LAN8740A
LAN8740A
LAN8740A
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site: http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.
10/100 MII/
LAN8740A/
RMII MDI
Ethernet Transformer RJ45
LAN8740Ai
MAC
Mode LED
Crystal or
Clock
Oscillator
MODE[0:2]
Mode Control HP Auto-MDIX
Auto- 100M TX 100M TXP/TXN
nRST Negotiation Logic Transmitter
Reset Control
RXP/RXN
RMIISEL Transmitter
TXD[0:3] 10M TX 10M
SMI Management
Logic Transmitter MDIX
TXEN Control
Control
TXER
XTAL1/CLKIN
TXCLK
PLL XTAL2
RXD[0:3]
RMII/MII Logic
VDD1A
RBIAS
RXDV
TXD3
RXN
RXP
TXN
TXP
32
31
30
29
28
27
26
25
VDD2A 1 24 TXD2
LED2/nINT/nPME/nINTSEL 2 23 TXD1
LED1/nINT/nPME/REGOFF 3 22 TXD0
XTAL2 4
LAN8740A/ 21 TXEN
LAN8740Ai
XTAL1/CLKIN 5 20 TXCLK
VDDCR 6 19 nRST
RXCLK/PHYAD1 7 18 nINT/TXER/TXD4
RXD3/PHYAD2 8 17 MDC
10
11
12
13
14
15
16
9
CRS
VDDIO
MDIO
RXD2/nPME/RMIISEL
RXD1/MODE1
RXD0/MODE0
COL/CRS_DV/MODE2
RXER/RXD4/PHYAD0
Note: When a lower case “n” is used at the beginning of the signal name, it indicates that the signal is active low.
For example, nRST indicates that the reset signal is active low.
Note: The buffer type for each signal is indicated in the BUFFER TYPE column. A description of the buffer types
is provided in Section 2.2.
1 +3.3 V Channel VDD2A P +3.3 V Analog Port Power to Channel 2 and the
2 Analog Port internal regulator.
Power
Refer to the LAN8740A/LAN8740Ai reference
schematic for connection information.
Note: The digital signals are not 5 V tolerant. Refer to Section 5.1, "Absolute Maximum Ratings*" for additional
buffer information.
Note: Sink and source capabilities are dependent on the VDDIO voltage. Refer to Section 5.1, "Absolute Maxi-
mum Ratings*" for additional information.
3.1 Transceiver
3.1.1 100BASE-TX TRANSMIT
The 100BASE-TX transmit data path is shown in Figure 3-1. Each major block is explained in the following subsections.
TX_CLK
(for MII only) PLL
NRZI MLT-3 Tx
125 Mbps Serial NRZI MLT-3
Converter Converter Driver
RX_CLK
(for MII only)
PLL
DSP: Timing
NRZI NRZI MLT-3 MLT-3
recovery, Equalizer
Converter Converter
and BLW Correction
6 bit Data
3.1.2.2 Equalizer, Baseline Wander Correction and Clock and Data Recovery
The 6 bits from the ADC are fed into the DSP block. The equalizer in the DSP section compensates for phase and ampli-
tude distortion caused by the physical channel consisting of magnetics, connectors, and CAT- 5 cable. The equalizer
can restore the signal for any good-quality CAT-5 cable between 1 m and 100 m.
If the DC content of the signal is such that the low-frequency components fall below the low frequency pole of the iso-
lation transformer, then the droop characteristics of the transformer will become significant and Baseline Wander (BLW)
on the received signal will result. To prevent corruption of the received data, the transceiver corrects for BLW and can
receive the ANSI X3.263-1995 FDDI TP-PMD defined “killer packet” with no bit errors.
The 100M PLL generates multiple phases of the 125 MHz clock. A multiplexer, controlled by the timing unit of the DSP,
selects the optimum phase for sampling the data. This is used as the received recovered clock. This clock is used to
extract the serial data from the received signal.
3.1.2.4 Descrambling
The descrambler performs an inverse function to the scrambler in the transmitter and also performs the Serial In Parallel
Out (SIPO) conversion of the data.
During reception of IDLE (/I/) symbols. the descrambler synchronizes its descrambler key to the incoming stream. Once
synchronization is achieved, the descrambler locks on this key and is able to descramble incoming data.
