Precision Quad Operational Amplifiers
Precision Quad Operational Amplifiers
Precision Quad Operational Amplifiers
1OUT
4OUT
1IN –
4IN –
Extends Below the Negative Rail (C-Suffix,
NC
I-Suffix Types)
D Low Noise . . . Typically 32 nV/√Hz
3 2 1 20 19
at f = 1 kHz 1IN + 4 18 4IN +
D Low Power . . . Typically 2.1 mW at NC 5 17 NC
TA = 25°C, VDD = 5 V VDD 6 16 GND
D Output Voltage Range Includes Negative NC 7 15 NC
3IN +
2IN + 8 14
Rail 9 10 11 12 13
D High Input Impedance . . . 1012 Ω Typ
2IN –
3IN –
2OUT
NC
3OUT
D ESD-Protection Circuitry
D Small-Outline Package Option Also
Available in Tape and Reel NC – No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
description (continued)
Four offset voltage grades are available (C-suffix and I-suffix types), ranging from the low-cost TLC27M4 (10
mV) to the high-precision TLC27M9 (900 µV). These advantages, in combination with good common-mode
rejection and supply voltage rejection, make these devices a good choice for new state-of-the-art designs as
well as for upgrading existing designs.
In general, many features associated with bipolar technology are available on LinCMOS operational
amplifiers, without the power penalties of bipolar technology. General applications such as transducer
interfacing, analog calculations, amplifier blocks, active filters, and signal buffering are easily designed with the
TLC27M4 and TLC27M9. The devices also exhibit low voltage single-supply operation, and low power
consumption, making them ideally suited for remote and inaccessible battery-powered applications. The
common-mode input voltage range includes the negative rail.
A wide range of packaging options is available, including small-outline and chip-carrier versions for high-density
system applications.
The device inputs and outputs are designed to withstand – 100-mA surge currents without sustaining latch-up.
The TLC27M4 and TLC27M9 incorporate internal ESD-protection circuits that prevent functional failures at
voltages up to 2000 V as tested under MIL-STD-883C, Method 3015; however, care should be exercised in
handling these devices, as exposure to ESD may result in the degradation of the device parametric
performance.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized
for operation from – 40°C to 85°C. The M-suffix devices are characterized for operation over the full military
temperature range of – 55°C to 125°C.
AVAILABLE OPTIONS
PACKAGE
CHIP
VIOmax SMALL CHIP CERAMIC PLASTIC
TA TSSOP FORM
AT 25°C OUTLINE CARRIER DIP DIP
(PW) (Y)
(D) (FK) (J) (N)
900 µV TLC27M9CD — — TLC27M9CN — —
2 mV TLC27M4BCD — — TLC27M4BCN — —
0°C to 70°C
5 mV TLC27M4ACD — — TLC27M4ACN — —
10 mV TLC27M4CD — — TLC27M4CN TLC27M4CPW TLC27M4Y
900 µV TLC27M9ID — — TLC27M9IN — —
2 mV TLC27M4BID — — TLC27M4BIN — —
– 40°C to 85°C
5 mV TLC27M4AID — — TLC27M4AIN — —
10 mV TLC27M4ID — — TLC27M4IN TLC27M41PW —
900 µV TLC27M9MD TLC27M9MFK TLC27M9MJ TLC27M9MN — —
– 55°C to 125°C
10 mV TLC27M4MD TLC27M4MFK TLC27M4MJ TLC27M4MN — —
The D and PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC279CDR).
P3 P4
R6
R1 R2 N5
IN –
P5 P6
P1 P2
IN + C1
R5
OUT
N3
N1 N2 N4 N6 N7
R3 D1 R4 D2 R7
GND
108
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VDD
Input voltage range, VI (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD
Input current, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA
Output current, lO (each output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 mA
Total current into VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 mA
Total current out of GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 mA
Duration of short-circuit current at (or below) 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D, N, or PW package . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: J package . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN –.
3. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded (see application section).
VDD VDD+
– –
VO VO
+ +
VI VI
CL RL CL RL
VDD –
2 kΩ 2 kΩ
VDD VDD+
20 Ω – –
1/2 VDD VO VO
+ +
20 Ω
20 Ω 20 Ω
VDD –
10 kΩ
10 kΩ
VDD+
VDD 100 Ω
VI –
100 Ω
VI
– VO
+
VO
+
1/2 VDD CL
CL
VDD –
V = VIC
8 14
full-power response
Full-power response, the frequency above which the operational amplifier slew rate limits the output voltage
swing, is often specified two ways: full-linear response and full-peak response. The full-linear response is
generally measured by monitoring the distortion level of the output, while increasing the frequency of a
sinusoidal input signal until the maximum frequency is found above which the output contains significant
distortion. The full-peak response is defined as the maximum output frequency, without regard to distortion,
above which full peak-to-peak output swing cannot be maintained.
