J-STD-004 - Requirements For Soldering FLuxes

AMERICAN NATIONAL
STANDARD
ANSI/J–STD-004
JANUARY 1995
JOINT
INDUSTRY
STANDARD
Requirements
for
Soldering
Fluxes
4th INTERIM FINAL
C IND
NI U
O
ST
E L E CT R
R I ES
EST. 1924
A
SO
S
O
C I ATI
Notice EIA and IPC Standards and Publications are designed to serve the public interest
through eliminating misunderstandings between manufacturers and purchasers,
facilitating interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for his
particular need. Existence of such Standards and Publications shall not in any
respect preclude any member or nonmember of EIA or IPC from manufacturing or
selling products not conforming to such Standards and Publications, nor shall the
existence of such Standards and Publications preclude their voluntary use by those
other than EIA or IPC members, whether the standard is to be used either domesti-
cally or internationally.
Recommended Standards and Publications are adopted by EIA and IPC without
regard to whether their adoption may involve patents on articles, materials, or pro-
cesses. By such action, EIA and IPC do not assume any liability to any patent
owner, nor do they assume any obligation whatever to parties adopting the Recom-
mended Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this joint standard was developed by the Flux Specifications Task
Group (5-22d).
APPROVED JUNE 1, 1995 AS AN
AMERICAN NATIONAL
STANDARD
AMERICAN NATIONAL STANDARDS INSTITUTE
For Technical Information Contact:
Electronic Industries Association The Institute for Interconnecting

Engineering Department and Packaging Electronic Circuits
2500 Wilson Boulevard 2215 Sanders Road
Arlington, VA 22201 Northbrook, IL 60646
Phone (703) 907-7500 Phone (847) 509-9700
Fax (703) 907-7501 Fax (847) 509-9798
Please use the Standard Improvement Form shown at the end of this
document.
Copyright © 1996 by the Electronics Industries Association and the Institute for Interconnecting and Packaging Electronic Circuits. All rights
reserved. Published 1996. Printed in the United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
JOINT J-STD-004
INDUSTRY
STANDARD
Requirements for
Soldering Fluxes
A joint standard developed by the Flux Specifications Task

Group of the Institute for Interconnecting and Packaging
Electronic Circuits
Users of this standard are encouraged to participate in the

development of future revisions.
Contact:
EIA IPC
Engineering Department 2215 Sanders Road
2500 Wilson Boulevard Northbrook, IL 60062-6135
Arlington, VA 22201 Phone (847) 509-9700
Phone (703) 907-7500 Fax (847) 509-9798
Fax (703) 907-7501
January 1995 J-STD-004
Acknowledgment
Members of the Flux Specifications Any Standard involving a complex below, it is not possible to include all
Task Group have worked to develop technology draws material from of those who assisted in the evolution
this document. We would like to a vast number of sources. While of this Standard. To each of them, the
thank them for their dedication to the principle members of the Flux members of the EIA and IPC extend
this effort. Specifications Task Group are shown their gratitude.
Joining Processes Committee Flux Specifications Task Group Technical Liaison of the
IPC Board of Directors
Chairman Chairman
David Schoenthaler Laura Turbini Bonnie Fena
AT&T Georgia Tech Hibbing Printed Circuits
Flux Specifications Task Group

Abbagnaro, L., Pace Inc. Hill, K., Hughes Aircraft Co. Officer, R. B., Lockheed Sanders Inc.
Bakszt, M., Ericsson Telecom AB Hinton, P., Hinton ‘‘PWB’’ Engineering Payne, R., Sundstrand Data Control
Baskin, Y., Superior Flux & Mfg. Co. Horvath, B., Superior Flux & Mfg. Co. Inc.
Bates, G., Sherwood Medical Hwang, J., H-Technologies Group, Inc. Prechter, J., Kester Solder
Beikmohamadi, A., E. I. Du Pont de Hymes, L., Les Hymes Associates Reed, J., Texas Instruments Inc.
Nemours and Co. Jawitz, M., Litton Guidance & Control Reithinger, M., Siemens AG
Bernier, D., Kester Solder Division System Rosser, J., Hughes Aircraft Co.
Bora, S., Smiths Industries Johnson, K., Hexacon Electric Co. Rumps, D., AT&T Technology
Bradshaw, C., Avex Electronics Inc. Kalenius, D., John Fluke Mfg. Co. Inc. Systems
Breunsbach, R., Electronic Controls Kenyon, W.G., Global Centre for Russell, J. H., Defense General
Design Inc. Process Change Supply Center
Brill, C., Amp Inc. Keusseyan, R., E. I. du Pont de Scheiner, D., Kester Solder Division
Brous, J., Alpha Metals Inc. Nemours and Co. Schneider, A., Alpha Metals Inc.
Carroll, T., Hughes Aircraft Co. Knopp, J., Boeing Defense & Space Schoenthaler, D., AT&T Bell Labs.
Cash, A., Northrop Corporation Group Sellers, R., EMPF
Chirdon,B., Superior Flux & Mfg. Co. Kraszewski, R., Kester Solder Division Slanina, J., Allied Signal Aerospace
Cormack, R., U.S. Navy Krska, C., Allied Signal Aerospace Slezak, E., Kester Solder Division
Couble, E., Shipley Co. Lambert, L., Digital Equipment Corp. Small, E., Multicore Solders
Culver, D., Bellcore Landolt, R., Enthone-OMI Inc. Socha, P., Indium Corp. of America
Davy, J. G., Westinghouse Electric Le, Q., Boeing Defense & Space Group Sovinsky, J., Indium Corp. of
Corp. Mackzum, S., Ericsson GE America
Deram, B., Kester Solder Division Maguire, J., Boeing Defense & Space Starosta, A., Eldec Corporation
Dodgen, D., Multicore Solders Group Strohmer, J., U.S. Department of
Down, W., Electrovert Inc. Mann, T., IBM Charlotte ECAT Defense
Duyck, D., Northern Telecom Canada McNicholl, B., Defense Electronic Supp, M., Kester Solder Division
Ltd. Supply Center Svensson, J., Ericsson Telecom AB
Elliott, D., Elliott Technologies Meeks, S., Lexmark International/IBM Sworin, C., Kester Solder Division
Evans, G., Indium Corp. of America Corp. Theroux, G., Honeywell Inc.
Evans, J., NASA HQ Minadeo, M., Trace Laboratories - Turbini, L., Georgia Institute of
Ewell, G., Aerospace Corp. East Technology
Falconbury, G., U.S. Navy Munie, G., AT&T Bell Laboratories Van Bibber, S., Hughes Aircraft Co.
Felty, J., Texas Instruments Inc. Munson, T., CSL Inc. Vargas, R., SCM Metal Products Inc.
Fish, D., Saturn Electronics & Nabhani, A., ESP Solder Plus Division/ Vaughan, D., E. I. Du Pont de
Engineering Inc. EFD Nemours and Co.
Gechter, J., Delco Systems Operations Nargi-Toth, K., Enthone-OMI Inc. Webb, J., Dexter Electronic Materials
Gonzalez, C., SCI Manufacturing Inc. Nicholas, R., London Chemical Co. Wilson, J., Jabil Circuit Company
Gundotra, V., Motorola Inc. Inc. Woodgate, R., Woodcorp. Inc.
Guth, L., AT&T Bell Laboratories Nielsen, R., Eastman Kodak Co. KAD Wooldridge, J., Rockwell
Hampshire, W., Tin Information Ctr.- Novick, D., Rockwell International International
N. America O’Day, P., U.S. Army Research Lab. Zachariah, J., Hi-Grade Alloy Corp.
Hiett, C., Martin Marietta
Astronautics
ii
Table of Contents
Figures
1.0 SCOPE AND DESIGNATION ................................. 1
Figure 1 Flux type classification by copper mirror test .... 4
1.1 Scope .................................................................... 1
Figure 2 Wetting balance curve ....................................... 5
1.2 Designation .......................................................... 1
2.0 APPLICABLE DOCUMENTS ................................... 2

Tables
2.1 Joint Standards..................................................... 2
2.2 Government ........................................................ 2 Table 1 Flux Identification, Materials of Composition,
Activity Levels .................................................... 1
2.3 International Standards Organization .................. 2
Table 2 Test Requirements for Flux Activity
2.4 The Institute for Interconnecting and Classification...................................................... 3
Packaging Electronic Circuits (IPC) ................... 2
Table 3 Typical Spread Areas Defined in mm2 .............. 6
2.5 American Society for Testing and Materials
Table 4 Solder Flux Test Method Classification ............. 7
(ASTM) ................................................................ 2
Table 5 Flux Form for Test ............................................. 8
3.0 REQUIREMENTS .................................................... 2
3.1 General Requirements.......................................... 2
3.2 Flux Classification and Testing .......................... 3
4.0 QUALITY ASSURANCE PROVISIONS .................. 6

4.1 Responsibility for Inspection............................... 6
4.2 Classification of Inspections................................ 6
4.3 Materials Inspection............................................. 6
4.4 Qualification Inspection....................................... 6
4.5 Performance Inspection ....................................... 6
4.6 Quality Conformance........................................... 6
4.7 Preparation of Fluxes for Testing ...................... 8
5.0 PREPARATION FOR DELIVERY ........................... 9

5.1 Preservation-packing and Packaging................... 9
6.0 NOTES ..................................................................... 9

6.1 Intended Use ........................................................ 9
6.2 Flux Composition ................................................ 9
6.3 Flux Activity ........................................................ 9
6.4 Flux and Cleaning Relationship .......................... 9
6.5 Ordering Data ...................................................... 9
6.6 Formic Acid ......................................................... 9
Appendix A ................................................................. 10
iii
Requirements for Soldering Fluxes
1.0 SCOPE AND DESIGNATION The requirements for soldering fluxes are defined in gen-
eral terms for standardized classification. In practice, where
1.1 Scope This standard prescribes general requirements more stringent requirements are necessary or other manu-
for the classification and testing of soldering fluxes for high facturing processes are used, these shall be defined as addi-
quality interconnections. This standard is a flux character- tional requirements by the user.
ization, quality control, and procurement document for sol-
der flux and flux containing material. 1.2 Designation For ordering purposes and designation
by other specifications, the following flux identification
1.1.1 Purpose This standard defines the classification of system shall be used. (See Table 1.)
soldering materials through specifications of test methods
and inspection criteria. These materials include: liquid flux,
paste flux, solder-paste flux, solder-preform flux, and flux
cored solder. It is not the intent of this standard to exclude
any acceptable flux or soldering aid material; however,
these materials must produce the desired electrical and
metallurgical interconnection.
Table 1 Flux Identification, Materials of Composition, Activity Levels1

Flux Materials of Composition2 Flux Activity Levels (% Halide)/Flux Type3 Flux Designator
Rosin Low (0%) L0 ROL0
(RO) Low (<0.5%) L1 ROL1
Moderate (0%) M0 ROM0
Moderate (0.5–2.0%) M1 ROM1
High (0%) H0 ROH0
High (>2.0%) H1 ROH1
Resin Low (0%) L0 REL0
(RE) Low (<0.5%) L1 REL1
Moderate (0%) M0 REM0
Moderate (0.5–2.0%) M1 REM1
High (0%) H0 REH0
High (>2.0%) H1 REH1
Organic Low (0%) L0 ORL0
(OR) Low (<0.5%) L1 ORL1
Moderate (0%) M0 ORM0
Moderate (0.5–2.0%) M1 ORM1
High (0%) H0 ORH0
High (>2.0%) H1 ORH1
Inorganic Low (0%) L0 INL0
(IN) Low (<0.5%) L1 INL1
Moderate (0%) M0 INM0
Moderate (0.5–2.0%) M1 INM1
High (0%) H0 INH0
High (>2.0%) H1 INH1
1
Fluxes of Type A–Y are available in S (Solid), P (Paste/Cream) or L (Liquid) forms
2
See paragraphs 6.2 and 6.3 for comparisons of RO, RE, OR and IN composition classes and L, M and H activity levels with the
traditional classes such as R, RMA, RA, water soluble and low solids ‘‘no-clean.’’
3
The 0 and 1 indicate absence and presence of halides, respectively. See paragraph 3.2.3 for an explanation of L, M and H
nomenclature.
1
J-STD-004 January 1995
2.0 APPLICABLE DOCUMENTS 2.3.35.1 Fluorides by Spot Test, Fluxes—Qualitative

The following documents of the issue currently in effect,
form a part of this specification to the extent specified 2.3.35.2 Fluoride Concentration, Fluxes—Quantitative
herein. In the event of a conflict between the text of this 2.4.14.2 Liquid Flux Activity, Wetting Balance Method
document and the references cited herein, the text of this
document takes precedence. Nothing in this document, 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method
however, supersedes applicable laws and regulations unless
a specific exemption has been obtained. 2.4.46 Spread Test, Liquid or Extracted Solder Flux, Sol-
der Paste and Extracted Cored Wires or Preforms
2.1 Joint Standards1
2.6.1 Fungus Resistance Printed Wiring Materials
J-STD-003 Solderability Tests for Printed Boards
2.6.3.3 Surface Insulation Resistance (SIR), Fluxes
2.2 Government 2
2.6.15 Corrosion, Flux
2
2.2.1 Military
2.5 American Society for Testing and Materials (ASTM)4
MIL-STD-45662 Calibration Systems Requirements
ASTM D-465 Acid Number of Rosin, Test Methods For
2.3 International Standards Organization3 ASTM D-1298 Density, Relative Density (Specific Grav-
ity), or API Gravity of Crude Petroleum and Liquid Petro-
ISO 9000 Quality Management and Quality Assurance
leum Products by Hydrometer Method
Standards Guidelines Selection and Use
ISO 9001 Quality Systems—Model for Quality Assurance 3.0 REQUIREMENTS

in Design/Development, Production, Installation and
3.1 General Requirements Except when otherwise
Servicing.
specified on the design or assembly drawings or instruc-
ISO 9002 Quality Systems—Model for Quality Assurance tions by the user, the soldering fluxes covered by this docu-
in Production and Installation ment shall conform with the following paragraphs.
2.4 The Institute for Interconnecting and Packaging 3.1.1 Conflict In the event of conflict between the
Electronic Circuits (IPC)1 requirements of this specification and other requirements of
the applicable acquisition documents, the precedence in
IPC-T-50 Terms and Definitions for Interconnecting and which documents shall govern, in descending order, is as
Packaging Electronic Circuits follows:
IPC-TM-650 Test Methods Manual 1. The applicable acquisition document
2. The applicable specification sheet/drawing
2.3.13Determination of Acid Value of Liquid Solder
Flux—Potentiometric and Visual Titration Methods 3. This specification
4. Applicable documents (see paragraph 2.0)
2.3.28Ionic Analysis of Circuit Boards—Chromatography
Method. 3.1.2 Terms and Definitions Definitions applicable to
this specification shall conform to IPC-T-50, and the fol-
2.3.32 Flux Induced Corrosion (Copper Mirror Method) lowing:
2.3.33 Presence of Halides in Flux, Silver Chromate
3.1.2.1 Form The flux is additionally classified accord-
Method
ing to the form that it takes—liquid (L), solid (S), or paste
2.3.34 Solids Content, Flux (P).
2.3.35 Halide Content, Quantitative (Chloride and Bro- 3.1.2.2 Inorganic Flux A solution of inorganic acids
mide) and/or salts.
1. Application for copies should be addressed to the IPC, 2215 Sanders Road, Northbrook, IL 60062-6135
2. Publications are available from Standardization Documents Order Dept., Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.
3. Publications are available from the International Standards Organization, 1 Rue de Varembe, Case Postale 56, CH-1211 Geneve 20 Switzerland
4. American Society for Testing Materials, 1916 Race Street, Philadelphia, PA 19103-1187
2
Table 2 Test Requirements for Flux Activity Classification