Special logic in the descrambler ensures synchronization with the remote transceiver by searching for IDLE symbols
within a window of 4000 bytes (40 µs). This window ensures that a maximum packet size of 1514 bytes, allowed by the
IEEE 802.3 standard, can be received with no interference. If no IDLE-symbols are detected within this time-period,
receive operation is aborted and the descrambler re-starts the synchronization process.
3.1.2.5 Alignment
The de-scrambled signal is then aligned into 5-bit code-groups by recognizing the /J/K/ Start-of-Stream Delimiter (SSD)
pair at the start of a packet. Once the code-word alignment is determined, it is stored and utilized until the next start of
frame.
FIGURE 3-3: RELATIONSHIP BETWEEN RECEIVED DATA AND SPECIFIC MII SIGNALS
RX_CLK
RX_DV
3.2 Auto-Negotiation
The purpose of the auto-negotiation function is to automatically configure the transceiver to the optimum link parameters
based on the capabilities of its link partner. Auto-negotiation is a mechanism for exchanging configuration information
between two link-partners and automatically selecting the highest performance mode of operation supported by both
sides. Auto-negotiation is fully defined in clause 28 of the IEEE 802.3 specification.
Once auto-negotiation has completed, information about the resolved link can be passed back to the controller via the
Serial Management Interface (SMI). The results of the negotiation process are reflected in the Speed Indication bits of
the PHY Special Control/Status Register, as well as in the Auto Negotiation Link Partner Ability Register. The auto-nego-
tiation protocol is a purely physical layer activity and proceeds independently of the MAC controller.
The advertised capabilities of the transceiver are stored in the Auto Negotiation Advertisement Register. The default
advertised by the transceiver is determined by user-defined on-chip signal options.
The following blocks are activated during an auto-negotiation session:
• Auto-negotiation (digital)
• 100M ADC (analog)
• 100M PLL (analog)
• 100M equalizer/BLW/clock recovery (DSP)
• 10M SQUELCH (analog)
• 10M PLL (analog)
• 10M Transmitter (analog)
When enabled, auto-negotiation is started by the occurrence of one of the following events:
• Hardware reset
• Software reset
• Power-down reset
• Link status down
• Setting the Restart Auto-Negotiate bit of the Basic Control Register
On detection of one of these events, the transceiver begins auto-negotiation by transmitting bursts of Fast Link Pulses
(FLP), which are bursts of link pulses from the 10M transmitter. They are shaped as Normal Link Pulses and can pass
uncorrupted down CAT-3 or CAT-5 cable. A Fast Link Pulse Burst consists of up to 33 pulses. The 17 odd-numbered
pulses, which are always present, frame the FLP burst. The 16 even-numbered pulses, which may be present or absent,
contain the data word being transmitted. Presence of a data pulse represents a “1”, while absence represents a “0”.
The data transmitted by an FLP burst is known as a “Link Code Word.” These are defined fully in IEEE 802.3 clause 28.
In summary, the transceiver advertises 802.3 compliance in its selector field (the first 5 bits of the Link Code Word). It
advertises its technology ability according to the bits set in the Auto Negotiation Advertisement Register.
3.4.1 MII
The MII includes 16 interface signals:
• Transmit data - TXD[3:0]
• Transmit strobe - TXEN
• Transmit clock - TXCLK
• Transmit error - TXER/TXD4
• Receive data - RXD[3:0]
• Receive strobe - RXDV
• Receive clock - RXCLK
• Receive error - RXER/RXD4/PHYAD0
• Collision indication - COL
• Carrier sense - CRS
In MII mode, on the transmit path, the transceiver drives the transmit clock, TXCLK, to the controller. The controller syn-
chronizes the transmit data to the rising edge of TXCLK. The controller drives TXEN high to indicate valid transmit data.
The controller drives TXER high when a transmit error is detected.
On the receive path, the transceiver drives both the receive data, RXD[3:0], and the RXCLK signal. The controller clocks
in the receive data on the rising edge of RXCLK when the transceiver drives RXDV high. The transceiver drives RXER
high when a receive error is detected.
3.4.2 RMII
The device supports the low pin count Reduced Media Independent Interface (RMII) intended for use between Ethernet
transceivers and switch ASICs. Under IEEE 802.3, an MII comprised of 16 pins for data and control is defined. In devices
incorporating many MACs or transceiver interfaces such as switches, the number of pins can add significant cost as the
port counts increase. RMII reduces this pin count while retaining a management interface (MDIO/MDC) that is identical
to MII.
