CC 2540

CC2540F128, CC2540F256
www.ti.com SWRS084C OCTOBER 2010 REVISED NOVEMBER 2011
2.4-GHz Bluetooth low energy System-on-Chip

Check for Samples: CC2540F128, CC2540F256
1
FEATURES
True Single-Chip BLE Solution: CC2540 Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, Etc. 6-mm 6-mm Package RF Bluetooth low energy technology Compatible Excellent Link Budget (up to 97 dB), Enabling Long-Range Applications Without External Front End Accurate Digital Received Signal-Strength Indicator (RSSI) Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) Layout Few External Components Reference Design Provided 6-mm 6-mm QFN40 Package Low Power Active Mode RX Down to 19.6 mA Active Mode TX (6 dBm): 24 mA Power Mode 1 (3-s Wake-Up): 235 A Power Mode 2 (Sleep Timer On): 0.9 A Power Mode 3 (External Interrupts): 0.4 A Wide Supply Voltage Range (2 V3.6 V) Full RAM and Register Retention in All Power Modes A
23456
TPS62730 Compatible Low Power in Active Mode RX Down to 15.8 mA (3 V Supply) TX (-6 dBm): 18.6 mA (3 V Supply) A Microcontroller High-Performance and Low-Power 8051 Microcontroller Core In-System-Programmable Flash, 128 KB or 256 KB 8-KB SRAM A Peripherals 12-Bit ADC with Eight Channels and Configurable Resolution Integrated High-Performance Op-Amp and Ultralow-Power Comparator General-Purpose Timers (One 16-Bit, Two 8-Bit) 21 General-Purpose I/O Pins (19 4 mA, 2 20 mA) 32-kHz Sleep Timer With Capture Two Powerful USARTs With Support for Several Serial Protocols Full-Speed USB Interface IR Generation Circuitry Powerful Five-Channel DMA AES Security Coprocessor Battery Monitor and Temperature Sensor Each CC2540 Contains a Unique 48-bit IEEE Address
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SmartRF is a trademark of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Supported by IAR Embedded Workbench is a trademark of IAR Systems AB. ZigBee is a registered trademark of ZigBee Alliance. All other trademarks are the property of their respective owners.
Copyright 20102011, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
CC2540F128, CC2540F256
SWRS084C OCTOBER 2010 REVISED NOVEMBER 2011 www.ti.com
SOFTWARE FEATURES
Bluetooth v4.0 Compliant Protocol Stack for Single-Mode BLE Solution Complete Power-Optimized Stack, Including Controller and Host GAP Central, Peripheral, Observer, or Broadcaster (Including Combination Roles) ATT / GATT Client and Server SMP AES-128 Encryption and Decryption L2CAP Sample Applications and Profiles Generic Applications for GAP Central and Peripheral Roles Proximity, Accelerometer, Simple Keys, and Battery GATT Services Multiple Configuration options Single-Chip Configuration, Allowing Application to Run on CC2540 Network Processor Interface for Applications Running on an External Microcontroller BTool Windows PC Application for Evaluation, Development, and Test Development Tools CC2540 Mini Development Kit SmartRF Software Supported by IAR Embedded Workbench Software for 8051
APPLICATIONS
2.4-GHz Bluetooth low energy Systems Mobile Phone Accessories Sports and Leisure Equipment Consumer Electronics Human Interface Devices (Keyboard, Mouse, Remote Control) USB Dongles Health Care and Medical
CC2540 WITH TPS62730

TPS62730 is a 2 MHz Step Down Converter with Bypass Mode Extends Battery Lifetime by up to 20% Reduced Current in TX and RX 30 nA Bypass Mode Current to Support Low Power Modes RF Performance Unchanged Small Package Allows for Small Solution Size CC2540 Controllable
DESCRIPTION
The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540 combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540 is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. The CC2540 comes in two different versions: CC2540F128/F256, with 128 and 256 KB of flash memory, respectively. Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540F128/F256 forms the markets most flexible and cost-effective single-mode Bluetooth low energy solution.
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Product Folder Link(s): CC2540F128 CC2540F256
CC2540F128, CC2540F256
RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0
RESET
WATCHDOG TIMER
ON-CHIP VOLTAGE REGULATOR
VDD (2 V3.6 V) DCOUPL
32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE
SFR Bus
CLOCK MUX and CALIBRATION
POWER-ON RESET BROWN OUT
SLEEP TIMER
HIGHSPEED RC-OSC
32-kHz RC-OSC
POWER MANAGEMENT CONTROLLER
P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 IRQ CTRL P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 OP-AMP DMA 8051 CPU CORE
PDATA XRAM IRAM SFR
MEMORY ARBITRATOR
FLASH
FLASH
UNIFIED
FLASH CTRL
ANALOG COMPARATOR FIFOCTRL 1 KB SRAM
Radio Arbiter
RADIO REGISTERS
I/O CONTROLLER
P0_0
SFR Bus
DS ADC AUDIO/DC
AES ENCRYPTION AND DECRYPTION
Link Layer Engine
SYNTH
DEMODULATOR
MODULATOR
USB_N USB_P USB
USART 0
FREQUENCY SYNTHESIZER
RECEIVE USART 1
TRANSMIT
TIMER 1 (16-Bit)
TIMER 2 (BLE LL TIMER)