Quantitative
Conditions for
Qualitative Halide Halide
Passing 100
Silver Chromate Corrosion Megohm SIR8, 10
Flux Type1 Copper Mirror2,3 (Cl, Br)2,4 Spot Test (F)2 (Cl, Br, F)5 Test2,6 Requirements
L0 No evidence of Pass7 Pass7 0.0% Both cleaned
No evidence of
mirror and
L1 Pass 7
Pass 7
<0.5% corrosion
breakthrough uncleaned9,10
7 7
M0 Breakthrough in Pass Pass 0.0% Cleaned8
Minor corrosion
less than 50% or
M1 Fail11 Fail11 0.5 to 2.0% acceptable
of test area uncleaned9,10
7 7
H0 Breakthrough in Pass Pass 0.0%
Major corrosion
more than 50% Cleaned
H1 Fail11
Fail 11
>2.0% acceptable
of test area
1. 0 and 1 in Flux Type column indicate absence and presence of halide, respectively.
2. Qualitative
3. Refer to Figure 1.
4. If the total absence of covalently bonded halogens is required by the user the Beilstein test (Practical Organic Chemistry, Mann
and Saunders; A New Dictionary of Chemistry, Stephen Miall, Editor, Longmans Green & Co., 1940, p. 68) should be
performed.
5. Quantitative
6. A quantitative test for corrosion is currently under development.
7. False failure could result from non-halide constituents (see 3.2.4.2).
8. If the M0 or M1 flux passes SIR when cleaned, but fails when not cleaned, this flux shall always be cleaned.
9. Fluxes which are not meant to be removed require testing only in the uncleaned state.
10. If an assembly using no-clean flux is to be cleaned prior to conformal coating, then the user should verify the SIR values after
cleaning.
11. Depending on the type of halide, one or both tests will be failed.
3.1.2.3 Organic Flux Primarily composed of organic L = Low or no flux/flux residue activity
materials other than rosin or resin.
M = Moderate flux/flux residue activity
3.1.2.4 Resin Flux Primarily composed of natural resins H = High flux/flux residue activity
other than rosin types, and/or synthetic resins. These classes shall be further characterized using 0 or 1 to
indicate absence or presence of halide in the flux. Both the
3.1.2.5 Rosin Flux Primarily composed of natural resin, L, M, H and 0, 1 classifications shall be determined per the
extracted from the oleoresin of pine trees and refined. Con- test methods in Table 2.
sists of one or more of the following types of rosin: gum
rosin, wood rosin, tall oil rosin, modified or natural rosin. It is the responsibility of the material suppliers to charac-
The rosins used must have a minimum acid value of 130, terize their fluxes in accordance with the classification
as determined per ASTM D-465. requirements in this standard.
3.2.3.1 Flux Activity Classification In order to be classi-

3.2 Flux Classification and Testing fied as a specific type, a flux must meet all the character-
ization requirements as shown in Table 2.
3.2.1 Standard Classification for Products Fluxes used
in the process of soldering shall be classified according to Flux used for the soldering of electronic assemblies shall
the corrosive or conductive properties of the flux or flux be further assessed by the impact of flux residue on the
residue (Table 1). assembly’s performance. Conductive properties of the flux
residue shall meet the SIR requirements contained in
Table 2.
3.2.2 Composition Soldering fluxes shall also be classi-
fied according to the general chemical composition of the (It is conceivable that certain corrosive fluxes could meet
non-volatile portion. Based on a minimum 51% composi- one or more tests for the L-type flux. However, failure to
tion of the non-volatile portion, the flux shall be classified meet all test requirements will cause the given flux to be
as either rosin, resin, organic or inorganic (Table 1). classified as either type M or H.)
3.2.4 Flux Type Classification (Table 2)
3.2.3 Activity The soldering fluxes of Table 1 shall be
further classified by test requirements relating to the activ- 3.2.4.1 Copper Mirror Test The corrosive properties of
ity of the flux and it’s residue. Soldering fluxes shall be flux shall be determined in accordance with IPC-TM-650,
characterized according to one of the following three types: Test Method 2.3.32.
3
L M H
No Breakthrough Less Than 50% Breakthrough Greater Than 50% Breakthrough
Figure 1 Flux type classification by copper mirror test
3.2.4.2 Qualitative Halide Tests The following tests are 3.2.4.3.3 Flux Solids (Nonvolatile) Determination The
used to determine the presence of halides, specifically, determination of the amount of residual solids content of
chlorides (Cl), bromides (Br), and fluorides (F), in liquid liquid fluxes shall be made in accordance with IPC-TM-
fluxes or extracted flux solutions. 650, Test Method 2.3.34 or as agreed between the manu-
facturer and the user. For fluxes with solids contents less
3.2.4.2.1 Chlorides and Bromides by Silver Chromate than 10%, the solids content shall not differ by more than
Method The presence of chlorides and bromides shall be 10% of the manufacturer’s nominal value. For all other
determined in accordance with IPC-TM-650, Test Method fluxes, flux solids content shall not differ by more than 5%
2.3.33. of the manufacturer’s nominal value.
3.2.4.2.2 Fluorides By Spot Test The presence of fluo- 3.2.4.4 Corrosion Test The corrosive properties of flux
rides shall be determined in accordance with IPC-TM-650, residue shall be determined in accordance with IPC-TM-
Test Method 2.3.35.1. 650, Test Method 2.6.15.
3.2.4.3 Quantitative Halide Content Tests If the flux 3.2.4.5 Surface Insulation Resistance (SIR) Test The
fails the test in 3.2.4.2.1 and/or 3.2.4.2.2, the following surface insulation requirements for fluxes shall be deter-
tests shall be used to determine the concentration of chlo- mined in accordance with IPC-TM-650, Test Method
rides (Cl), bromides (Br), and fluorides (F), in liquid fluxes 2.6.3.3.
or extracted flux solutions. The halide content is reported
3.2.4.5.1 Reporting Flux Surface Insulation Resistance
as the equivalent weight percentage of chloride to the solid
Values When specifying the SIR test results, the supplier
(nonvolatile) portion of the flux. The solids content is
shall clearly indicate the type of cleaning procedure used
determined in accordance with 3.2.4.3.3. The total halide
prior to SIR testing (See Appendix A - Qualification Test
content of the flux is obtained by adding together the halide
Report). SIR values shall be measured at 24, 96, and 168
contents from sections 3.2.4.3.1 (Cl and Br) and 3.2.4.3.2
hours, while the specimen is still under elevated tempera-
(F). Ion chromatography is also an acceptable test method
ture and humidity. Specimens shall comply with the
for quantitative halide content.
requirements specified in Table 2 (100 megohms) measured
at 96 and 168 hours.
3.2.4.3.1 Chloride and Bromide Concentrations The
combined concentration of chlorides and bromides shall be 3.2.4.6 Fungus Test When specified in the procurement
determined in accordance with IPC-TM-650, Test Method document fungus resistance shall be evaluated in accor-
2.3.35 or Test Method 2.3.28. dance with IPC-TM-650, Test Method 2.6.1.
3.2.4.3.2 Fluoride Concentration For fluxes giving a 3.2.5 Qualification For qualification testing the flux ven-
positive result when tested per 3.2.4.2.2, the concentration dor shall perform the testing in accordance with tests listed
of fluorides shall be determined using IPC-TM-650, Test in Table 4 and complete a qualification test report (See
Method 2.3.35.2 or Test Method 2.3.28. Appendix A).
4
Instrument Zero
▼
▼
FORCE ( µ N)
Fmax
Corrected Zero
0 ▼ ▼
Tw
▼
TIME
J-I-002046
Figure 2 Wetting balance curve
3.2.6 Quality Conformance The following tests shall be If the stated shelf life on a product is expired, but the prod-
performed to evaluate product consistency per the flux uct meets the performance test, it may be used.
manufacturers technical data sheets. (See 4.6)
3.2.7.1 Wetting Balance Test (Optional) When speci-
3.2.6.1 Acid Value Determination The acid value of liq-
fied, the wetting balance shall be evaluated in accordance
uid flux shall be evaluated in accordance with IPC-TM-
with IPC-TM-650, Test Method 2.4.14.2. Using the coupon
650, Test Method 2.3.13.
as specified, the acceptance to satisfactory solderability
3.2.6.2 Flux Specific Gravity Determination For fluxes shall be defined as those fluxes which exhibit the follow-
with solids contents of 10% or less flux density shall be ing:
supplied within 0.003 g/ml from the nominal value at 1. A wetting time (Tw) for the wetting curve to cross the
specified temperature. For fluxes with solids higher than corrected zero axis after the start of the test in less than
10%, flux density shall be supplied within 0.005 g/ml from 2.0 seconds. (See Figure 2)
the nominal value at specified temperature. Density (spe-
2. A maximum wetting force, Fmax, taken after correction
cific gravity) determination shall be performed using the
for buoyancy (see J-STD-003) greater than the mini-
hydrometer method in accordance with ASTM D-1298
mum acceptance force of 150 micronewtons/mm.
(static method).
3. If the ‘‘dip and look’’ requirement is specified, the
3.2.6.3 Determination of Viscosity of Paste or Solder sample from the above procedure can be used, and a
Paste Flux The viscosity of the paste flux shall be evalu- minimum of 95% of the surface area immersed shall
ated in accordance with IPC-TM-650, Test Method exhibit good wetting.
2.4.34.4.
3.2.6.4 Visual The flux material shall be examined for 3.2.7.2 Spread Test—Liquid Flux (Optional) The solder
clarity and the absence of precipitation. spread may be determined by means of a flux wetting/
spreading test (static method) per IPC-TM-650, Test
3.2.7 Performance When specified, the following tests Method 2.4.46. (Table 3 is intended as an aid in defining
shall be used to determine the flux’s performance. areas in mm2.)
5
Table 3 Typical Spread Areas Defined in mm2 the required inspection(s), shall be established and main-
Diameter in mm Area in mm2 Circles tained or designated by the supplier. Establishment and
10.00 78.54 maintenance of a calibration system to control the accuracy
10.70 90.00* of the measuring and test equipment shall be in accordance
11.28 100.00**
with MIL-STD-45662.
* Minimum for L1
** Minimum for M1 4.1.3 Inspection Conditions Unless otherwise specified
herein, all inspections shall be performed in accordance
3.2.8 Labeling The manufacturer shall label each con- with the test conditions specified in Section 3.
tainer of solder flux with the following:
4.2 Classification of Inspections The inspections speci-
1. The manufacturer’s name and address.
fied herein are classified as follows:
2. The number of this standard and the soldering product
part number (see paragraph 6.6). 1. Materials Inspection (4.3)
3. The manufacturer’s designation of the flux . 2. Qualification Inspection (4.4)
4. The net mass of flux. 3. Performance Inspection (4.5)
5. The batch number. 4. Quality Conformance (4.6)
6. The date of manufacture.
4.3 Materials Inspection Materials inspection shall con-
7. Shelf life. sist of certification supported by verifying data that the
8. Any health, safety and environmental markings appli- materials used in compounding the flux, are in accordance
cable in the country of use. with the applicable referenced specifications or require-
ments prior to such compounding. The verifying data and
4.0 QUALITY ASSURANCE PROVISIONS certification applicable to a qualification test sample shall
be made a part of the qualification test report.
4.1 Responsibility for Inspection The flux manufacturer
is responsible for the performance of all inspection speci- 4.4 Qualification Inspection Qualification inspection
fied herein except the performance inspections which are shall be performed at a laboratory acceptable to the user on
the responsibility of the user. The flux manufacturer may samples produced with equipment and procedures normally
use its own or any other facilities suitable for the perfor- used in production.
mance of the inspections specified herein, unless disap-
proved by the user. The user reserves the right to perform 4.4.1 Sample Size Sample sizes shall be appropriate to
any of the inspections set forth in the specification where the solder form being inspected and the inspection being
such inspections are deemed necessary to ensure that sup- performed.
plies and services conform to prescribed requirements.
4.4.2 Inspection Routine The sample shall be subjected
4.1.1 Responsibility for Compliance Materials covered to the inspections specified in Table 4.
by this specification shall meet all requirements of Section
3. The inspection(s) excluding the performance inspections 4.5 Performance Inspection Performance Inspections
defined in this specification shall become a part of the con- are non-mandatory inspections and are for the benefit of
tractor’s overall inspection system or quality program. The the user.
vendor has responsibility of ensuring that all products or
supplies submitted to the user for acceptance comply with 4.6 Quality Conformance The material manufacturer
all requirements of the purchase order contract. shall perform those inspections necessary to insure that the
process is in control and to insure that the product is within
4.1.1.1 Quality Assurance Program When required by specification limit.
the user, a quality assurance program for material furnished
under this specification shall be established and maintained 4.6.1 Sampling Plan Statistical sampling and inspection
in accordance with ISO 9002, or as otherwise agreed on shall be in accordance with an approved quality program.
between user and manufacturer, and shall be monitored by (See 4.1.1.1).
the qualifying activity.
4.6.2 Rejected Lots If an inspection lot is rejected, the
4.1.2 Test Equipment and Inspection Facilities Test/ supplier may rework it to correct the defects, or screen out
measuring equipment and inspection facilities, of sufficient the defective units and resubmit for reinspection. Resub-
accuracy, quality, and quantity to permit performance of mitted lots shall be inspected using tightened inspection.
6
Table 4 Solder Flux Test Method Classification

Quality
Conformance
Inspection
Certificate of
Test Method Qualification Compliance Performance
Name (Reference Paragraph) IPC-TM-650
Materials
Copper Mirror (3.2.4.1) 2.3.32 X
Halides, Qualitative (3.2.4.2)
Silver Chromate (3.2.4.2.1) 2.3.33 X
Fluoride Spot (3.2.4.2.2) 2.3.35.1 X
Halides Quantitative (3.2.4.3)
Chloride, Bromide (3.2.4.3.1) 2.3.35 or X

2.3.28
Fluoride (3.2.4.3.2) 2.3.35.2 or X

2.3.28
Nonvolatile Determination (3.2.4.3.3) 2.3.34 X
Corrosion (3.2.4.4) 2.6.15 X
SIR (3.2.4.5) 2.6.3.3 X
Acid Value Determination (3.2.6.1) 2.3.13 X
Spread Test, Liquid Flux (3.2.7.2) 2.4.46 (O)
Wetting Balance (3.2.7.1) 2.4.14.2 (O)
Flux Specific Gravity Determination (3.2.6.2) X
Viscosity—Paste Flux (3.2.6.3) 2.4.34.4 X
Visual (3.2.6.4) X
Fungus (3.2.4.6) 2.6.1 (O)
(O) – Optional
7
Table 5 Flux Form for Test

