Mru Diode
Mru Diode
Mru Diode
www.vishay.com
Vishay Sprague
Solid Tantalum Surface Mount Chip Capacitors
TANTAMOUNT™, Molded Case, Low ESR
FEATURES
• Low ESR
• Molded case available in five case codes
Available
• Terminations: 100 % matte tin standard,
tin / lead available Available
ORDERING INFORMATION
593D 107 X9 010 D 2WE3
TYPE CAPACITANCE CAPACITANCE DC VOLTAGE RATING CASE CODE TERMINATION AND
TOLERANCE AT +85 °C PACKAGING
Tin / lead
8T = 7" (178 mm) reel
8W = 13" (330 mm) reel
8D = 7" (178 mm) reel,
dry pack
8R = 13" (330 mm) reel,
dry pack
Notes
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating.
Low ESR solid tantalum chip capacitors allow delta ESR of 1.25 times the datasheet limits after mounting
• Dry pack as specified in J-STD-033
W TW
H
Glue Pad
TH (MIN.)
Glue Pad P
MARKING
“A” CASE VOLTAGE CODE
Voltage
Capacitance code, pF VOLTS CODE Indicates
Indicates lead (Pb)-free Capacitance
lead (Pb)-free
4.0 G μF
Date code
designation 6.3 J
10 A 22 10L
V 104L Polarity band
16 C XX 2
20 D
Voltage code Vishay marking
Polarity band 25 E Data code
A Case 35 V B, C, D, E Cases
50 T
Marking
Capacitor marking includes an anode (+) polarity band, capacitance in microfarads and the voltage rating. “A” case capacitors use a letter
code for the voltage and EIA capacitance code.
The Vishay identification marking is included if space permits. Vishay marking (“circled 2”) may show additives in the form of short lines,
depicting actual manufacturing facility. For A case capacitors discontinuation in polarity bar maybe used as actual manufacturing facility
designation. Capacitors rated at 6.3 V are marked 6 V.
A manufacturing date code is marked on all capacitors, for details see FAQ: www.vishay.com/doc?40110.
Capacitors may bear TP3 marking scheme if parts are substituted with high performance automotive grade TP3 family products.
This includes, for example, letter “P” as shown below.
Call the factory for further explanation.
Note
(1) Capital letter indicates lead (Pb)-free
STANDARD RATINGS
MAX. DF MAX. ESR MAX. RIPPLE
MAX. DCL
CAPACITANCE AT +25 °C AT +25 °C 100 kHz
CASE CODE PART NUMBER AT +25 °C
(μF) 120 Hz 100 kHz IRMS
(μA)
(%) () (A)
4 VDC AT +85 °C; 2.7 VDC AT +125 °C
15 A 593D156(1)004A(2) 0.6 6 1.500 0.22
22 A 593D226(1)004A(2) 0.9 6 1.500 0.22
33 A 593D336(1)004A(2) 1.3 6 1.500 0.22
33 B 593D336(1)004B(2) 1.3 6 0.500 0.41
47 A 593D476(1)004A(2) 1.9 14 0.800 0.31
47 B 593D476(1)004B(2) 1.9 6 0.500 0.41
68 B 593D686(1)004B(2) 2.7 6 0.500 0.41