The RMII interface has the following characteristics:
• It is capable of supporting 10 Mbps and 100 Mbps data rates
• A single clock reference is used for both transmit and receive
• It provides independent 2-bit (di-bit) wide transmit and receive data paths
• It uses LVCMOS signal levels, compatible with common digital CMOS ASIC processes
The RMII includes the following interface signals (1 optional):
• Transmit data - TXD[1:0]
• Transmit strobe - TXEN
• Receive data - RXD[1:0]
• Receive error - RXER (Optional)
• Carrier sense - CRS_DV
• Reference Clock - (RMII references usually define this signal as REF_CLK)
Note 1: The RXER signal is optional on the RMII bus. This signal is required by the transceiver, but it is optional for
the MAC. The MAC can choose to ignore or not use this signal.
2: In RMII mode, this pin needs to be tied to VSS.
Read Cycle
MDC ...
MDIO 32 1's 0 1 1 0 A4 A3 A2 A1 A0 R4 R3 R2 R1 R0 D15 D14 ... D1 D0
Start of OP Turn
Preamble PHY Address Register Address Data
Frame Code Around
Write Cycle
MDC ...
MDIO 32 1's 0 1 0 1 A4 A3 A2 A1 A0 R4 R3 R2 R1 R0 D15 D14 ... D1 D0
Start of OP Turn
Preamble PHY Address Register Address Data
Frame Code Around
Data To Phy
Note: In addition to the main interrupts described in this section, an nPME pin is provided exclusively for WoL
specific interrupts. Refer to Section 3.8.4, "Wake on LAN (WoL)" for additional information on nPME.
Note: Due to the multiplexing of nINT and TXER on the same pin, when EEE and WoL are both enabled, nINT
and/or nPME must be multiplexed on LED1 and/or LED2. Refer to Section 3.8.1, "LEDs" and Section 3.8.4,
"Wake on LAN (WoL)" for additional information.
Note: The ENERGYON bit in the Mode Control/Status Register is defaulted to a ‘1’ at the start of the signal acqui-
sition process, therefore the INT7 bit in the Interrupt Mask Register will also read as a ‘1’ at power-up. If no
signal is present, then both ENERGYON and INT7 will clear within a few milliseconds.
Note: When externally pulling configuration straps high, the strap should be tied to VDDIO, except for REGOFF
and nINTSEL which should be tied to VDD2A.
[13,12,10,8] [8,7,6,5]
000 10BASE-T Half Duplex. Auto-negotiation disabled. 0000 N/A
001 10BASE-T Full Duplex. Auto-negotiation disabled. 0001 N/A
010 100BASE-TX Half Duplex. Auto-negotiation disabled. 1000 N/A
CRS is active during Transmit & Receive.
011 100BASE-TX Full Duplex. Auto-negotiation disabled. 1001 N/A
CRS is active during Receive.
100 100BASE-TX Half Duplex is advertised. Auto-negoti- 1100 0100
ation enabled.
CRS is active during Transmit & Receive.
101 Repeater mode. Auto-negotiation enabled. 1100 0100
100BASE-TX Half Duplex is advertised.
CRS is active during Receive.
110 Power-Down mode. In this mode the transceiver will N/A N/A
wake-up in Power-Down mode. The transceiver can-
not be used when the MODE[2:0] bits are set to this
mode. To exit this mode, the MODE bits in Register
18.7:5 (see Section 4.2.14, "Special Modes Register")
must be configured to some other value and a soft
reset must be issued.
111 All capable. Auto-negotiation enabled. X10X 1111
The MODE[2:0] hardware configuration pins are multiplexed with other signals as shown in Table 3-7.
TABLE 3-7: PIN NAMES FOR MODE BITS
Note: Due to the multiplexing of nINT and TXER on the same pin, when EEE and WoL are both enabled, nINT
and/or nPME must be multiplexed on LED1 and/or LED2. Refer to Section 3.6, "Interrupt Management"
and Section 3.8.4, "Wake on LAN (WoL)" for additional information.
Note: Because the nINTSEL configuration strap shares functionality with the LED2 pin, proper consideration
must also be given to the LED polarity. Refer to Section 3.8.1.6, "nINTSEL and LED2 Polarity Selection"
for additional information on the relation between nINTSEL and the LED2 polarity.
