ST33TPHF20SPI

Data brief

Flash-memory-based TPM 2.0 device with an SPI interface

Features
TPM features

• Flash-memory-based Trusted Platform Module (TPM)

VFQFPN32 TSSOP28 • Compliant with Trusted Computing Group (TCG) Trusted Platform Module
(5 × 5 mm) (9.7 × 6.4 mm, (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client
4.4 mm body width) Specific TPM Platform Specifications 1.03
• TPM firmware code can be upgraded thanks to a persistent Flash-memory
loader application to support new standard evolutions
• Common Criteria (CC) certification according to the TPM 2.0 protection profiles
at EAL4+
• FIPS 140-2 level 2 certification
• SPI support for up to 33 MHz in FIFO and CRB protocol modes
• Support for software and hardware physical presence

Hardware features

• Arm® SecurCore® SC300™ 32-bit RISC core

• Highly reliable Flash memory technology
• Extended temperature range: −40 °C to 105 °C
• ESD (electrostatic discharge) protection up to 4 kV (HBM)
• 1.8 V or 3.3 V supply voltage range
• 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack
Product status link ECOPACK packages
ST33TPHF20SPI
Security features
• Active shield and environmental sensors
• Monitoring of environmental parameters (power)
• Hardware and software protection against fault injection
STSAFE-TPM
• FIPS-compliant random-number generator (RNG) built on an SP800-90A
compliant SHA256 deterministic random bit generator (DRBG) and an AIS-31
Class PTG2 compliant true random number generator (TRNG)
• Cryptographic algorithms:
– RSA (Rivest-Shamir-Adleman) key generation (1024 or 2048 bits)
– RSA signature and encryption
– Hash-based message authentication code (HMAC) SHA-1 & SHA-256
– Advanced Encryption Standard (AES)-128-192-256
– Elliptic curve cryptography (ECC) 224 & 256 bits
– Elliptic curve Diffie–Hellman (ECDH) 224 & 256 bits
– Elliptic curve direct anonymous attestation (ECDAA)

Product compliance

• TPM 2.0 compliant with Microsoft® Windows® 8.1 and 10

• Compliant with Intel® TXT
• TPM 2.0 compliant with the corresponding TCG test suites

DB2868 - Rev 4 - November 2019 www.st.com

For further information contact your local STMicroelectronics sales office.
 ST33TPHF20SPI
Description

1 Description

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions
for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.
It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services
to protect the confidentiality, integrity and authenticity of information and devices.
These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM
ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against
advanced forms of attack.
The ST33TPHF20SPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM
Profile specifications.
The ST33TPHF20SPI supports TPM 2.0 commands exclusively, and offers 112 Kbytes of user-dedicated non-
volatile memory.
The ST33TPHF20SPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage
of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.
Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

DB2868 - Rev 4 page 2/25

 ST33TPHF20SPI
Data brief scope

2 Data brief scope

2.1 ST33TPHF20SPI products

This document covers the functionality of the ST33TPHF20SPI product family, the most recent of which has
firmware version 4A.40 (74.64 in decimal) preloaded on ST TPM hardware with markings:
• P0AHD1
The information to order the supporting platforms is provided in Section 8 Ordering information.

2.2 Firmware image

The firmware image version 4A.40 can be loaded to the ST TPM hardware of the ST33TPHF20SPI products,
identifiable by their firmware version, which is of the form 4A.xx. The ordering codes of the products upgradable to
firmware version 4A.40 are the following:
• ST33HTPH2ExxAAF3 (FW 4A.00)
• ST33HTPH2ExxAHC1 (FW 4A.08)
See Section 9 Firmware image overview for an overview of the available firmware images.

DB2868 - Rev 4 page 3/25

 ST33TPHF20SPI
Pin and signal description

3 Pin and signal description

The two figures below give the pinouts of the two packages in which the devices are delivered. The table
describes the associated signals.