Because there is no industry-wide accepted value for significant distortion, the full-peak response is specified
in this data sheet and is measured using the circuit of Figure 1. The initial setup involves the use of a sinusoidal
input to determine the maximum peak-to-peak output of the device (the amplitude of the sinusoidal wave is
increased until clipping occurs). The sinusoidal wave is then replaced with a square wave of the same
amplitude. The frequency is then increased until the maximum peak-to-peak output can no longer be maintained
(Figure 5). A square wave is used to allow a more accurate determination of the point at which the maximum
peak-to-peak output is reached.
(a) f = 1 kHz (b) 1 kHz < f < BOM (c) f = BOM (d) f > BOM
test time
Inadequate test time is a frequent problem, especially when testing CMOS devices in a high-volume,
short-test-time environment. Internal capacitances are inherently higher in CMOS than in bipolar and BiFET
devices and require longer test times than their bipolar and BiFET counterparts. The problem becomes more
pronounced with reduced supply levels and lower temperatures.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
VIO Input offset voltage Distribution 6, 7
αVIO Temperature coefficient of input offset voltage Distribution 8, 9
vs High-level output current 10, 11
VOH High level output voltage
High-level vs Supply voltage 12
vs Free-air temperature 13
vs Common-mode input voltage 14, 15
vs Differential input voltage
g 16
VOL Low level output voltage
Low-level
vs Free-air temperature 17
vs Low-level output current 18, 19
vs Su
Supply
ly voltage 20
AVD Differential voltage
g amplification vs Free-air temperature 21
vs Frequency 32, 33
IIB Input bias current vs Free-air temperature 22
IIO Input offset current vs Free-air temperature 22
VIC Common-mode input voltage vs Supply voltage 23
vs Supply
y voltage
g 24
IDD Supply current
vs Free-air temperature 25
vs Supply
y voltage
g 26
SR Slew rate
vs Free-air temperature 27
Normalized slew rate vs Free-air temperature 28
VO(PP) Maximum peak-to-peak output voltage vs Frequency 29
vs Free-air temperature 30
B1 Unity gain bandwidth
Unity-gain
vs Supply voltage 31
Phase shift vs Frequency 32, 33
vs Su
Supply
ly voltage 34
φm Phase margin
g vs Free-air temperature 35
vs Load capacitance 36
Vn Equivalent input noise voltage vs Frequency 37
TYPICAL CHARACTERISTICS
Percentage of Units – %
40 40
30 30
20 20
10 10
0 0
–5 –4 –3 –2 –1 0 1 2 3 4 5 –5 –4 –3 –2 –1 0 1 2 3 4 5
VIO – Input Offset Voltage – mV VIO – Input Offset Voltage – mV
Figure 6 Figure 7
30 30
20 20
10 10
0 0
– 10 – 8 – 6 – 4 – 2 0 2 4 6 8 10 – 10 – 8 – 6 – 4 – 2 0 2 4 6 8 10
αVIO – Temperature Coefficient – µV/°C αVIO – Temperature Coefficient – µV/°C
Figure 8 Figure 9
TYPICAL CHARACTERISTICS†
VDD = 5 V
10
3
VDD = 4 V
8
VDD = 10 V
2 VDD = 3 V
6
4
1
2
0 0
0 –2 –4 –6 –8 – 10 0 – 5 – 10 – 15 – 20 – 25 – 30 – 35 – 40
IOH – High-Level Output Current – mA IOH – High-Level Output Current – mA
Figure 10 Figure 11
TA = 25°C VDD = 5 V
12
VDD – 1.8
10
VDD – 1.9
8
VDD – 2
VDD = 10 V
6
VDD – 2.1
4
VDD – 2.2
2
VDD – 2.3
0
0 2 4 6 8 10 12 14 16 VDD – 2.4
– 75 – 50 – 25 0 25 50 75 100 125
VDD – Supply Voltage – V
TA – Free-Air Temperature – °C
Figure 12 Figure 13
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
550
400
VID = – 100 mV
500 VID = – 100 mV
VID = – 1 V
350
450 VID = – 2.5 V
400
VID = – 1 V 300
350
300 250
0 0.5 1 1.5 2 2.5 3 3.5 4 0 1 2 3 4 5 6 7 8 9 10
VIC – Common-Mode Input Voltage – V VIC – Common-Mode Input Voltage – V
Figure 14 Figure 15
VIC = 0.5 V
TA = 25°C 700
600
600 VDD = 5 V
500
VDD = 5 V 500
400
400
VDD = 10 V
300
300
VDD = 10 V
200 200
100 100