Flux Material Copper Mirror Halides SIR Corrosion
1
Liquid flux as received X X X X
Paste flux as received X X X X
Solder paste as received X2 X X X
Melted & Extracted Solder Paste X2
Preforms as received X
Cored-wire as received X
Extracted preforms3 X X X
Extracted cored wire3 X X X
1
A flux containing >50% water may be oven dried at 80°C and reconstituted in an alcohol solvent for use in this test.
2
See 4.7.5 and 4.7.5.1
3
Extracted then concentrated/diluted
Such lots shall be separate from new lots, and shall be carefully pour the liquified hot solder-paste flux into Con-
clearly identified as reinspected lots. tainer No. 1 and allow to cool. Weigh Container No. 1 to
determine the weight of reflowed solder-paste flux. Add an
4.7 Preparation of Fluxes for Testing excess amount of 2-propanol solvent or other more suitable
solvent such that after evaporation a 25% by weight solu-
4.7.1 Flux Form for Test The form of the flux to be used tion of reflowed solder paste flux will result. Stir or agitate
for each classification test is shown in Table 5. the mixture as required. If a flocculent precipitate results,
this precipitate should be allowed to settle and the superna-
4.7.2 Liquid Fluxes Testing for flux and flux residue tant liquid used for subsequent tests. Store the solution in a
activity is done on liquid fluxes and other (liquid) fluxing closed container.
materials, such as flux thinners, infrared reflow fluids, sol-
dering (intermix) oils, preparation fluid (from inert atmo-
4.7.6 Other Materials Flux-cored solder wires and flux-
sphere soldering), etc., in the ‘‘as supplied’’ form.
cored solder preforms shall be extracted for testing, as
specified in paragraph 4.7.6.1 and 4.7.6.2. Testing for flux
4.7.3 Solid Fluxes Testing for flux activity will be done
extract activity shall be performed on extracts dissolved in
on material as a 35% weight percent solution in
a suitable solvent. Fluxes intended to be cleaned shall be
2-propanol, reagent grade (or other solvent recommended
tested as 10% solid solutions, while those no-clean flux
by the manufacturer).
extracts shall be tested as a 5% solid solution.
4.7.4 Paste Flux Testing for flux activity will be done on
material as a 35% weight percent solution in 2-propanol, reagent 4.7.6.1 Flux Extraction Procedure for Flux-Cored Sol-
grade (or other solvent recommended by the manufacturer). der Wire Cut a length of wire to correspond to approxi-
mately 150 grams. Seal the ends with a soldering iron.
4.7.5 Solder Paste Solder paste shall be tested as Wipe the surface clean with a cloth moistened with
received. If the solder paste, as received, does not pass the 2-propanol. Wind the wire around a 50 mm mandrel. Place
copper mirror test as an L-type flux, the reflowed solder the coil into a beaker filled with deionized water to cover
paste flux (see 4.7.5.1) may be used for the test. If this the coil and boil for 5–6 minutes. Decant, rinse the coil
passes in the L category, the solder paste flux shall be listed with 2-propanol and dry. Cut the wire into approximately 3
as an L for this test. mm lengths with a sharp blade. Discard the sealed ends of
the wire. Two containers are required. Container No. 1 may
4.7.5.1 Procedure for Preparing Reflowed Solder-Paste be a test tube or small beaker. Preferably container No. 2
Flux To assess the corrosivity of reflowed solder-paste should be a low-profile container, such as a Petri dish or
flux, the following sample preparation procedure shall be watch glass, to enhance heat transfer. Label Container No.
used. Two containers are required. Container No. 1 may be 1 and record its weight. Place the accumulated 3 mm
a test tube or small beaker. Preferably container No. 2 lengths in Container No. 2 and hold in a solder bath main-
should be a low-profile container, such as a Petri dish or tained at 215°C for 20 seconds beyond the time required
watch glass, to enhance heat transfer. Label Container No. for the pool of liquid solder alloy to form. While the solder
1 and record its weight. Place 10 grams of solder paste (A) is molten, carefully pour the liquified hot cored-solder flux
in Container No. 2 and hold in a solder bath maintained at into Container No. 1 and allow to cool. Weigh Container
215°C for 20 seconds beyond the time required for the pool No. 1 to determine the weight of the reflowed cored-solder
of liquid solder alloy to form. While the solder is molten, flux. Add an excess amount of 2-propanol or other suitable
8
solvent such that after evaporation a 10% by weight solu- 6.2 Flux Composition Low solids ‘‘no-clean’’ fluxes may
tion of reflowed cored- solder flux will result. For low sol- have rosin compositions (symbol RO), resin compositions
ids, no clean fluxes a 5% solution shall be used. Stir or (symbol RE), or they may be substantially free of rosins
agitate the mixture as required. If a flocculent precipitate and resins, in which case they are classified as organic type
results, this precipitate should be allowed to settle and the (symbol OR). They typically have type L or M activity
supernatant liquid used for subsequent tests. Store the solu- levels. Water soluble fluxes for electronic soldering appli-
tion in a closed container. cations and synthetic activated fluxes generally have
organic compositions (symbol OR). They typically have
4.7.6.2 Flux Extraction Procedure for Flux-Coated and type H activity levels.
Flux-Cored Preforms Two containers are required. Con-
tainer No. 1 may be a test tube or small beaker. Preferably 6.3 Flux Activity In order to illustrate an approximate,
container No. 2 should be a low-profile container, such as though not necessarily always accurate, analogy between
a Petri dish or watch glass, to enhance heat transfer. Label L, M, and H type fluxes with the traditional classes of
Container No. 1 and record its weight. Place 10 grams of rosin-based fluxes (R, RMA, RA, and RSA), as well as
solder preforms in Container No. 2 and hold in a solder other fluxes such as water soluble or synthetic activated
bath maintained at 215°C for 20 seconds beyond the time fluxes, the following guideline is offered:
required for the pool of liquid solder alloy to form. While L0 Type Fluxes – All R,
the solder is molten, carefully pour the liquified hot solder- Some RMA
preform flux into Container No. 1 and allow to cool. Weigh Some Low Solids ‘‘No-Clean’’
Container No. 1 to determine the weight of reflowed
solder-preform flux. Add an excess amount of 2-propanol L1 Type Fluxes – Most RMA,
or other suitable solvent such that after evaporation a 10% Some RA
by weight solution of reflowed solder preform flux will M0 Type Fluxes – Some RA,
result. For low solids, no clean fluxes a 5% solution shall Some Low Solids ‘‘No-Clean’’
be used. Stir or agitate the mixture as required. If a floccu-
lent precipitate results, this precipitate should be allowed to M1 Type Fluxes – Most RA, Some RSA
settle and the supernatant liquid used for subsequent tests. H0 Type Fluxes – Some Water Soluble
Store the solution in a closed container.
H1 Type Fluxes – Some RSA,
If the user requires an assessment of the as-received solid Most Water Soluble and Synthetic
or paste flux activity, paste or solid fluxes identical to those Activated
in the solder containing materials shall be obtained from a
supplier and applied to the test vehicles as 10 weight per- 6.4 Flux and Cleaning Relationship The type of flux
cent solutions in 2-propanol or other suitable solvent. If the used impacts cleaning requirements of the assembly, so any
flux component is a low-solids flux, a 5 weight percent changes in flux type, or cleanliness requirements may
solution in 2-propanol shall be used. require changes in cleaning method and test methods.
6.5 Ordering Data Purchasers should select the preferred
5.0 PREPARATION FOR DELIVERY
options permitted herein and include the following infor-
5.1 Preservation-packing and Packaging Unless other- mation in procurement documents:
wise specified, the preservation-packing, packaging, and a. Title, number, revision, and date of this specification
marking of soldering products shall be equivalent to or
better than the supplier’s standard commercial practice. b. Part number of product
c. Flux type or type symbol (see Table 1)
6.0 NOTES
d. Flux form
6.1 Intended Use This document is intended to be appli-
cable to all types of flux as used for soldering in general e. Viscosity
and to soldering in electronics particularly. The fluxes f. Viscosity tolerance, if different
involved relate to all aspects of application, such as for
g. Slump criteria, if different
wave soldering, PWB fabrication, lead tinning, and reflow,
and include those in solder pastes, flux-cored wire, and h. Tack criteria
flux-coated preforms. Soldering fluxes covered by this
i. Detailed requirements for nonstandard solder flux and/or
standard are intended for use in various consumer, indus-
solder flux characteristics, when specified
trial and commercial electronics soldering applications of
industry and, when adopted by government, in applications 6.6 Formic Acid Formic acid is not considered a flux for
on that government’s electronic hardware. the purposes of this document.
9
Appendix A
Qualification Test Report
I.D. Number:
Flux Classification: Date of Manufacture:
Original Use by Date:
Manufacturer’s Identification: Requalified Use by Date:
Manufacturer’s Batch Number: Original:
Date Original Qualification Tests Completed: Date Requalification Tests Completed:
Tested By: Pass: _ Tested By: Pass: _
Witnessed By: Fail: _ Witnessed By: Fail: _
Requirement
Certification Test Paragraph IPC-TM-650 Method Test Requirement Result Pass/Fail/NA
Copper Mirror 3.2.4.1 2.3.32
Halides Qualitative 3.2.4.2
Silver Chromate 3.2.4.2.1 2.3.33
Fluoride Spot 3.2.4.2.2 2.3.35.1
Halides Quantitative 3.2.4.3
Chloride, Bromide 3.2.4.3.1 2.3.35, 2.3.28
Fluoride 3.2.4.3.2 2.3.35.2
Nonvolatile 3.2.4.3.3 2.3.34

Determination
Total as Chloride 3.2.4.3.1
Corrosion 3.2.4.4 2.6.15
SIR 3.2.4.5 2.6.3.3 Cleaned

Not Cleaned
Fungus (optional) 3.2.4.6 2.6.1
Cleaning Procedure for Flux Characterization
Cleaning Material
Cleaning Equipment
Cleaning Process Parameters
10
The Institute for Interconnecting and Packaging Electronic Circuits Number
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.13
Subject
Determination of Acid Value of Liquid Solder
Flux—Potentiometric and Visual Titration Methods
Date Revision
1/95
IPC-TM-650 Originating Task Group
TEST METHODS MANUAL Flux Specifications Task Group (5-24a)
1.0 Scope This test method specifies two methods for the phthalein as an indicator.
determination of the acid value of a flux of types L, M. or H.
4.2.5 Ethanol/toluene mixture. Mix equal volumes of the
Method A is a potentiometric titration method and is to be
anhydrous ethanol (4.2.3) and toluene (4.2.4).
considered as the reference method.
Method B is an alternative, visual end-point, titration method. 4.2.6 Millivoltmeter or pH meter.
2.0 Applicable Documents 4.2.7 Glass electrode.

ISO 9455 Soft Soldering Fluxes, Test Methods
4.2.8 Saturated calomel, or silver chloride/silver, electrode.
IPC-TM-650 - Test Methods Manual
2.3.34 Solids Content, Flux 4.2.9 Magnetic or mechanical stirrer with variable speed
drive.
3.0 Test Specimen A minimum of 2.0 grams of liquid flux,
10 grams of solder paste, 150 grams of cored wire or 10 4.3 For titration with visual End-Point (Method B).
grams of solder preforms.
4.3.1 Ethanol, anhydrous. Neutralized with potassium
4.0 Apparatus and Reagents hydroxide, 0.1 M in alcohol (4.3.5), to a faint pink color using
phenolphthalein as an indicator.
4.1 General
1. Use only reagents of recognized analytical quality and only 4.3.2 Toluene. Neutralized with potassium hydroxide, 0.1 M
distilled or deionized water. in alcohol (4.3.5), to a faint pink color using phenolphthalein as
an indicator.
2. Ordinary laboratory apparatus.
4.3.3 Ethanol/toluene mixture. Mix equal volumes of the
4.2 For Potentiometric Titration Method (Method A). anhydrous ethanol (4.3.1 and toluene 4.3.2).
4.2.1 Tetrabutyl ammonium hydroxide. 0.1 M (0.1 mol/1). 4.3.4 2-Propanol. Neutralized with potassium hydroxide, 0.1
Use a commercially available standard solution or one pre- M in alcohol (4.3.1), to a faint pink color using phenolphthalein
pared from a commercially available concentrated standard
as an indicator.
solution by dilution with 2-propanol (4.2.2). Alternatively, pre-
pare an 0.1 mol/1 tetrabutyl ammonium hydroxide solution by
4.3.5 Potassium hydroxide solution. 0.1 M in alcohol. Use a
diluting commercial concentrated solution with 2-propanol
commercially available standard solution or one prepared from
and standardize this solution against an accurately weighed
a commercially available concentrated standard solution by
amount of benzoic acid (about 0.5 g) dissolved in dimethylfor-
dilution with ethanol (4.3.1). Alternatively, prepare an 0.1
mamide, previously neutralized to thymol blue.
Mol/1 potassium hydroxide solution by dissolving 3 +/–0.1 g
potassium hydroxide (KOH) in 500 ml of ethanol (4.3.1), and
4.2.2 2-Propanol. Neutralized with tetrabutyl ammonium
standardize this solution against an accurately weighed
hydroxide solution (4.2.1) to a faint pink color using phenol-
phthalein as an indicator. amount of benzoic acid (about 0.5 g) dissolved in ethanol
(4.3.1).
4.2.3 Ethanol. Anhydrous, neutralized with tetrabutyl ammo-
nium hydroxide solution (4.2.1) to a faint pink color using phe- 4.3.6 Phenolphthalein indicator solution. Add 1g of phenol-
nolphthalein as an indicator. phthalein to approximately 50 ml methanol and mix. When
dissolved, dilute to 100 ml with methanol and mix.
4.2.4 Toluene. Neutralized with tetrabutyl ammonium
hydroxide solution (4.2.1) to a faint pink color using phenol- 5.0 Procedures
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Page 1 of 3
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
IPC-TM-650
Number Subject Date
2.3.13 Determination of Acid Value of Liquid Solder Flux— 1/95
Potentiometric and Visual Titration Methods
Revision
5.1 Potentiometric Titration (Method A) 5.2.2 Carry out the following procedure, in triplicate, on the
flux sample.
5.1.1 By preliminary experiments, determine whether the
sample is soluble in 2-propanol, anhydrous ethanol, toluene or 5.2.2.1 Weigh, to the nearest 0.001 g sufficient of the flux
the ethanol/toluene mixture. If it is not completely soluble in sample to correspond to approximately 1 g of non-volatile
any of these solvents, select the one in which it appears to be matter (see IPC-TM-650, test method 2.3.34), taking steps in
the most soluble. If it is equally soluble in all four solvents then the case of liquid flux samples to prevent loss of volatile mat-
use 2-propanol. ter during the weighing.
5.1.2 Carry out the following procedure, in triplicate, on the 5.2.2.2 Transfer the weighed sample to a suitable flask or
flux sample. beaker and add 100 ml of the selected solvent. Stir until the
sample has dissolved as completely as possible. Do not heat.
5.1.2.1 Weigh, to the nearest 0.001 g, 2.0 to 5.0 g of the
liquid flux sample taking steps to prevent loss of volatile mat- 5.2.2.3 Add 3 drops of phenolphthalein indicator (4.3.6) and
ter during the weighing. The larger size sample is required for titrate with the potassium hydroxide (4.3.5) until a faint pink
very low solids fluxes. Transfer the weighed sample to a 250 color persists throughout the titrated solution for 15 seconds.
ml low form beaker.
5.2.2.4 Carry out blank determination, using all reagents, for
5.1.2.2 Dilute sample to 100 ml with 2-propanol, or the comparison purposes.
selected solvent (4.2.3 to 4.2.5), according to the solubility
characteristics of the flux. Cover with a watch glass and dis- 5.3 Calculation of Results The acid value is expressed in
solve the flux by gentle agitation. milligrams of potassium hydroxide per gram of non-volatile
matter, regardless of the alkali used to perform the titration.
5.1.2.3 Place the beaker on the stand of the titration assem-
bly with the electrodes, stirrer and burette in position. Adjust 5.3.1 The acid value (expressed in milligrams of potassium
the speed of the stirrer to give vigorous stirring without splash- hydroxide per gram of non-volatile matter) is given by:
ing. Titrate with the tetrabutyl ammonium hydroxide solution
(4.2.1), adding 1 ml portions and recording the pH, or mV 56.11 VM
meter readings after each addition. As the end point is mS
approached, reduce the additions of titrant to 0.1 ml and con- Where:
tinue titrating past the end point.
V is the volume, in ml, of alkali used (tetrabutyl ammonium
5.1.2.4 Plot the pH, or potential values against the volume hydroxide for method A, potassium hydroxide for method B).
of titrant added to obtain the titration curve. The point of M is the molarity of the alkali used.
inflection of the curve corresponds to the end-point of the
titration. m is the mass, in grams of the sample taken.
Note: The point of inflection of the curve may conveniently be S is the percentage non-volatile matter determined as
determined by using the derivative curve. described in IPC-TM-650, test method 2.3.34.
The acid value (expressed in milligrams of potassium hydrox-