68 C 593D686(1)004C(2) 2.7 6 0.275 0.63
100 B 593D107(1)004B(2) 4.0 8 0.450 0.43
100 C 593D107(1)004C(2) 4.0 6 0.225 0.66
Note
• Part number definitions:
(1) Tolerance: X0, X9. For ± 5 % tolerance (code X5) contact factory
(2) Terminations and packaging: 2TE3, 2WE3, 8T, 8W, 2DE3, 2RE3, 8D, 8R
STANDARD RATINGS
MAX. DF MAX. ESR MAX. RIPPLE
MAX. DCL
CAPACITANCE AT +25 °C AT +25 °C 100 kHz
CASE CODE PART NUMBER AT +25 °C
(μF) 120 Hz 100 kHz IRMS
(μA)
(%) () (A)
4 VDC AT +85 °C; 2.7 VDC AT +125 °C
150 B 593D157(1)004B(2) 6.0 14 0.500 0.41
150 C 593D157(1)004C(2) 6.0 12 0.250 0.66
150 D 593D157(1)004D(2) 6.0 8 0.150 1.00
220 C 593D227(1)004C(2) 8.8 8 0.200 0.74
220 D 593D227(1)004D(2) 8.8 8 0.150 1.00
330 D 593D337(1)004D(2) 13.2 8 0.150 1.00
470 D 593D477(1)004D(2) 18.8 10 0.125 1.10
470 E 593D477(1)004E(2) 18.8 10 0.100 1.28
680 E 593D687(1)004E(2) 27.2 12 0.100 1.28
6.3 VDC AT +85 °C; 4 VDC AT +125 °C
10 A 593D106(1)6R3A(2) 0.6 6 2.000 0.19
15 A 593D156(1)6R3A(2) 0.9 6 2.000 0.19
22 A 593D226(1)6R3A(2) 1.3 6 2.000 0.19
22 B 593D226(1)6R3B(2) 1.3 6 0.600 0.38
33 A 593D336(1)6R3A(2) 2.0 14 0.800 0.31
33 B 593D336(1)6R3B(2) 2.0 6 0.600 0.38
47 B 593D476(1)6R3B(2) 2.8 6 0.550 0.39
47 C 593D476(1)6R3C(2) 2.8 6 0.300 0.61
68 B 593D686(1)6R3B(2) 4.1 6 0.550 0.39
68 C 593D686(1)6R3C(2) 4.1 6 0.275 0.63
100 B 593D107(1)6R3B(2) 6.0 15 0.500 0.41
100 C 593D107(1)6R3C(2) 6.0 6 0.250 0.66
100 D 593D107(1)6R3D(2) 6.0 6 0.140 1.04
150 C 593D157(1)6R3C(2) 9.0 8 0.200 0.74
150 D 593D157(1)6R3D(2) 9.0 8 0.125 1.10
150 E 593D157(1)6R3E(2) 9.0 8 0.100 1.28
220 D 593D227(1)6R3D(2) 13.2 8 0.100 1.22
220 E 593D227(1)6R3E(2) 13.2 8 0.100 1.28
330 D 593D337(1)6R3D(2) 19.8 8 0.125 1.10
330 E 593D337(1)6R3E(2) 19.8 8 0.100 1.28
470 E 593D477(1)6R3E(2) 28.2 10 0.100 1.28
10 VDC AT +85 °C; 7 VDC AT +125 °C
4.7 A 593D475(1)010A(2) 0.5 6 3.000 0.16
6.8 A 593D685(1)010A(2) 0.7 6 3.000 0.16
10 A 593D106(1)010A(2) 1.0 6 2.000 0.19
15 A 593D156(1)010A(2) 1.5 6 2.000 0.19
15 B 593D156(1)010B(2) 1.5 6 0.700 0.35
22 A 593D226(1)010A(2) 2.2 8 1.500 0.22
22 B 593D226(1)010B(2) 2.2 6 0.700 0.35
22 C 593D226(1)010C(2) 2.2 6 0.345 0.56
33 B 593D336(1)010B(2) 3.3 6 0.600 0.38
33 C 593D336(1)010C(2) 3.3 6 0.300 0.61
47 B 593D476(1)010B(2) 4.7 6 0.600 0.38
47 C 593D476(1)010C(2) 4.7 6 0.300 0.61
47 D 593D476(1)010D(2) 4.7 6 0.200 0.87
68 C 593D686(1)010C(2) 6.8 6 0.275 0.63
68 D 593D686(1)010D(2) 6.8 6 0.150 1.00
Note
• Part number definitions:
(1) Tolerance: X0, X9. For ± 5 % tolerance (code X5) contact factory