RF_P
RF_N
TIMER 3 (8-Bit) DIGITAL ANALOG TIMER 4 (8-Bit) MIXED

B0301-05
CC2540F128, CC2540F256
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)

MIN Supply voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) (1) (2) All pads, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 40 All supply pins must have the same voltage 0.3 0.3 MAX 3.9 VDD + 0.3, 3.9 10 125 2 750 UNIT V V dBm C kV V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS

MIN Operating ambient temperature range, TA Operating supply voltage 40 2 MAX 85 3.6 UNIT C V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2540 EM reference design with TA = 25C and VDD = 3 V
PARAMETER TEST CONDITIONS Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention Low MCU activity: 32-MHz XOSC running. No radio or peripherals. No flash access, no RAM access. Timer 1. Timer running, 32-MHz XOSC used Timer 2. Timer running, 32-MHz XOSC used Iperi Peripheral current consumption (Adds to core current Icore for each peripheral unit activated) Timer 3. Timer running, 32-MHz XOSC used Timer 4. Timer running, 32-MHz XOSC used Sleep timer, including 32.753-kHz RCOSC ADC, when converting MIN TYP MAX UNIT 235 A
Icore
Core current consumption
0.9 0.4 6.7 90 90 60 70 0.6 1.2
mA A A A A A mA
CC2540F128, CC2540F256
GENERAL CHARACTERISTICS
PARAMETER WAKE-UP AND TIMING Power mode 1 Active Power mode 2 or 3 Active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC Crystal ESR = 16 . Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF With 32-MHz XOSC initially on RX/TX turnaround RADIO PART RF frequency range Data rate and modulation format Programmable in 2-MHz steps 1 Mbps, GFSK, 250 kHz deviation 2402 2480 MHz 4 120 410 160 150 s s s s s TEST CONDITIONS MIN TYP MAX UNIT
Active TX or RX
RF RECEIVE SECTION
Measured on Texas Instruments CC2540 EM reference design with TA = 25C, VDD = 3 V, fc = 2440 MHz 1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy mode, and 0.1% BER (1)
PARAMETER Receiver sensitivity (2) Receiver sensitivity Saturation (3) Co-channel rejection (3) Adjacent-channel rejection Blocking (3) Frequency error tolerance (4) Symbol rate error tolerance
(5) (3) (2)
TEST CONDITIONS High-gain mode Standard mode
MIN
TYP MAX 93 87 6 5
UNIT dBm dBm dBm dB dB dB dBm
1 MHz 2 MHz Including both initial tolerance and drift 250 80
5 30 30 250 80 75 19.6
Alternate-channel rejection (3)
kHz ppm dBm
Conducted measurement with a 50- single-ended load. Spurious emission. Only largest spurious Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, emission stated within each band. Part 15 and ARIB STD-T-66 RX mode, standard mode, no peripherals active, low MCU activity, MCU at 250 kHz RX mode, high-gain mode, no peripherals active, low MCU activity, MCU at 250 kHz
Current consumption
mA 22.1
(1) (2) (3) (4) (5)
0.1% BER maps to 30.8% PER The receiver sensitivity setting is programmable using a TI BLE stack vendor-specific API command. The default value is standard mode. Results based on standard gain mode Difference between center frequency of the received RF signal and local oscillator frequency Difference between incoming symbol rate and the internally generated symbol rate
CC2540F128, CC2540F256
RF TRANSMIT SECTION
Measured on Texas Instruments CC2540 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz
PARAMETER TEST CONDITIONS Delivered to a single-ended 50- load through a balun using maximum recommended output power setting Delivered to a single-ended 50- load through a balun using minimum recommended output power setting Delivered to a single-ended 50 load through a balun Conducted measurement with a 50- single-ended load. Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 (1) TX mode, 23-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz TX mode, 6-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz TX mode, 0-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz TX mode, 4-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz Optimum load impedance (1) Differential impedance as seen from the RF port (RF_P and RF_N) toward the antenna MIN TYP 4 dBm 20 24 dB MAX UNIT
Output power
Programmable output power range Spurious emissions
41 21.1 23.8
dBm
Current consumption
mA 27 31.6 70 + j30
Designs with antenna connectors that require conducted ETSI compliance at 64 MHz should insert an LC resonator in front of the antenna connector. Use a 1.6-nH inductor in parallel with a 1.8-pF capacitor. Connect both from the signal trace to a good RF ground.
CURRENT CONSUMPTION WITH TPS62730

Measured on Texas Instruments CC2540TPS62730 EM reference design with TA = 25C, VDD = 3 V, and fc = 2440 MHZ. 1 Mbps, GFSK, 250 kHz deviation, Bluetooth low energy mode, 1% BER (1)
PARAMETER TEST CONDITIONS RX mode, standard mode, no peripherals active, low MCU activity, MCU at 1 MHZ RX mode, high-gain mode, no peripherals active, low MCU activity, MCU at 1 MHZ TX mode, -23 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ TX mode, -6 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ TX mode, 0 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ TX mode, 4 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ (1) 0.1% BER maps to 30.8% PER MIN TYP 15.8 17.8 16.5 mA 18.6 21 24.6 MAX UNIT
Current Consumption
CC2540F128, CC2540F256
32-MHz CRYSTAL OSCILLATOR