5.1.2.5 Carry out a blank determination, using all reagents,
ide per gram of flux) is given by:
for comparison purposes.
56.11 VM
5.2 Visual Titration (Method B) m
5.2.1 By preliminary experiments, determine whether the 5.3.2 The acid value of the flux under test is calculated as
sample is soluble in 2-propanol anhydrous ethanol, toluene or the mean of the results obtained on each of the three test
the ethanol/toluene mixture. If it is not completely soluble in samples.
any of these solvents, select the one in which it appears to be
the most soluble. If it is equally soluble in all four solvents then 6.0 Notes
use ethanol as the selected solvent.
Page 2 of 3
IPC-TM-650
Number Subject Date
2.3.13 Determination of Acid Value of Liquid Solder Flux— 1/95
Potentiometric and Visual Titration Methods
Revision
6.1 Safety Operator should be trained and familiar with the

hazards inherent to the chemicals being used and analyzed.
Proper personal safety equipment, such as safety glasses,
gloves and splash apron, and adequate ventilation should be
used.
Page 3 of 3
Subject
Ionic Analysis of Circuit Boards Ion
Chromatography Method
Date Revision
1/95
TEST METHODS MANUAL New Methods Task Group (5-32f)
1.0 Scope 5.1 Extraction
l.0 This test procedure is designed to measure the level of 5.1.1 Record area of PWB. General rule on surface area is
anionic contaminants on the surface of circuit boards by ion (length x width x 2) + 10% for a populated PWB.
chromatography.
5.1.2 Use clean gloves when handling the samples to be
2.0 Applicable Documents tested, and then place each sample in the extraction bag.
IPC-TP-1043 ‘‘Cleaning and Cleanliness Test Program,

5.1.3 Prepare 75/25 IPA/H20 solutions for the extraction.
Phase Ill, Water Soluble Fluxes, Part 1: B-Z4, lnteractions of
Water Soluble Fluxes with Metal/Substrates. October, 1992.‘‘ 5.1.4 Add 100-250 mls of the extraction solution to the
IPC-TP-1044 ‘‘Cleaning and Cleanliness Test Program, extraction bag (enough to cover the PWB).
Phase III, Water Soluble Fluxes, Part 2: B-36, Comparison to
Phase 1 Rosin Benchmark’’, September 1992. 5.1.5 Heat seal the extraction bag and place in the 80°C
water bath for one hour (cut a vent hole in the bag).
3.0 Test Specimens
5.1.6 Measure solution volume after extraction.
3.1 Printed Wiring Board (PWB) for extraction
5.1.7 Prepare unprocessed PWB as control.
4.0 Apparatus and Material
5.2 Standard and Sample Analysis.
4.1 Dionex 4000i (Ion Chromatograph) or equivalent. The
system consists of a gradient pump and an anion column 5.2.1 Inject solution into Ion Chromatograph (IC) and calcu-
(AS4A-SC or equivelant), and a conductivity detector. A sys- late against known standards.
tem which is operating properly shou]d be capable of 50 ppb
or better. The equipment and chemistry should be set up and 5.2.2 Values from the IC are in the ppb in solution range.
standardized per manufacturers’ instructions.
5.2.3 Standards should be used per mfg. instruction. (Chlo-
ride levels of 100 ppb are recommended).
4.2 Hot Water Bath capable of holding 80°C ±5°C.
5.2.4 A calculation to take into account for surface area and

4.3 Use a clean heat sealable bag, ie. KAPAKT 500 series or
evaporation must be done so as to compare all different sizes
equivalent, with less than 250 ppb extractable contaminants.
of circuit boards.
(Specify cleanliness level or manufacturers’ part number.)
(ppb value from IC/1000) x (final volume/original volume)
ug/cm2 =
4.4 Cleanroom vinyl gloves. (<3ppm of Cl) Surface Area (cm2)
4.5 Hi-purity deionized water 18.3 meg-ohm grade and

chloride levels of less than 50 ppb.
4.6 Hi-purity chemicals for eluent and regenerant

preparation.
4.7 NIST traceable standards
4.8 2-Propanol (IPA), Electronic grade
5.0 Procedure
Subject
Flux Induced Corrosion (Copper Mirror Method)
Date Revision
1/95 C
1.0 Scope This test method is designed to determine the g of Federal Specification LLL-R-626 rosin into 100 ml of
removal effect the flux has (if any) on the bright copper mirror reagent grade 99% 2-propanol and stir thoroughly.
film which has been vacuum deposited on clear glass.
5.1.2 Preparation of Temperature/Humidity Chamber
2.0 Applicable Documents When acid or salt solutions, such as reported in ASTM E104,
are used the environment shall be monitored for a minimum of
ASTM E104 Maintaining Constant Relative Humidity by
48 hours prior to exposing the copper mirror samples, to
means of Aqueous Solutions
assure compliance with the 50% ± 5% relative humidity
LLL-R-626 Rosin, Gum, Rosin Wood and Rosin Tall Oil requirement.
3.0 Test Specimen A minimum of 100 ml of liquid flux, a 5.1.3 Preparation of Copper Mirror Test Panels.
representative container of solder paste, reflowed solder-
paste flux, extracted solder preform flux or extracted flux- 5.1.3.1 Apply by vacuum deposition, a film of copper metal
cored wire. on one surface of a flat sheet or clear, polished glass.
4.0 Apparatus and Reagents 5.1.3.2 Apply a uniform thickness of approximately 50 nm

and assure that the finished mirror permits 10 ± 5% transmis-
4.1 0.5L of control standard rosin flux, class A, type II, grade sion of normal incident light of nominal wave length of 500
WW, of LLL-R-626. nm. This may be determined using a suitable photoelectric
spectrophotometer. Commercially available copper mirrors
4.2 0.5L of reagent grade (99% pure) 2-propanol. meeting the above specifications are acceptable. (See 6.2.)
4.3 A vacuum deposition system or the means to procure 5.1.3.3 Prevent oxidation of the copper mirror by storing in
glass test panels having a copper mirror coating as described a closed container which has been flushed with nitrogen.
in paragraph 5 below.
5.1.3.4 Immediately before testing, immerse the copper mir-
4.4 0.5L of reagent grade 0.5% solution of ethylene diamine ror in a 5 g/l solution of EDTA for copper oxide removal. MIr-
tetra acetic acid (EDTA). rors stored in a non-oxidizing environment, do not require
cleaning with the EDTA solution prior to testing. The cleaning
4.5 0.5L of reagent grade ethanol or methanol. step must be used if test results are in dispute.
4.6 100 ml medicine bottle with dropper. 5.1.3.5 Rinse thoroughly in running water, immerse in clean
ethanol or methanol and dry with clean, oil free air.
4.7 Test cabinet capable of achieving 23 ± 2°C and 50 ± 5%
relative humidity. 5.1.3.6 Carefully examine the mirror before testing. There
must be no oxide.
4.8 Glass slides
5.2 Test
4.9 A relative humidity gauge having a ± 2% accuracy, or
better, shall be used to continuously monitor the test environ- 5.2.1 Place the copper mirror test panel on a flat surface,
ment. The gauge should be calibrated periodically. mirror side up, and protect from dust and dirt at all times.
5.0 Procedures 5.2.2 Place one drop of test flux or extract to be tested
(approximately 0.05 ml) on each copper mirror test panel. Do
5.1 Preparation not allow the dropper to touch the test panel.
5.1.1 Preparation of Control Standard Flux Dissolve 35 5.2.3 Solder-paste shall be applied directly to the mirror
IPC-TM-650
Number Subject Date
2.3.32 Flux Induced Corrosion (Copper Mirror Method) 1/95
Revision
C
L M H
No Breakthrough Less Than 50% Breakthrough Greater Than 50% Breakthrough
Figure 1 Flux type classification by copper mirror test
without scratching the copper mirror, with a volume approxi- 5.3.3 If the control flux fails, repeat the entire test, using new
mating a 0.5 mm thickness and 8 mm diameter. (It has been copper mirror test panels.
determined that significant variations from this quantity have
little effect for most materials.) 5.3.4 Discoloration of the copper film due to a superficial
reaction or only a partial reduction of the copper film thickness
5.2.4 Immediately also place one drop of the control stan- is not considered a failure.
dard flux adjacent to the test flux. Do not allow drops to
touch. 5.3.5 A number of chemicals can cause failure of copper
mirror: free halides, stronger organic and inorganic acids and
5.2.5 Place test panels in a horizontal position in the dust free amines.
free cabinet at 23 ± 2°C and 50 ± 5% relative humidity for 24
± 1/2 hours. 6.0 Notes
5.2.6 At the end of the 24 hour period, remove the test 6.1 Safety Observe all appropriate precautions on MSDS
panels and remove the test flux and control standard fluxes by for chemicals involved in this test method.
immersion in clean 2-propanol.
6.2 Sources for prepared copper mirrors
5.3 Evaluation
6.2.1 Evaporated Metal Films, Inc., Ithaca, NY 14850.
5.3.1 Carefully examine each test panel for possible copper
removal or discoloration. 6.2.2 Clausing PA Co., 8038 Monticello Ave., Skokie, IL,
708/267-3399
5.3.2 If there is any complete removal of the copper film as
evidenced by the background showing through the glass, the
test flux has failed the L category. Complete removal of the
copper only around the perimeter of the drop defines the flux
as M. Complete removal of the copper places the flux in the
H category. (See Figure 1).
Page 2 of 2
Subject
Presence of Halides in Flux, Silver Chromate
Method
Date Revision
1/95 C
1.0 Scope This test method is designed to determine the 5.3.2 Moisten a piece of silver chromate reagent paper of
presence (if any) of chlorides and bromides in soldering flux by suitable size with deionized water.
visual examination after placement on test paper.
5.3.3 Apply the wet paper to the glass slide and remove the
2.0 Applicable Documents None excess water with blotting paper.
3.0 Test Specimen A minimum of 100 ml of liquid flux, a 5.3.4 Using a spatula, apply a thin coating of the paste flux
representative container of solder paste, reflowed solder or solder paste flux directly to the moist reagent paper.
paste flux, extracted solder preform flux or extracted flux-
cored wire. 5.3.5 Allow the paste flux or solder paste flux to remain in
contact with the paper for 1 minute, then remove the flux with
4.0 Apparatus and Reagents 2-propanol without disturbing the paper.
4.1 Six pieces of silver chromate test paper 51 mm x 51 mm 5.4 Evaluation Carefully examine each test sheet for pos-
sible color change. A change to off-white or yellow-white indi-
4.2 0.25L of reagent grade 2-propanol. cates the presence of chlorides or bromides. See Figure 1.
5.0 Procedures 5.4.1 Interferences A number of chemicals besides free

halides may cause test failures. (Representative examples are,
5.1 Preparation but are not limited to, amines, cyanides, isocyanates, etc.)
a. The silver chromate paper is extremely light sensitive and
5.4.2 Certain acidic solutions may react with the reagent
must be stored in a closed container away from light until
paper to provide a color change similar to that obtained with
used for testing.
chlorides and bromides. When a color change is observed, it
b. To avoid contamination, the paper must be handled with
forceps and must never be touched with bare hands.
5.2 Test for Liquid Flux or Flux Extract Solution
5.2.1 Place one drop of test flux or flux extract (approxi-

mately 0.05 ml) on each piece of silver chromate test paper.
Allow the droplet to remain on each test paper for a minimum
of 15 seconds.
5.2.2 After the 15 seconds, immediately immerse each test

paper in clean 2-propanol to remove the residual organic
materials.
5.2.3 Allow each test paper to dry for 10 minutes, then

examine for color change.
5.3 Test for Paste Flux or Solder Paste Flux as Obtained

from the Supplier
5.3.1 Clean a glass microscope slide with 2-propanol and

air dry. Figure 1 Chlorides and/or bromides test results
IPC-TM-650
Number Subject Date
2.3.33 Presence of Halides in Flux, Silver Chromate Method 1/95
Revision
C
is advisable to check the acidity of the affected area by means

of a pH indicating paper. If pH values of less than 3 are
obtained, the presence of chlorides and bromides should be
verified by other analytical means.
6.0 Notes
6.1 Safety Observe all appropriate precautions on MSDS

for chemicals involved in this test method.
6.2 Source For Silver Chromate Test Paper
6.2.1 Quantek, PO Box 136, Lyndhurst, NJ 07071, (201)

935-4103
Page 2 of 2
Subject
Solids Content, Flux
Date Revision
1/95 B
1.0 Scope This test method is designed to determine the 5.3 Evaluation Calculate the residual solids as follows:
residual solids content of the liquid flux after evaporation of the
100 x m2
volatile chemicals from within the liquid flux; typically 15% by
weight minimum. m1
where:
2.0 Applicable Documents None
m2 = the mass of residual after drying, in grams
3.0 Test Specimen A minimum of 6 grams by weight per m1 = the mass of original test flux specimen, in grams
test of liquid flux or flux extracted from solder paste, solder
preforms or flux-cored wire. 6.0 Notes
4.0 Apparatus and Reagents 6.1 Sample Size Larger sample sizes may be required to
1. A circulating air drying oven capable of maintaining 85 ± obtain accurate data on low solids (<15%) fluxes.
5°C.
2. An analytical balance capable of weighing to the 4th deci- for chemicals involved in this test method.
mal of a gram.
3. Glass pipettes
4. Glass petri dish, 30 ml capacity

5. Silica gel desiccant, or equivalent, in a glass desiccator
6. Analytical balance capable of 0.001 g. Carry out the follow-
ing procedures in triplicate.
5.0 Procedures
5.1 Preparation
5.1.1 Dry 3 empty glass petri dishes in the drying oven, then
cool in the desiccator to room temperature.
5.1.2 Weigh each dish to the nearest 0.001 gram.
5.2 Test
5.2.1 Pipette approximately 6 grams (see 6.1) by weight of

test flux specimen into each specimen dish and weigh to the
nearest 0.001 gram.
5.2.2 Heat in the drying oven for one hour, then reweigh
after allowing the sample to come to room temperature.
5.2.3 Repeat heating and drying procedure until the weight

is constant to within 0.005 gram.
Subject
Halide Content, Quantitative (Chloride & Bromide)
Date Revision
1/95 B
1.0 Scope This test method is designed to determine the 5.1.1 For Rosin/Resin Fluxes
halide content of fluxes attributable to chlorides and bromides.
The halide content is reported as the weight percentage of 5.1.1.1 In a tared 100 ml beaker, accurately weigh about
chloride to the solid (non-volatile) portion of the flux or as mil- 3-5 g of flux sample on an analytical balance.
liequivalent per gram of flux solids. A sample of flux or flux
extract is tritrated to an end-point and the percentage chloride 5.1.1.2 Quantitatively transfer the flux sample to a 125 ml
or meq/g of halides is calculated. separatory funnel using three 10 ml aliquots of chloroform.
2.0 Applicable Documents: None 5.1.1.3 Add 15 ml of deionized water to the funnel and
shake the funnel for 10 seconds.
3.0 Test Specimen: A minimum of 100 ml of liquid flux,
10-50 ml flux extract of known solids content from solder 5.1.1.4 Allow the funnel to stand until the layers completely
paste, solder preforms or flux-cored wire. separate.
4.0 Apparatus and Reagents: 5.1.1.5 Draw off the bottom (chloroform) layer into a beaker
(1) Hot plate with magnetic stirrer. and save for the next extraction.
(2) Analytical balance capable of reading to 0.001 g.
5.1.1.6 Transfer the top (water) layer to a 125 ml Erlenmeyer
(3) Pipettes
flask.
(4) Burettes
(5) 100 ml beakers, Pyrex 5.1.1.7 Transfer the chloroform layer from the beaker to the
(6) 125 ml separatory funnel funnel and repeat the extraction with 15 ml of water two more
times, each time adding the water extract portion to the flask.
(7) 125 ml Erlenmeyer flasks
(8) 1000 ml volumetric flasks 5.1.1.8 Heat the water extract in the Erlenmeyer flask using
(9) Reagents a steam bath to expel any chloroform which may be present.
a. 0.1N silver nitrate, standardized: dissolve 17.000 g silver
5.1.1.9 Do not heat above 80°C. Allow for solution to cool
nitrate in deionized water and dilute to 1000 ml in a volu-
to room temperature.
metric flask.
b. 1M sodium hydroxide: 40.0 g of sodium hydroxide diluted 5.1.2 For Organic and Inorganic Fluxes
to 1000 ml with deionized water in a volumetric flask.
5.1.2.1 In a tared 125 ml Erlenmeyer flask, accurately weigh
c. 0.2M nitric acid: add 12.6 ml concentrated (16M) nitric
about 3-5 g of flux sample on an analytical balance.
acid to deionized water and dilute to 1000 ml in a volumet-
ric flask.
5.1.2.2 Add 50 ml deionized water.
d. 1M Potassium chromate: 194 g diluted to 1000 ml using
deionized water in a volumetric flask. 5.1.2.3 Add 2 drops of 0.03 M phenolphthalein solution to
e. 0.03M phenolphthalein solution. (Reagent Grade) the Erlenmeyer flask (from step 5.1.1.9 or 5.1.2.2).
f. Chloroform (Reagent Grade) 5.1.2.4 Add 1 M sodium hydroxide until the solution turns
g. Deionized water red. Add 0.2 M nitric acid dropwise until the red color is just
completely discharged.
5.O Procedures
5.1 Sample Preparation
IPC-TM-650
Number Subject Date
2.3.35 Halide Content, Quantitative (Chloride & Bromide) 1/95
Revision
B
5.1.2.5 Dulute to about 60 ml with deionized water.
5.1.2.6 Add 6 drops of 1 M potassium chromate and titrate

with standardized 0.1N silver nitrate to the red-brown end
point.
5.1.3 For extracted preforms and extracted cored-wire fol-

low the procedure in paragraph 5.1.1 if the extract contains a
rosin or resin; follow the procedure in paragraph 5.1.2 if the
extract is water soluble.
5.2 Calculations
5.2.1 Calculate the percentage of halides as chloride based

on flux solids content, using the following formula:
Halides, as % chlorides = 3.55 VN x 100
mS
5.2.2 Calculate halides milliequivalent per gram of flux solids