(2) Terminations and packaging: 2TE3, 2WE3, 8T, 8W, 2DE3, 2RE3, 8D, 8R
STANDARD RATINGS
MAX. DF MAX. ESR MAX. RIPPLE
MAX. DCL
CAPACITANCE AT +25 °C AT +25 °C 100 kHz
CASE CODE PART NUMBER AT +25 °C
(μF) 120 Hz 100 kHz IRMS
(μA)
(%) () (A)
10 VDC AT +85 °C; 7 VDC AT +125 °C
100 C 593D107(1)010C(2) 10.0 8 0.200 0.74
100 D 593D107(1)010D(2) 10.0 6 0.100 1.22
150 D 593D157(1)010D(2) 15.0 8 0.100 1.22
150 E 593D157(1)010E(2) 15.0 8 0.100 1.28
220 D 593D227(1)010D(2) 22.0 8 0.125 1.10
220 E 593D227(1)010E(2) 22.0 8 0.100 1.28
330 E 593D337(1)010E(2) 33.0 10 0.100 1.28
16 VDC AT +85 °C; 10 VDC AT +125 °C
1.0 A 593D105(1)016A(2) 0.5 4 5.500 0.12
3.3 A 593D335(1)016A(2) 0.5 6 3.500 0.15
4.7 A 593D475(1)016A(2) 0.8 6 2.500 0.17
4.7 B 593D475(1)016B(2) 0.8 6 1.500 0.24
6.8 A 593D685(1)016A(2) 1.1 6 3.000 0.16
10 A 593D106(1)016A(2) 1.6 6 1.700 0.21
10 B 593D106(1)016B(2) 1.6 6 0.800 0.33
10 C 593D106(1)016C(2) 1.6 6 0.450 0.49
15 B 593D156(1)016B(2) 2.4 6 0.800 0.33
15 C 593D156(1)016C(2) 2.4 6 0.400 0.52
22 B 593D226(1)016B(2) 3.5 6 0.700 0.35
22 C 593D226(1)016C(2) 3.5 6 0.350 0.56
33 B 593D336(1)016B(2) 5.3 6 0.700 0.35
33 C 593D336(1)016C(2) 5.3 6 0.300 0.61
33 D 593D336(1)016D(2) 4.2 4 0.225 0.82
47 C 593D476(1)016C(2) 7.5 6 0.300 0.61
47 D 593D476(1)016D(2) 7.5 6 0.150 1.00
68 D 593D686(1)016D(2) 10.9 6 0.150 1.00
100 D 593D107(1)016D(2) 16.0 8 0.125 1.10
100 E 593D107(1)016E(2) 16.0 8 0.100 1.28
150 E 593D157(1)016E(2) 24.0 8 0.100 1.28
20 VDC AT +85 °C; 13 VDC AT +125 °C
1.0 A 593D105(1)020A(2) 0.5 4 5.500 0.12
2.2 A 593D225(1)020A(2) 0.5 6 4.000 0.14
3.3 A 593D335(1)020A(2) 0.7 6 4.000 0.14
4.7 A 593D475(1)020A(2) 0.9 6 3.500 0.15
4.7 B 593D475(1)020B(2) 0.9 6 1.000 0.29
6.8 B 593D685(1)020B(2) 1.4 6 1.000 0.29
10 B 593D106(1)020B(2) 2.0 6 1.000 0.29
10 C 593D106(1)020C(2) 2.0 6 0.450 0.49
15 B 593D156(1)020B(2) 3.0 6 1.000 0.29
15 C 593D156(1)020C(2) 3.0 6 0.400 0.52
22 C 593D226(1)020C(2) 4.4 6 0.375 0.54
22 D 593D226(1)020D(2) 3.5 4 0.225 0.82
33 C 593D336(1)020C(2) 6.6 6 0.350 0.56
33 D 593D336(1)020D(2) 6.6 6 0.200 0.87
47 D 593D476(1)020D(2) 9.4 6 0.200 0.87
47 E 593D476(1)020E(2) 7.5 4 0.150 1.05
68 D 593D686(1)020D(2) 13.6 6 0.175 0.93
68 E 593D686(1)020E(2) 13.6 6 0.150 1.05
100 E 593D107(1)020E(2) 20.0 8 0.150 1.05
Note
• Part number definitions:
(1) Tolerance: X0, X9. For ± 5 % tolerance (code X5) contact factory
(2) Terminations and packaging: 2TE3, 2WE3, 8T, 8W, 2DE3, 2RE3, 8D, 8R
STANDARD RATINGS
MAX. DF MAX. ESR MAX. RIPPLE
