CPC3980

N-Channel Depletion-Mode
INTEGRATED CIRCUITS DIVISION Vertical DMOS FET

BVDSX/ RDS(on) IDSS (min) Package Description

BVDGX (max) The CPC3980 is an 800V, N-channel,
800V 45 100mA SOT-223 depletion-mode, Field Effect Transistor (FET) created
using IXYS Integrated Circuits Division’s proprietary
vertical DMOS process. Yielding a robust device with
Features high input impedance, this process enables world
• High Breakdown Voltage: 800V class, high voltage MOSFET performance with an
• Low On-Resistance: 45 max. at 25ºC economical silicon gate architecture.
• Low VGS(off) Voltage: -1.4 to -3.1V
• High Input Impedance As with all MOS devices, the FET structure prevents
• Small Package Size: SOT-223 thermal runaway and thermal-induced secondary
breakdown, which makes the CPC3980 ideal for use
in high-power applications.
Applications
• Normally-On Switches The CPC3980 is a highly reliable FET device that
• Solid State Relays has been used extensively in IXYS Integrated Circuits
• Converters Division’s Solid State Relays for industrial and
• Telecommunications telecommunications applications.
• Power Supply
• Current Regulators The CPC3980 is available in the SOT-223 package.

Ordering Information
Part # Description
CPC3980ZTR SOT-223: Tape and Reel (1000/Reel)

Package Pinout
Circuit Symbol
D

4 D

1 2 3
G

G D S
S

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INTEGRATED CIRCUITS DIVISION CPC3980

Absolute Maximum Ratings @ 25ºC

Parameter Ratings Units Absolute Maximum Ratings are stress ratings. Stresses in
Drain-to-Source Voltage 800 V excess of these ratings can cause permanent damage to the
Gate-to-Source Voltage ±15 V device. Functional operation of the device at conditions beyond
Pulsed Drain Current 150 mA those indicated in the operational sections of this data sheet is
Total Package Dissipation 1 1.8 W not implied.
Operational Temperature -55 to +125 ºC
Junction Temperature, Maximum +125 ºC
Storage Temperature -55 to +125 ºC

1 Mounted on 1"x1" 2 oz. Copper FR4 board.

Electrical Characteristics @ 25ºC (Unless Otherwise Noted)

Parameter Symbol Conditions Min Typ Max Units
Drain-to-Source Breakdown Voltage BVDSX VGS= -5.5V, ID=100µA 800 - - V
Gate-to-Source Off Voltage VGS(off) VDS= 15V, ID=1A -1.4 - -3.1 V
Change in VGS(off) with Temperature dVGS(off) /dT VDS= 15V, ID=1A - - 4.5 mV/ºC
Gate Body Leakage Current IGSS VGS=±15V, VDS=0V - - 100 nA
Drain-to-Source Leakage Current ID(off) VGS= -5.5V, VDS=800V - - 1 µA
Saturated Drain-to-Source Current IDSS VGS= 0V, VDS=15V 100 - - mA
Static Drain-to-Source On-State Resistance RDS(on) - - 45 
VGS= 0V, ID=100mA, VDS=10V
Change in RDS(on) with Temperature dRDS(on) /dT - - 2.5 %/ºC

Forward Transconductance Gfs ID= 50mA, VDS = 10V 100 - - m
Input Capacitance CISS VGS= -3.5V 115
Common Source Output Capacitance COSS VDS= 25V - 5 - pF
Reverse Transfer Capacitance CRSS f= 1MHz 3
Source-Drain Diode Voltage Drop VSD VGS= -5V, ISD=150mA - 0.72 1 V
Thermal Resistance
Junction to Ambient JA - - 55 -
ºC/W
Junction to Case JC - - 23 -

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INTEGRATED CIRCUITS DIVISION CPC3980

PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

Threshold Voltage vs. Temperature On-Resistance vs. Temperature Power Dissipation

(ID=1PA, VDS=10V) (ID=100mA, VGS=5V) vs. Ambient Temperature
-1.6 70 2.0

Power Dissipation (W)

-1.7 60

On-Resistance (:)
1.5
VTHRESHOLD (V)

-1.8 50
1.0
-1.9 40

0.5
-2.0 30

-2.1 20 0.0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 0 20 40 60 80 100 120 140
Temperature (ºC) Temperature (ºC) Temperature (ºC)

Forward Safe Operating Bias Capacitance vs. Drain-Source Voltage

(VGS=0, DC Load) (VGS=3.5V) Output Characteristics
1 1000 100
VGS= -1
Limited by device RDS(on) 80

Drain Current (mA)

Capacitance (pF)
Current (A)

0.1 100
CISS 60
CRSS VGS= -1.2
COSS
40
0.01 10
VGS= -1.4
Limited by device channel saturation 20
VGS= -1.6
0.001 1 0
0.1 1 10 100 1000 0 5 10 15 20 25 30 0 2 4 6 8 10
Voltage (V) VDS (V) VDS (V)

On-Resistance vs. Drain Current Input Admittance Transconductance vs. Drain Current
(VGS=0V) (VDS=10V) (VDS=10V)
40 120 300
-40ºC
25ºC
100 85ºC 250
55ºC
On-Resistance (:)

35 55ºC 85ºC
80 25ºC 200
gm (mS)
ID (mA)

-40ºC
30 60 150

40 100
25
20 50

20 0 0
0 20 40 60 80 100 -2.5 -2.0 -1.5 -1.0 -0.5 0 20 40 60 80 100
ID (mA) VGS (V) ID (mA)

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.

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 INTEGRATED CIRCUITS DIVISION CPC3980

Manufacturing Information
Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Rating

CPC3980Z MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.

Device Maximum Temperature x Time

CPC3980Z 260ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.

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INTEGRATED CIRCUITS DIVISION CPC3980

Mechanical Dimensions
CPC3980Z
2.90 / 3.10 0.229 / 0.330 PCB Land Pattern
(0.114 / 0.122) (0.009 / 0.013)
1.90
(0.075)

3.30 / 3.71 6.705 / 7.290 3.20

1.499 / 1.981 (0.126)
(0.130 / 0.146) (0.264 / 0.287) (0.059 / 0.078) 6.10
(0.24)

Pin 1
1.90
0.610 / 0.787 (0.075)
(0.024 / 0.031) 0.914 MIN
(0.036 MIN)
2.286 0.90
(0.090) (0.035)
6.30 / 6.71
(0.248 / 0.264)
0.020 / 0.102
(0.0008 / 0.004) 1.549 / 1.803
(0.061 / 0.071)
2.286 Dimensions
0.864 / 1.067 (0.090)
(0.034 / 0.042) 4.597 mm MIN / mm MAX
(0.181) (inches MIN / inches MAX)

CPC3980ZTR Tape & Reel

177.8 Dia 2.00 ± 0.05
5.50 ± 0.05
(7.00 Dia) (0.079 ± 0.002) 1.75 ± 0.1
(0.217 ± 0.002)
4.00 ± 0.1 (0.069 ± 0.004)
(0.157 ± 0.004)
Top Cover
Tape Thickness
0.102 Max W=12.08 ± 0.2
(0.004 Max) (0.476 ± 0.008)
B0=7.42 ± 0.1
(0.292 ± 0.004)

K0=1.88 ± 0.1
(0.074 ± 0.004)
A0=6.83 ± 0.1
(0.269 ± 0.004)
Embossed
Carrier P=8.03 ± 0.1
(0.316 ± 0.004) Dimensions
mm
Embossment (inches)

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC3980-R02
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5 4/10/2015
Mouser Electronics

Authorized Distributor

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