(non volatiles) using the following formula:
Halides, meq/g solids = V x N x 100
mS
Where:
V is the volume of 0.1N silver nitrate in ml.
N is the normality of silver nitrate solution.
m is the mass (weight) of flux sample in gram.
S is the percentage of solids (non-volatiles) of the flux.
6.0 Notes
6.1 Safety: Observe all appropriate precautions on MSDS

Page 2 of 2
2215 Sanders Road • Northbrook, IL 60062-6135 2.3.35.1
Subject
Fluorides By Spot Test, Fluxes—Qualitative
Date Revision
1/95
1.0 Scope This test method is designed to determine the 5.0 Procedure
presence (if any) of fluoride(s) in soldering flux by visual exami-
nation after placement of a drop of liquid test flux in a zirco- 5.1 Preparation
nium - alizarin purple lake.
5.1.1 Prepare a fresh zirconium - alizarin purple lake in three
2.0 Applicable Documents None spots of the white spot plate by adding 1 drop each of zirco-
nium nitrate and sodium alizarin sulfate solutions.
3.0 Test Specimen
5.2 Test
3.1 A minimum of 10 ml of first article or production speci-
men of liquid flux, solderpaste flux, paste flux, or extracted flux 5.2.1 Add one drop of the test flux to each of the spots.
from preform or wire furnished in a new clean glass container.
5.2.2 Mix each spot with a clean glass rod.
3.2 For paste flux or solder paste flux dilute the sample in
2-propanol or another suitable solvent. 5.2.3 Examine for any color change.
Note: The solvent used in dilution/extraction must be water
5.3 Evaluation A change in color of the lake from purple to
miscible.
yellow is an indication of the presence of fluoride(s).
4.0 Apparatus and Reagents
6.0 Notes
4.1 Apparatus
4.1.1 White spot plate
4.1. Glass droppers
4.1. Glass rods
4.2 Reagents:
4.2.1 Zirconium nitrate solution: 0.05g dissolved in 50 ml of

deionized water.
4.2.2 Sodium alizarin sulfate solution: 0.05g dissolved in 50

ml of deionized water.
Subject
Fluoride Concentration, Fluxes—Quantitative
Date Revision
1/95
1.0 Scope This test method is used to determine the con- 4.2 Reagents
centration of fluorides in soldering flux. The fluoride content is
reported as the weight percentage of fluoride to the non- 4.2.1 Deionized water
volatile portion of the flux. Ion specific electrodes are used for
the determination. This method uses Orion equipment and 4.2.2 Sodium fluoride, reagent grade
solutions.
4.2.3 Chloroform, reagent grade
4.2.4 Orion TISAB II #940909 or equivalent
3.0 Test Specimen
4.2.5 Whatman #41 ashless filter paper
3.1 A minimum of 100 ml of first article or production speci-
men of liquid rosin flux or prepared flux solution furnished in a 5.0 Procedure
new clean glass container.
5.1 Sample Preparation—Water Soluble Flux
3.2 For paste flux and solder paste flux 100 ml of the diluted Depending on the expected concentration of fluoride, use the
material. following amount of sample and deionized water.
ppm Fluoride Sample ml DI Water ml

3.3 For preform and cored wire 100 ml of the extracted
material. 0.1–1.0 25 50
1.0–10.0 5 50
5.1.1 Tare the beaker and add sample, record the weight
4.1 Apparatus
of the flux to 0.001 gram
4.1.1 Autocalibrating ion analyzer (Orion EA 920 or equiva-

5.1.2 Add DI water and mix with stirrer for 10 minutes. Stop
lent)
mixing and allow to stand for 5 minutes
4.1.2 Fluoride specific electrode (Orion 94-09-00 or equiva-

5.1.3 Pour solution through filter paper in funnel into a clean
lent)
beaker. Allow sample to drain completely
4.1.3 Double junction reference electrode (Orion 90-02 or

5.2 Sample Preparation—Non-water Soluble Flux
equivalent)
5.2.1 Depending on the expected concentration of fluoride,
4.1.4 Magnetic stirrer and stir bars
use the following amount of sample and chloroform.
4.1.5 250 ml and 500 ml beakers, glass or polypropylene ppm Fluoride Sample ml Chloroform ml
0.1–1.0 25 25
4.1.6 Funnel stand and funnel
1.0–10.0 5 5
4.1.7 50 ml graduated cylinders
5.2.2 Tare the beaker and add sample, record the weight of
4.1.8 100 ml and 1000 ml volumetric flasks the flux to 0.001 gram
4.1.9 10 ml and 100 ml pipets 5.2.3 Add chloroform and 50 ml DI water and mix with stir-
rer for 10 minutes. Stop mixing and allow to stand for 5 min-
4.1.10 Analytical balance capable of 0.001 g utes.
IPC-TM-650
Number Subject Date
2.3.35.2 Fluoride Concentration, Fluxes—Quantitative 1/95
Revision
5.2.4 Carefully decant the water solution through filter paper While stirring with a magnetic stirrer, immerse electrodes in
in funnel into a clean beaker. Allow sample to drain com- the more dilute standard solution. Adjust the display using
pletely. arrows or X10 keys to the correct value. When ‘‘Ready’’ illu-
minates, press ‘‘Enter.’’ The display automatically proceeds to
5.2.5 Standard Solutions ‘‘STD 2.’’
Remove and rinse electrodes with DI water. Immerse elec-

5.2.5.1 10 ppm fluoride (0.001%)—This standard can be
trodes in the more concentrated standard solution. Adjust the
purchased ready-to-use from Orion, catalog #040908. Alter-
display to read the correct value for STD 2. When ‘‘Ready’’
nately, a solution can be prepared. Weight 0.0221 gram (dried illuminates, press ‘‘Enter.’’ The display automatically proceeds
to 140°C) reagent grade NaF. Add 500 ml DI water. Dilute to to ‘‘Sample’’ function.
one liter in a volumetric flask with Orion catalog #940909
TISAB (total ionic strength adjustment buffer). To the sample prepared per instructions for water soluble flux,
add 25 ml TISAB. While stirring, immerse electrodes. When
5.2.5.2 1.0 ppm fluoride (0.0001%)—This standard can be display indicates ‘‘Ready,‘‘ record indicated value.
purchased ready-to-use from Orion, catalog #040906. Alter-
nately, a solution can be prepared. Weigh 0.0023 gram (dried 5.4 Evaluation The indicated value is equal to the parts per
to 140°C) reagent grade NaF. Add 500 ml DI water. Dilute to million (ppm) fluoride. To obtain weight % of fluoride as per-
one liter in a volumetric flask with Orion catalog #940909 centage of the non-volatile content, use the following formula:
TISAB. Fluoride % of Solids = I
(MS)100
5.2.5.2.1 Another method is to dilute 100 ml 10 ppm fluo-
ride standard with 450 ml DI water and dilute to one liter in a Where:
volumetric flask with Orion #940909 TISAB. 0.1 ppm fluoride I is indicated value in ppm
(0.00001%)—This standard is prepared by diluting 100 ml,
M is mass of the flux sample in grams
1.0 ppm fluoride standard with 450 ml DI water and dilute to
one liter in a volumetric flask with Orion catalog #940909 S is the percentage of solids (non-volatile chemicals) of the
TISAB. flux
5.2.5.2.2 Another method is to dilute 10 ml, 10 ppm fluoride 6.0 Notes

standard with 495 ml DI water and dilute to one liter in a volu-
metric flask with Orion catalog #940909 TISAB. 6.1 Standardization and Limits Restandardization should
be done every few hours to compensate for electrode drift.
5.2.6 Double Reference Electrode Filling Solutions
Reproducibility is typically ±2% obtainable with hourly recali-
Inner chamber filling solution (green). Solution saturated with bration. Temperature fluctuation, drift and noise will limit
AgCl, Orion catalog #900002. reproducibility.
Outer chamber filling solution. 10% KNO3 - Orion catalog Detection limits are 0.02 ppm minimum and no known maxi-
#900003. mum. A list of possible interfering ions has not yet been deter-
mined for this electrode method.
5.3 Test For accurate results, allow all samples and stan-
dards to reach the same temperature before attempting a 6.2 Safety Operator should be trained and familiar with the
measurement. Stir the samples and standards while a mea- hazards inherent to the chemicals being used and analyzed.
surement is being made. Proper personal safety equipment, such as safety glasses,
gloves and splash apron, and adequate ventilation should be
Prepare two standards that differ in concentration by a factor
used.
of 10. The standards should bracket the expected sample
concentration. Select concentration mode and STD 1 func- Using the same batch of DI water for dilutions will eliminate
tion. Significant digit selection is accomplished by pressing the the need to run blanks.
X10 key the required number of times.
Dilute 50 ml of the two standard solutions, each with 50 ml of

DI water.
Page 2 of 2
Subject
Liquid Flux Activity, Wetting Balance Method
Date Revision
1/95
1.0 Scope This test prescribes the recommended test sensitive at this temperature.
method for assessing the activity of liquid fluxes using a wet-
Solder composition shall be Sn60/Pb40 or Sn63/Pb37.
ting balance.
4.2 A chart recorder, data logger, or computer capable of

2.0 Applicable Documents
recording force as a function of time with a minimum recorder
ISO 1634 speed of 10 mm/s.
3.0 Test Specimen 4.3 A mechanical dipping device as shown in Figure 1 shall
be used. This device shall be present to produce an immer-
3.1 The test specimen shall be a copper coupon complying sion and emersion rate of 20–25 mm per second to a depth
with ISO 1634-CU-ETP Condition HA. The width shall be 6.0 of 6.0 ±0.1 mm and a dwell time of 5.0 ±0.5 seconds.
±0.25 mm wide; the length should be 25.0 ± 1 mm long or as
appropriate to the test equipment. The thickness shall be 0.5 5.0 Procedure
±0.05 mm.
5.1 Preparation
5.1.1 The test coupon should be cleaned (degreased) by
4.1 Apparatus immersion in a suitable solvent, then cleaned using a 10±1%
fluoroboric acid dip.
4.1 A meniscus force measuring device (wetting balance)
which includes a temperature-controlled solder pot containing 5.1.2 The coupon shall then be washed with water and
solder maintained at 245 ±3°C. Note: Reaction rate is very dried.
▼ LVDT
Signal Chart
Conditioner Recorder
(Transducer)
Relative Clamp
Motion
Copper
Coupon
▼
Solder
▼ Bath
Heater
Controls
IPC-I-002045
Figure 1 Wetting Balance Apparatus
IPC-TM-650
Number Subject Date
2.4.14.2 Liquid Flux Activity, Wetting Balance Method 1/95
Revision
5.2 Test 6.2 Correction for Buoyancy For the wetting balance to
obtain wetting force values that are relatable to one another, it
5.2.1 After mounting the specimen in a suitable holder, the is necessary to correct for the variability in specimen sizes, in
coupon should be immersed in the liquid flux at room tem- particular width and thickness. This is done by correcting for
perature to a minimum depth of 10 mm. the volume of the sample immersed in the solder. The follow-
ing formula may be used to calculate the buoyant force cor-
5.2.2 Excess flux is to be immediately drained off by stand- rection:
ing the specimen vertically on a clean filter paper for 1–5 sec- Pb = ρ gV
onds.
ρ = Density of solder @ 245°C (8.15g/cm3)*
g = Acceleration of gravity (9810 mm/s2)
5.2.3 After partial drying, it should be mounted in the test
V = Immersed volume of coupon (cm3)
equipment.
= width x thickness x immersion depth
5.2.4 The surface of the molten solder shall be skimmed just When the buoyancy force is calculated it should be used to
prior to immersing the specimen in the solder. correct the zero axis. This correction is required to obtain both
the proper measurement of wetting times as well as wetting
5.2.5 The specimen in its holder shall be held for approxi- forces. All measurements of wetting times and wetting forces
mately 10±1 second, 3 mm above the solder pot. The test must be made from the corrected zero axis. In the case of an
shall be started and the specimen immersed only once using upright curve, the new corrected zero axis will be below the
an immersion and emersion rate of 20–25 mm per second to instrument zero.
a depth of 5.0 ±0.1 mm and a dwell time of 5.0 ±0.5 seconds.
*For Sn60/Pb40 Alloy
5.2.6 During the test, the wetting curve shall be recorded on

a suitable device for use in the evaluation.
5.3 Evaluation Using the coupon as specified, fluxes

which shall be evaluated for the following:
1. A wetting time (Tw) for the wetting curve to cross the cor-
rected zero axis after the start of the test. (See Figure 2)
2. A maximum wetting force, Fmax, taken after correction for
buoyancy (See 6.2).
6.0 Note This test method can be useful in requalifying

materials that have exceeded the recommended shelf life. In
addition, the method can help evaluate fluxing power prior to
manufacturing operations on critical applications.