Figure 1. TSSOP28 pinout

NiC 1 28 NiC
NiC 2 27 NiC
NiC 3 26 MISO
GND 4 25 NiC
NiC 5 24 VPS
GPI 6 23 MOSI
PP 7 22 SPI_CS
TSSOP28
NiC 8 21 SPI_CLK
NiC 9 20 SPI_PIRQ
NiC 10 19 NiC
NiC 11 18 NiC
NiC 12 17 NiC
NiC 13 16 SPI_RST
NiC 14 15 NiC

Figure 2. VQFN32 pinout

NiC
NiC
NiC
NiC
NiC
NiC
NiC
NiC

32 31 30 29 28 27 26 25
NiC 1 24 MISO
GND 2 23 NiC
NiC 3 22 VPS
VQFN32
NiC 4 21 MOSI
NiC 33
NiC 5 20 SPI_CS
GPI 6 19 SPI_CLK
PP 7 18 SPI_PIRQ
NiC 8 17 SPI_RST
9 10 11 12 13 14 15 16
NiC
NiC
NiC
NiC
NiC
NiC
NiC
NiC

Table 1. Pin descriptions

Signal Type Description

VPS Input Power supply. This pin must be connected to 1.8 V or 3.3 V DC power rail supplied by the motherboard.
GND Input GND has to be connected to the main motherboard ground.
SPI Reset, active low, used to re-initialize the device. Must not be unconnected. External pull-up resistor
SPI_RST Input
required if it cannot be driven.
MISO Output SPI Master Input, Slave Output (output from slave)
MOSI Input SPI Master Output, Slave Input (output from master)
SPI_CLK Input SPI Serial Clock (output from master)
SPI_CS Input SPI Chip (or Slave) Select, internal pull-up (active low; output from master)

DB2868 - Rev 4 page 4/25

 ST33TPHF20SPI
Pin and signal description

Signal Type Description

SPI_PIRQ Output SPI IRQ, active low, open drain, used by TPM to generate an interrupt
PP Input Physical Presence, active high, internal pull-down. Used to indicate Physical Presence.
Used for activation and deactivation of the TPM Standby mode (TPMLowPowerByGPIO). If this feature
GPI Input
is not used, connect an external pull-up resistor (10 kΩ) to this pad.
Not internally connected: not connected to the die. May be left unconnected but no impact on TPM if
NiC -
connected.

Note: The VQFN32 package has a central pad (PIN33) on the bottom, which is not connected to the die. This pin does
not impact the TPM, be it connected or not.

DB2868 - Rev 4 page 5/25

 ST33TPHF20SPI
Integration guidance

4 Integration guidance

4.1 Typical hardware implementation

The Physical Presence (PP) pin should be connected if platform implementation (at boot level) uses a hardware
physical presence function.
The figure below shows the hardware implementation in the case of the TSSOP28 package. The same
implementation is also valid for the TSSOP28 and QFN32 packages.

Figure 3. Typical hardware implementation (TSSOP28 package)

1 28
NC NC
2 27
NC NC
3 26 MISO
VPS NC MISO
4 25
GND GND NC VPS
10 kΩ 5 24
(optional) NC VPS
GPI (opt) 6 23 MOSI
GPI MOSI
PP (opt) 7 22 SPI_CS
PP SPI_CS 100 nF 10 µF
8 21 SPI_CLK
NC SPI_CLK
9 20 SPI_PIRQ
NC SPI_PIRQ
10 19
NC NC
11 18
NC NC
12 17
NC NC
13 16 SPI_RST
NC SPI_RST
14 15
NC NC

DB2868 - Rev 4 page 6/25

 ST33TPHF20SPI
Power supply filtering

4.2 Power supply filtering

As mentioned in Section 3 Pin and signal description, the power supply of the circuit must be filtered using the
circuit shown in the figure below.

Figure 4. Mandatory filtering capacitors on VPS

Host device
SPI_MISO
SPI_MOSI
SPI_CLK
SPI_RST
SPI_CS
SPI_PIRQ
TPM
VPS

10 µF 100 nF
+

-
GND

1. 10 µF and 100 nF are recommended values. The minimum required capacitor value is 2.1 µF (2 µF in
parallel with 100 nF).