MAX. DCL
CAPACITANCE AT +25 °C AT +25 °C 100 kHz
CASE CODE PART NUMBER AT +25 °C
(μF) 120 Hz 100 kHz IRMS
(μA)
(%) () (A)
25 VDC AT +85 °C; 17 VDC AT +125 °C
1.0 A 593D105(1)025A(2) 0.5 4 4.000 0.14
1.5 A 593D155(1)025A(2) 0.5 6 4.000 0.14
2.2 A 593D225(1)025A(2) 0.6 6 4.000 0.14
2.2 B 593D225(1)025B(2) 0.6 6 1.500 0.24
3.3 B 593D335(1)025B(2) 0.8 6 1.500 0.24
4.7 B 593D475(1)025B(2) 1.2 6 1.500 0.24
4.7 C 593D475(1)025C(2) 1.2 6 0.525 0.46
6.8 C 593D685(1)025C(2) 1.7 6 0.500 0.47
10 C 593D106(1)025C(2) 2.5 6 0.450 0.49
15 C 593D156(1)025C(2) 3.8 6 0.425 0.51
15 D 593D156(1)025D(2) 3.8 6 0.250 0.77
22 D 593D226(1)025D(2) 5.5 6 0.200 0.87
33 D 593D336(1)025D(2) 8.3 6 0.200 0.87
33 E 593D336(1)025E(2) 8.3 6 0.200 0.91
47 E 593D476(1)025E(2) 11.8 6 0.200 0.91
35 VDC AT +85 °C; 23 VDC AT +125 °C
0.47 A 593D474(1)035A(2) 0.5 4 4.000 0.14
0.68 A 593D684(1)035A(2) 0.5 4 4.000 0.14
1.0 A 593D105(1)035A(2) 0.5 4 4.000 0.14
1.0 B 593D105(1)035B(2) 0.5 4 2.000 0.21
1.5 B 593D155(1)035B(2) 0.5 6 2.000 0.21
1.5 C 593D155(1)035C(2) 0.5 6 0.900 0.35
2.2 B 593D225(1)035B(2) 0.8 6 2.000 0.21
2.2 C 593D225(1)035C(2) 0.8 6 0.900 0.40
3.3 C 593D335(1)035C(2) 1.2 6 0.700 0.45
4.7 C 593D475(1)035C(2) 1.6 6 0.500 0.47
6.8 C 593D685(1)035C(2) 2.4 6 0.475 0.48
6.8 D 593D685(1)035D(2) 2.4 6 0.300 0.71
10 C 593D106(1)035C(2) 3.5 6 0.450 0.49
10 D 593D106(1)035D(2) 3.5 6 0.300 0.71
15 D 593D156(1)035D(2) 5.3 6 0.300 0.71
15 E 593D156(1)035E(2) 5.3 6 0.300 0.74
22 D 593D226(1)035D(2) 7.7 6 0.300 0.71
22 E 593D226(1)035E(2) 7.7 6 0.275 0.77
50 VDC AT +85 °C; 33 VDC AT +125 °C
1.0 B 593D105(1)050B(2) 0.5 4 2.000 0.21
1.0 C 593D105(1)050C(2) 0.5 4 1.600 0.26
1.5 B 593D155(1)050B(2) 0.8 6 2.000 0.21
1.5 C 593D155(1)050C(2) 0.8 6 1.500 0.27
2.2 C 593D225(1)050C(2) 1.1 6 1.500 0.27
2.2 D 593D225(1)050D(2) 1.1 6 0.800 0.43
3.3 C 593D335(1)050C(2) 1.7 6 1.500 0.27
3.3 D 593D335(1)050D(2) 1.7 6 0.800 0.43
4.7 D 593D475(1)050D(2) 2.4 6 0.600 0.50
4.7 E 593D475(1)050E(2) 1.9 6 0.600 0.50
6.8 D 593D685(1)050D(2) 3.4 6 0.600 0.50
6.8 E 593D685(1)050E(2) 3.4 6 0.550 0.55
10 D 593D106(1)050D(2) 5.0 6 0.550 0.52
10 E 593D106(1)050E(2) 5.0 6 0.550 0.55
Note
• Part number definitions:
(1) Tolerance: X0, X9. For ± 5 % tolerance (code X5) contact factory
(2) Terminations and packaging: 2TE3, 2WE3, 8T, 8W, 2DE3, 2RE3, 8D, 8R
POWER DISSIPATION
CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
A 0.075
B 0.085
C 0.110
D 0.150
E 0.165
PRODUCT INFORMATION
Guide for Molded Tantalum Capacitors
