eSIM GSMA System-On-Chip Solution For Secure M2M Industrial Applications
eSIM GSMA System-On-Chip Solution For Secure M2M Industrial Applications
eSIM GSMA System-On-Chip Solution For Secure M2M Industrial Applications
Data brief
Features
WLCSP11
• Remote SIM provisioning compliant with GSMA M2M and SIMalliance
specifications
• Bootstrap connectivity profile provided by a trusted partner
• Up to 7 connectivity profiles (depending on memory size)
VFDFPN8 WLCSP11
5 × 6 mm, Wettable • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
flanks (MFF2) • Network access applications supported: SIM / USIM / ISIM / CSIM
• Secure element access control (ARF / PKCS#15)
• OTA capability over SMS, CAT-TP & HTTPS (including DNS)
• Multi-interfaces able to combine eSIM + eSE
Hardware
• Product available on ST33G1M2M
Card plugin 2FF, 3FF or 4FF (Based on • ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
D16 micromodule) • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
• Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
• Serial peripheral interface (SPI), depending on packages
• Industrial qualification (JEDEC JESD47)
• Operating temperature: -40°C to +105°C
• Common Criteria EAL5+
Security
• Symmetric cryptography DES / 3DES / AES
• Asymmetric cryptography RSA (up to 2048 bits)
• HTTPS remote management TLS v1.0, v1.1 and v1.2
• Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST
P-256 and brainpool P256r1
• Authentication algorithm: MILENAGE, TUAK, CAVE
Certification
Applications
• Cellular Connected Nodes
• LTE: Cat M1 and NBIoT
• Surveillance
• IoT for smart home and city such as gas metering
• IoT for smart industry such as tracking
1 Description
The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed
for all industrial devices.
It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.
The device can manage different MNO profiles while ensuring the appropriate security level to all eSIM
stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly
managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java® Card environment compliant with Java® Card v3.0.4
classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI,
3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java® Card garbage collection mechanism
optimizing the usage of the memory.
The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe
conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a
powerful 32-bit Arm® SecurCore® SC300™ RISC core.
Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
Note: Java is a registered trademark of Oracle and/or its affiliates.
A cellular connectivity solution enables devices to be used by the edge mobile network operators (also called
MNO) or mobile virtual network operators (MVNO). This solution increases network coverage and it maintains
seamless connectivity.
Moreover, a cellular solution is simple to deploy. This solution is mainly composed of the modem (baseband), the
SIM card connector and the plastic SIM card. This is the traditional SIM concept inherited from the mobile phone.
It is also possible to have an embedded SIM (eSIM) solution. In this case, the SIM is soldered directly into the
device. It reduces the board footprint and there is no need for a SIM connector.
These traditional solutions are simple but the SIM / eSIM only supports one cellular connectivity profile at a time
for one network operator. In this case, if the operator needs to be changed, the SIM / eSIM solution must be
changed.
The eSIM GSMA solution extends this traditional SIM / eSIM solution.
The ST4SIM-200M is a GSMA eSIM solution compliant with the eSIM M2M specifications from the GSM
Association (GSMA). This solution integrates a new secure architecture and complete ecosystem able to manage
cellular network connectivity remotely without impacting the eSIM component.
Thanks to this eSIM technology, IoT devices can now be deployed to the field with one network connectivity
solution and if at some later stage, this solution needs to be changed, a new one can be put in place through the
network. So, no need for a product recall, nor product maintenance.
This solution is flexible and does not depend on a particular operator. For M2M, including industrial and
automotive markets, this solution is service-oriented; the profile is remotely controlled by the service provider
through a platform (push model). In this case, end-user interaction is not required.
The ST4SIM-200M is interoperable with large subscription management platforms already deployed in the field.
STMicroelectronics has attended all test fest sessions driven by GlobalPlatform (including PoC on SM-SR
changes initiated by GSMA) and submitted all the platform solution interfaces (ES5, ES6 and ES8 interfaces).
The device offers a complete ecosystem thanks to STMicroelectronics trusted partners. Our partners provide
the connectivity profile and the subscription management platform to provision and remotely manage operator
profiles. (Contact the local STMicroelectronics sales office for more details on STMicroelectronics trusted
partners)
Based on a certified Common Criteria EAL5+ secure hardware solution, the ST4SIM-200M is a GSMA-certified
solution compliant with the GSMA M2M specification SGP.02 v3.2. It provides a flexible and scalable solution
while maintaining the best level of security.
The ST4SIM-200M integrates the GSMA architecture with the profile management mechanisms. A profile
contains the operator network data related to a subscription (operator’s credentials, file system, PINs/PUKs,
network authentication, application and so on). Each profile is independent of other profiles.
The ST4SIM-200M can host up to 7 profiles. Each profile has sufficient memory size available in the device or can
have a specific memory size coded using the cumulative granted memory defined by GlobalPlatform amendment
C.
This profile is described by the SIMalliance interoperable profile package specification.