DB2868 - Rev 4 page 7/25

 ST33TPHF20SPI
Package information

5 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

5.1 TSSOP28 package information

TSSOP28 is a 28-pin, 9.7 × 6.4 mm, 4.4 mm body width, 0.65 mm pitch, thin shrink small outline package.
Unless otherwise specified, general tolerance is ± 0.1 mm.

Figure 5. TSSOP28 - outline

D

28 15

c
E1 E

1 14 k

A1
L
A A2
aaa L1
b e

1. Drawing is not to scale.

Table 2. TSSOP28 - mechanical data

millimeters inches (1)

Symbol
Min. Typ. Max. Min. Typ. Max.

A - - 1.200 - - 0.0472
A1 0.050 - 0.150 0.0020 - 0.0059
A2 0.800 1.000 1.050 0.0315 0.0394 0.0413
b 0.190 - 0.300 0.0075 - 0.0118
c 0.090 - 0.200 0.0035 - 0.0079
D 9.600 9.700 9.800 0.3780 0.3819 0.3858
E 6.200 6.400 6.600 0.2441 0.2520 0.2598
E1 4.300 4.400 4.500 0.1693 0.1732 0.1772
e - 0.650 - - 0.0256 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -

DB2868 - Rev 4 page 8/25

 ST33TPHF20SPI
TSSOP28 package information

millimeters inches (1)

Symbol
Min. Typ. Max. Min. Typ. Max.

k 0° - 8° 0° - 8°
aaa - - 0.100 - - 0.0039

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 6. TSSOP28 - recommended footprint

0.3

28 15

6.4 4.4

1 14

1.0

0.65

8.75

1. All dimensions are in millimeters.

DB2868 - Rev 4 page 9/25

 ST33TPHF20SPI
VFQFPN32 package information

5.2 VFQFPN32 package information

VFQFPN32 is a 32-lead, 5 × 5 mm, 0.5 mm pitch, very thin fine pitch quad flat pack no-lead package.

Figure 7. VFQFPN32 - outline

Seating plane

C
ddd C

A3 A1

9 16

8 17

E2 b E

24
1
L

32
Pin # 1 ID
R = 0.30
D2
L

Bottom view

1. Drawing is not to scale.

Table 3. VFQFPN32 - mechanical data

millimeters inches (1)

Symbol
Min. Typ. Max. Min. Typ. Max.

A 0.800 0.900 1.000 0.0315 0.0354 0.0394

A1 0.000 0.020 0.050 0.0000 0.0008 0.0020
A3 - 0.200 - - 0.0079 -
b 0.180 0.250 0.300 0.0071 0.0098 0.0118
D 4.850 5.000 5.150 0.1909 0.1969 0.2028
D2 3.500 3.600 3.700 0.1378 0.1417 0.1457

DB2868 - Rev 4 page 10/25

 ST33TPHF20SPI
VFQFPN32 package information

millimeters inches (1)

Symbol
Min. Typ. Max. Min. Typ. Max.

E 4.850 5.000 5.150 0.1909 0.1969 0.2028

E2 3.500 3.600 3.700 0.1378 0.1417 0.1457
e - 0.500 - - 0.0197 -
L 0.300 0.400 0.500 0.0118 0.0157 0.0197
ddd - - 0.050 - - 0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 8. VFQFPN32 - recommended footprint

5.30
3.80

0.60
32 25

1 24

3.45

3.80
5.30

3.45

0.50

0.30 8 17

9 16
0.75

All dimensions are in millimeters.

DB2868 - Rev 4 page 11/25

 ST33TPHF20SPI
Thermal characteristics of packages

5.3 Thermal characteristics of packages

The table below provides the thermal characteristics of the TSSOP28 and VFQFPN32 packages.