Pad Dimensions www.vishay.com/doc?40074
Packaging Dimensions
Moisture Sensitivity (MSL) www.vishay.com/doc?40135
SELECTOR GUIDES
Solid Tantalum Selector Guide www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors www.vishay.com/doc?40091
FAQ
Frequently Asked Questions www.vishay.com/doc?40110
Molded Chip tantalum capacitor encases the element in Vishay Sprague patented the original solid electrolyte
plastic resins, such as epoxy materials. After assembly, the capacitors and was the first to market them in 1956. Vishay
capacitors are tested and inspected to assure long life and Sprague has the broadest line of tantalum capacitors and
reliability. It offers excellent reliability and high stability for has continued its position of leadership in this field. Data
consumer and commercial electronics with the added sheets covering the various types and styles of Vishay
feature of low cost Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
Surface mount designs of “Solid Tantalum” capacitors use
where detailed performance characteristics must be
lead frames or lead frameless designs as shown in the
specified.
accompanying drawings.
Epoxy
Silver Encapsulation
Adhesive
Anode
Polarity Bar
MnO2/Carbon/
Silver Coating
Solderable Leadframe Solderable Anode
Cathode Sintered Termination
Termination Tantalum
PRODUCT IMAGE
PRODUCT IMAGE
PRODUCT
IMAGE
TANTAMOUNT™,
TANTAMOUNT™, TANTAMOUNT™, molded case,
TYPE molded case,
molded case, hi-rel. DLA approved
hi-rel. COTS
TEMPERATURE
-55 °C to +125 °C
RANGE
CAPACITANCE
1 μF to 220 μF 0.1 μF to 470 μF 0.1 μF to 100 μF 4.7 μF to 220 μF
RANGE
VOLTAGE RANGE 4 V to 20 V 4 V to 63 V 4 V to 50 V
CAPACITANCE
± 10 %, ± 20 % ± 5 %, ± 10 %, ± 20 % ± 10 %, ± 20 %
TOLERANCE
DISSIPATION
4 % to 8 % 4 % to 15 % 4 % to 6 % 4 % to 12 %
FACTOR
CASE CODES A, B, C, D, E A, B, C, D, E A, B, C, D C, D, E
Top
cover
A0 20°
tape 0.030 [0.75]
F W
B1 MAX. MIN. (Note 3) Maxim um
K0
(Note 6) component
B0
Top 0.030 [0.75] rotation
cover MIN. (Note 4) (Side or front sectional view)
tape
0.004 [0.1] Center lines P1
For tape feeder MAX. of cavity D1 MIN. for components
reference only 0.079 x 0.047 [2.0 x 1.2] and larger .
including draft. USER DIRECTION OF FEED
Maximum (Note 5)
Concentric around B0 cavity size
(Note 5) (Note 1)
Cathode (-)
Anode (+)
Direction of Feed
20° maximum 3.937 [100.0] Tape and Reel Specifications: all case sizes are available
component rotation 0.039 [1.0] on plastic embossed tape per EIA-481. Standard reel
MAX.