The ST4SIM-200M fully supports SIMalliance interoperable profile package v2.1. No proprietary features are
introduced and profiles are coded according to ASN.1 / DER coding.
The ST4SIM-200M is an interoperable solution. The device already integrates most of main operators (MNO /
MVNO) and it is possible to integrate any operator profile or personalized profile compliant with the SIMalliance
specification.
The ST4SIM-200M is able to combine the eSIM solution with an embedded secure element (eSE) section inside
the same chip.
This eSE section is used to provide secure storage, cryptographic services, and so on via Java® Card applets.
ST4SIM
eSIM eSE
The eSE section is accessible through a dedicated serial peripheral interface (SPI) protocol and the eSIM uses
the ISO/IEC 7816 protocol in parallel. Consequently, the eSE is only available on WLCSP packages including ISO
and SPI protocols.
The embedded secure element is optional and configurable.
Contact the local STMicroelectronics sales office for more details on the pin configuration.
As it is compliant with the ETSI, 3GPP and 3GPP2, the ST4SIM-200M can easily be integrated into any OTA
platform compliant with relevant standards. STMicroelectronics cards are field-proven to be interoperable with the
mainstream OTA platforms commonly chosen by mobile network operators.
6 Electrical characteristics
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the
device. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under
the measurement conditions summarized in the relevant tables. Users should check that the operating conditions
in their circuit match the measurement conditions when relying on the quoted parameters.
VESD Electrostatic discharge voltage according to JESD22-A114, Human Body Model 4000 V
1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb-free assembly), the ST ECOPACK® 7191395
specification, and the European directive on Restrictions on Hazardous Substances (RoHS directive 2011/65/EU of July
2011).
Note: Stresses listed above may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the operational sections of the
specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Interface device
I/O
CLK
RST
Vcc
100 nF 1 µF
+
GND
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
D2
A (Datum A)
A1 D D
A3
7 8
L
E2
(Datum B)
K
Pin 1 IDR0.200
1 2 2 1
Seatingplane
(0.05)
(0.10)
(0.30)
(0.40)
VFDFPN8 package is constructed with "WETTABLE" flanks, a "dimpled" pad formed during the half-etching step
of the lead frame manufacturing process.
The wettable flank feature, in conjunction with an optimized board mount process, promotes formation of solder
joints which can be easily inspected. The presence of a solder fillet improves the inspection capability of the
solder joints by automated optical inspection.
Figure 10. Solder joint side view Figure 11. Solder joint top view
This package is compliant with machine to machine form factor defined by ETSI in TS 102 671.
GND 1 8 VCC
SWIO 2 7 RESET
I/O 3 6 CLK
NC 4 5 NC
GND
R1 GND VCC
VCC
SWIO RST
RST
I/O CLK
CLK
N/C N/C
I/O
Package Description Tape width Tape pitch Reel diameter Quantity per reel
VFDFPN8
Flat package, no lead 5 x 6 mm. 12 mm 8 mm 13 in. 4000
5x6
A N
D C
Reel size Tape size A max B min C D min G max N min T max Unit
Ko Po
Do E
T P2
F
W
Bo B2
Ao P1
D1
#4000 #0001
Index
7.2 2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)
The ST4SIM-200M card is based on flexible plastic chip cards, composed of ABS and Polycarbonate, improving
all round resistance in an industrial environment. This card contains a STMicroelectronics industrial grade D16
micromodule.
All elements; card and micromodule, are designed to run at a temperature of -40 °C to +105 °C.
The ST4SIM-200M is available for different card plugin packages as detailed in the table below.
Package Mini SIM (2FF) Micro SIM (3FF) Nano SIM (4FF)
Package format
Note: These formats comply to the ISO/IEC 7810 and ETSI TS 102 221 standards.
Table 9. Glossary
Term Description
Term Description
Revision history
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Cellular connectivity solutions overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 eSIM GSMA solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Additional embedded secure element (eSE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Card OS technical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 Supported standards and networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Algorithms and cryptography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 Over the air (OTA) functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.4 Memory management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2 2FF, 3FF or 4FF plugin card package information (based on D16 micromodule) . . . . . . . . . 18
7.2.1 D16 micromodule pinout information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
List of tables
Table 1. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 2. Maximum VCC rising slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. VFDFPN8 - mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. Packing on tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 6. 13" reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 7. SIM plugin package types and dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 8. D16 contact descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 9. Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 10. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
List of figures
Figure 1. SIM solution overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. eSIM solution overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. eSIM GSMA solution overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4. eSIM architecture overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 5. ST4SIM-200M architecture eSIM & eSE overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. Recommended filtering capacitors on VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. VFDFPN8 - outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. Regular DFN (non-wettable flank) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 9. DFN wettable flank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Solder joint side view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Solder joint top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. VFDFPN8 pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. ST4SIM-200M PCB integration recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 14. 13 " reel diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 15. Leader and trailer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Embossed carrier tape for VFDFPN8 (5 × 6 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 17. Component orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 18. D16 micromodule contact assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19