This document is a data sheet for an LED array called the LA16B/DBK-S19-PF made by Ligitek Electronics Co., Ltd. It contains information about the product such as package dimensions, electrical and optical characteristics, and recommended soldering conditions. The LED array emits blue light with a peak wavelength of 470nm and has a viewing angle of 30 degrees. It has an operating temperature range of -20 to 80 degrees Celsius.
This document is a data sheet for an LED array called the LA16B/DBK-S19-PF made by Ligitek Electronics Co., Ltd. It contains information about the product such as package dimensions, electrical and optical characteristics, and recommended soldering conditions. The LED array emits blue light with a peak wavelength of 470nm and has a viewing angle of 30 degrees. It has an operating temperature range of -20 to 80 degrees Celsius.
This document is a data sheet for an LED array called the LA16B/DBK-S19-PF made by Ligitek Electronics Co., Ltd. It contains information about the product such as package dimensions, electrical and optical characteristics, and recommended soldering conditions. The LED array emits blue light with a peak wavelength of 470nm and has a viewing angle of 30 degrees. It has an operating temperature range of -20 to 80 degrees Celsius.
This document is a data sheet for an LED array called the LA16B/DBK-S19-PF made by Ligitek Electronics Co., Ltd. It contains information about the product such as package dimensions, electrical and optical characteristics, and recommended soldering conditions. The LED array emits blue light with a peak wavelength of 470nm and has a viewing angle of 30 degrees. It has an operating temperature range of -20 to 80 degrees Celsius.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA16B/DBK-S19-PF Page 1/5
Package Dimensions
4.6 2.4±0.5 6.5
Ø 3.5
3.0 7.4 5.08
3.5±0.5 □0.5 TYP
2.54TYP 4.75± 0.5
+ -
LDBK2341 3.0
5.0
1.5MAX
25.0MIN
□0.5 TYP 1.0MIN
2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA16B/DBK-S19-PF Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings Parameter Symbol UNIT DBK
Forward Current IF 30 mA Peak Forward Current IFP 100 mA Duty 1/10@10KHz Power Dissipation PD 120 mW
Reverse Current @5V Ir 50 μA
Electrostatic Discharge( * ) ESD 150 V
Operating Temperature Topr -20 ~ +80 ℃
Storage Temperature Tstg -30 ~ +100 ℃
* glove Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
wave halfwidth voltage intensity angle COLOR PART NO MATERIAL length △λ nm @20mA(V) @20mA(mcd) 2 θ 1/2 λD nm (deg) Emitted Lens Typ. Max. Min. Typ.
LA16B/DBK-S19-PF InGaN/GaN Blue Blue Transparent 470 30 3.5 4.0 550 1100 30
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA16B/DBK-S19-PF Page 3/5
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000 3.0 Forward Current(mA)
2.5
Normalize @20mA Relative Intensity 100 2.0
10 1.5
1.0 1 0.5
01 0.0 1.0 2.0 3.0 4.0 5.0 1 10 100 1000
Forward Voltage(V) Forward Current(mA)
Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature
Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA16B/DBK-S19-PF Page 4/5
Soldering Condition(Pb-Free)
1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile
Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp(° C)
260° C3sec Max
260° 5° /sec max
120°
2° /sec 25° max 0° 0 50 100 150 Preheat Time(sec) 60 Seconds Max
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA16B/DBK-S19-PF Page 5/5
Reliability Test:
Reference Test Item Test Condition Description Standard
1.Under Room Temperature This test is conducted for the purpose MIL-STD-750: 1026 Operating Life Test 2.If=20mA of detemining the resistance of a part MIL-STD-883: 1005 3.t=1000 hrs (-24hrs, +72hrs) in electrical and themal stressed. JIS C 7021: B-1
The purpose of this is the resistance of
High Temperature 1.Ta=105 ℃±5 ℃ the device which is laid under condition MIL-STD-883:1008 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) of high temperature for hours. JIS C 7021: B-10
The purpose of this is the resistance
Low Temperature 1.Ta=-40 ℃±5℃ of the device which is laid under Storage Test 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 condition of low temperature for hours.
High Temperature 1.Ta=65 ℃±5℃
The purpose of this test is the resistance MIL-STD-202:103B High Humidity Test 2.RH=90 %~95 % of the device under tropical for hours. JIS C 7021: B-11 3.t=240hrs ±2hrs
1.Ta=105 ℃±5 ℃&-40 ℃±5℃ The purpose of this is the resistance of MIL-STD-202: 107D Thermal Shock Test (10min) (10min) the device to sudden extreme changes MIL-STD-750: 1051 2.total 10 cycles in high and low temperature. MIL-STD-883: 1011
This test intended to determine the
thermal characteristic resistance MIL-STD-202: 210A Solder Resistance 1.T.Sol=260 ℃±5℃ of the device to sudden exposures MIL-STD-750: 2031 Test 2.Dwell time= 10 ±1sec. at extreme changes in temperature JIS C 7021: A-1 when soldering the lead wire.
MIL-STD-202: 208D 1.T.Sol=230 ℃±5℃ This test intended to see soldering well MIL-STD-750: 2026 Solderability Test 2.Dwell time=5 ±1sec performed or not. MIL-STD-883: 2003 JIS C 7021: A-2