Typical diameter is 7" [178 mm], 13" [330 mm] reels are available and
component
Tape
recommended as the most cost effective packaging method.
B0 cavity
center line 0.039 [1.0] The most efficient packaging quantities are full reel
MAX.
0.9843 [250.0]
increments on a given reel diameter. The quantities shown
Typical allow for the sealed empty pockets required to be in
component Camber
A0 center line (top view) conformance with EIA-481. Reel size and packaging
Allowable camber to be 0.039/3.937 [1/100] orientation must be specified in the Vishay Sprague part
(Top view) non-cumulative over 9.843 [250.0] number.
Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only
(1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
0 0 0
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location shall be applied independent of each other
(6) B dimension is a reference dimension tape feeder clearance only
1
CASE TAPE B1 D1 K0
F P1 W
CODE SIZE (MAX.) (MIN.) (MAX.)
MOLDED CHIP CAPACITORS; ALL TYPES
A 0.165 0.039 0.138 ± 0.002 0.094 0.157 ± 0.004 0.315 ± 0.012
8 mm
B [4.2] [1.0] [3.5 ± 0.05] [2.4] [4.0 ± 1.0] [8.0 ± 0.30]
C
D 0.32 0.059 0.217 ± 0.00 0.177 0.315 ± 0.004 0.472 ± 0.012
12 mm
E [8.2] [1.5] [5.5 ± 0.05] [4.5] [8.0 ± 1.0] [12.0 ± 0.30]
W
TEMPERATURE (°C)
TL
tL
Ts max. Preheat area
Ts min.
ts
25
Time 25 °C to peak
TIME (s)
A B C D
CASE CODE
(MIN.) (NOM.) (NOM.) (NOM.)
MOLDED CHIP CAPACITORS, ALL TYPES
A 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75]
B 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25]
C 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80]
D 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
E 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
W 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
4. Temperature Derating: if these capacitors are to be 8.1 When using ultrasonic cleaning, the board may
operated at temperatures above +25 °C, the resonate if the output power is too high. This
permissible RMS ripple current shall be calculated vibration can cause cracking or a decrease in the
using the derating factors as shown: adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
TEMPERATURE (°C) DERATING FACTOR 9. Recommended Mounting Pad Geometries: proper
+25 1.0 mounting pad geometries are essential for
+85 0.9 successful solder connections. These dimensions
+125 0.4 are highly process sensitive and should be designed
+150 (1) 0.3 to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
+175 (1) 0.2 are the recommended pad geometries for both wave
+200 (1) 0.1 and reflow soldering techniques. These dimensions
Note
are intended to be a starting point for circuit board
(1) Applicable for dedicated high temperature product series
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
5. Power Dissipation: power dissipation will be or circuit board design.
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
1.0
2nd line
1st line
2nd line
0.6
0.4 100
0.2
0 10
-55 0 25 55 85 105 125
Temperature (°C)
10
Leakage Current Factor
+175 °C
+150 °C 1000
1 +125 °C
2nd line
1st line
2nd line
85 °C
0.1 +55 °C
100
+25 °C
0.01
0 °C
-55 °C
0.001 10
0 10 20 30 40 50 60 70 80 90 100
Percent of Rated Voltage
Note
• At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table.
At +150 °C, the leakage current shall not exceed 15 times the value listed in the Standard Ratings table.
At +175 °C, the leakage current shall not exceed 18 times the value listed in the Standard Ratings table
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