detected Warning • Disabled Enabled presents a warning message if a keyboard is
• Enabled (default) not detected during restart.
Mouse Detected Warning • Disabled Enabled presents a warning message if a mouse is
Floppy Detected Warning • Disabled Enabled presents a warning message if a diskette is
CD/DVD Detected Warning • Disabled Enabled presents a warning message if a CD/DVD is
Hard Drive Detected • Disabled Enabled presents a warning message if a hard drive is
Warning • Enabled (default) not detected during restart.
SMART for Hard Drives • Disabled Enables or disables SMART for hard drives.
Notes:
1 ARMD-FDD = ATAPI removable device - floppy disk drive
2 ARMD-HDD = ATAPI removable device - hard disk drive
3 HDD = Hard disk drive
106
BIOS Setup Program
4.8 Exit Menu

To access this menu, select Exit from the menu bar at the top of the screen.
The menu represented in Table 74 is for exiting the BIOS Setup program, saving changes, and
loading and saving defaults.
Table 74. Exit Menu

Feature Description
Exit Saving Changes Exits and saves the changes in CMOS SRAM.
Exit Discarding Changes Exits without saving any changes made in the BIOS Setup program.
Load Setup Defaults Loads the factory default values for all the Setup options.
Load Custom Defaults Loads the custom defaults for Setup options.
Save Custom Defaults Saves the current values as custom defaults. Normally, the BIOS reads the
Setup values from flash memory. If this memory is corrupted, the BIOS reads the
custom defaults. If no custom defaults are set, the BIOS reads the factory
defaults.
Discard Changes Discards changes without exiting Setup. The option values present when the
computer was turned on are used.
107
108
5 Error Messages and Beep Codes

5.1 BIOS Error Messages...............................................................................................109
5.2 Port 80h POST Codes..............................................................................................111
5.3 Bus Initialization Checkpoints ...................................................................................115
5.4 Speaker ....................................................................................................................116
5.5 BIOS Beep Codes ....................................................................................................116
5.6 Diagnostic LEDs (Optional) ......................................................................................118
5.1 BIOS Error Messages

Table 75 lists the error messages and provides a brief description of each.
Table 75. BIOS Error Messages

Error Message Explanation
GA20 Error An error occurred with Gate A20 when switching to protected
mode during the memory test.
Pri Master HDD Error Could not read sector from corresponding drive.
Pri Slave HDD Error
Sec Master HDD Error
Sec Slave HDD Error
Pri Master Drive - ATAPI Incompatible Corresponding drive in not an ATAPI device. Run Setup to make
Pri Slave Drive - ATAPI Incompatible sure device is selected correctly.
Sec Master Drive - ATAPI Incompatible
Sec Slave Drive - ATAPI Incompatible
A: Drive Error No response from diskette drive.
Cache Memory Bad An error occurred when testing L2 cache. Cache memory may be
bad.
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Display Type Wrong The display type is different than what has been stored in CMOS.
Check Setup to make sure type is correct.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
CMOS Settings Wrong CMOS values are not the same as the last boot. These values
have either been corrupted or the battery has failed.
CMOS Date/Time Not Set The time and/or date values stored in CMOS are invalid. Run
Setup to set correct values.
DMA Error Error during read/write test of DMA controller.
FDC Failure Error occurred trying to access diskette drive controller.
HDC Failure Error occurred trying to access hard disk controller.
continued
109
Table 75. BIOS Error Messages (continued)