Note: Due to the multiplexing of nINT and TXER on the same pin, when EEE and WoL are both enabled, nINT
and/or nPME must be multiplexed on LED1 and/or LED2. Refer to Section 3.6, "Interrupt Management"
and Section 3.8.4, "Wake on LAN (WoL)" for additional information.
nRST
Link Activity nINT/nPME Link Activity
LED1/nINT/
nPME/REGOFF
nRST
Link Activity nINT/nPME
LED1/nINT/
nPME/REGOFF
nRST
Link Speed/
Link Speed/ nINT/nPME Link Activity
Link Activity
LED2/nINT/
nPME/nINTSEL
nRST
Link Speed nINT/nPME
LED2/nINT/
nPME/nINTSEL
10K
~270 ~270
LED1/REGOFF
Note: Refer to Section 3.7.4, "REGOFF: Internal +1.2 V Regulator Configuration" for additional information on
the REGOFF configuration strap.
nINTSEL = 1 nINTSEL = 0
LED output = Active Low LED output = Active High
VDD2A
LED2/nINTSEL
10K
~270 ~270
LED2/nINTSEL
Note: Refer to Section 3.7.5, "nINTSEL: nINT/TXER/TXD4 Configuration" for additional information on the nINT-
SEL configuration strap.
Note: Due to the multiplexing of nINT and TXER on the same pin, when EEE and WoL are both enabled, nINT
and/or nPME must be multiplexed on LED1 and/or LED2.
The Wakeup Control and Status Register (WUCSR) also provides a WoL Configured bit, which may be set by software
after all WoL registers are configured. Because all WoL related registers are not affected by software resets, software
can poll the WoL Configured bit to ensure all WoL registers are fully configured. This allows the software to skip repro-
gramming of the WoL registers after reboot due to a WoL event.
The following subsections detail each type of WoL event. For additional information on the main system interrupts, refer
to Section 3.6, "Interrupt Management".
Address Frame
Any MCAST BCAST
Filter Enabled Frame Type CRC Matches Match Address
Enabled Enabled
Enabled Matches
Yes Unicast Yes No X X X
Yes Unicast Yes Yes X X Yes
Yes Multicast Yes X Yes X X
Yes Multicast Yes Yes No X Yes
Yes Broadcast Yes X X Yes X
Calculate:
F0 = CRC[15] ^ Data[0]
F1 = CRC[14] ^ F0 ^ Data[1]
F2 = CRC[13] ^ F1 ^ Data[2]
F3 = CRC[12] ^ F2 ^ Data[3]
F4 = CRC[11] ^ F3 ^ Data[4]
F5 = CRC[10] ^ F4 ^ Data[5]
F6 = CRC[09] ^ F5 ^ Data[6]
F7 = CRC[08] ^ F6 ^ Data[7]
Note: Due to the multiplexing of nINT and TXER on the same pin, when EEE and WoL are both enabled, nINT
and/or nPME must be multiplexed on LED1 and/or LED2. Refer to Section 3.8.1, "LEDs" and Section 3.8.4,
"Wake on LAN (WoL)" for additional information.
3.8.7 RESETS
The device provides two forms of reset: hardware and software. The device registers are reset by both hardware and
software resets. Select register bits, indicated as “NASR” in the register definitions, are not cleared by a software reset.
The registers are not reset by the power-down modes described in Section 3.8.3.
Note: For the first 16 µs after coming out of reset, the MII/RMII interface will run at 2.5 MHz. After this time, it will
switch to 25 MHz if auto-negotiation is enabled.
Start
Enable TDR
NO
Reg 25.8 == 0
YES
Reg 25.8 == 1
Save:
TDR Channel Type (Reg 25.10:9)
TDR Channel Length (Reg 25.7:0)
Repeat Testing
in MDIX Mode
YES
Done
Since the TDR relies on the reflected signal of an improperly terminated cable, there are several factors that can affect
the accuracy of the physical length estimate. These include:
1. Cable Type (CAT 5, CAT5e, CAT6): The electrical length of each cable type is slightly different due to the twists-
per-meter of the internal signal pairs and differences in signal propagation speeds. If the cable type is known, the
length estimate can be calculated more accurately by using the propagation constant appropriate for the cable
type (see Table 3-9). In many real-world applications the cable type is unknown, or may be a mix of different cable
types and lengths. In this case, use the propagation constant for the “unknown” cable type.