Page 2 of 3
IPC-TM-650
Number Subject Date
2.4.14.2 Liquid Flux Activity, Wetting Balance Method 1/95
Revision
Instrument Zero
▼
▼
FORCE ( µ N)
Fmax
Corrected Zero
0 ▼ ▼
Tw
▼
TIME
IPC-I-002046
Figure 2 Wetting Balance Curve

Note: The vertical force measured by the wetting balance is made up from two forces—the buoyancy force, and the wetting force caused by the contact
angle changing from initial non-wetting to wetting.
The buoyancy force may be considered during the test, and is equal to the weight of the solder displaced, when the specimen is immersed into the
solder.
The only changing force is the wetting force, caused by the changing contact angle, as the specimen solders.
The corrected zero (buoyancy) line is the force when the contact angle is 90°, or when the bath surface has returned to horizontal, having been initially
depressed by the immersed sample.
The wetting balance curve is centered on the corrected zero (buoyancy) line since the only parameter that changes during the test is the contact angle. θ.
See equation 1:
F=γ p cos θ - g ρv Equation 1
Buoyancy = gpv Equation 2
where
F = The measured force in micronewtons
γ = Surface tension of molten solder (400 µN mm-1)
p = Specimen perimeter in mm
θ = Contact angle
g = Gravitational acceleration (9.81 x 10-3 mm—sec-2)
ρ = Solder density (8000 µg mm-3)
v = immersed volume in mm3
The corrected zero line (buoyancy) is a fixed reference point from which the force measurements should be taken. This line should also be used as a
reference point for any time measurements.
Altering the specimen dimensions changes the immersed volume and hence the buoyancy, and so alters the position of the corrected zero line; but the
wetting curve still remains centered on this line. Similarly, any change in immersion depth will also alter the immersed volume, with the same effect on the
buoyancy.
Although use of the corrected zero line will cancel small variations in the specimen immersed volume and the immersion depth, large changes will affect
the rate of heat transfer into the specimen, which will affect both Tw, the time to recross the corrected zero (buoyancy) line and the time to reach F max.
Page 3 of 3
Subject
Paste Flux Viscosity − T-Bar Spindle Method
Date Revision
1/95
1.0 Scope This test method is designed to measure the 6.0 Notes
viscosity of paste flux.
2.0 Applicable Documents None for chemicals involved in this test method.
3.0 Test Specimen Enough paste flux to fill a container

with a minimum diameter of 4 cm to a minimum depth of
approximately 10 cm.
4.1 Brookfield RVT viscometer or equivalent with helipath

stand and a TC spindle.
4.2 Water bath capable of holding 25 +/-0.5°C.
4.3 Stopwatch
4.4 Spatula
5.0 Procedure
5.1 Test
5.1.1 Place container of paste flux in water bath at 25+/-

0.5°C.
5.1.2 When medium has attained thermal equilibrium, place

container under spindle so that it is at center of surface.
5.1.3 Start the Brookfield at 5 revolutions per minute and

start the Helipath stand on descend.
5.1.4 Two minutes after the spindle has cut into the top sur-
face of the medium, record the value. Check that spindle is
not touching bottom of container.
5.1.5 Remove spindle from the paste flux. Using spatula, stir
the flux vigorously for 15 to 20 seconds and remeasure
viscosity.
5.2 Expression of Results The viscosities are calculated

from the values recorded after 2 minutes of medium penetra-
tion. Both stirred and unstirred results should be quoted.
Subject
Spread Test, Liquid or Extracted Solder Flux,
Solder Paste and Extracted Cored Wires or
Preforms
Date Revision
IPC-TM-650 1/95
Originating Task Group
1.0 Scope This test method will give an indication of activ- 5.1.5 Cut the coil into individual rings to make a preform of
ity of wave solder fluxes, core solder fluxes, and solder paste. the solder.
2.0 Applicable Documents 5.2 Test
ASTM B-36 Brass Plate, Sheet, Strip, and Rolled Bar

5.2.1 Maintain solder pot at 260 +/–10°C.
J-STD-006 Requirements for Solder Wire
5.2.2 Place the preformed solder in the center of the test
3.0 Test Specimen coupon.
3.1 A minimum of 10 ml of first article or production speci- 5.2.3 Place one drop (0.05ml) of flux in center of preform on
men of liquid flux furnished in a new clean glass container. the test coupon.
3.2 For paste flux and solder paste flux 10 ml of the diluted 5.2.4 Carefully place the coupon on the surface of the sol-
der bath for 15 seconds.
material (35%).
5.2.5 Remove the coupon in a horizontal position and place

3.3 For preform and cored wire 10 ml of the extracted mate-
on a flat surface allowing the adhered solder to solidify undis-
rial.
turbed.
5.2.6 Remove all flux residue with a suitable solvent.
4.1 Five (5) replicates of 0.25 mm thick 70/30 brass (per

5.3 Evaluation
ASTM-B-36 C2600 HO2) approximately 40 x 75 mm.
5.3.1 Measure the solder spread area by comparing to
4.2 Degreased steel wool #00.
circles (pre-drawn) with areas similar to those listed in Table 1.
The mean of the spread of all five samples tested is to be
4.3 Sn60 1.5 mm diameter Type S solid wire solder per reported.
J-STD-006.
Table 1 is intended as an aid in defining areas in mm2.
4.4 Solder pot containing at least 2 kg of solder and no less
than 25 mm in depth. Table 1 Typical Spread Areas Defined in mm2
Diameter in mm Area in mm2
5.0 Test 10.00 78.54
10.70 90.00
5.1 Specimen Preparation 11.28 100.00
5.1.1 Clean five (5) brass coupons with steel wool. 6.0 Notes
5.1.2 Using a flat strip of brass, bend the opposite ends 6.1 Safety Observe all appropriate precautions on MSDS
parallel to the curve of the metal coil to stiffen and flatten the for chemicals involved in this test method.
test coupon.
5.1.3 Cut a 30 mm length of solid wire solder
5.1.4 Wrap the cut length of solder around a 3 mm mandrel.
Subject
Fungus Resistance Printed Wiring Materials
Date Revision
1/95 D
1.0 Scope The fungus resistance test is used to determine 5.1.1 Mineral-Salts Solution Prepare the solution to con-
the resistance of materials to fungi and to determine if such tain the following:
material is adversely affected by fungi under conditions favor-
Potassium dihydrogen orthophosphate (KH2PO4) ............0.7g
able for their development, namely high humidity, warm atmo-
sphere, and presence of inorganic salts. Potassium monohydrogen orthophosphate (K2HPO4)......0.7g
Magnesium sulfate heptahydrate (MgSo4 7H2O...............0.7g

Ammonium nitrate (NH4NO3)............................................1.0g
3.0 Test Specimen Specimens must be a minimum size of
Sodium chloride (NaCl).................................................0.005g
50 mm x 50 mm with copper foil (if applicable) removed by
etching using standard commercial practices. Ferrous sulfate heptahydrate (FeSo4 7H2O) .................0.002g
Zinc sulfate heptahydrate (ZnSO47H2O) .......................0.002g

Manganous sulfate monohydrate (MnSO4 H2O) ...........0.001g
4.1 Test Chamber The autoclave shall be capable of main-
Distilled water .............................................................1000 ml
taining 30°C and 95% relative humidity and an ultra violet (360
nm) source for subsequent decontamination. Provisions shall Sterilize the mineral salts solution by autoclaving at 121°C for
be made to prevent condensation from dripping on the test 20 minutes. Adjust the pH of the solution by the addition of
item. There shall be free circulation of air around the test item 0.01 normal solution of NaOH so that after sterilization the pH
and the contact area of fixtures supporting the test item shall is between 6.0 and 6.5. Prepare sufficient salts solution for the
be kept to a minimum. required tests.
4.2 Sterilizer 5.1.2 Purity of Reagents Reagent grade chemicals shall

be used in all tests. Unless otherwise specified, it is intended
4.3 Centrifuge that all reagents shall conform to the specification of the Com-
mittee on Analytical Reagents of the American Chemical Soci-
4.4 pH Meter ety, where such specifications are available.
4.5 Colony Counter 5.1.3 Purity of Water Unless otherwise specified, refer-
ences to water shall be understood to mean distilled water or
4.6 Incubator water of equal purity.
4.7 Dishwasher 5.1.4 Preparation of Mixed Spore Suspension The fol-

lowing test fungi shall be used:
4.8 Petri Dishes
Description ATCC
4.9 Filter Paper Aspergillus niger ..............................................................9642
Chaetomium globosum ...................................................6205

4.10 Media Solutions
Gliocladium virans ...........................................................9645
4.11 Microorganism
Aureobasidium pullulans..................................................9348
4.12 Atomizer, 15,000 ± 3000 spores Penicillium funiculosum....................................................9644
5.0 Procedures 5.1.5 Maintain cultures of these fungi separately on an

appropriate medium such as potato dextrose agar. However,
5.1 Preparation of Test Media the culture of chaetomium globosum shall be cultured on
IPC-TM-650
Number Subject Date
2.6.1 Fungus Resistance Printed Wiring Materials 1/95
Revision
D
strips of filter paper on the surface of mineral salts agar. (Min- 5.1.17 Repeat this operation for each organism used in the
eral salts agar is identical to mineral salts solution, but con- test and blend equal volumes of the resultant spore suspen-
tains in addition 15.0 g of agar per liter). sion to obtain the final mixed spore suspension. The spore
suspension may be prepared fresh each day or may be held
5.1.6 The stock cultures may be kept for not more than 4 at 6° ± 4°C for not more than 7 days.
months at 6°± 4°C, at which time subcultures shall be made
and new stocks shall be selected from the subcultures. 5.2 Viability of Inoculum Control With each daily group
of tests, place each of 3 pieces of sterilized filter paper, 25
5.1.7 If genetic or physiological changes occur, obtain new mm x 25 mm square, on hardened mineral-salts agar in sepa-
cultures as specified above. Subcultures used for preparing rate Petri dishes. Inoculate these with the spore suspension
new stock cultures or the spore suspension shall be incu- by spraying the suspension from a sterilized atomizer until ini-
bated at 30°C for 9 to 12 days or longer. tiation of droplet coalescence. Incubate these at 30°C at a
relative humidity not less than 85% and examine them after 7
5.1.8 Prepare a spore suspension of each of the five fungi days of incubation. There shall be copious growth on all three
by pouring into one subculture of each fungus, a 10-ml por- of the filter paper control specimens. Absence of such growth
tion of a sterile solution containing 0.05 g per liter of a non- requires repetition of the test.
toxic wetting agent such as sodium dioctyl sulfosuccinate or
sodium lauryl sulfate. 5.3 Control Items
5.1.9 Use a sterile platinum or nichrome inoculating wire to 5.3.1 In addition to the viability of inoculum control, known
scrape gently the surface growth from the culture of the test susceptible substrates shall be inoculated along with the test
organism. item to insure that proper conditions are present in the incu-
bation chamber to promote fungus growth.
5.1.10 Pour the spore charge into a sterile 125-ml glass-
stoppered Erlenmeyer flask containing 45 ml of sterile water 5.3.2 The control items shall consist of cotton duck 8.25-
and 50 to 75 solid glass beads, 5 mm in diameter. ounce strips that are 5 cm, that have been dipped into a solu-
tion containing 10% glycerol, 0.1% potassium dihydrogen
5.1.11 Shake the flash vigorously to liberate the spores from orthophosphate (KH 2 PO 4 ), 0.1% ammonium nitrate
the fruiting bodies and to break the spore clumps. (NH4NO3), 0.025% magnesium sulfate (MgSO4 7H2O), and
0.05% yeast extract (pH 5.3), and from which the excess liq-
5.1.12 Filter the dispersed fungal spore suspension, through uid has been removed.
a 6 mm layer of glass wool contained in a glass funnel, into a
sterile flask. 5.3.3 The strips should be hung to air dry before being
inoculated and placed into the chamber.
5.1.13 This process should remove large mycelial fragments
and clumps of agar which could interfere with the spraying 5.4 Inoculation of Test and Control Item
process.
5.4.1 Mount the test and control items on suitable fixtures or
5.1.14 Centrifuge the filtered spore suspension aseptically suspend from hangers. No cleaning of the test item shall be
and discard the supernatant liquid. permitted for 72 hours prior to the beginning of the fungus
test.
5.1.15 Resuspend the residue in 50 ml of sterile water and
Equipment handling prior to and during the fungus test shall
centrifuge. Wash the spores obtained from each of the fungi
be accomplished without contamination of the equipment.
in this manner three times.
5.4.2 Precondition the chamber and its contents at: 30°C

5.1.16 Dilute the final washed residue with sterile mineral-
and 97 ± 2% relative humidity for at least 4 hours.
salts solution in such a manner that the resultant spore sus-
pension shall contain 1,000,000 ± 200,000 spores per ml as
determined with a counting chamber.
Page 2 of 3
IPC-TM-650
Number Subject Date
2.6.1 Fungus Resistance Printed Wiring Materials 1/95
Revision
D
5.4.3 Inoculate the test and control items with the mixed 6.2 Secondary Sources for Microorganisms
fungus spore suspension (3.1.2) by spraying it on and into the
test and control items (if not hermetically sealed) in the form of 6.2.1
a fine mist from a previously sterilized atomizer or nebulizer. In
Pioneering Research Division
spraying the test and control items, care should be taken to
U.S. Army Natick Laboratories
spray all surfaces which are exposed during use or mainte-
Natick, Massachusetts 01760
nance. If the surfaces are nonwetting, spray until initiation of
droplet coalescence. Incubation is to be started immediately
6.2.2.
following the inoculation.
USDA Northern Regional Research Center
5.5 Test Incubation of Test Items 1815 North University St.
Peoria, IL 61604
5.5.1 Incubate test items under cyclic temperature and Contact: Dr. Stephen Peterson
humidity conditions to include 20 hours of relative humidity at 309-685-4011
95 ± 5% at an air temperature of 30° ± 1°C followed by 4
hours of 100% relative humidity at 25° ± 1°C. 6.3 After evaluation, the materials and the test chamber
must be decontaminated by exposure on all sides to ultravio-
5.5.2 After 7 days, inspect the growth on the control items let rays (360 nm) for a minimum of two hours, or sprayed with
to be assured that the environmental conditions are suitable a solution of 1:750 zephiran chloride solution. (One part zephi-
for growth. If inspection reveals that the environmental condi- ran chloride to 750 parts distilled water).
tions are unsuitable for growth, the entire test shall be
repeated. 6.4 Safety Observe all appropriate precautions on MSDS
5.5.3 If the control items show satisfactory fungus growth,
continue the test for a period of 28 days from the time of
inoculation, or as specified.
5.6 Evaluation
5.6.1 Report those specimens which were found to be nutri-

ent to fungus growth.
5.6.2 Corrosion should be noted separately from the fungus

test results.
6.0 Notes
6.1 Source for Microorganisms
6.1.1
American Type Culture Collection

12301 Parklawn Drive
Rockville, MD 20852 USA
(301) 881-2600 TELEX: 908768 ATCC ROVE
Page 3 of 3
Subject
Surface Insulation Resistance, Fluxes
Date Revision
1/95 A
1.0 Scope This test method is to characterize fluxes by 4.2 A power supply capable of producing a standing bias
determining the degradation of electrical insulation resistance potential of 45–50 volts DC with a tolerance of ±10%.
of rigid printed wiring board specimens after exposure to the
specified flux. This test is carried out at high humidity and heat 4.3 A resistance meter capable of reading high resistance
conditions. (1012ohms) with a test voltage of 100 volts or an ammeter
capable of reading 10-10 amps in combination with 100 volts
2.0 Applicable Documents DC power supply.
IPC-B-24 Surface Insulation Resistance Test Board 4.4 Three 2000 ml beakers
IPC-A-600 Acceptability Guidelines
4.5 Exhaust ventilation hood.
3.0 Test Specimens
4.6 Metal tongs.
3.1 Comb Patterns Use the IPC-B-24 test pattern which
4.7 Soft bristle brush
consists of four comb patterns per coupon. The individual
comb, pictured in Figure 1, has 0.4 mm lines and 0.5 mm
4.8 Deionized or distilled water (2 megohm-cm, minimum
spacing. The test coupon shall be unpreserved bare copper
resistivity recommended).
metallization.
4.9 Drying oven capable of maintaining at least 50°C.
3.2 Laminate The laminate material for this test shall be
FR-4 epoxy-glass. 5.0 Test
4.0 Apparatus 5.1 Test Conditions All fluxes will be tested at 85 ±2°C,
85±2% relative humidity for 168 hours.
4.1 A clean test chamber capable of programming and
recording an environment of 25 +10/-2°C to at least 85 ±2°C 5.2 Specimen Preparation There shall be 3 test coupons
and 85% ±2% relative humidity. A salt solution and desiccator for each liquid flux to be tested in the cleaned state (see Table
may be used to maintain humidity if a tight temperature con- 1, A). When testing liquid fluxes which are intended to remain
trol is maintained on the temperature of the chamber. in the uncleaned state, six test coupons are required. Three
uncleaned test coupons shall be wave soldered pattern side
down (Table 1, B) and three shall be wave soldered pattern
side up (Table 1, C).
Solder paste coupons shall be reflowed pattern side up and
either cleaned (Table 1, D) or not cleaned (Table 1, E). In addi-
tion, there shall be at least 2 unprocessed control coupons for
comparison purposes (Table 1, F).
5.2.1 Positive, permanent and non-contaminating identifica-

tion of test specimens is of paramount importance. (For
example, a vibrating scribe.)
5.2.2 Visually inspect the test specimens for any obvious