Error Message Explanation
Checking NVRAM..... NVRAM is being checked to see if it is valid.
Update OK! NVRAM was invalid and has been updated.
Updated Failed NVRAM was invalid but was unable to be updated.
Keyboard Error Error in the keyboard connection. Make sure keyboard is
connected properly.
KB/Interface Error Keyboard interface test failed.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed then memory may be bad.
Memory Size Increased Memory size has increased since the last boot. If no memory was
added there may be a problem with the system.
Memory Size Changed Memory size has changed since the last boot. If no memory was
added or removed then memory may be bad.
No Boot Device Available System did not find a device to boot.
Off Board Parity Error A parity error occurred on an off-board card. This error is followed
by an address.
On Board Parity Error A parity error occurred in onboard memory. This error is followed
by an address.
Parity Error A parity error occurred in onboard memory at an unknown
address.
NVRAM / CMOS / PASSWORD cleared NVRAM, CMOS, and passwords have been cleared. The system
by Jumper should be powered down and the jumper removed.
<CTRL_N> Pressed CMOS is ignored and NVRAM is cleared. User must enter Setup.
110
Error Messages and Beep Codes
5.2 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If
the POST fails, execution stops and the last POST code generated is left at port 80h. This code is
useful for determining the point where an error occurred.
Displaying the POST-codes requires an add-in card, often called a POST card (PCI not ISA). The
POST card can decode the port and display the contents on a medium such as a seven-segment
display.
The tables below offer descriptions of the POST codes generated by the BIOS. Table 76 defines
the uncompressed INIT code checkpoints, Table 77 describes the boot block recovery code
checkpoints, and Table 78 lists the runtime code uncompressed in F000 shadow RAM. Some
codes are repeated in the tables because that code applies to more than one operation.
Table 76. Uncompressed INIT Code Checkpoints

Code Description of POST Operation
D0 NMI is Disabled. Onboard KBC, RTC enabled (if present). Init code Checksum verification
starting.
D1 Keyboard controller BAT test, CPU ID saved, and going to 4 GB flat mode.
D3 Do necessary chipset initialization, start memory refresh, and do memory sizing.
D4 Verify base memory.
D5 Init code to be copied to segment 0 and control to be transferred to segment 0.
D6 Control is in segment 0. To check recovery mode and verify main BIOS checksum. If either it is
recovery mode or main BIOS checksum is bad, go to check point E0 for recovery else go to check
point D7 for giving control to main BIOS.
D7 Find Main BIOS module in ROM image.
D8 Uncompress the main BIOS module.
D9 Copy main BIOS image to F000 shadow RAM and give control to main BIOS in F000 shadow
RAM.
Table 77. Boot Block Recovery Code Checkpoints

E0 Onboard Floppy Controller (if any) is initialized. Compressed recovery code is uncompressed in
F000:0000 in Shadow RAM and give control to recovery code in F000 Shadow RAM. Initialize
interrupt vector tables, initialize system timer, initialize DMA controller and interrupt controller.
E8 Initialize extra (Intel Recovery) Module.
E9 Initialize floppy drive.
EA Try to boot from floppy. If reading of boot sector is successful, give control to boot sector code.
EB Booting from floppy failed, look for ATAPI (LS-120, Zip) devices.
EC Try to boot from ATAPI. If reading of boot sector is successful, give control to boot sector code.
EF Booting from floppy and ATAPI device failed. Give two beeps. Retry the booting procedure again
(go to check point E9).
111
Table 78. Runtime Code Uncompressed in F000 Shadow RAM

03 NMI is Disabled. To check soft reset/power-on.
05 BIOS stack set. Going to disable cache if any.
06 POST code to be uncompressed.
07 CPU init and CPU data area init to be done.
08 CMOS checksum calculation to be done next.
0B Any initialization before keyboard BAT to be done next.
0C KB controller I/B free. To issue the BAT command to keyboard controller.
0E Any initialization after KB controller BAT to be done next.
0F Keyboard command byte to be written.
10 Going to issue Pin-23,24 blocking/unblocking command.
11 Going to check pressing of <INS>, <END> key during power-on.
12 To init CMOS if "Init CMOS in every boot" is set or <END> key is pressed. Going to disable DMA
and Interrupt controllers.
13 Video display is disabled and port-B is initialized. Chipset init about to begin.
14 8254 timer test about to start.
19 About to start memory refresh test.
1A Memory Refresh line is toggling. Going to check 15 µs ON/OFF time.
23 To read 8042 input port and disable Megakey GreenPC feature. Make BIOS code segment
writeable.
24 To do any setup before Int vector init.
25 Interrupt vector initialization to begin. To clear password if necessary.
27 Any initialization before setting video mode to be done.
28 Going for monochrome mode and color mode setting.
2A Different buses init (system, static, output devices) to start if present. (See Section 5.3 for details
of different buses.)
2B To give control for any setup required before optional video ROM check.
2C To look for optional video ROM and give control.
2D To give control to do any processing after video ROM returns control.
2E If EGA/VGA not found then do display memory R/W test.
2F EGA/VGA not found. Display memory R/W test about to begin.
30 Display memory R/W test passed. About to look for the retrace checking.
31 Display memory R/W test or retrace checking failed. To do alternate Display memory R/W test.
32 Alternate Display memory R/W test passed. To look for the alternate display retrace checking.
34 Video display checking over. Display mode to be set next.
37 Display mode set. Going to display the power-on message.
38 Different buses init (input, IPL, general devices) to start if present. (See Section 5.3 for details of
different buses.)
39 Display different buses initialization error messages. (See Section 5.3 for details of different
buses.)
3A New cursor position read and saved. To display the Hit <DEL> message.
continued
112
Table 78. Runtime Code Uncompressed in F000 Shadow RAM (continued)