Table 4. Thermal characteristics

Parameter Symbol Value

Ambient temperature TA −40 to 105 °C

Recommended operating temperature range Case temperature TC -

Junction temperature TJ −43 to 108 °C

Absolute maximum junction temperature - 125 °C

Maximum power dissipation - 63 mW

Junction to ambient thermal resistance θJA 35.8 at 0 lfpm (1)

Theta-JA, -JB and -JC Junction to case thermal resistance θJC 1.48 at 0 lfpm(1)

Junction to board thermal resistance θJB 13.9 at 0 lfpm(1)

1. Linear feet per minute.

DB2868 - Rev 4 page 12/25

 ST33TPHF20SPI
Delivery packing

6 Delivery packing

Surface-mount packages can be supplied with tape and reel packing. The reels have a 13" typical diameter.
Reels are in plastic, either anti-static or conductive, with a black conductive cavity tape. The cover tape is
transparent anti-static or conductive.
The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the same side as the
sprocket holes in the tape.
The STMicroelectronics tape and reel specifications are compliant to the EIA 481-A standard specification.

Table 5. Packages on tape and reel

Package Description Tape width Tape pitch Reel diameter Quantity per reel

TSSOP 28 Thin shrink small outline package 16 mm 8 mm 13 in. 2500

VFQFPN 32 Very thin fine pitch quad flat pack no-lead package 12 mm 8 mm 13 in. 3000

Figure 9. Reel diagram

A N

D C

Table 6. Reel dimensions

Reel size Tape width A Max. B Min. C D Min. G Max. N Min. T Max. Unit

16 16.4 +2/–0 22.4

13” 330 1.5 13 ±0.2 20.2 100 mm
12 12.6 18.4

DB2868 - Rev 4 page 13/25

 ST33TPHF20SPI
Delivery packing

Figure 10. Embossed carrier tape for VFQFPN 5 × 5 mm

P0
P2
Y E
T
D

D1

F
W
B0

Y
K0 P A0

Section Y - Y
User direction of feed

1. Drawing is not to scale.

Figure 11. Chip orientation in the embossed carrier tape for VFQFPN 5 × 5 mm

User direction of feed

Table 7. Carrier tape dimensions for VFQFPN 5 × 5 mm

Package A0 B0 K0 D1 Min. P P2 D P0 E F W T Max. Unit

VFQFPN 5×5 5.25 ±0.1 5.25 ±0.1 1.1 ±0.1 1.5 8 ±0.1 2 ±0.1 1.55 ±0.05 4 ±0.1 1.75 ±0.1 5.5 ±0.1 12 ±0.3 0.3 ±0.05 mm

DB2868 - Rev 4 page 14/25

 ST33TPHF20SPI
Delivery packing

Figure 12. Embossed carrier tape for TSSOP28 4.4 mm body width

K Po
T P2
D
Top E
Cover
Tape
Ao
F
W

Bo B1 Bo

Ko P D1

User direction of feed

1. Drawing is not to scale.

Figure 13. Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width

Typical

User direction of feed

Table 8. Carrier tape constant dimensions for TSSOP 4.4 mm body width

Tape size Ao, Bo, Ko (1) D E Po T Max. Unit

16 mm See note. 1.5 +0.1 / −0 1.75 ±0.1 4 ±0.1 0.4 mm

1. Ao, Bo, Ko, are determined by components sizes. The clearance between the component and the cavity
must be within 0.05 mm (Min.) to 0.90 mm (Max.)

DB2868 - Rev 4 page 15/25

 ST33TPHF20SPI
Package marking information

7 Package marking information

The two figures below illustrate the typical markings of the TSSOP28 and the VQFN32 device packages,
respectively.

Figure 14. TSSOP28 device package marking area

A: Marking area
A B: Assembly plant
C: BE sequence
D: Diffusion plant
B C D E F E: Assembly year
F: Assembly week
G: ECOPACK level
H H: ST logo
a G J
J: Marking area - 2 digits
a: Dot

Figure 15. VQFN32 device package marking area

A: Marking area

A B: Assembly plant

C: BE sequence

D: Diffusion plant
B C D
E: Country of origin

F: Assembly year
E F G
G: Assembly week

H: ECOPACK
I
H J I: ST logo

J: Marking area - 2 digits

K
K: Dot

For both packages, the 8-digit ‘A’ marking area is equal to "P68XYZZZ", with:
• X = Hardware product
• Y = Hardware revision
• ZZZ = Firmware revision