defects, as described in IPC-A-600. If there is any doubt
about the overall quality of any test specimen, the test speci-
men should be discarded.
Figure 1 Typical ‘‘Comb Pattern’’ (from IPC-B-24)
IPC-TM-650
Number Subject Date
2.6.3.3 Surface Insulation Resistance, Fluxes 1/95
Revision
A
Table 1 Coupons for SIR Testing 5.3.1.2 Solder Paste Stencil print the solder paste on to
the comb pattern using a 0.2 mm thick stencil (the IPC-A-24
Number of
Sample Group Flux/Solder Clean Coupons
artwork contains the stencil design).
A yes yes 3
5.3.1.2.1 The samples shall be run through a reflow solder-
B yes no 3 ing process using the temperature profile recommended by
C yes no 3 the vendor.
D yes yes 3
E yes no 3 5.3.2 Cleaning of Samples
F no no 2
5.3.2.1 After exposure to flux and solder, samples to be
A = Pattern down/clean tested in an uncleaned state shall be evaluated as in 5.3.3
B = Pattern down/no clean
C = Pattern up/no clean
through 5.4.1.
D = Solder paste/reflow/clean
E = Solder paste/reflow/no clean 5.3.2.2 After exposure to flux and solder, samples to be
F = Control (precleaned, unprocessed) tested in the cleaned state shall be cleaned using one of the
procedures listed below. The cleaning parameters shall be
5.2.3 Clean the test coupon with deionized or distilled water reported in the Qualification Test Report (Appendix A).
and scrub with a soft bristle brush for a minimum of 30 sec-
onds. Spray rinse thoroughly with deionized or distilled water. 5.3.2.2.1 The samples to be cleaned shall be cleaned with
Rinse cleaned area thoroughly with fresh 2-propanol. an appropriate environmentally safe solvent or aqueous clean-
ing medium. The use of a commercial in-line or batch cleaner
An alternative cleaning method is to place the test coupon in is preferred. If this is not available, the following laboratory
an ionic contamination tester containing 75% 2-propanol, cleaning process shall be followed.
25% deionized water and process the solution until all ionics
have been removed. Three samples shall be cleaned (within 30 minutes or less)
after soldering. For solvent or aqueous detergent cleaning,
During the remainder of the specimen preparation, handle test three 2000 ml beakers each containing 1000 ml of solvent
specimens by the edges only, or use non-contaminating rub- shall be used such that one beaker serves as the primary
ber gloves. cleaning stage and the other two are used for rinsing pur-
poses. Each test coupon shall be agitated in each beaker for
5.2.4 If boards are to be stored before treatment, place the 1 minute. In the case of aqueous detergent, one beaker shall
boards in Kapak bags or other contamination-free containers contain the cleaning agent and the remaining beakers shall
and close bags (do not heat seal). (Kapak bags are available contain deionized water for rinsing purposes. After the clean-
from Fischer, VWR and other distributors). ing procedure is complete, samples are dried for 2 hours at
50°C. Following cleaning, the specimens shall be tested as
5.3 Procedure outlined in 5.3.3 through 5.4.1.
5.3.3 Preparation of Samples for Chamber Visually

5.3.1 Sample Preparation Flux application and soldering.
inspect all combs and discard any combs with bridging of
conductors. Use water white rosin to solder teflon-insulated
5.3.1.1 Liquid Flux or Flux Extract Coat the comb pat-
wires to the connection points of the specimens. Do not
tern with a thin coating of the liquid flux or flux extract under
attempt to remove the flux residues. Connectors may be used
test.
in lieu of soldering wires but are not recommended. In the
event of a dispute, the samples with soldered wires shall be
5.3.1.1.1 The test coupons shall be exposed to solder by
used as a referee.
floating the fluxed comb patterns of the test specimens face
down on the solder pot at 245-260°C for 4 ±1 seconds. Wave 5.3.4 Place the specimens in the environmental chamber in
solder of comb patterns face down at 245-260°C and a con- a vertical position such that the air flow is parallel to the direc-
veyor speed with a contact time of 3 ±1 seconds. For fluxes tion of the board in the chamber. Set the chamber tempera-
to be tested in the uncleaned state, a second set of comb ture at 85±2°C and humidity at 20% RH and allow the oven
patterns shall be fluxed and floated pattern up on the solder to stabilize at this temperature for 3 hours. Then, slowly ramp
pot or passed pattern up over the solder wave. the humidity to 85±2% over a minimum 15 minute period.
Page 2 of 4
IPC-TM-650
Number Subject Date
Revision
A
Allow the specimens to come to equilibrium for at least 1 hour densation on the cooler oven window can be blown around
before applying the bias voltage to begin the test. If a salt the oven as microdroplets which deposit on test specimens
solution and dessicator are used for humidity, specimens shall and cause dendritic growth if the spots bridge the distance
be held for 24 hours before beginning the test. between two electrified conductors. Both of these conditions
must be eliminated for proper testing.
5.3.5 Connect the 45–50v DC voltage source to the speci-
men test points to apply the bias voltage to all specimens. 6.2 IPC-B-24 test board artwork and electronic data is avail-
able from IPC.
5.4 Measurements
5.4.1 Measurements shall be made with test specimens in

the chamber under the test conditions of temperature and
humidity at 24, 96 and 168 hours. To take these measure-
ments, the 45 - 50v DC bias voltage source must be removed
from the test specimen and a test voltage of -100v DC shall
be applied. (Test voltage polarity is opposite the bias polarity.)
5.5 Evaluation
5.5.1 Each comb pattern on each test specimen shall be

evaluated by the insulation resistance values obtained at 96
and 168 hours. If the control coupon readings are less than
1000 megohms, a new set of test coupons shall be obtained
and the entire test repeated. The reading at 24 hours may fall
below the required value provided that it recovers by 96
hours. Any reason for deleting values (scratches, condensa-
tion, bridged conductors, outlying points, etc., must be
noted).
5.5.2 All specimens shall also be examined under a 10x to

30x microscope using backlighting within 24 hours of com-
pleting the testing. If the coupons are to be held longer, they
shall be placed in Kapak or other noncontaminating container
and stored in a dessicator. All samples must be evaluated
within 7 days. If dendritic growth or corrosion is observed, it
shall be determined if the dendrite spans 25% or more of the
original spacing. This latter condition will constitute a failure. It
should be determined whether dendritic growth is due to con-
densation from the chamber (see paragraph 6.1).
5.5.3 Rejection of results for more than 2 combs for a given

condition shall require the test to be repeated.
6.0 Notes
6.1 If condensation occurs on the test specimens in the

environmental chamber while the samples are under voltage,
dendritic growth will occur. This can be caused by a lack of
sufficient control of the humidification of the oven. Water spot-
ting may also be observed in some ovens where the air flow
in the chamber is from back to front. In this case, water con-
Page 3 of 4
IPC-TM-650
Number Subject Date
Revision
A
Appendix A
Qualification Test Report
I.D. Number:
Certification Test IPC-TM-650 Method Test Requirement Result Pass/Fail/NA
Copper Mirror 2.3.32
Halides Qualitative
Silver Chromate 2.3.33
Fluoride Spot 2.3.35.1
Halides Quantitative
Chloride, Bromide 2.3.35, 2.3.28
Fluoride 2.3.35.2
Nonvolatile Determination 2.3.34
Total as Chloride
Corrosion 2.6.15
SIR 2.6.3.3 Cleaned

Not Cleaned
Fungus (optional) 2.6.1
Cleaning Material
Cleaning Equipment
Page 4 of 4
Subject
Corrosion, Flux
Date Revision
1/95 B
TEST METHODS MANUAL Flux Specifications Task Group (5-22d)
1.0 Scope This test method is designed to determine the 5.1.1.1 Ammonium persulphate (25% m/v in 0.5% v/v sulfu-
corrosive properties of flux residues under extreme environ- ric acid). Dissolve 250 g of ammonium persulphate in water
mental conditions. A pellet of solder is melted in contact with and add cautiously 5 ml of 5% sulphuric acid (relative density
the test flux on a sheet metal test piece. The solder is then 1.84). Mix, cool, dilute to 1 liter and mix. This solution should
exposed to prescribed conditions of humidity and the result- be freshly prepared.
ing corrosion, if any, is assessed visually.
5.1.1.2 Sulfuric acid (5% v/v). To 400 ml of water cautiously
2.0 Applicable Documents add 50 ml of sulfuric acid (relative density 1.84). Mix, cool,
dilute to 1 liter and mix.
IPC-TM-650 Test Methods Manual
2.3.34 Solids Content, Flux 5.1.2 Test Panel
British Standard Institute BS5625 Specification of Purchas- 5.1.2.1 Cut a 0.50 ±0.05 mm thick piece of 99% pure cop-
ing Requirements and Methods of Test for Fluxes for Soft Sol- per 51 mm x 51 mm for each test.
dering
5.1.2.2 Form a circular depression in the center of each test
3.0 Test Specimen At least 0.035 g of flux solids, 1 g sol- panel 3.2 mm deep by forcing a 19 mm steel ball into a 25.4
der paste, 1 g wire, or 1 g preform with an equivalent amount mm hole to form a cup.
of solids. Flux solids are defined as the residue from the sol-
ids content, fluxes test described in IPC-TM-650, Test 5.1.2.3 Bend one corner of each test panel up to facilitate
Method 2.3.34. All solvent must have been evaporated from subsequent handling with tongs.
the specimen in a chemical fume hood.
5.1.3 Pre-treating Test Panels
5.1.3.1 Immediately before performing test, pretreat as fol-
1. Solder pot
lows using clean tongs for handling.
2. Humidity chamber capable of achieving 50 ±2°C and 95 ±
A. Degrease with a suitable neutral organic solvent such as
2% relative humidity.
acetone, toluene, or petroleum ether.
3. Air circulating drying oven
B. Immerse in 5% sulfuric acid (by volume) at 65 ±5°C for 1
4. Microscope having 20X minimum minute to remove the tarnish film.
5. Chemicals: All chemicals must be reagent grade and water C. Immerse in a solution of 25% m/v ammonium persulphate
must be distilled or demineralized: (0.5% v/v sulfuric acid) at 23 ±2°C for 1 minute to etch the
surface uniformly.
a. Ammonium persulphate
D. Wash in running tap water for a maximum of 5 seconds.
b. Sulfuric acid, % v/v
E. Immerse in 5% sulfuric acid (by volume) at 23 ±2°C for 1
c. Degreasing agent, Acetone, Toluene, or Petroleum minute.
ether.
F. Wash for 5 seconds in running tap water, then rinse thor-
6. Analytical balance capable of weighing 0.001 g oughly in demineralized water.
5.0 Procedures G. Rinse with acetone.
H. Allow to dry in clean air.

5.1 Preparation
5.1.3.2 Use the test piece as soon as possible or store up
5.1.1 Chemicals to 1 hour in a closed container.
IPC-TM-650
Number Subject Date
2.6.15 Corrosion, Flux 1/95
Revision
B
5.1.4 Preparation of Test Solder 5.2.9 Expose specimens to the above environment for 240
hours (10 days). M and H may be tested in the cleaned, as
5.1.4.1 Weigh 1.00 gram ±0.05 gram specimen of solder for well as uncleaned, condition.
each test and place in center of depression of each test panel.
5.3 Evaluation Carefully examine specimens prior to plac-
5.1.4.2 Degrease solder specimen with a suitable neutral ing them in the environmental chamber. Note any discolora-
organic solvent such as acetone, toluene, or petroleum ether. tion.
5.1.4.3 Solder may be in the form of pellets or by forming 5.3.1 After the appropriate exposure period, remove test
tight spirals of solder wire. specimens from humidity chamber, examine at 20X magnifi-
cation and compare with observations noted in paragraph
5.2 Test 5.2.5.
5.2.1 Heat solder pot so that solder bath stabilizes at 235 ± 5.3.2 Corrosion is described as follows:
5°C.
A. Excrescences at the interfaces of the flux residue and cop-
per boundary, or the residues or discontinuities in the resi-
5.2.2 Liquid Flux Place 0.035 g of flux solids into the
dues.
depression in the test panel. Add solder sample.
B. Discrete white or colored spots in the flux residues.
5.2.2.1 Solder Paste, Cored-Wire or Cored-Preform
Place 1 g of solder paste, flux-cored wire or cored-preform 5.3.3 An initial change of color which may develop when the
into the depression in the test panel. test panel is heated during soldering is disregarded, but sub-
sequent development of green-blue discoloration with obser-
5.2.3 Using tongs, lower each test panel onto the surface of vation of pitting of the copper panel is regarded as corrosion.
the molten solder.
6.0 Notes
5.2.4 Allow the test panel to remain in contact until solder
specimen in the depression of the test panel melts. Maintain 6.1 Definition of Corrosion For purposes of this test
this position for 5 ±1 seconds. method, the following definition of corrosion shall prevail. ‘‘A
chemical reaction between the copper, the solder, and the
5.2.5 Carefully examine test specimen at 20X magnification constituents of the flux residues, which occurs after soldering
for subsequent comparison after humidity exposure. Record and during exposure to the above environmental conditions.’’
observations, especially any discoloration.
6.2 Color photos before and after the test are valuable tools
5.2.6 Preheat test panel to 40 ±1°C for 30 ±2 minutes. in identifying corrosion. (See 5.2.5.)
5.2.7 Preset humidity chamber to 40 ±1°C and 93 ±2% 6.3 Safety Observe all appropriate precautions on MSDS
relative humidity. for chemicals involved in this test method.
5.2.8 Suspend each test specimen vertically (and sepa-

rately) in the humidity chamber.
Page 2 of 2
Standard Improvement Form J-STD-004
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the subject standard. appropriate committee(s). 2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847 509.9798
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Requirement, paragraph number
Test Method number , paragraph number
The referenced paragraph number has proven to be:

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2. Recommendations for correction:
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Our home page provides access to information about upcoming events, publications and videos, membership, and
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Education and Training

IPC conducts local educational workshops and national conferences to help you better understand emerging
technologies. National conferences have covered Ball Grid Array and Flip Chip/Chip Scale Packaging. Some workshop
topics include:
Printed Wiring Board Fundamentals High Speed Design
Troubleshooting the PWB Manufacturing Process Design for Manufacturability
Choosing the Right Base Material Laminate Design for Assembly
Acceptability of Printed Boards Designers Certification Preparation
New Design Standards
IPC video tapes and CD-ROMs can increase your industry know-how and on the job eff ectiveness.
For more information on programs, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org
For more information on IPC Video/CD Training, contact Mark Pritchard
tel 505/758-7937 ext. 202 fax 505/758-7938
e-mail: markp@taos.newmex.com
http://www.ipc.org
Training and Certification

IPC-A-610 Training and Certification Program
“The Acceptability of Electronic Assemblies” (ANSI/IPC-A-610) is the most widely used specification for the PWB
assembly industry. An industry consensus Training and Certification program based on the IPC-A-610 is available to
your company.
For more information, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org/html/610.htm
IPC Printed Circuits Expo

IPC Printed Circuits Expo is the largest trade exhibition in North America devoted to the PWB industry. Over 90
technical presentations make up this superior technical conference.
April 28-30, 1998 March 16-18, 1999

Long Beach, California Long Beach, California
For more information, contact Kim Behr

tel 847/509-9700 ext. 319 fax 847/509-9798
e-mail: behrki@ipc.org http://www.ipc.org
How to Get Involved

The first step is to join IPC. An application for membership can be found on page 74.
Once you become a member, the opportunities to enhance your competitiveness are vast. Join a technical committee
and
learn from our industry’s best while you help develop the standards for our industry. Participate in market research
programs which forecast the future of our industry. Participate in Capitol Hill Day and lobby your Congressmen and
Senators for better industry support. Pick from a wide variety of educational opportunities: workshops, tutorials, and
conferences. More up-to-date details on IPC opportunities can be found on our web page: http:/www.ipc.org.
For information on how to get involved, contact:
Jeanette Ferdman, Membership Manager
tel 847/509-9700 ext. 309 fax 847/509-9798
e-mail: JeanetteFerdman@ipc.org http://www.ipc.org
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INDEPENDENT the merchant market.
PRINTED BOARD
MANUFACTURERS WHAT PRODUCTS DO YOU
MAKE FOR SALE?
n One-sided and two-sided rigid printed n Flexible printed boards n Discrete wiring devices
boards n Flat cable n Other interconnections
n Multilayer printed boards n Hybrid circuits
Name of Chief Executive Officer/President___________________________________________________________________
■
Our facility assembles printed wiring boards on a contract basis and/or offers other electronic interconnection products for sale.
INDEPENDENT
PRINTED BOARD
ASSEMBLERS n Turnkey n Through-hole n Consignment
EMSI COMPANIES n SMT n Mixed Technology n BGA
n Chip Scale Technology
Name of Chief Executive Officer/President ________________________ _
■ Our facility purchases, uses and/or manufactures printed wiring boards or other electronic interconnection products for our own
OEM – use in a final product. Also known as original equipment manufacturers (OEM).
MANUFACTURERS
OF ANY END IS YOUR INTEREST IN:
PRODUCT n purchasing/manufacture of printed circuit boards
USING
PCB/PCAS n purchasing/manufacturing printed circuit assemblies
OR CAPTIVE
MANUFACTURERS What is your company’s main product line? __________________________________________________________________
OF PCBS/PCAS
■ Our facility supplies raw materials, machinery, equipment or services used in the manufacture or assembly of electronic inter-
INDUSTRY connection products.
SUPPLIERS What products do you supply?_____________________________________________________________________________
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$1,000,000.00. **Please provide proof of annual sales.
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Chicago, IL 60678-3491 Northbrook, IL 60062-6135