40 To prepare the descriptor tables.
42 To enter in virtual mode for memory test.
43 To enable interrupts for diagnostics mode.
44 To initialize data to check memory wrap around at 0:0.
45 Data initialized. Going to check for memory wrap around at 0:0 and finding the total system
memory size.
46 Memory wrap around test done. Memory size calculation over. About to go for writing patterns to
test memory.
47 Pattern to be tested written in extended memory. Going to write patterns in base 640k memory.
48 Patterns written in base memory. Going to find out amount of memory below 1M memory.
49 Amount of memory below 1M found and verified. Going to find out amount of memory above 1M
memory.
4B Amount of memory above 1M found and verified. Check for soft reset and going to clear memory
below 1M for soft reset. (If power on, go to check point # 4Eh).
4C Memory below 1M cleared. (SOFT RESET) Going to clear memory above 1M.
4D Memory above 1M cleared. (SOFT RESET) Going to save the memory size. (Go to check
point # 52h).
4E Memory test started. (NOT SOFT RESET) About to display the first 64k memory size.
4F Memory size display started. This will be updated during memory test. Going for sequential and
random memory test.
50 Memory testing/initialization below 1M complete. Going to adjust displayed memory size for
relocation/ shadow.
51 Memory size display adjusted due to relocation/ shadow. Memory test above 1M to follow.
52 Memory testing/initialization above 1M complete. Going to save memory size information.
53 Memory size information is saved. CPU registers are saved. Going to enter in real mode.
54 Shutdown successful, CPU in real mode. Going to disable gate A20 line and disable parity/NMI.
57 A20 address line, parity/NMI disable successful. Going to adjust memory size depending on
relocation/shadow.
58 Memory size adjusted for relocation/shadow. Going to clear Hit <DEL> message.
59 Hit <DEL> message cleared. <WAIT...> message displayed. About to start DMA and interrupt
controller test.
60 DMA page register test passed. To do DMA#1 base register test.
62 DMA#1 base register test passed. To do DMA#2 base register test.
65 DMA#2 base register test passed. To program DMA unit 1 and 2.
66 DMA unit 1 and 2 programming over. To initialize 8259 interrupt controller.
7F Extended NMI sources enabling is in progress.
80 Keyboard test started. Clearing output buffer, checking for stuck key, to issue keyboard reset
command.
81 Keyboard reset error/stuck key found. To issue keyboard controller interface test command.
82 Keyboard controller interface test over. To write command byte and init circular buffer.
83 Command byte written, global data init done. To check for lock-key.
continued
113