DB2868 - Rev 4 page 16/25

 ST33TPHF20SPI
Ordering information

8 Ordering information

Table 9. Ordering information for ST33TPHF20SPI products

Operating Maximum SPI

TPM library revision & Marking area
Ordering code temperature clock Package Product status
firmware version A
range (1) frequency

ST33HTPH2028AHD1 TPM2.0 Rev 1.38 TSSOP28

0x00 0x4A 0x00 0x40 −40 °C to +105 °C 33 MHz P0AHD1 Active
ST33HTPH2032AHD1 VQFN32
(74.64)
ST33HTPH2028AHC9 TPM2.0 Rev 1.38 TSSOP28 NRND (not
0x00 0x4A 0x00 0x10 −40 °C to +105 °C 33 MHz P0AHC9 recommended for new
ST33HTPH2032AHC9 VQFN32 design)
(74.16)
ST33HTPH2028AHC1 TPM2.0 Rev 1.38 TSSOP28 NRND (not
0x00 0x4A 0x00 0x08 −40 °C to +105 °C 33 MHz P0AHC1 recommended for new
ST33HTPH2032AHC1 VQFN32 design)
(74.08)
ST33HTPH2028AAF3 TPM2.0 Rev 1.16 TSSOP28 NRND (not
0x00 0x4A 0x00 0x00 −40 °C to +105 °C 33 MHz P68HAAF3 recommended for new
ST33HTPH2032AAF3 VQFN32 design)
(74.00)

1. Refer to Section 1 Description for the operating voltages associated with the different operating
temperature ranges.

DB2868 - Rev 4 page 17/25

 ST33TPHF20SPI
Firmware image overview

9 Firmware image overview

Table 10. Firmware image overview for the ST33TPHF20SPI products

TPM 2.0 library

Firmware version Firmware version (TPM capability) Product status
revision

74.00 0x00 0x4A 0x00 0x00 1.16 NRND (not recommended for new design)
74.04 0x00 0x4A 0x00 0x04 1.16 NRND (not recommended for new design)
74.08 0x00 0x4A 0x00 0x08 1.38 NRND (not recommended for new design)
74.16 0x00 0x4A 0x00 0x10 1.38 NRND (not recommended for new design)
74.20 0x00 0x4A 0x00 0x14 1.16 Active
74.64 0x00 0x4A 0x00 0x40 1.38 Active

Table 11. Commercial product supporting the update with firmware image version 74.20
xx = 28 for products delivered in TSSOP28, and 32 for products delivered in QFN32 packages.
Commercial products Firmware preloaded in factory TPM2_Clear required before firmware update

74.00
ST33HTPH2ExxAAF3 No
0x00 0x4A 0x00 0x00

Table 12. Commercial product supporting the update with firmware image version 74.64
xx = 28 for products delivered in TSSOP28, and 32 for products delivered in QFN32 packages.
Commercial products Firmware preloaded in factory TPM2_Clear required before firmware update

74.00
ST33HTPH20xxAAF3 Yes
0x00 0x4A 0x00 0x00
74.08
ST33HTPH20xxAHC1 No
0x00 0x4A 0x00 0x08
74.16
ST33HTPH20xxAHC9 No
0x00 0x4A 0x00 0x10

DB2868 - Rev 4 page 18/25

 ST33TPHF20SPI
Support and information

10 Support and information

Additional information regarding ST TPM devices can be obtained from the www.st.com website.
For any specific support information you can contact STMicroelectronics through the following e-mail:
TPMsupport@list.st.com.

DB2868 - Rev 4 page 19/25

 ST33TPHF20SPI
Terms and abbreviations

Appendix A Terms and abbreviations

Table 13. List of abbreviations

Term Meaning

AES Advanced Encryption Standard

CC Common Criteria
DES Data Encryption Standard
DRBG Deterministic random-bit generator
EAL Evaluation assurance level
EC Elliptic curve
ECC Elliptic curve cryptography
ECDAA Elliptic curve direct anonymous attestation
ECDH Elliptic curve Diffie–Hellman
ESD Electrostatic discharge
FIPS Federal Information Processing Standard
FW Firmware
GPI General-purpose input
HBM Human body model
HMAC Keyed-Hashing for message authentication
MPU Memory protection unit
NIST National Institute of Standards and Technology
NRND Not recommended for new design
RNG Random number generator
RSA Rivest Shamir Adelman
SHA Secure Hash algorithm
SPI Serial Peripheral Interface
ST STMicroelectronics
TCG Trusted Computed Group
TIS TPM interface specification
TPM Trusted Platform Module
TRNG True random number generator