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PLEASE ATTACH BUSINESS CARD

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2215 Sanders Road Tel 847 509.9700
Northbrook, Illinois Fax 847 509.9798
60062-6135 URL: http://www.ipc.org
J–STD-004
JANUARY 1995
Amendment 1 April 1996
JOINT
INDUSTRY
STANDARD
Requirements
for
Soldering
Fluxes
Amendment 1
C IND
NI U
O
ST
E L E CT R
R I ES
EST. 1924
A
SO
S
O
C I ATI
Notice EIA and IPC Standards and Publications are designed to serve the public interest
through eliminating misunderstandings between manufacturers and purchasers, facili-
tating interchangeability and improvement of products, and assisting the purchaser
in selecting and obtaining with minimum delay the proper product for his particular
need. Existence of such Standards and Publications shall not in any respect pre-
clude any member or nonmember of EIA or IPC from manufacturing or selling prod-
ucts not conforming to such Standards and Publications, nor shall the existence of
such Standards and Publications preclude their voluntary use by those other than EIA
or IPC members, whether the standard is to be used either domestically or interna-
tionally.
Recommended Standards and Publications are adopted by EIA and IPC without
regard to whether their adoption may involve patents on articles, materials, or pro-
cesses. By such action, EIA and IPC do not assume any liability to any patent owner,
nor do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting themselves
against all claims of liabilities for patent infringement.
The material in this joint standard was developed by the Solder Alloy Task Group
(5-24c).
For Technical Information Contact:
Electronic Industries Association The Institute for Interconnecting

Engineering Department and Packaging Electronic Circuits
2500 Wilson Boulevard 2215 Sanders Road
Arlington, VA 22201 Northbrook, IL 60062-6135
Phone (703) 907-7500 Phone (847) 509-9700
Fax (703) 907-7501 Fax (847) 509-9798
Please use the Standard Improvement Form shown at the end of this
document.
Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
April 1996 J-STD-004, Amendment 1
Requirements for Soldering Fluxes

Amendment 1
Table 1 Delete and replace with the following:
Table 1 Flux Identification, Materials of Composition, Activity Levels

Flux Materials of Composition2 Flux Activity Levels (% Halide)/Flux Type1,3 Flux Designator
Rosin Low (0/ %) L0/ ROL0/
(RO) Low (<0/ .5%) L1 ROL1
Moderate (0/ %) M0/ ROM0/
Moderate (0/ .5–2.0/ %) M1 ROM1
High (0/ %) H0/ ROH0/
High (>2.0/ %) H1 ROH1
Resin Low (0/ %) L0/ REL0/
(RE)
Low (<0/ .5%) L1 REL1
Moderate (0/ %) M0/ REM0/
Moderate (0/ .5–2.0/ %) M1 REM1
High (0/ %) H0/ REH0/
High (>2.0/ %) H1 REH1
Organic Low (0/ %) L0/ ORL0/
(OR) Low (<0/ .5%) L1 ORL1
Moderate (0/ %) M0/ ORM0/
Moderate (0/ .5–2.0/ %) M1 ORM1
High (0/ %) H0/ ORH0/
High (>2.0/ %) H1 ORH1
Inorganic Low (0/ %) L0/ INL0/
(IN) Low (<0/ .5%) L1 INL1
Moderate (0/ %) M0/ INM0/
Moderate (0/ .5–2.0/ %) M1 INM1
High (0/ %) H0/ INH0/
High (>2.0/ %) H1 INH1
1
Fluxes are available in S (Solid), P (Paste/Cream) or L (Liquid) forms.
2
See paragraphs 6.2 and 6.3 for comparisons of RO, RE, OR and IN composition classes and L, M and H activity levels with the
traditional classes such as R, RMA, RA, water soluble and low solids ‘‘no-clean.’’
3
The 0/ and 1 indicate absence and presence of halides, respectively. See paragraph 3.2.3 for an explanation of L, M and H
nomenclature.
Para 6.5 Delete: ‘‘c. Flux type or type symbol (see Table 1)’’
Replace with: c. Flux designator (see Table 1)
1
J-STD-004, Amendment 1 April 1996
Appendix A Delete and replace as follows:
Appendix A Qualification Test Report
I.D. Number:
Requirement
Certification Test Paragraph IPC-TM-650 Method Test Requirement Result Pass/Fail/NA
Copper Mirror 3.2.4.1 2.3.32
Halides Qualitative 3.2.4.2
Silver Chromate 3.2.4.2.1 2.3.33
Fluoride Spot 3.2.4.2.2 2.3.35.1
Halides Quantitative 3.2.4.3
Chloride, Bromide 3.2.4.3.1 2.3.35, 2.3.28
Fluoride 3.2.4.3.2 2.3.35.2
Nonvolatile 3.2.4.3.3 2.3.34

Determination
Total as Chloride 3.2.4.3.1
Corrosion 3.2.4.4 2.6.15
SIR 3.2.4.5 2.6.3.3 Cleaned

Not Cleaned
Fungus (optional) 3.2.4.6 2.6.1
Cleaning Material
Cleaning Equipment
2
Standard Improvement Form J-STD-004
The purpose of this form is to provide the Individuals or companies are invited to If you can provide input, please complete
Technical Committee of IPC with input submit comments to IPC. All comments this form and return to:
from the industry regarding usage of will be collected and dispersed to the IPC
the subject standard. appropriate committee(s). 2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847 509.9798
1. I recommend changes to the following:

Requirement, paragraph number
Test Method number , paragraph number
The referenced paragraph number has proven to be:

Unclear Too Rigid In Error
Other
2. Recommendations for correction:
3. Other suggestions for document improvement:
Submitted by:
Name Telephone
Company E-mail
Address
City/State/Zip Date
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IPC World Wide Web Page http://www.ipc.org
Our home page provides access to information about upcoming events, publications and videos, membership, and
industry activities and services. Visit soon and often.
Education and Training

IPC conducts local educational workshops and national conferences to help you better understand emerging
technologies. National conferences have covered Ball Grid Array and Flip Chip/Chip Scale Packaging. Some workshop
topics include:
Printed Wiring Board Fundamentals High Speed Design
Troubleshooting the PWB Manufacturing Process Design for Manufacturability
Choosing the Right Base Material Laminate Design for Assembly
Acceptability of Printed Boards Designers Certification Preparation
New Design Standards
IPC video tapes and CD-ROMs can increase your industry know-how and on the job eff ectiveness.
For more information on programs, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org
For more information on IPC Video/CD Training, contact Mark Pritchard
tel 505/758-7937 ext. 202 fax 505/758-7938
e-mail: markp@taos.newmex.com
http://www.ipc.org
Training and Certification

IPC-A-610 Training and Certification Program
“The Acceptability of Electronic Assemblies” (ANSI/IPC-A-610) is the most widely used specification for the PWB
assembly industry. An industry consensus Training and Certification program based on the IPC-A-610 is available to
your company.
For more information, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org/html/610.htm
IPC Printed Circuits Expo

IPC Printed Circuits Expo is the largest trade exhibition in North America devoted to the PWB industry. Over 90
technical presentations make up this superior technical conference.
April 28-30, 1998 March 16-18, 1999

Long Beach, California Long Beach, California
For more information, contact Kim Behr

tel 847/509-9700 ext. 319 fax 847/509-9798
e-mail: behrki@ipc.org http://www.ipc.org
How to Get Involved

The first step is to join IPC. An application for membership can be found on page 74.
Once you become a member, the opportunities to enhance your competitiveness are vast. Join a technical committee
and
learn from our industry’s best while you help develop the standards for our industry. Participate in market research
programs which forecast the future of our industry. Participate in Capitol Hill Day and lobby your Congressmen and
Senators for better industry support. Pick from a wide variety of educational opportunities: workshops, tutorials, and
conferences. More up-to-date details on IPC opportunities can be found on our web page: http:/www.ipc.org.
For information on how to get involved, contact:
Jeanette Ferdman, Membership Manager
tel 847/509-9700 ext. 309 fax 847/509-9798
e-mail: JeanetteFerdman@ipc.org http://www.ipc.org
Thank you for your decision to join IPC members on the “Intelligent Path to Competitiveness”! IPC Membership is
site specific, which means that IPC member benefits are available to all individuals employed at the site designat-
ed on the other side of this application.
PLEASE CHECK
APPROPRIATE To help IPC serve your member site in the most efficient manner possible, please tell us what your facility does by
CATEGORY choosing the most appropriate member category.
■ Our facility manufactures and sells to other companies, printed wiring boards or other electronic interconnection products on
INDEPENDENT the merchant market.
PRINTED BOARD
MANUFACTURERS WHAT PRODUCTS DO YOU
MAKE FOR SALE?
n One-sided and two-sided rigid printed n Flexible printed boards n Discrete wiring devices
boards n Flat cable n Other interconnections
n Multilayer printed boards n Hybrid circuits
Name of Chief Executive Officer/President___________________________________________________________________
■
Our facility assembles printed wiring boards on a contract basis and/or offers other electronic interconnection products for sale.
INDEPENDENT
PRINTED BOARD
ASSEMBLERS n Turnkey n Through-hole n Consignment
EMSI COMPANIES n SMT n Mixed Technology n BGA
n Chip Scale Technology
Name of Chief Executive Officer/President ________________________ _
■ Our facility purchases, uses and/or manufactures printed wiring boards or other electronic interconnection products for our own
OEM – use in a final product. Also known as original equipment manufacturers (OEM).
MANUFACTURERS
OF ANY END IS YOUR INTEREST IN:
PRODUCT n purchasing/manufacture of printed circuit boards
USING
PCB/PCAS n purchasing/manufacturing printed circuit assemblies
OR CAPTIVE
MANUFACTURERS What is your company’s main product line? __________________________________________________________________
OF PCBS/PCAS
■ Our facility supplies raw materials, machinery, equipment or services used in the manufacture or assembly of electronic inter-
INDUSTRY connection products.
SUPPLIERS What products do you supply?_____________________________________________________________________________
■ We are representatives of a government agency, university, college, technical institute who are directly concerned with design,
GOVERNMENT research, and utilization of electronic interconnection devices. (Must be a non-profit or not-for-profit organization.)
AGENCIES/
ACADEMIC
TECHNICAL
LIAISONS
Please be sure both sides of this application are correctly completed

Site Information:
Company Name
Street Address
City State Zip Country
Main Phone No. Fax
Primary Contact Name
Title Mail Stop
Phone Fax e-mail
Alternate Contact Name
Title Mail Stop
Phone Fax e-mail
Please check one:
❏ $1,000.00 Annual dues for Primary Site Membership (Twelve months of IPC membership begins from the time the application
and payment are received)
❏ $800.00 Annual dues for Additional Facility Membership: Additional membership for a site within an organization where
another site is considered to be the primary IPC member.
❏ $600.00** Annual dues for an independent PCB/PWA fabricator or independent EMSI provider with annual sales of less than
$1,000,000.00. **Please provide proof of annual sales.
❏ $250.00 Annual dues for Government Agency/University/not-for-profit organization
TMRC Membership ❏ Please send me information on Membership in the Technology Marketing Research Council (TMRC)
AMRC Membership ❏ Please send me information for Membership in the Assembly Marketing Research Council (AMRC)
Payment Information
Enclosed is our check for $
Please bill my credit card: (circle one) MC AMEX VISA DINERS
Card No. Exp date ____________________
Authorized Signature
@@@@@@@@e?
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Mail application with Fax/Mail application with

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credit card payment to:

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check or money order to:

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Dept. 77-3491 2215 Sanders Road

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Chicago, IL 60678-3491 Northbrook, IL 60062-6135

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PLEASE ATTACH BUSINESS CARD

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OF OFFICIAL REPRESENTATIVE HERE @@
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2215 Sanders Road Tel 847 509.9700
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60062-6135 URL: http://www.ipc.org

J-STD-004 - Requirements For Soldering FLuxes

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AMERICAN NATIONAL

4th INTERIM FINAL

APPROVED JUNE 1, 1995 AS AN

For Technical Information Contact:

Electronic Industries Association The Institute for Interconnecting

A joint standard developed by the Flux Specifications Task

Users of this standard are encouraged to participate in the

Flux Specifications Task Group

2.0 APPLICABLE DOCUMENTS ................................... 2

4.0 QUALITY ASSURANCE PROVISIONS .................. 6

5.0 PREPARATION FOR DELIVERY ........................... 9

6.0 NOTES ..................................................................... 9

Requirements for Soldering Fluxes

Table 1 Flux Identification, Materials of Composition, Activity Levels1

2.0 APPLICABLE DOCUMENTS 2.3.35.1 Fluorides by Spot Test, Fluxes—Qualitative

ISO 9001 Quality Systems—Model for Quality Assurance 3.0 REQUIREMENTS

Table 2 Test Requirements for Flux Activity Classification

3.2.3.1 Flux Activity Classification In order to be classi-

Figure 1 Flux type classification by copper mirror test

Figure 2 Wetting balance curve

Table 4 Solder Flux Test Method Classification

Copper Mirror (3.2.4.1) 2.3.32 X

Halides, Qualitative (3.2.4.2)

Silver Chromate (3.2.4.2.1) 2.3.33 X

Fluoride Spot (3.2.4.2.2) 2.3.35.1 X

Halides Quantitative (3.2.4.3)

Chloride, Bromide (3.2.4.3.1) 2.3.35 or X

Fluoride (3.2.4.3.2) 2.3.35.2 or X

Nonvolatile Determination (3.2.4.3.3) 2.3.34 X

Corrosion (3.2.4.4) 2.6.15 X

SIR (3.2.4.5) 2.6.3.3 X

Acid Value Determination (3.2.6.1) 2.3.13 X

Spread Test, Liquid Flux (3.2.7.2) 2.4.46 (O)

Wetting Balance (3.2.7.1) 2.4.14.2 (O)

Flux Specific Gravity Determination (3.2.6.2) X

Viscosity—Paste Flux (3.2.6.3) 2.4.34.4 X

Fungus (3.2.4.6) 2.6.1 (O)

Table 5 Flux Form for Test

Flux Classification: Date of Manufacture:

Original Use by Date:

Manufacturer’s Identification: Requalified Use by Date:

Manufacturer’s Batch Number: Original:

Date Original Qualification Tests Completed: Date Requalification Tests Completed:

Tested By: Pass: _ Tested By: Pass: _

Witnessed By: Fail: _ Witnessed By: Fail: _

Copper Mirror 3.2.4.1 2.3.32

Halides Qualitative 3.2.4.2

Silver Chromate 3.2.4.2.1 2.3.33

Fluoride Spot 3.2.4.2.2 2.3.35.1

Halides Quantitative 3.2.4.3

Chloride, Bromide 3.2.4.3.1 2.3.35, 2.3.28

Fluoride 3.2.4.3.2 2.3.35.2

Nonvolatile 3.2.4.3.3 2.3.34

Total as Chloride 3.2.4.3.1

Corrosion 3.2.4.4 2.6.15

SIR 3.2.4.5 2.6.3.3 Cleaned

Fungus (optional) 3.2.4.6 2.6.1

Cleaning Procedure for Flux Characterization

Cleaning Process Parameters