2. TX and RX Pair: For each cable type, the EIA standards specify different twist rates (twists-per-meter) for each
signal pair within the Ethernet cable. This results in different measurements for the RX and TX pair.
3. Actual Cable Length: The difference between the estimated cable length and actual cable length grows as the
physical cable length increases, with the most accurate results at less than approximately 100 m.
4. Open/Short Case: The Open and Shorted cases will return different TDR Channel Length values (electrical
lengths) for the same physical distance to the fault. Compensation for this is achieved by using different propa-
gation constants to calculate the physical length of the cable.
For the Open case, the estimated distance to the fault can be calculated as follows:
Distance to Open fault in meters TDR Channel Length * POPEN
Where: POPEN is the propagation constant selected from Table 3-9.
For the Shorted case, the estimated distance to the fault can be calculated as follows:
Distance to Open fault in meters TDR Channel Length * PSHORT
Where: PSHORT is the propagation constant selected from Table 3-9.
TABLE 3-9: TDR PROPAGATION CONSTANTS
TABLE 3-11: TYPICAL MEASUREMENT ERROR FOR SHORTED CABLE (+/- METERS)
Note: For a properly terminated cable (Match case), there is no reflected signal. In this case, the TDR Channel
Length field is invalid and should be ignored.
TXD TX
10/100 X CAT-5
Ethernet XFMR
RXD RX
MAC X
Digital Analog
Microchip
Ethernet Transceiver
Far-end system
TXD TX
10/100 X CAT-5 Link
Ethernet XFMR
MAC
RXD
X
RX Partner
Digital Analog
Microchip
Ethernet Transceiver
1
TXD TX 2
10/100 3
Ethernet XFMR 4
5
RXD RX
MAC 6
7
Digital Analog 8
LAN8740A/LAN8740Ai
10/100 PHY
32-VQFN
MII MII
MDIO
MDC
nINT
Mag RJ45
TXD[3:0] TXP
4 TXN
TXCLK
TXER RXP
TXEN
RXN
RXD[3:0]
4
RXCLK
RXDV
XTAL1/CLKIN
25 MHz
LED[2:1]
XTAL2
2
nRST
Interface
LAN8740A/LAN8740Ai
32-VQFN Power
Supply
3.3 V
Ch.2: 3.3 V
Core Logic
Circuitry
VDDDIO VDD1A
VDDIO Ch.1: 3.3 V
Supply
Circuitry
1.8 - 3.3 V CBYPASS
CF CBYPASS
RBIAS
LED1/
REGOFF VSS 12.1k
~270 Ohm
LAN8740A/LAN8740Ai
32-VQFN Power
Supply
3.3 V
Ch.2: 3.3 V
Core Logic
Circuitry
VDDDIO VDD1A
VDDIO Ch.1: 3.3 V
Supply
Circuitry
1.8 - 3.3 V CBYPASS
CF CBYPASS
RBIAS
LED1/
REGOFF VSS 12.1k
~270 Ohm
10k
VDD2A
CBYPASS
VDD1A
CBYPASS Magnetics
RJ45
TXP 1
2
75 Ohm 3
4
5
6
TXN 7
8
RXP
75 Ohm
RXN
1000 pF
3 kV
CBYPASS
VDD2A
CBYPASS
VDD1A
CBYPASS Magnetics
RJ45
TXP 1
2
75 Ohm 3
4
5
6
TXN 7
8
RXP
75 Ohm
RXN
1000 pF
3 kV
CBYPASS
Many of these register bit notations can be combined. Some examples of this are shown below:
• R/W: Can be written. Will return current setting on a read.
• R/WAC: Will return current setting on a read. Writing anything clears the bit.