84 Lock-key checking over. To check for memory size mismatch with CMOS.
85 Memory size check done. To display soft error and check for password or bypass setup.
86 Password checked. About to do programming before setup.
87 Programming before setup complete. To uncompress SETUP code and execute CMOS setup.
88 Returned from CMOS setup program and screen is cleared. About to do programming after
setup.
89 Programming after setup complete. Going to display power-on screen message.
8B First screen message displayed. <WAIT...> message displayed. PS/2 Mouse check and
extended BIOS data area allocation to be done.
8C Setup options programming after CMOS setup about to start.
8D Going for hard disk controller reset.
8F Hard disk controller reset done. Floppy setup to be done next.
91 Floppy setup complete. Hard disk setup to be done next.
95 Init of different buses optional ROMs from C800 to start. (See Section 5.3 for details of different
buses.)
96 Going to do any init before C800 optional ROM control.
97 Any init before C800 optional ROM control is over. Optional ROM check and control will be done
next.
98 Optional ROM control is done. About to give control to do any required processing after optional
ROM returns control and enable external cache.
99 Any initialization required after optional ROM test over. Going to setup timer data area and printer
base address.
9A Return after setting timer and printer base address. Going to set the RS-232 base address.
9B Returned after RS-232 base address. Going to do any initialization before Coprocessor test.
9C Required initialization before Coprocessor is over. Going to initialize the Coprocessor next.
9D Coprocessor initialized. Going to do any initialization after Coprocessor test.
9E Initialization after Coprocessor test is complete. Going to check extended keyboard, keyboard ID
and num-lock.
A2 Going to display any soft errors.
A3 Soft error display complete. Going to set keyboard typematic rate.
A4 Keyboard typematic rate set. To program memory wait states.
A5 Going to enable parity/NMI.
A7 NMI and parity enabled. Going to do any initialization required before giving control to optional
ROM at E000.
A8 Initialization before E000 ROM control over. E000 ROM to get control next.
A9 Returned from E000 ROM control. Going to do any initialization required after E000 optional
ROM control.
AA Initialization after E000 optional ROM control is over. Going to display the system configuration.
AB Put INT13 module runtime image to shadow.
AC Generate MP for multiprocessor support (if present).
AD Put CGA INT10 module (if present) in Shadow.
continued
114

AE Uncompress SMBIOS module and init SMBIOS code and form the runtime SMBIOS image in
shadow.
B1 Going to copy any code to specific area.
00 Copying of code to specific area done. Going to give control to INT-19 boot loader.
5.3 Bus Initialization Checkpoints

The system BIOS gives control to the different buses at several checkpoints to do various tasks.
Table 79 describes the bus initialization checkpoints.
Table 79. Bus Initialization Checkpoints

Checkpoint Description
2A Different buses init (system, static, and output devices) to start if present.
38 Different buses init (input, IPL, and general devices) to start if present.
39 Display different buses initialization error messages.
95 Init of different buses optional ROMs from C800 to start.
While control is inside the different bus routines, additional checkpoints are output to port 80h as
WORD to identify the routines under execution. In these WORD checkpoints, the low byte of the
checkpoint is the system BIOS checkpoint from which the control is passed to the different bus
routines. The high byte of the checkpoint is the indication of which routine is being executed in
the different buses. Table 80 describes the upper nibble of the high byte and indicates the function
that is being executed.
Table 80. Upper Nibble High Byte Functions

Value Description
0 func#0, disable all devices on the bus concerned.
1 func#1, static devices init on the bus concerned.
2 func#2, output device init on the bus concerned.
3 func#3, input device init on the bus concerned.
4 func#4, IPL device init on the bus concerned.
5 func#5, general device init on the bus concerned.
6 func#6, error reporting for the bus concerned.
7 func#7, add-on ROM init for all buses.
115
Table 81 describes the lower nibble of the high byte and indicates the bus on which the routines are
being executed.
Table 81. Lower Nibble High Byte Functions

Value Description
0 Generic DIM (Device Initialization Manager)
1 On-board System devices
2 ISA devices
3 EISA devices
4 ISA PnP devices
5 PCI devices
5.4 Speaker
A 47 Ω inductive speaker is mounted on the D850GB board. The speaker provides audible error
code (beep code) information during POST.
The location of the onboard speaker Figure 1, page 14
5.5 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS displays an error message describing
the problem (see Table 82). The BIOS also issues a beep code (one long tone followed by two
short tones) during POST if the video configuration fails (a faulty video card or no card installed)
or if an external ROM module does not properly checksum to zero.
An external ROM module (for example, a video BIOS) can also issue audible errors, usually
consisting of one long tone followed by a series of short tones. For more information on the beep
codes issued, check the documentation for that external device.
There are several POST routines that issue a POST terminal error and shut down the system if they
fail. Before shutting down the system, the terminal-error handler issues a beep code signifying the
test point error, writes the error to I/O port 80h, attempts to initialize the video and writes the error
in the upper left corner of the screen (using both monochrome and color adapters).
116
If POST completes normally, the BIOS issues one short beep before passing control to the
operating system.
Table 82. Beep Codes