PARAMETER Crystal frequency Crystal frequency accuracy requirement (1) ESR C0 CL Equivalent series resistance Crystal shunt capacitance Crystal load capacitance Start-up time The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. 40 6 1 10 0.25 TEST CONDITIONS MIN TYP 32 40 60 7 16 MAX UNIT MHz ppm pF pF ms
Power-down guard time
ms
(1)
Including aging and temperature dependency, as specified by [1]
32.768-kHz CRYSTAL OSCILLATOR

PARAMETER Crystal frequency Crystal frequency accuracy requirement (1) ESR C0 CL Equivalent series resistance Crystal shunt capacitance Crystal load capacitance Start-up time (1) Including aging and temperature dependency, as specified by [1] 40 40 0.9 12 0.4 TEST CONDITIONS MIN TYP 32.768 40 130 2 16 MAX UNIT kHz ppm k pF pF s
32-kHz RC OSCILLATOR
Measured on Texas Instruments CC2540 EM reference design with T = 25C and VDD = 3 V.
PARAMETER Calibrated frequency
(1)
TEST CONDITIONS
MIN
TYP 32.753 0.2% 0.4 3 2
MAX
UNIT kHz %/C %/V ms
Frequency accuracy after calibration Temperature coefficient (2) Supply-voltage coefficient Calibration time (4) (1) (2) (3) (4)
(3)
The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. Frequency drift when temperature changes after calibration Frequency drift when supply voltage changes after calibration When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is set to 0.
CC2540F128, CC2540F256
16-MHz RC OSCILLATOR
PARAMETER Frequency
(1)
TEST CONDITIONS
MIN
TYP 16 18% 0.6% 10
MAX
UNIT MHz
Uncalibrated frequency accuracy Calibrated frequency accuracy Start-up time Initial calibration time (1) (2)
(2)
s s
50
The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0.
RSSI CHARACTERISTICS
PARAMETER Useful RSSI range (1) Absolute uncalibrated RSSI accuracy (1) Step size (LSB value) (1) Assuming CC2540 EM reference design. Other RF designs give an offset from the reported value. TEST CONDITIONS High-gain mode Standard mode High-gain mode MIN TYP MAX UNIT dBm dB dB 99 to 44 90 to 35 4 1
FREQUENCY SYNTHESIZER CHARACTERISTICS

Measured on Texas Instruments CC2540 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz
PARAMETER Phase noise, unmodulated carrier TEST CONDITIONS At 1-MHz offset from carrier At 3-MHz offset from carrier At 5-MHz offset from carrier MIN TYP 109 112 119 dBc/Hz MAX UNIT
ANALOG TEMPERATURE SENSOR

PARAMETER Output Temperature coefficient Voltage coefficient Initial accuracy without calibration Accuracy using 1-point calibration Current consumption when enabled Measured using integrated ADC, internal band-gap voltage reference, and maximum resolution TEST CONDITIONS MIN TYP 1480 4.5 1 10 5 0.5 MAX UNIT 12-bit mv/C / 0.1 V C C mA
CC2540F128, CC2540F256
OP-AMP CHARACTERISTICS
TA = 25C, VDD = 3 V, . All measurement results are obtained using the CC2540 reference designs post-calibration.
PARAMETER Output maximum voltage Output minimum voltage Open-loop gain Gain-bandwidth product Slew rate Input maximum voltage Intput minimum voltage Input offset voltage CMRR Common-mode rejection ratio Supply current Input noise voltage f = 0.01 Hz to 1 Hz f = 0.1 Hz to 10 Hz TEST CONDITIONS MIN TYP VDD 0.1 0.1 108 2 2.6 VDD 0 40 90 0.4 1.1 1.7 VDD 0.1 0.1 108 2 2.6 VDD 0 3.2 90 0.4 f = 0.01 Hz to 1 Hz f = 0.1 Hz to 10 Hz 60 65 MAX UNIT V V dB MHz V/s V mV V dB mA nV/(Hz) Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x03, OPAMPC = 0x01
Non-Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x00, OPAMPC = 0x01 Output maximum voltage Output minimum voltage Open-loop gain Gain-bandwidth product Slew rate Input maximum voltage Intput minimum voltage Input offset voltage CMRR Common-mode rejection ratio Supply current Input noise voltage V V dB MHz V/s V mV mV dB mA nV/(Hz)
COMPARATOR CHARACTERISTICS
TA = 25C, VDD = 3 V. All measurement results are obtained using the CC2540 reference designs, post-calibration.
PARAMETER Common-mode maximum voltage Common-mode minimum voltage Input offset voltage Offset vs temperature Offset vs operating voltage Supply current Hysteresis TEST CONDITIONS MIN TYP MAX VDD 0.3 1 16 4 230 0.15 mV V/C mV/V nA mV UNIT V
CC2540F128, CC2540F256
ADC CHARACTERISTICS
TA = 25C and VDD = 3 V
PARAMETER Input voltage External reference voltage External reference voltage differential Input resistance, signal Full-scale signal (1) TEST CONDITIONS VDD is voltage on AVDD5 pin VDD is voltage on AVDD5 pin VDD is voltage on AVDD5 pin Simulated using 4-MHz clock speed Peak-to-peak, defines 0 dBFS Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting Single-ended input, 12-bit setting ENOB (1) Effective number of bits Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting 10-bit setting, clocked by RCOSC 12-bit setting, clocked by RCOSC Useful power bandwidth 7-bit setting, both single and differential Single ended input, 12-bit setting, 6 dBFS (1) Differential input, 12-bit setting, 6 dBFS (1) Single-ended input, 12-bit setting (1) Differential input, 12-bit setting Signal to nonharmonic ratio
(1)
MIN 0 0 0
TYP
MAX VDD VDD VDD
UNIT V V V k V
197 2.97 5.7 7.5 9.3 10.3 6.5 8.3 10 11.5 9.7 10.9 020 75.2
bits
kHz
THD
Total harmonic distortion
dB 86.6 70.2 79.3 78.8 88.9 >84 >84 3 0.68% 0.05 0.9 4.6 13.3 10 29 35.4 46.8 57.5 66.6 40.7 51.6 61.8 70.8 dB dB dB mV dB
Single-ended input, 12-bit setting, 6 dBFS (1) Differential input, 12-bit setting, 6 dBFS (1)
CMRR
Common-mode rejection ratio Crosstalk Offset Gain error
Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Single ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Midscale 12-bit setting, mean (1) 12-bit setting, maximum (1) 12-bit setting, mean (1) 12-bit setting, maximum
(1)
DNL
Differential nonlinearity
LSB
INL
Integral nonlinearity
12-bit setting, mean, clocked by RCOSC 12-bit setting, max, clocked by RCOSC Single ended input, 7-bit setting
(1)
LSB
Single ended input, 9-bit setting (1) Single ended input, 10-bit setting (1) SINAD (THD+N) Signal-to-noise-and-distortion Single ended input, 12-bit setting Differential input, 7-bit setting (1) Differential input, 9-bit setting (1) Differential input, 10-bit setting (1) Differential input, 12-bit setting
(1) (1)
(1) 10
Measured with 300-Hz sine-wave input and VDD as reference. Submit Documentation Feedback
CC2540F128, CC2540F256
ADC CHARACTERISTICS (continued)