0 0
0 –1 –2 –3 –4 –5 –6 –7 –8 – 9 – 10 – 75 – 50 – 25 0 25 50 75 100 125
VID – Differential Input Voltage – V TA – Free-Air Temperature – °C
Figure 16 Figure 17
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
0.4
1
0.3
0.2
0.5
0.1
0 0
0 1 2 3 4 5 6 7 8 0 5 10 15 20 25 30
IOL – Low-Level Output Current – mA IOL – Low-Level Output Current – mA
Figure 18 Figure 19
LARGE-SIGNAL LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION DIFFERENTIAL VOLTAGE AMPLIFICATION
vs vs
SUPPLY VOLTAGE FREE-AIR TEMPERATURE
500 500
TA = – 55°C
450 RL = 100 kΩ 450 RL = 100 kΩ
– 40°C
VD – Large-Signal Differential
VD – Large-Signal Differential
400 400
Voltage Amplification – V/mV
Voltage Amplification – V/mV
0°C
350 350
25°C VDD = 10 V
300 300
70°C
ÌÌÌÌÌ
250 250
85°C
ÁÁ
200
150
ÌÌÌÌÌÁÁ
TA = 125°C 200
150
ÁÁ ÁÁ
AVD
AVD
VDD = 5 V
A
A
100 100
50 50
0 0
0 2 4 6 8 10 12 14 16 – 75 – 50 – 25 0 25 50 75 100 125
VDD – Supply Voltage – V TA – Free-Air Temperature – °C
Figure 20 Figure 21
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
COMMON-MODE
INPUT BIAS CURRENT AND INPUT OFFSET CURRENT INPUT VOLTAGE POSITIVE LIMIT
vs vs
FREE-AIR TEMPERATURE SUPPLY VOLTAGE
10000 16
I IB and I IO – Input Bias and Offset Currents – pA
VDD = 10 V
TA = 25°C
VIC = 5 V
14
10
6
4
1
2
0.1 0
25 45 65 85 105 125 0 2 4 6 8 10 12 14 16
TA – Free-Air Temperature – °C VDD – Supply Voltage – V
NOTE A: The typical values of input bias current and input offset
current below 5 pA were determined mathematically.
Figure 22 Figure 23
I DD – Supply Current – µ A
700
– 40°C
1000
600
0°C VDD = 10 V
800 500
25°C 400
600 VDD = 5 V
70°C 300
400
TA = 125°C 200
200
100
0 0
0 2 4 6 8 10 12 14 16 – 75 – 50 – 25 0 25 50 75 100 125
VDD – Supply Voltage – V TA – Free-Air Temperature – °C
Figure 24 Figure 25
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
SR – Slew Rate – V/ µs
0.7
SR – Slew Rate – V/ µs
See Figure 1
0.7
0.6 VDD = 10 V
0.6 VIPP = 1 V
0.5
0.5
0.4
0.4 VDD = 5 V
0.3
VIPP = 1 V
VDD = 5 V
VIPP = 2.5 V
0.3 0.2
0 2 4 6 8 10 12 14 16 – 75 – 50 – 25 0 25 50 75 100 125
VDD – Supply Voltage – V TA – Free-Air Temperature – °C
Figure 26 Figure 27
AV = 1
9
1.3 VIPP = 1 V
VDD = 10 V
RL = 100 kΩ 8 VDD = 10 V
1.2 CL = 20 pF TA = 125°C
Normalized Slew Rate
7
VDD = 5 V TA = 25°C
1.1 TA = – 55°C
6
1 5
VDD = 5 V
4
0.9
3
0.8 RL = 100 kΩ
2
See Figure 1
0.7
1
0.6 0
– 75 – 50 – 25 0 25 50 75 100 125 1 10 100 1000
TA – Free-Air Temperature – °C f – Frequency – kHz
Figure 28 Figure 29
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
See Figure 3
See Figure 3 700
700
650
600 600
550
500
500
400
450
300 400
– 75 – 50 – 25 0 25 50 75 100 125 0 2 4 6 8 10 12 14 16
TA – Free-Air Temperature – °C VDD – Supply Voltage – V
Figure 30 Figure 31
ÌÌÌ
105 0°
Voltage Amplification
AVD
104 30°
Phase Shift
103 60°
102 90°
ÁÁ Phase Shift
ÁÁ
AVD
101 120°
A
1 150°
0.1 180°
1 10 100 1k 10 k 100 k 1M
f – Frequency – Hz
Figure 32
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
ÌÌ
VD – Large-Signal Differential
105 0°
ÌÌ
Voltage Amplification
AVD
10 4 30°
Phase Shift
103 60°
ÁÁ
102 90°
ÁÁ
Phase Shift
AVD
101 120°
ÁÁ
A
1 150°
0.1 180°
1 10 100 1k 10 k 100 k 1M
f – Frequency – Hz
Figure 33
46°
φ m – Phase Margin
φ m – Phase Margin
41°
44°
39°
42°
37°
40°
38° 35°
0 2 4 6 8 10 12 14 16 – 75 – 50 – 25 0 25 50 75 100 125
VDD – Supply Voltage – V TA – Free-Air Temperature – °C
Figure 34 Figure 35
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
PHASE MARGIN
vs
CAPACITIVE LOAD
44°
VDD = 5 V
42°
VI = 10 mV
TA = 25°C
40° See Figure 3
38°
φ m – Phase Margin
36°
34°
32°
30°
28°
0 10 20 30 40 50 60 70 80 90 100
CL – Capacitive Load – pF
Figure 36
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