Beep Description
1 Refresh failure
2 Parity cannot be reset
3 First 64 KB memory failure
4 Timer not operational
5 Not used
6 8042 GateA20 cannot be toggled
7 Exception interrupt error
8 Display memory R/W error
9 Not used
10 CMOS Shutdown register test error
11 Invalid BIOS (e.g. POST module not found, etc.)
117
5.6 Diagnostic LEDs (Optional)

The optional enhanced diagnostics feature consists of a hardware decoder and four LEDs located
between the LAN connector and the parallel port connector on the back panel. This feature requires no
modifications to the chassis (other than I/O back panel shield) or cabling.
Figure 17 shows the location of the diagnostic LEDs. Table 83 lists the diagnostic codes displayed by
the LEDs.
4
OM10451
Figure 17. Diagnostic LEDs
118
Table 83. Diagnostic LED Codes

Display BIOS Operation Display BIOS Operation
Amber Power on, starting BIOS Amber Undefined
Amber Amber
Amber Amber
Amber Green
Green Recovery mode Green Undefined
Amber Amber
Amber Amber
Amber Green
Amber Processor, cache, etc. Amber Undefined
Green Green
Amber Amber
Amber Green
Green Memory, auto-size, shadow, Green Undefined
Green Green
etc.
Amber Amber
Amber Green
Amber PCI bus initialization Amber Undefined
Amber Amber
Green Green
Amber Green
Green Video Green Undefined
Amber Amber
Green Green
Amber Green
Amber IDE bus initialization Amber Undefined
Green Green
Green Green
Amber Green
Green USB initialization Green Booting operating system
Green Green
Green Green
Amber Green
Note: Undefined states are reserved for future use.
✏ NOTE
After the computer has booted, the diagnostic LEDs remain green during normal operation.
119
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Intel® Desktop Board D850GB

Technical Product Specification

Order Number A26080-002

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

Copyright  2000, 2001, Intel Corporation. All rights reserved.

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

2.4 DMA Channels ...........................................................................................................46

4 BIOS Setup Program

47. States for a One Color Power LED .............................................................................67

What This Chapter Contains

1.1.1 Feature Summary

Table 1. Feature Summary

For information about Refer to

1.1.2 Manufacturing Options

Table 2. Manufacturing Options

1.1.3 D850GB Board Layout

A AD1881/AD1885 audio codec (optional) L Diskette drive connector

Figure 1. D850GB Board Components

1.1.4 Block Diagram

USB USB Ports 0 and 1

82850 Memory 82801BA SST 49LF004A

PCI Bus CNR

Figure 2. Block Diagram

1.2 Online Support

1.3 Design Specifications

Table 3. Specifications (continued)

Table 3. Specifications (continued)

Table 4. Supported Processors

1.5 System Memory

1.5.1 Memory Features

1.5.2 Continuity RIMM Modules

1.5.3 RDRAM Memory Configuration

Table 5. Supported Memory Configurations

1.6 Intel® 850 Chipset

System Bus USB

82850 82801BA SST 49LF004A

Figure 3. Intel 850 Chipset Block Diagram

For information about Refer to

AGP is a high-performance interface for graphics-intensive applications, such as 3D applications.

1.6.3 IDE Support

1.6.3.2 SCSI Hard Drive Activity LED Connector

1.6.4 Real-Time Clock, CMOS SRAM, and Battery

1.6.5 SST 49LF004A 4 Mbit Firmware Hub (FWH)

1.7 I/O Controller

1.7.1 Serial Port

1.7.2 Parallel Port

1.7.3 Diskette Drive Controller

1.7.4 Keyboard and Mouse Interface

1.8 Audio Subsystem (Optional)

Figure 4. Audio Subsystem Block Diagram

For information about Refer to

1.8.1 Audio Connectors

1.8.1.2 ATAPI CD-ROM Audio Connector (Optional)

1.8.1.3 Auxiliary Line In Connector (Optional)

1.8.2 Audio Subsystem Software

1.9 LAN Subsystem

1.9.1 Intel® 82562EM Platform LAN Connect Device (Optional)

1.9.2 RJ-45 LAN Connector with Integrated LEDs (Optional)