Register Index
Register Name Group
(Decimal)
0 Basic Control Register Basic
1 Basic Status Register Basic
2 PHY Identifier 1 Register Extended
3 PHY Identifier 2 Register Extended
4 Auto Negotiation Advertisement Register Extended
5 Auto Negotiation Link Partner Ability Register Extended
6 Auto Negotiation Expansion Register Extended
7 Auto Negotiation Next Page TX Register Extended
8 Auto Negotiation Next Page RX Register Extended
13 MMD Access Control Register Extended
14 MMD Access Address/Data Register Extended
16 EDPD NLP/Crossover Time/EEE Configuration Register Vendor-specific
17 Mode Control/Status Register Vendor-specific
18 Special Modes Register Vendor-specific
24 TDR Patterns/Delay Control Register Vendor-specific
25 TDR Control/Status Register Vendor-specific
26 Symbol Error Counter Register Vendor-specific
27 Special Control/Status Indications Register Vendor-specific
28 Cable Length Register Vendor-specific
29 Interrupt Source Flag Register Vendor-specific
30 Interrupt Mask Register Vendor-specific
31 PHY Special Control/Status Register Vendor-specific
Note: The default value of the Revision Number field may vary dependent on the silicon revision number.
This register in conjunction with the MMD Access Address/Data Register provides indirect access to the MDIO Man-
ageable Device (MMD) registers. Refer to Section 4.3, "MDIO Manageable Device (MMD) Registers" for additional
details.
This register in conjunction with the MMD Access Control Register provides indirect access to the MDIO Manageable
Device (MMD) registers. Refer to Section 4.3, "MDIO Manageable Device (MMD) Registers" for additional details.
13:8 RESERVED RO -
7:5 MODE R/W (see Note 2)
Transceiver mode of operation. Refer to Section 3.7.2, "MODE[2:0]: Mode NASR
Configuration" for additional details.
4:0 PHYAD R/W (see Note 3)
PHY Address. The PHY Address is used for the SMI address and for initializa- NASR
tion of the Cipher (Scrambler) key. Refer to Section 3.7.1, "PHYAD[2:0]: PHY
Address Configuration" for additional details.
Note 1: The default value of this field is determined by the RMIISEL configuration strap. Refer to Section 3.7.3,
"RMIISEL: MII/RMII Mode Configuration" for additional information.
2: The default value of this field is determined by the MODE[2:0] configuration straps. Refer to Section 3.7.2,
"MODE[2:0]: Mode Configuration" for additional information.
3: The default value of this field is determined by the PHYAD[0] configuration strap. Refer to Section 3.7.1,
"PHYAD[2:0]: PHY Address Configuration" for additional information.
MMD Device
Index
Address Register Name
(In Decimal)
(In Decimal)
3 0 PCS Control 1 Register
(PCS) 1 PCS Status 1 Register
5 PCS MMD Devices Present 1 Register
6 PCS MMD Devices Present 2 Register
20 EEE Capability Register
22 EEE Wake Error Register
32784 Wakeup Control and Status Register (WUCSR)
32785 Wakeup Filter Configuration Register A (WUF_CFGA)
32786 Wakeup Filter Configuration Register B (WUF_CFGB)
32801 Wakeup Filter Byte Mask Registers (WUF_MASK)
32802
32803
32804
32805
32806
32807
32808
32865 MAC Receive Address A Register (RX_ADDRA)
32866 MAC Receive Address B Register (RX_ADDRB)
32867 MAC Receive Address C Register (RX_ADDRC)
32868 Miscellaneous Configuration Register (MCFGR)
7 5 Auto-Negotiation MMD Devices Present 1 Register
(Auto-Negotiation) 6 Auto-Negotiation MMD Devices Present 2 Register
60 EEE Advertisement Register
61 EEE Link Partner Advertisement Register
30 2 Vendor Specific MMD 1 Device ID 1 Register
(Vendor Specific) 3 Vendor Specific MMD 1 Device ID 2 Register
5 Vendor Specific 1 MMD Devices Present 1 Register
6 Vendor Specific 1 MMD Devices Present 2 Register
8 Vendor Specific MMD 1 Status Register
11 TDR Match Threshold Register
12 TDR Short/Open Threshold Register
14 Vendor Specific MMD 1 package ID 1 Register
15 Vendor Specific MMD 1 package ID 2 Register
Note: The MAC address must be loaded into the RX_ADDRA, RX_ADDRB, and RX_ADDRC registers in the
proper byte order. For example, a MAC address of 12:34:56:78:9A:BC should be loaded into these regis-
ters as follows:
RX_ADDRA = BC9Ah
RX_ADDRB = 7856h
RX_ADDRC = 3412h
Note: The MAC address must be loaded into the RX_ADDRA, RX_ADDRB, and RX_ADDRC registers in the
proper byte order. For example, a MAC address of 12:34:56:78:9A:BC should be loaded into these regis-
ters as follows:
RX_ADDRA = BC9Ah
RX_ADDRB = 7856h
RX_ADDRC = 3412h
Note: The MAC address must be loaded into the RX_ADDRA, RX_ADDRB, and RX_ADDRC registers in the
proper byte order. For example, a MAC address of 12:34:56:78:9A:BC should be loaded into these regis-
ters as follows:
RX_ADDRA = BC9Ah
RX_ADDRB = 7856h
RX_ADDRC = 3412h
Note 1: This bit is read/write (R/W). However, the user must not set this bit if EEE is disabled.