300
VDD = 5 V
Vn – Equivalent Input Noise Voltage – nV/ Hz
RS = 20 Ω
TA = 25°C
250
See Figure 2
200
150
100
50
0
1 10 100 1000
f – Frequency – Hz
Figure 37
APPLICATION INFORMATION
single-supply operation
While the TLC27M4 and TLC27M9 perform well using dual power supplies (also called balanced or split
supplies), the design is optimized for single-supply operation. This design includes an input common-mode
voltage range that encompasses ground as well as an output voltage range that pulls down to ground. The
supply voltage range extends down to 3 V (C-suffix types), thus allowing operation with supply levels commonly
available for TTL and HCMOS; however, for maximum dynamic range, 16-V single-supply operation is
recommended.
Many single-supply applications require that a voltage be applied to one input to establish a reference level that
is above ground. A resistive voltage divider is usually sufficient to establish this reference level (see Figure 38).
The low input bias current of the TLC27M4 and TLC27M9 permits the use of very large resistive values to
implement the voltage divider, thus minimizing power consumption.
The TLC27M4 and TLC27M9 work well in conjunction with digital logic; however, when powering both linear
devices and digital logic from the same power supply, the following precautions are recommended:
1. Power the linear devices from separate bypassed supply lines (see Figure 39); otherwise, the linear
device supply rails can fluctuate due to voltage drops caused by high switching currents in the digital
logic.
2. Use proper bypass techniques to reduce the probability of noise-induced errors. Single capacitive
decoupling is often adequate; however, high-frequency applications may require RC decoupling.
VDD
R4
R1 VREF = VDD R3
R2 R1 + R3
VI –
VO R4 + V
+ VO = (VREF – VI) REF
R2
VREF
R3 C
0.01 µF
APPLICATION INFORMATION
–
Power
Output + Logic Logic Logic Supply
–
Power
Output + Logic Logic Logic Supply
input characteristics
The TLC27M4 and TLC27M9 are specified with a minimum and a maximum input voltage that, if exceeded at
either input, could cause the device to malfunction. Exceeding this specified range is a common problem,
especially in single-supply operation. Note that the lower range limit includes the negative rail, while the upper
range limit is specified at VDD – 1 V at TA = 25°C and at VDD – 1.5 V at all other temperatures.
The use of the polysilicon-gate process and the careful input circuit design gives the TLC27M4 and TLC27M9
very good input offset voltage drift characteristics relative to conventional metal-gate processes. Offset voltage
drift in CMOS devices is highly influenced by threshold voltage shifts caused by polarization of the phosphorus
dopant implanted in the oxide. Placing the phosphorus dopant in a conductor (such as a polysilicon gate)
alleviates the polarization problem, thus reducing threshold voltage shifts by more than an order of magnitude.
The offset voltage drift with time has been calculated to be typically 0.1 µV/month, including the first month of
operation.
Because of the extremely high input impedance and resulting low bias current requirements, the TLC27M4 and
TLC27M9 are well suited for low-level signal processing; however, leakage currents on printed-circuit boards
and sockets can easily exceed bias current requirements and cause a degradation in device performance. It
is good practice to include guard rings around inputs (similar to those of Figure 4 in the Parameter Measurement
Information section). These guards should be driven from a low-impedance source at the same voltage level
as the common-mode input (see Figure 40).
