PRODUCT DATA SHEET

NC-SMQ81
Solder Paste
Introduction
NC-SMQ81 is an air reflow, halide-free, no-clean solder paste designed for assembly processes using the eutectic SnBi and
SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature
of NC-SMQ81, in combination with the SnBi alloy, can be especially useful as a low-temperature, Pb-free solution. In addition,
NC-SMQ81 meets J-STD-004 and -005 test criteria.

Features Packaging
• Designed for use with SnBi and SnBiAg alloys Standard packaging of NC-SMQ81 is 4oz jars, and 6 and 12oz
• Low-temperature Pb-free solution cartridges. For dispensing applications, 10 and 30cc syringes
• No-clean residue are standard. Other packaging options may be available upon
request.
• Exceptional wetting in air reflow
• Halide-free Storage and Handling Procedures
Refrigerated storage will prolong the shelf life of solder paste.
Alloys The shelf life of NC-SMQ81 is 6 months at storage temperatures
<5°C. Storage temperatures should not exceed 25°C. When
Indium Corporation manufactures low-oxide spherical powder storing solder paste contained in syringes and cartridges, they
composed of the 58Bi/42Sn eutectic alloy in the industry standard should be stored tip down.
Type 3 mesh size. Other non-standard mesh sizes are available
upon request. The weight ratio of the flux vehicle to the solder Solder paste should be allowed to reach ambient working
powder is referred to as the metal load and is typically in the temperature prior to use. Generally, paste should be removed
range of 83–92% for standard alloy compositions. from refrigeration at least 2 hours before use. Actual time to
reach thermal equilibrium will vary with container size. Paste
Standard Product Specifications temperature should be verified before use. Jars and cartridges
should be labeled with date and time of opening.
Metal Load Mesh Particle
Alloy
Printing Dispensing Size Size
Technical Support
Indalloy 281
®
Indium Corporation’s internationally experienced engineers
(58Bi/42Sn) Type 3 25–45μm provide in-depth technical assistance to our customers.
89% 84%
Indalloy ® 282 -325/+500 0.001–0.0018" Thoroughly knowledgeable in all facets of Materials Science
(57Bi/42Sn/1Ag) as it applies to the electronics and semiconductor sectors,
Technical Support Engineers provide expert advice in solder
properties, alloy compatibility and selection of
Bellcore and J-STD Tests and Results solder preforms, wire, ribbon, and paste. Indium
Corporation’s Technical Support Engineers
Test Result Test Result provide rapid response to all technical inquiries.
J-STD-004 (IPC-TM-650) J-STD-005 (IPC-TM-650)
Flux Type Classification ROL0 Typical Solder Paste Viscosity Safety Data Sheets
(Indalloy ® 281, 89%, -325/+500) 900kcps
Flux-Induced Corrosion
Pass Brookfield (5rpm)
The SDS for this product can be found online at
(Copper Mirror) http://www.indium.com/sds
Typical Thixotropic Index; SSF
Presence of Halide -0.6
(ICA Test)
– Silver Chromate Pass
– Fluoride Spot Test Pass Slump Test Pass
Post-Reflow Flux Residue Solder Ball Test Pass
56%
(ICA Test)
Typical Tackiness 37g
Corrosion Pass
Wetting Test Pass
SIR Pass All information is for reference only.
Acid Value 116 Not to be used as incoming product specifications.

Form No. 97721 R9

PRODUCT DATA SHEET
NC-SMQ81 Solder Paste
Printing Reflow
Stencil Design: Recommended Profile:
Electroformed and laser cut/electropolished stencils produce
the best printing characteristics among stencil types. Stencil
aperture design is a crucial step in optimizing the print process.
The following are a few general recommendations:

• Discrete components—A 10–20% reduction in stencil

aperture area may significantly reduce or eliminate the
occurrence of mid-chip solder beads. The “home plate”
design is a common method for achieving this reduction.

• Fine-pitch components—A surface area reduction is

recommended for apertures of 20mil pitch and finer. This
reduction will help minimize solder balling and bridging
that can lead to electrical shorts. The amount of reduction
necessary is process-dependent (5–15% is common).

• A minimum aspect ratio of 1:5 is suggested for adequate This profile is designed for use with Indalloy #281 and can
release of solder paste from stencil apertures. The aspect serve as a general guideline in establishing a reflow profile
ratio is defined as the width of the aperture divided by the for use with other alloys. Adjustments to this profile may be
thickness of the stencil. necessary based on specific process requirements.

Printer Operation Heating Stage:

The following are general recommendations for stencil printer
A linear ramp rate of 0.5 –1.0°C/second allows gradual
optimization. Adjustments may be necessary based on specific
evaporation of volatile flux constituents and prevents defects
process requirements:
such as solder balling/beading and bridging as a result of hot
Solder Paste Bead Size 20–25mm in diameter slump. It also prevents unnecessary depletion of fluxing capacity
Print Speed 12.5–50mm/second
when using higher temperature alloys.
Squeegee Pressure 0.018–0.027kg/mm of blade length Liquidus Stage:
Underside Stencil Wipe Once every 10–25 prints A peak temperature of 25–45°C (175°C shown) above the melting
Solder Paste Stencil Life >8 hours (at 30–60% RH and 22–28°C) point of the solder alloy is needed to form a quality solder joint
and achieve acceptable wetting due to the formation of an
Cleaning intermetallic layer.
NC-SMQ81 is designed for no-clean applications; however, Cooling Stage:
the flux can be removed, if necessary, by using a commercially
A rapid cool down of <4°C/second is desired to form a fine-grain
available flux residue remover.
structure in the solder joint. Slow cooling will form a large-grain
Stencil Cleaning: This is best performed using an automated structure, which typically exhibits poor fatigue resistance. If
stencil cleaning system for both stencil and misprint cleaning excessive cooling (>4°C/second) is used, both the components
to prevent extraneous solder balls. Most commercially available and the solder joint can be stressed due to a high CTE mismatch.
stencil cleaning formulations, including isopropyl alcohol (IPA),
work well.

Compatible Products
• Rework Flux: TACFlux ® 021

This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance
of the products described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices.
All Indium Corporation’s products and solutions are designed to be commercially available unless specifically stated otherwise.
All of Indium Corporation’s solder paste and preform manufacturing facilities are IATF 16949:2016 certified. Indium Corporation is an ISO 9001:2015 registered company.

Contact our engineers: askus@indium.com

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