TA = 25C and VDD = 3 V
PARAMETER TEST CONDITIONS 7-bit setting Conversion time 9-bit setting 10-bit setting 12-bit setting Power consumption Internal reference VDD coefficient Internal reference temperature coefficient Internal reference voltage MIN TYP 20 36 68 132 1.2 4 0.4 1.15 mA mV/V mV/10C V s MAX UNIT
CONTROL INPUT AC CHARACTERISTICS

TA = 40C to 85C, VDD = 2 V to 3.6 V.
PARAMETER System clock, fSYSCLK tSYSCLK = 1/ fSYSCLK TEST CONDITIONS The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but do not lead to complete reset of all modules within the chip. See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. MIN 16 TYP MAX 32 UNIT MHz
RESET_N low duration
Interrupt pulse duration
20
ns
RESET _N
Px.n
T0299-01
Figure 1. Control Input AC Characteristics
11
CC2540F128, CC2540F256
SPI AC CHARACTERISTICS
TA = 40C to 85C, VDD = 2 V to 3.6 V
PARAMETER t1 SCK period SCK duty cycle t2 t3 t4 t5 t6 t7 t10 t11 t9 SSN low to SCK SCK to SSN high MOSI early out MOSI late out MISO setup MISO hold SCK duty cycle MOSI setup MOSI hold MISO late out Master, RX and TX Slave, RX and TX Master Master Slave Master Slave Master, load = 10 pF Master, load = 10 pF Master Master Slave Slave Slave Slave, load = 10 pF Master, TX only Operating frequency Master, RX and TX Slave, RX only Slave, RX and TX 35 10 95 8 4 8 4 MHz 90 10 50% 63 63 63 63 7 10 TEST CONDITIONS MIN 250 250 50% ns ns ns ns ns ns ns ns ns ns TYP MAX UNIT ns
SCK
t2
t3
SSN
t4
t5
MOSI
D0
D1
t6
t7
MISO
D0
X
T0478-01
Figure 2. SPI Master AC Characteristics
12
CC2540F128, CC2540F256
SCK
t2
t3
SSN
t8
t9
MISO
D0
D1
t10
t11
MOSI
D0
X
T0479-01
Figure 3. SPI Slave AC Characteristics
13
CC2540F128, CC2540F256
DEBUG INTERFACE AC CHARACTERISTICS

TA = 40C to 85C, VDD = 2 V to 3.6 V
PARAMETER fclk_dbg t1 t2 t3 t4 t5 t6 t7 t8 Debug clock frequency (see Figure 4) Allowed high pulse on clock (see Figure 4) Allowed low pulse on clock (see Figure 4) EXT_RESET_N low to first falling edge on debug clock (see Figure 6) Falling edge on clock to EXT_RESET_N high (see Figure 6) EXT_RESET_N high to first debug command (see Figure 6) Debug data setup (see Figure 5) Debug data hold (see Figure 5) Clock-to-data delay (see Figure 5) Load = 10 pF
Time
TEST CONDITIONS
MIN 35 35 167 83 83 2 4
TYP
MAX 12
UNIT MHz ns ns ns ns ns ns ns
30
ns
DEBUG CLK _ P2_2
t1 1/fclk_dbg
t2
T0436-01
Figure 4. Debug Clock Basic Timing

Time
DEBUG CLK _ P2_2
RESET _N
t3
t4
t5
T0437-01
Figure 5. Debug Enable Timing
14
CC2540F128, CC2540F256
Time
DEBUG CLK _ P2_2
DEBUG _DATA (to CC2540) P2_1
DEBUG _DATA (from CC2540) P2_1
t6
t7
t8
T0438-02
Figure 6. Data Setup and Hold Timing
TIMER INPUTS AC CHARACTERISTICS