2: The default value of this field is determined by the value of the PHY Energy Efficient Ethernet Enable (PHY-
EEEEN) of the EDPD NLP/Crossover Time/EEE Configuration Register on page 71. If PHY Energy Efficient
Ethernet Enable (PHYEEEEN) is 0b, this field is 0b and 100BASE-TX EEE capability is not advertised. If
PHY Energy Efficient Ethernet Enable (PHYEEEEN) is 1b, then this field is 1b and 100BASE-TX EEE capa-
bility is advertised.
Note 1: Software reset places the default values of this register into an indeterminate state. For proper operation of
the TDR, the TDR Match High Threshold and TDR Match Low Threshold must be set to 5’h12 and 5’h09,
respectively.
Note 1: Software reset places the default values of this register into an indeterminate state. For proper operation of
the TDR, the TDR Short Low Threshold and TDR Open High Threshold must be set to 5’h09 and 5’h12,
respectively.
Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.
3.3 V Device
3.3 V Device 1.2 V Device Current w/ Total Device
Power Pin Group
Current (mA) Current (mA) Magnetics Power (mW)
(mA)
nRESET Typical 21 21 70
Note 1: This specification applies to all inputs and tri-stated bi-directional pins. Internal pull-down and pull-up resis-
tors add ±50 µA per-pin (typical).
2: XTAL1/CLKIN can optionally be driven from a 25 MHz single-ended clock oscillator.
Neg-Going Threshold VILT 0.64 0.83 1.15 1.41 1.76 V Schmitt trigger
Pos-Going Threshold VIHT 0.81 0.99 1.29 1.65 1.90 V Schmitt trigger
Note 1: Measured at line side of transformer, line replaced by 100 Ω (±1%) resistor.
2: Offset from 16 ns pulse width at 50% of pulse peak.
3: Measured differentially.
OUTPUT
25 pF
tcss tcsh
Configuration Strap
Pins Input
totaa todad
Configuration Strap
Pins Output Drive
Note: Device configuration straps are latched as a result of nRST assertion. Refer to Section 3.7, "Configuration
Straps" for details. Configuration straps must only be pulled high or low and must not be driven as inputs.
tclkp
tclkh tclkl
RXCLK
(OUTPUT)
tval tval tinvld
RXD[3:0]
(OUTPUTS)
tinvld
tval
RXDV, RXER
(OUTPUTS)
tclkp
tclkh tclkl
TXCLK
(OUTPUT)
tsu thold tsu thold thold
TXD[3:0]
(INPUTS)
thold tsu
TXEN, TXER
(INPUTS)
TXCLK
(OUTPUT)
TXEN
(INPUT)
t1
RXDV
(OUTPUT)
RXD[3:0]
(OUTPUTS)
Note: The t1 measurement applies in MII mode when the Loopback bit of the Basic Control Register is set to “1”
and a link has been established in 100 Mb full-duplex mode. The t1 measurement is taken from the first
rising edge of TXCLK following assertion of TXEN to the rising edge of RXDV.