Unused amplifiers should be connected as unity-gain followers to avoid possible oscillation.
noise performance
The noise specifications in operational amplifier circuits are greatly dependent on the current in the first-stage
differential amplifier. The low input bias current requirements of the TLC27M4 and TLC27M9 result in a very
low noise current, which is insignificant in most applications. This feature makes the devices especially
favorable over bipolar devices when using values of circuit impedance greater than 50 kΩ, since bipolar devices
exhibit greater noise currents.
APPLICATION INFORMATION
– – –
VI
VO VO VO
+ +
VI +
VI
output characteristics
The output stage of the TLC27M4 and TLC27M9 is designed to sink and source relatively high amounts of
current (see typical characteristics). If the output is subjected to a short-circuit condition, this high current
capability can cause device damage under certain conditions. Output current capability increases with supply
voltage.
All operating characteristics of the TLC27M4 and TLC27M9 were measured using a 20-pF load. The devices
drive higher capacitive loads; however, as output load capacitance increases, the resulting response pole
occurs at lower frequencies, thereby causing ringing, peaking, or even oscillation (see Figure 41). In many
cases, adding a small amount of resistance in series with the load capacitance alleviates the problem.
2.5 V
–
VO
+
VI
CL TA = 25°C
f = 1 kHz
VIPP = 1 V
– 2.5 V
(d) TEST CIRCUIT
(c) CL = 190 pF, RL = NO LOAD
APPLICATION INFORMATION
VI + IP RP VDD – VO
Rp =
IF + IL + IP
– VO IP = Pullup current required
–
feedback
Operational amplifier circuits nearly always employ feedback, and since feedback is the first prerequisite for
oscillation, some caution is appropriate. Most oscillation problems result from driving capacitive loads
(discussed previously) and ignoring stray input capacitance. A small-value capacitor connected in parallel with
the feedback resistor is an effective remedy (see Figure 43). The value of this capacitor is optimized empirically.
latch-up
Because CMOS devices are susceptible to latch-up due to their inherent parasitic thyristors, the TLC27M4 and
TLC27M9 inputs and outputs were designed to withstand – 100-mA surge currents without sustaining latch-up;
however, techniques should be used to reduce the chance of latch-up whenever possible. Internal protection
diodes should not, by design, be forward biased. Applied input and output voltage should not exceed the supply
voltage by more than 300 mV. Care should be exercised when using capacitive coupling on pulse generators.
Supply transients should be shunted by the use of decoupling capacitors (0.1 µF typical) located across the
supply rails as close to the device as possible.
APPLICATION INFORMATION
latch-up (continued)
The current path established if latch-up occurs is usually between the positive supply rail and ground; it can be
triggered by surges on the supply lines and/or voltages on either the output or inputs that exceed the supply
voltage. Once latch-up occurs, the current flow is limited only by the impedance of the power supply and the
forward resistance of the parasitic thyristor and usually results in the destruction of the device. The chance of
latch-up occurring increases with increasing temperature and supply voltages.
1N4148
470 kΩ
100 kΩ
5V
1/4
TLC27M4
–
47 kΩ VO
100 kΩ +
R2
68 kΩ
1 µF 100 kΩ
C2
R1 C1 2.2 nF
68 kΩ 2.2 nF
NOTE: VOPP ≈ 2 V
1
fO =
2π √R1R2C1C2
IS
5V
1/4
VI + TLC27M9
– 2N3821
NOTE: VI = 0 V to 3 V
V
IS = I
R
APPLICATION INFORMATION
5V
Gain Control
1 MΩ
(see Note A)
1 µF 100 kΩ
+
–
10 kΩ +
0.1 µF
+ + 1 µF
1/4
1 kΩ TLC27M4 100 kΩ
100 kΩ
10 MΩ
VDD
–
1 kΩ 1/4
TLC27M4
–
+
1/4 VO
TLC27M4 +
VREF
15 nF
100 kΩ
150 pF
NOTE: VDD = 4 V to 15 V
VREF = 0 V to VDD – 2 V
APPLICATION INFORMATION
1 MΩ
VDD
33 pF
–
VO
+ 1/4
TLC27M4
1N4148
100 kΩ
100 kΩ
NOTE: VDD = 8 V to 16 V
VO = 5 V, 10 mA
5V
1 MΩ
0.01 µF
VI + 0.22 µF
VO
– 1/4
TLC27M4
1 MΩ
100 kΩ
100 kΩ
10 kΩ
0.1 µF
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.