TA = 40C to 85C, VDD = 2 V to 3.6 V
PARAMETER Input capture pulse duration TEST CONDITIONS Synchronizers determine the shortest input pulse that can be recognized. The synchronizers operate at the current system clock rate (16 MHz or 32 MHz). MIN 1.5 TYP MAX UNIT tSYSCLK
DC CHARACTERISTICS
TA = 25C, VDD = 3 V
PARAMETER Logic-0 input voltage Logic-1 input voltage Logic-0 input current Logic-1 input current I/O-pin pullup and pulldown resistors Logic-0 output voltage, 4- mA pins Logic-1 output voltage, 4-mA pins Output load 4 mA Output load 4 mA 2.4 Input equals 0 V Input equals VDD 2.5 50 50 20 0.5 50 50 TEST CONDITIONS MIN TYP MAX 0.5 UNIT V V nA nA k V V
15
CC2540F128, CC2540F256
DEVICE INFORMATION PIN DESCRIPTIONS

The CC2540 pinout is shown in Figure 7 and a short description of the pins follows.
CC2540 RHA Package (Top View) P2_3 / XOSC32K_Q2 P2_4 / XOSC32K_Q1
32
DCOUPL
DVDD1
P1_6
P1_7
P2_0
P2_1
P2_2
DGND_USB USB_P USB_N DVDD_USB P1_5 P1_4 P1_3 P1_2 P1_1 DVDD2
40 1 2 3 4 5 6 7 8 9 10 11
39
38
37
36
35
34
33
31 30 29 28 27
AVDD6
R_BIAS AVDD4 AVDD1 AVDD2 RF_N RF_P AVDD3 XOSC_Q2 XOSC_Q1 AVDD5
GND Ground Pad
26 25 24 23 22
12
13
14
15
16
17
18
19
21 20
P0_1
RESET_N
P0_4
P0_2
P1_0
P0_7
P0_6
P0_5
P0_3
P0_0
P0076-05
NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip.
Figure 7. Pinout Top View
16
CC2540F128, CC2540F256
PIN DESCRIPTIONS
PIN NAME AVDD1 AVDD2 AVDD3 AVDD4 AVDD5 AVDD6 DCOUPL DGND_USB DVDD_USB DVDD1 DVDD2 GND P0_0 P0_1 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3/ XOSC32K_Q2 P2_4/ XOSC32K_Q1 RBIAS RESET_N RF_N RF_P USB_N USB_P XOSC_Q1 XOSC_Q2 PIN 28 27 24 29 21 31 40 1 4 39 10 19 18 17 16 15 14 13 12 11 9 8 7 6 5 38 37 36 35 34 33 32 30 20 26 25 3 2 22 23 PIN TYPE Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (digital) Ground pin Power (digital) Power (digital) Power (digital) Ground Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Analog I/O Digital input RF I/O RF I/O Digital I/O Digital I/O Analog I/O Analog I/O DESCRIPTION 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. Connect to GND 2-V3.6-V digital power-supply connection 2-V3.6-V digital power-supply connection 2-V3.6-V digital power-supply connection The ground pad must be connected to a solid ground plane. Port 0.0 Port 0.1 Port 0.2 Port 0.3 Port 0.4 Port 0.5 Port 0.6 Port 0.7 Port 1.0 20-mA drive capability Port 1.1 20-mA drive capability Port 1.2 Port 1.3 Port 1.4 Port 1.5 Port 1.6 Port 1.7 Port 2.0 Port 2.1 Port 2.2 Port 2.3/32.768 kHz XOSC Port 2.4/32.768 kHz XOSC External precision bias resistor for reference current Reset, active-low Negative RF input signal to LNA during RX Negative RF output signal from PA during TX Positive RF input signal to LNA during RX Positive RF output signal from PA during TX USB N USB P 32-MHz crystal oscillator pin 1 or external-clock input 32-MHz crystal oscillator pin 2
17
CC2540F128, CC2540F256
BLOCK DIAGRAM
A block diagram of the CC2540 is shown in Figure 8. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given.
RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 DEBUG INTERFACE RESET WATCHDOG TIMER ON-CHIP VOLTAGE REGULATOR VDD (2 V3.6 V) DCOUPL
32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC
SFR Bus
CLOCK MUX and CALIBRATION
POWER-ON RESET BROWN OUT
SLEEP TIMER
HIGHSPEED RC-OSC
32-kHz RC-OSC
POWER MANAGEMENT CONTROLLER
P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 IRQ CTRL P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 OP-AMP DMA 8051 CPU CORE
PDATA XRAM IRAM SFR
MEMORY ARBITRATOR
FLASH
FLASH
UNIFIED
FLASH CTRL
ANALOG COMPARATOR FIFOCTRL 1 KB SRAM
Radio Arbiter
RADIO REGISTERS
I/O CONTROLLER
P0_0
SFR Bus
DS ADC AUDIO/DC
AES ENCRYPTION AND DECRYPTION
Link Layer Engine
SYNTH
DEMODULATOR
MODULATOR
USB_N USB_P USB
USART 0
FREQUENCY SYNTHESIZER
RECEIVE USART 1
TRANSMIT
TIMER 1 (16-Bit)
TIMER 2 (BLE LL TIMER)