tclkp
tclkh tclkl
CLKIN
(REF_CLK)
(INPUT) toval toval toinvld
RXD[1:0], RXER
(OUTPUTS)
toinvld toval
CRS_DV
(OUTPUT)
tsu tihold tsu tihold tihold
TXD[1:0]
(INPUTS)
tihold tsu
TXEN
(INPUT)
tclkp
tclkh tclkl
MDC
(INPUT)
tval toinvld
toinvld
MDIO
(Data-Out)
tsu tihold
MDIO
(Data-In)
LAN8740
XTAL2
Y1
XTAL1
C1 C2
LAN8740
XTAL2
RS
Y1
XTAL1
C1 C2
32-Lead Very Thin Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [VQFN]
SMSC LEGACY SQFN
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D A B
N
1
2
NOTE 1
E
(DATUM B)
(DATUM A)
2X
0.20 C
2X
0.20 C TOP VIEW
(A3) 0.10 C
C A1
A
SEATING
PLANE
32X
SIDE VIEW 0.08 C
0.10 C A B
D2
0.10 C A B
E2
e
2
2
1
NOTE 1
N 32X K
32X L 32X b
e 0.10 C A B
0.05 C
BOTTOM VIEW
Microchip Technology Drawing C04-160B SQFN Sheet 1 of 2
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Terminals N 32
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Terminal Thickness A3 0.20 REF
Overall Width E 5.00 BSC
Exposed Pad Width E2 3.20 3.30 3.40
Overall Length D 5.00 BSC
Exposed Pad Length D2 3.20 3.30 3.40
Terminal Width b 0.18 0.25 0.30
Terminal Length L 0.35 0.40 0.45
Terminal-to-Exposed-Pad K 0.20 - -
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
C1
X2
EV
32
1 ØV
2
G2
C2 Y2
EV
G1
Y1
X1
E
SILK SCREEN
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
REVISION LEVEL
& DATE SECTION/FIGURE/ENTRY CORRECTION
Revision A Replaces the previous SMSC version Rev. 1.1
(09-07-15) • Added Note and Trademark page
• Added Worldwide Sales and Services page
• Added Product Identification System
• Changed ‘QFN’ to ‘VQFN’
Chapter 2, "Pin Description and • Figure 2-1: rotated 90° cw
Configuration" • Table 2-3, “Serial Management Interface (SMI)
Pins”: Changed “VIS/VOD8 (PU)” to “VIS/VO8
(PU)”
Section 4.1, "Register Nomenclature" Table 4-1, “Register Bit Types”, register bit
description for byte type notification ‘W’: Changed
“read” to ‘written”
Section 5.6.4, "RMII Interface Timing" Updated RMII timing table: Updated REF_CLK In
mode toval max from “14.0 ns” to “15.0 ns”
Section 5.7, "Clock Circuit" Added new 100 µW crystal specifications and circuit
diagram. The section is now split into two
subsections, one for 300 µW crystals and the other
for 100 µW crystals.
Chapter 6, "Package Outline" Updated package outline drawing information
Rev. 1.1 General • Changed part numbers from
(05-10-13) “LAN8740/LAN8740i” to
“LAN8740A/LAN8740Ai”
• Updated ordering information
• Updated figures
Cover Added new bullet under Highlights section:
“Deterministic 100 Mb internal loopback latency (MII
Mode)”
Chapter 2, "Pin Description and Changed buffer type from “VIS (PU)” to “VIS”
Configuration", Table 2-1, “MII/RMII
Signals”
Chapter 2, "Pin Description and • Added pull-up to MDIO buffer type description
Configuration", Table 2-3, “Serial • Changed “VIS/VOD8 (PU)” to “VIS/VO8 (PU)”
Management Interface (SMI) Pins”
Section 3.3, "HP Auto-MDIX Support" Changed “100BASE-T” to “100BASE-TX”
Section 3.4.2.1, "CRS_DV - Carrier Changed “100BASE-X” to “100BASE-TX”
Sense/Receive Data Valid"
Section 3.5, "Serial Management Removed sentence stating “Non-supported registers
Interface (SMI)" (such as 7 to 15) will be read as hexadecimal
“FFFF”.
Section 3.8.11, "Cable Diagnostics" Updated section with additional operation details
Section 3.8.12.1, "Near-end Loopback" Added cross-reference to 100 Mbps internal
loopback timing section
, "," on page 58 Removed
- TDR Channel Threshold Maximum Register
- TDR Wait Counter Threshold Register
- TDR TX Pattern Generator Divider Register
Section 4.2.2, "Basic Status Register" Updated definitions of bits 10:8
Section 4.2.18, "Special Control/Status Updated bit 11 definition
Indications Register"
Section 4.2.22, "PHY Special Updated bit 6 definition
Control/Status Register"
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://microchip.com/support
Tape and Reel Blank = Standard packaging (tray) Note 1: Tape and Reel identifier only appears in the
Option: TR = Tape and Reel(1) catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Reel size is 4,000.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
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harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL
ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2013-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-636-5
QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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and manufacture of development systems is ISO 9001:2000 certified.