DB2868 - Rev 4 page 20/25

 ST33TPHF20SPI

Revision history

Table 14. Document revision history

Date Version Changes

04-Mar-2016 1 Initial release.

Updated TPM features related to certification and updated Section 1.1: Security
certifications.
Updated references in Section 1: Description.
15-Mar-2016 2
Added Figure 38: Chip orientation in the embossed carrier tape for VFQFPN 5 × 5
mm and Figure 40: Chip orientation in the embossed carrier tape for TSSOP28 4.4
mm body width.
Updated Appendix B: Referenced documents. The device is compliant with these
revisions of the TCG documentation.
The device has obtained FIPS 140-2 level 2 certification.
Updated Section 1.1: Security certifications.
Updated TPM 2.0 compliance with Microsoft Windows 8.1 and 10.
06-Feb-2018 3
Updated Section 2: Pin and signal description.
Added Section 3: Integration guidance.
Updated Arm logo and trademark.
Reference modified at bottom of pages.
Small text changes.
Updated document for firmware version 4A.40 (74.64 in decimal):
• Updated Section 1 Description.
• Added Section 2.1 ST33TPHF20SPI products and Section 2.2 Firmware
image.
• Changed GPIO pin to GPI in Section 3 Pin and signal description.
• Updated Figure 3. Typical hardware implementation (TSSOP28 package).
• Added θJC and θJB values to Table 4. Thermal characteristics.
15-Nov-2019 4 • Updated Section 7 Package marking information.
• Added Section 8 Ordering information.
• Added Section 9 Firmware image overview.
Added Section 5.3 Thermal characteristics of packages.
Updated Section Appendix A Terms and abbreviations.
Removed Referenced documents section.
Small text changes.

DB2868 - Rev 4 page 21/25

 ST33TPHF20SPI
Contents

Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Data brief scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2.1 ST33TPHF20SPI products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Firmware image. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3 Pin and signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

4 Integration guidance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 Typical hardware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2 Power supply filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 TSSOP28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 VFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Thermal characteristics of packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6 Delivery packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

7 Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
9 Firmware image overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
10 Support and information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Appendix A Terms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

DB2868 - Rev 4 page 22/25

 ST33TPHF20SPI
List of tables

List of tables
Table 1. Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. TSSOP28 - mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3. VFQFPN32 - mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. Packages on tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Carrier tape dimensions for VFQFPN 5 × 5 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. Carrier tape constant dimensions for TSSOP 4.4 mm body width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 9. Ordering information for ST33TPHF20SPI products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 10. Firmware image overview for the ST33TPHF20SPI products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 11. Commercial product supporting the update with firmware image version 74.20 . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 12. Commercial product supporting the update with firmware image version 74.64 . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 13. List of abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 14. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DB2868 - Rev 4 page 23/25

 ST33TPHF20SPI
List of figures

List of figures
Figure 1. TSSOP28 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. VQFN32 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. Typical hardware implementation (TSSOP28 package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Mandatory filtering capacitors on VPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. TSSOP28 - outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6. TSSOP28 - recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 7. VFQFPN32 - outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 8. VFQFPN32 - recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Reel diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Embossed carrier tape for VFQFPN 5 × 5 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Chip orientation in the embossed carrier tape for VFQFPN 5 × 5 mm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. Embossed carrier tape for TSSOP28 4.4 mm body width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width . . . . . . . . . . . . . . . . . . . . . . 15
Figure 14. TSSOP28 device package marking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 15. VQFN32 device package marking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

DB2868 - Rev 4 page 24/25

 ST33TPHF20SPI

IMPORTANT NOTICE – PLEASE READ CAREFULLY

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