RF_P
RF_N
TIMER 3 (8-Bit) DIGITAL ANALOG TIMER 4 (8-Bit) MIXED

B0301-05
Figure 8. CC2540 Block Diagram
18
CC2540F128, CC2540F256
BLOCK DESCRIPTIONS
CPU and Memory The 8051 CPU core is a single-cycle 8051-compatible core. It has three different memory access busses (SFR, DATA, and CODE/XDATA), a debug interface, and an 18-input extended interrupt unit. The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory-access points, access of which can map to one of three physical memories: an SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The SFR bus is drawn conceptually in Figure 8 as a common bus that connects all hardware peripherals to the memory arbiter. The SFR bus in the block diagram also provides access to the radio registers in the radio register bank, even though these are indeed mapped into XDATA memory space. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2 and 3). The 128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. Peripherals Writing to the flash block is performed through a flash controller that allows page-wise erasure and 4-bytewise programming. See User Guide for details on the flash controller. A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors that can be located anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface, etc.) can be used with the DMA controller for efficient operation by performing data transfers between a single SFR or XREG address and flash/SRAM. Each CC2540 contains a unique 48-bit IEEE address that can be used as the public device address for a Bluetooth device. Designers are free to use this address, or provide their own, as described in the Bluetooth specfication. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. I/O and sleep timer interrupt requests are serviced even if the device is in a sleep mode (power modes 1 and 2) by bringing the CC2540 back to the active mode. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to erase or program the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-circuit debugging and external flash programming elegantly. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. The sleep timer is an ultralow-power timer that can either use an external 32.768-kHz crystal oscillator or an internal 32.753-kHz RC oscillator. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power modes 1 or 2. A built-in watchdog timer allows the CC2540 to reset itself if the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out.
19
CC2540F128, CC2540F256
Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR generation mode, where it counts timer 3 periods and the output is ANDed with the output of timer 3 to generate modulated consumer IR signals with minimal CPU interaction. Timer 2 is a 40-bit timer used by the Bluetooth low energy stack. It has a 16-bit counter with a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends. There are two 16-bit timer-compare registers and two 24-bit overflow-compare registers that can be used to give exact timing for start of RX or TX to the radio or general interrupts. Timer 3 and timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as PWM output. USART 0 and USART 1 are each configurable as either an SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each USART has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. When configured as SPI slaves, the USARTs sample the input signal using SCK directly instead of using some oversampling scheme, and are thus well-suited for high data rates. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The AES core also supports ECB, CBC, CFB, OFB, CTR, and CBC-MAC, as well as hardware support for CCM. The ADC supports 7 to 12 bits of resolution with a corresponding range of bandwidths from 30-kHz to 4-kHz, respectively. DC and audio conversions with up to eight input channels (I/O controller pins) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The operational amplifier is intended to provide front-end buffering and gain for the ADC. Both inputs as well as the output are available on pins, so the feedback network is fully customizable. A chopper-stabilized mode is available for applications that need good accuracy with high gain. The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin interrupt.
20
CC2540F128, CC2540F256
TYPICAL CHARACTERISTICS
RX CURRENT IN WAIT FOR SYNC vs TEMPERATURE
20.5 Gain = Standard Setting Input = -70 dBm VCC = 3 V
TX CURRENT vs TEMPERATURE
32.5 TX Power Setting = 4 dBm VCC = 3 V 32 Current (mA)
20 Current (mA)
19.5
31.5
19
31
18.5 -40
-20
20 40 Temperature (C)
60
80
G001
30.5 -40
-20
60
80
G002
Figure 9. RX SENSITIVITY vs TEMPERATURE

-83 -84 -85 Level (dBm) Gain = Standard Setting VCC = 3 V
Figure 10. TX POWER vs TEMPERATURE

7 6 5 Level (dBm) 4 3 2 1 0 -40
G003
TX Power Setting = 4 dBm VCC = 3 V
-86 -87 -88 -89 -90 -91 -92 -40 -20 0 20 40 Temperature (C) 60 80
-20
60
80
G004
Figure 11. RX CURRENT IN WAIT FOR SYNC vs SUPPLY VOLTAGE

19.7 19.68 19.66 19.64 Current (mA) 19.62 19.6 19.58 19.56 19.54 19.52 19.5 2 2.2 2.4 2.6 2.8 3 Supply Voltage (V) 3.2 3.4 3.6
G005
Figure 12. TX CURRENT vs SUPPLY VOLTAGE

32 31.9 31.8 31.7 Current (mA) 31.6 31.5 31.4 31.3 31.2 31.1 31 2 2.2 2.4 2.6 2.8 3 Supply Voltage (V) 3.2 3.4 3.6
G006
Gain = Standard Setting Input = -70 dBm T A = 25C
T A = 25C TX Power Setting = 4 dBm
Figure 13.
Figure 14. Submit Documentation Feedback 21
CC2540F128, CC2540F256
TYPICAL CHARACTERISTICS (continued)

RX SENSITIVITY vs SUPPLY VOLTAGE
-87 -87.2 -87.4 -87.6 Level (dBm) Gain = Standard Setting T A = 25C
TX POWER vs SUPPLY VOLTAGE

5 4.8 4.6 4.4 Level (dBm) 4.2 4 3.8 3.6 3.4 3.2 3 T A = 25C TX Power Setting = 4 dBm
-87.8 -88 -88.2 -88.4 -88.6 -88.8 -89 2 2.2 2.4 2.6 2.8 3 Supply Voltage (V) 3.2 3.4 3.6
G007
2.2
2.4
2.6 2.8 3 Supply Voltage (V)
3.2
3.4
3.6
G008
Figure 15. RX SENSITIVITY vs FREQUENCY

-87 -87.2 -87.4 -87.6 -87.8 -88 -88.2 -88.4 -88.6 -88.8 -89 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) 0 Rejection (dB) Level (dBm) Gain = Standard Setting T A = 25C VCC = 3 V 60 50 40 30 20 10
Figure 16. RX INTERFERER REJECTION (SELECTIVITY) vs INTERFERER FREQUENCY
Gain = Standard Setting T A = 25C VCC = 3 V Wanted Signal at 2426 MHz with -67 dBm Level
G009
-10 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz)
G010
Figure 17. TX POWER vs FREQUENCY

5 4.8 4.6 4.4 Level (dBm) 4.2 4 3.8 3.6 3.4 3.2 3 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) T A = 25C TX Power Setting = 4 dBm VCC = 3 V
Figure 18.
G011
Figure 19.
22
CC2540F128, CC2540F256
TYPICAL CHARACTERISTICS (continued)

Table 1. Output Power and Current Consumption (1) (2)
Typical Output Power (dBm) 4 0 6 23 (1) (2) Typical Current Consumption (mA) 32 27 24 21 Typical Current Consumption With TPS62730 (mA) 24.6 21 18.5 16.5
Measured on Texas Instruments CC2540 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings Measured on Texas Instruments CC2540TPS62730 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings
TYPICAL CURRENT SAVINGS

35 30 25
CC2540 Current Consumption TX 4dBm
40 35 30
CC2540 Current Consumption RX SG CLKCONMOD0x80

25 40 35 20
Current Savings (%)
30
Current (mA)
25 20 20 15 15 10 5 0 2.1 2.4 2.7 3 3.3 3.6 Supply (V) 10
15
25 20
Current Savings (%)
Current (mA)
DC/DC ON DC/DC OFF % Current Savings
DC/DC ON DC/DC OFF Current Savings
10
15 10
5 0
5 5 0 2.1 2.4 2.7 3 3.3 3.6 Supply (V) 0
Figure 20. Current Savings in TX at Room Temperature
Figure 21. Current Savings in RX at Room Temperature
The application note (SWRA365) has information regarding the CC2540 and TPS62730 como board and the current savings that can be achieved using the como board.
23
CC2540F128, CC2540F256
APPLICATION INFORMATION
Few external components are required for the operation of the CC2540. A typical application circuit is shown in Figure 22.
Optional 32-kHz Crystal C331 2-V to 3.6-V Power Supply
(1)
XTAL2
C321
P2_3/XOSC32K_Q2 33 P2_4/XOSC32K_Q1 32 AVDD6 31 P2_0 36 P1_7 37 P2_2 34 P2_1 35
C401
DVDD1 39
DCOUPL 40
P1_6 38
R301
RBIAS 30
1 2 3 4 5 6 7 8 9
DGND_USB USB_P USB_N DVDD_USB P1_5 P1_4 P1_3 P1_2 P1_1
L251
AVDD4 29 AVDD1 28 AVDD2 27 RF_N 26
C251
C252 L252 L253
Antenna (50 W)
CC2540
RF_P 25
C261
L261
DIE ATTACH PAD
AVDD3 24 XOSC_Q2 23 XOSC_Q1 22
C262
C253
10 DVDD2
12 P0_7
13 P0_6
16 P0_3
14 P0_5
17 P0_2
15 P0_4
18 P0_1
19 P0_0
20 RESET_N
AVDD5
21
11 P1_0
XTAL1 Power Supply Decoupling Capacitors are Not Shown Digital I/O Not Connected C221 C231
S0383-03
(1) 32-kHz crystal is mandatory when running the chip in low-power modes, except if the link layer is in the standby state (Vol. 6 Part B Section 1.1 in [1]). NOTE: Different antenna alternatives will be provided as reference designs.
Figure 22. CC2540 Application Circuit Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors)
Component C221 C231 C251 C252 C253 C261 C262 C321 C331 C401 24 32-MHz xtal loading capacitor 32-MHz xtal loading capacitor Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network 32-kHz xtal loading capacitor 32-kHz xtal loading capacitor Decoupling capacitor for the internal digital regulator Description Value 12 pF 12 pF 18 pF 1 pF 1 pF 18 pF 1 pF 15 pF 15 pF 1 F
CC2540F128, CC2540F256
Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued)

Component L251 L252 L253 L261 R301 Description Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Resistor used for internal biasing Value 2 nH 1 nH 3 nH 2 nH 56 k
Input/Output Matching
When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252.
Crystal
An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See 32-MHz CRYSTAL OSCILLATOR for details. The load capacitance seen by the 32-MHz crystal is given by: 1 CL = + Cparasitic 1 1 + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: 1 CL = + Cparasitic 1 1 + C321 C331 (2) A series resistor may be used to comply with the ESR requirement.
On-Chip 1.8-V Voltage Regulator Decoupling

The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation.
Power-Supply Decoupling and Filtering

Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely.
References
1. Bluetooth Core Technical Specification document, version 4.0 http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip 2. CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications/CC2540 System-on-Chip Solution for 2.4-GHz Bluetooth low energy Applications (SWRU191) 3. Current Savings in CC254x Using the TPS62730 (SWRA365)
25
CC2540F128, CC2540F256
Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information.
Texas Instruments Low-Power RF Web Site

Forums, videos, and blogs RF design help E2E interaction
Join us today at www.ti.com/lprf-forum.
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Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: RF circuit, low-power RF, and ZigBee design services Low-power RF and ZigBee module solutions and development tools RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork
Low-Power RF eNewsletter
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26
CC2540F128, CC2540F256
REVISION HISTORY
Changes from Revision Original (October 2010) to Revision A Page
Changed several items in Features list ................................................................................................................................ 1 Changed upper limit of storage temperature range .............................................................................................................. 4 Changed ESD rating for charged-device model ................................................................................................................... 4 Changed adjacent-channel rejection from 5 dB to 5 dB ..................................................................................................... 5
Changes from Revision A (May 2011) to Revision B
Page
Added the TPS62730 Compatible Features List .................................................................................................................. 1 Added the CC2540 WITH TPS62730 Applications .............................................................................................................. 2 Added CURRENT CONSUMPTION WITH TPS62730 characteristics ................................................................................ 6 Changed Table 1 ................................................................................................................................................................ 23 Added the TYPICAL CURRENT SAVINGS section ........................................................................................................... 23
Changes from Revision B (July 2011) to Revision C
Page
Changed on page 2, under CC2540...item 2 from Application Run Time to Battery Lifetime .............................................. 2 Corrected block diagram ....................................................................................................................................................... 3 In the OP-AMP CHARACTERISTICS table, changed several values in the TYP column ................................................... 9
27
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2011
PACKAGING INFORMATION
Orderable Device CC2540F128RHAR CC2540F128RHAT CC2540F256RHAR CC2540F256RHAT Status
(1)
Package Type Package Drawing VQFN VQFN VQFN VQFN RHA RHA RHA RHA
Pins 40 40 40 40
Package Qty 2500 250 2500 250
Eco Plan
(2)
Lead/ Ball Finish
MSL Peak Temp
(3)
Samples (Requires Login)
ACTIVE ACTIVE ACTIVE ACTIVE
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 27-Oct-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins Type Drawing VQFN VQFN VQFN RHA RHA RHA 40 40 40
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 16.4 16.4 16.4 6.3 6.3 6.3
B0 (mm) 6.3 6.3 6.3
K0 (mm) 1.5 1.5 1.5
P1 (mm) 12.0 12.0 12.0
W Pin1 (mm) Quadrant 16.0 16.0 16.0 Q2 Q2 Q2
CC2540F128RHAR CC2540F128RHAT CC2540F256RHAR
2500 250 2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 27-Oct-2011
*All dimensions are nominal
Device CC2540F128RHAR CC2540F128RHAT CC2540F256RHAR
Package Type VQFN VQFN VQFN
Package Drawing RHA RHA RHA
Pins 40 40 40
SPQ 2500 250 2500
Length (mm) 333.2 333.2 333.2
Width (mm) 345.9 345.9 345.9
Height (mm) 28.6 28.6 28.6
Pack Materials-Page 2
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What are the main features of the CC2540 chip?

What are the main features of the CC2540 chip?

What are some applications that can use the CC2540 chip?

What are some applications that can use the CC2540 chip?

CC2540F128, CC2540F256

www.ti.com SWRS084C OCTOBER 2010 REVISED NOVEMBER 2011

2.4-GHz Bluetooth low energy System-on-Chip

CC2540 WITH TPS62730

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Product Folder Link(s): CC2540F128 CC2540F256

RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0

ON-CHIP VOLTAGE REGULATOR

VDD (2 V3.6 V) DCOUPL

32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE

CLOCK MUX and CALIBRATION

POWER-ON RESET BROWN OUT

POWER MANAGEMENT CONTROLLER

PDATA XRAM IRAM SFR

ANALOG COMPARATOR FIFOCTRL 1 KB SRAM

AES ENCRYPTION AND DECRYPTION

Link Layer Engine

USB_N USB_P USB

TIMER 2 (BLE LL TIMER)

TIMER 3 (8-Bit) DIGITAL ANALOG TIMER 4 (8-Bit) MIXED

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ABSOLUTE MAXIMUM RATINGS (1)

RECOMMENDED OPERATING CONDITIONS

Core current consumption

0.9 0.4 6.7 90 90 60 70 0.6 1.2

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Product Folder Link(s): CC2540F128 CC2540F256

TEST CONDITIONS High-gain mode Standard mode

UNIT dBm dBm dBm dB dB dB dBm

1 MHz 2 MHz Including both initial tolerance and drift 250 80

Alternate-channel rejection (3)

kHz ppm dBm

(1) (2) (3) (4) (5)

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Product Folder Link(s): CC2540F128 CC2540F256

Programmable output power range Spurious emissions

CURRENT CONSUMPTION WITH TPS62730

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Product Folder Link(s): CC2540F128 CC2540F256

32-MHz CRYSTAL OSCILLATOR

Power-down guard time

Including aging and temperature dependency, as specified by [1]

32.768-kHz CRYSTAL OSCILLATOR

TYP 32.753 0.2% 0.4 3 2

UNIT kHz %/C %/V ms

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Product Folder Link(s): CC2540F128 CC2540F256

TYP 16 18% 0.6% 10